Electronic device

Abstract

An electronic device according to an embodiment may include a display module and a digitizer including a plurality of engraved patterns on a folded portion of a base layer, the plurality of engraved patterns being configured with a liquid metal. By this means, the electronic device according to one embodiment can prevent a resistance increase and a driving defect of the sensing coil due to a broken line or a crack, and can improve sensing sensitivity at the folding portion.

Description

Technical Field

[0001] The utility model relates to an electronic device, and more particularly to an electronic device comprising a digitizer. Background Art

[0002] In the information society, electronic devices are gaining importance as a medium for transmitting visual information. The electronic devices are activated by the application of electrical signals. The electronic devices include a digitizer that senses input applied from outside a display layer that displays an image.

[0003] The digitizer of the electronic device may include various sensing coils to be activated by an electrical signal. The area where the sensing coil is activated reacts to the signal applied from the outside. Utility Model Content

[0004] The utility model aims to provide an electronic device with improved folding characteristics of a digitizer for sensing external input.

[0005] It may be that an electronic device of an embodiment includes: a display module, including: a first non-folding area and a second non-folding area, arranged along a first direction; and a folding area, arranged between the first non-folding area and the second non-folding area, and folded with an imaginary folding axis extending along a second direction intersecting the first direction as a reference; and a digitizer, arranged below the display module. It may be that the digitizer includes: a base layer, including: a first non-folding portion, overlapping the first non-folding area; a second non-folding portion, overlapping the second non-folding area; and a folding portion, overlapping the folding area and defining a plurality of holes; a plurality of first coils, each provided on one side of the base layer, and including: a first portion, overlapping the first non-folding portion and extending in the first direction; a second portion, overlapping the second non-folding portion and extending in the first direction; and a third portion, overlapping the folding portion and surrounding corresponding holes among the plurality of holes; and a plurality of second coils, provided on the other side of the base layer facing the one side. It may be that the base layer includes a plurality of engraved patterns arranged on the folding portion, and the third portion is formed of liquid metal and arranged in the engraved pattern.

[0006] In one embodiment, the liquid metal may be any one of a gallium alloy, a eutectic gallium-indium alloy (EGain) and a gallium-indium-tin alloy (Galinstan).

[0007] In one embodiment, the first portion and the second portion may be formed of copper.

[0008] In an embodiment, each of the plurality of engraved patterns may include: a plurality of first patterns and a plurality of second patterns configured to surround a portion of a corresponding hole among the plurality of holes.

[0009] In one embodiment, the plurality of engraved patterns may further include: a third pattern connecting two first patterns adjacent to each other along the first direction; and a fourth pattern connecting two second patterns adjacent to each other along the first direction.

[0010] In one embodiment, each of the first patterns may include: a 1-1 pattern and a 1-2 pattern, each extending in the second direction and arranged along the first direction with a hole between them; and a 1-3 pattern, connecting the 1-1 pattern and the 1-2 pattern. Each of the second patterns may include: a 2-1 pattern and a 2-2 pattern, each extending in a direction opposite to the second direction and arranged along the first direction with a hole between them; and a 2-3 pattern, connecting the 2-1 pattern and the 2-2 pattern.

[0011] In one embodiment, on a plane, the plurality of engraved patterns include two engraved patterns extending in the first direction and spaced apart in the second direction via a hole, and the spacing distance between the two engraved patterns is greater than 5.5 mm and less than 7.5 mm.

[0012] In one embodiment, on a plane, each of the plurality of engraved patterns includes two engraved patterns extending in the second direction and spaced apart in the first direction via a hole, and a spacing distance between the two engraved patterns is greater than 0.1 mm and less than 0.6 mm.

[0013] In one embodiment, the plurality of engraved patterns may include two engraved patterns extending in the first direction and spaced apart in the second direction between holes adjacent to each other in the second direction in a plane. In this case, the spacing distance between the two engraved patterns excluding the width of each of the two engraved patterns may be greater than 0.01 mm, and the spacing distance between the two engraved patterns including the width of each of the two engraved patterns may be less than 0.2 mm.

[0014] In one embodiment, the width of each of the engraved patterns may be greater than or equal to 0.01 mm and less than or equal to 0.09 mm.

[0015] In one embodiment, each of the plurality of holes may include a first group of holes extending in the second direction and arranged spaced apart from each other along the second direction, and a second group of holes, wherein the second group of holes is displaced from the first group of holes by a predetermined distance in the second direction.

[0016] In one embodiment, the base layer may include: a matrix including a filler; and fiber threads in a woven shape arranged inside the matrix.

[0017] In one embodiment, the matrix may be at least one of epoxy, polyester, polyamide, polycarbonate, polypropylene, polybutylene and vinyl ester. The filler may be at least one of silica, barium sulphate, sintered talc, barium titanate, titanium oxide, clay, alumina, mica, boehmite, zinc borate and zinc titanate.

[0018] In one embodiment, the upper surface of the third portion may be higher than one surface of the base layer in the thickness direction.

[0019] It can be that an electronic device of an embodiment includes: a display module, including: a first non-folding area and a second non-folding area, arranged along a first direction; and a folding area, arranged between the first non-folding area and the second non-folding area, and folded with an imaginary folding axis extending along a second direction intersecting the first direction as a reference; a panel protection layer, arranged below the display module; and a digitizer, arranged below the panel protection layer, and including: a base layer, including: a folding portion, overlapping with the folding area and defining a plurality of holes; and a first non-folding portion and a second non-folding portion, arranged spaced apart along the first direction across the folding portion; and a sensing coil, arranged on the base layer. It can be that the base layer includes a plurality of engraved patterns arranged on the folding portion, and at least a portion of the sensing coils arranged on the folding portion are arranged within the plurality of engraved patterns.

[0020] The electronic device of one embodiment can prevent the resistance increase and driving defect of the sensing coil due to disconnection or cracks, thereby improving the sensing sensitivity at the folding portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1a It is a three-dimensional diagram of an electronic device in an unfolded state according to an embodiment of the present invention.

[0022] Figure 1b It is a three-dimensional diagram of an electronic device in a folded working state according to an embodiment of the utility model.

[0023] Figure 1c It is a three-dimensional diagram of an electronic device in a folded working state according to an embodiment of the utility model.

[0024] Figure 1d It is a three-dimensional diagram of an electronic device in a folded state according to an embodiment of the present invention.

[0025] Figure 1e It is a three-dimensional diagram of an electronic device in a folded state according to an embodiment of the present invention.

[0026] Figure 2 It is an exploded perspective view of an electronic device according to an embodiment of the present utility model.

[0027] Figure 3 is a cross-sectional view of an electronic device according to an embodiment of the present invention.

[0028] Figure 4a It is a plan view of a digitizer according to an embodiment of the utility model.

[0029] Figure 4b It is a rear view of a digitizer according to an embodiment of the utility model.

[0030] Figure 5a Is magnification Figure 4a Floor plan of the AA' area.

[0031] Figure 5b is a cross-sectional view of a digitizer according to an embodiment of the utility model.

[0032] Figure 6a It is a cross-sectional view of a base layer according to an embodiment of the present utility model.

[0033] Figure 6b It is a plan view of a base layer according to an embodiment of the utility model.

[0034] Figure 7a to Figure 7h is a cross-sectional view exemplarily showing a method for manufacturing a digitizer according to an embodiment of the present utility model.

[0035] (Explanation of Reference Numerals)

[0036] 1000: Electronic devices

[0037] 100: Display module

[0038] 200: Digitizer

[0039] 210, 220: first and second unfolded parts

[0040] 230: Folding

[0041] PP: Engraving pattern

[0042] HL: Hole

[0043] BG: Basal layer

[0044] MT: Matrix

[0045] FL1, FL2: Fiber line

[0046] 300: Buffer layer

[0047] 400: Form DETAILED DESCRIPTION

[0048] In this specification, when mentioning that any constituent element (or region, layer, part, etc.) is "on" other constituent elements, "connected to" or "combined with" other constituent elements, it means that any constituent element can be directly configured / connected / combined with other constituent elements or a third constituent element can be configured between them.

[0049] The same reference numerals refer to the same components. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated for the effective description of the technical content. "And / or" includes all combinations of the associated components that can be defined in more than one combination.

[0050] The terms first, second, etc. may be used to describe various constituent elements, but the constituent elements cannot be limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from other constituent elements. For example, without departing from the scope of the invention, the first constituent element may be named the second constituent element, and similarly the second constituent element may also be named the first constituent element. Unless the context clearly indicates otherwise, a singular expression includes a plural expression.

[0051] In addition, terms such as “below”, “lower side”, “above”, and “upper side” are used to explain the relationship between components shown in the drawings. These terms are relative concepts and are explained based on the directions shown in the drawings.

[0052] The terms "including" or "having" etc. should be understood as being used to specify the existence of features, numbers, steps, tasks, constituent elements, accessories or these combinations recorded in the specification, and do not preclude the existence or additional possibility of one or more other features or numbers, steps, tasks, constituent elements, accessories or these combinations.

[0053] Unless defined differently, all terms (including technical terms and scientific terms) used in this specification have the same meanings as those generally understood by those skilled in the art to which the present invention belongs. In addition, terms that may be the same as those defined in commonly used dictionaries should be interpreted as having the same meanings as those in the context of the associated technology, and not interpreted as highly idealized or overly formal meanings, unless explicitly defined herein.

[0054] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

[0055] Figure 1a It is a three-dimensional diagram of an electronic device in an unfolded state according to an embodiment of the present invention. Figure 1b It is a three-dimensional diagram of an electronic device in a folded working state according to an embodiment of the utility model. Figure 1c It is a three-dimensional diagram of an electronic device in a folded working state according to an embodiment of the utility model. Figure 1d It is a three-dimensional diagram of an electronic device in a folded state according to an embodiment of the present invention. Figure 1e It is a three-dimensional diagram of an electronic device in a folded state according to an embodiment of the present invention.

[0056] Reference Figures 1a to 1e According to the present invention, the electronic device 1000 may be a device activated by an electrical signal. The electronic device 1000 may include various embodiments. For example, the electronic device 1000 may include a tablet, a notebook, a computer, a smart TV, etc. In this embodiment, the electronic device 1000 is exemplarily shown as a smart phone.

[0057] The electronic device 1000 may display an image IM toward the third direction DR3 through a display surface FS parallel to each of the first direction DR1 and the second direction DR2. The display surface FS displaying the image IM may correspond to the front surface of the electronic device 1000. The image IM may include not only dynamic images but also static images. Figure 1a to Figure 1c As an example of the image IM, an Internet search window, a clock window, and a plurality of application programs are shown.

[0058] According to this embodiment, the front (or top) and back (or bottom) of each structure are defined based on the direction in which the image IM is displayed in the unfolded state. The front and back may be opposite to each other in the third direction DR3, and the normal direction of each of the front and back is parallel to the third direction DR3.

[0059] The distance between the front and back sides in the third direction DR3 may correspond to the thickness / height in the third direction DR3 of the electronic device 1000. On the other hand, the directions indicated by the first to third directions DR1, DR2, DR3 are relative concepts and may be changed to other directions.

[0060] The electronic device 1000 may sense an external input applied from the outside. The external input may be an input from a user. The user's input may include input in various forms such as a part of the user's body, an electronic pen, light, heat, or pressure. When the electronic device 1000 senses the input through the electronic pen, the electronic device 1000 may further include a digitizer driven by using resonance (EMR) through electromagnetic induction, without being limited to any one embodiment.

[0061] The display surface FS of the electronic device 1000 may include an active area F-AA and a peripheral area F-NAA. The active area F-AA may be an area activated according to an electrical signal. The active area F-AA may be an area that may display an image IM and sense an external input.

[0062] The peripheral area F-NAA may be adjacent to the active area F-AA. The peripheral area F-NAA may have a lower light transmittance than the active area F-AA and have a predetermined color. The peripheral area F-NAA may surround the active area F-AA. Thus, the shape of the active area F-AA may be substantially defined by the peripheral area F-NAA. However, this is shown by way of example, and the peripheral area F-NAA may also be configured adjacent to only one side of the active area F-AA, or may be omitted.

[0063] The display surface FS may further include a signal transmission area TA. Figure 1a to Figure 1c exemplarily shows that the signal transmission area TA is included in the inside of the active area F-AA, but is not limited thereto. For example, the signal transmission area TA may be included in the inside of the peripheral area F-NAA, or may be surrounded by each of the active area F-AA and the peripheral area F-NAA.

[0064] The signal transmission area TA has a higher transmittance than the active area F-AA and the peripheral area F-NAA. Natural light, visible light or infrared rays may move to the signal transmission area TA.

[0065] The electronic device 1000 may further include a sensor for capturing an external image by visible light passing through the signal transmission area TA or determining the proximity of an external object by infrared rays. The sensor may overlap the signal transmission area TA. Thus, the electronic device 1000 including a sensor with improved reliability may be provided.

[0066] Reference Figure 1b , the electronic device 1000 according to an embodiment may be a foldable electronic device 1000. For example, the electronic device 1000 may be folded along an imaginary first folding axis AX1 extending in the second direction DR2. The first folding axis AX1 may be formed on the display surface FS.

[0067] The electronic device 1000 may include a folding area FA folded by a first folding axis AX1 and a first non-folding area NFA1 and a second non-folding area NFA2 separated from each other in a first direction DR1 across the folding area FA. The folding area FA may be referred to as a foldable area, and the first and second non-folding areas NFA1 and NFA2 may be referred to as non-foldable areas.

[0068] The electronic device 1000 can be folded with the first folding axis AX1 as a reference, so as to be folded in an in-folding manner in which the first non-folding area NFA1 and the second non-folding area NFA2 face each other. The electronic device 1000 can be folded in an in-folding manner without the display surface FS being exposed to the outside. In the present utility model, the "first mode" can be defined as when the electronic device 1000 is in an unfolded state, and the "second mode" can be defined as when the electronic device 1000 is in a folded state.

[0069] Reference Figure 1c The electronic device 1000 may also be folded in an out-folding manner with the second folding axis AX2 as the center in a direction in which the first non-folding area NFA1 and the second non-folding area NFA2 are opposite to each other. The second folding axis AX2 may be formed on a surface opposite to the display surface FS. The electronic device 1000 may be folded in an out-folding manner, and the display surface FS may be recognized by the user.

[0070] According to an embodiment, the electronic device 1000 can only operate in one of the inner folding mode and the outer folding mode with the folding axis extending on the same line as the center. In addition, the electronic device 1000 can also repeatedly operate in the inner folding mode or the outer folding mode with one folding axis as the center.

[0071] Reference Figure 1dWhen the electronic device 1000 of an embodiment is folded, at least a portion of the folding area FA may have a predetermined curvature. It may be that the folding area FA has a curvature center RX inside the folding area FA, and the electronic device 1000 has a predetermined curvature radius R and is folded based on the curvature center RX. According to an embodiment, the curvature radius R may be greater than the interval DT between the first non-folding area NFA1 and the second non-folding area NFA2.

[0072] Reference Figure 1e According to an embodiment, the electronic device 1000 may have a predetermined radius of curvature R when folded inward and folded. At this time, the interval DT between the portion extending from the folding area FA to the first non-folding area NFA1 and the portion extending from the folding area FA to the second non-folding area NFA2 may be constant along the first direction DR1, without being limited to any one embodiment.

[0073] Figure 2 It is an exploded perspective view of an electronic device according to an embodiment of the present utility model. Figure 3 is a cross-sectional view of an electronic device according to an embodiment of the present invention. Figure 2 Only a part of the structure included in the electronic device 1000 is shown.

[0074] Reference Figure 2 as well as Figure 3 , the electronic device 1000 may include a display module 100, a digitizer 200, a buffer layer 300 and a window 400. In more detail, the electronic device 1000 may include a plurality of adhesive layers AD1-AD5, an upper functional layer disposed between the display module 100 and the window 400, and a lower functional layer disposed below the digitizer 200.

[0075] The adhesive layers AD1 to AD5 described below may include any one of an optically clear adhesive (OCA), an optically clear resin (OCR), and a pressure sensitive adhesive (PSA).

[0076] The display module 100 may be flexible. The active area AA of the display module 100 may be Figure 1a The illustrated active area F-AA corresponds to the electronic device 1000 , and the peripheral area NAA corresponds to the peripheral area F-NAA of the electronic device 1000 .

[0077] The display module 100 may include a display panel 110 that displays an image and an input sensor 120 that senses an external input. The display panel 110 may be a light-emitting display panel 110, without particular limitation. For example, the display panel 110 may be an organic light-emitting display panel 110 or an inorganic light-emitting display panel 110. The light-emitting element of the organic light-emitting display panel 110 may include an organic light-emitting substance. The light-emitting element of the inorganic light-emitting display panel 110 may include quantum dots or quantum rods, etc. In addition, the display panel 110 according to an embodiment may include micro LED elements and / or nano LED elements, without particular limitation.

[0078] The display panel 110 may include a plurality of pixels, each of which includes any one of the light-emitting elements. The light-emitting layer included in each of the light-emitting elements is configured in the active area AA and emits light of a predetermined color. In the case where the light-emitting layers are provided in plurality, the light-emitting elements may correspond to the light-emitting layers respectively. In addition, in the case where the light-emitting layer is provided as a single layer, a color filter or a color conversion component configured on the light-emitting layer may be further included.

[0079] The input sensor 120 may be disposed on the display panel 110. The input sensor 120 may be driven in a capacitive manner. The input sensor 120 may sense the position and / or strength applied by the user's hand across the front of the active area F-AA. The input sensor 120 may include sensing electrodes insulated from each other, routing wiring connected to the corresponding sensing electrodes, and at least one sensing insulating layer.

[0080] The input sensor 120 according to an embodiment may be formed on the display panel 110 through a continuous process. In this case, the input sensor 120 may be described as being "directly disposed" on the display panel 110. Directly disposed may mean that no third component is disposed between the input sensor 120 and the display panel 110. That is, no separate adhesive component may be disposed between the input sensor 120 and the display panel 110.

[0081] However, not limited thereto, the input sensor 120 may be provided as a separate module and combined with the display panel 110 through an adhesive layer.

[0082] The digitizer 200 may be disposed below the display module 100. The digitizer 200 according to the present invention may sense input through the electronic pen. At this time, the digitizer 200 may be driven by using a resonance (EMR) method through electromagnetic induction.

[0083] The digitizer 200 may be disposed below the display module 100 to support the display module 100. The digitizer 200 may include a first non-folding portion 210, a second non-folding portion 220, and a folding portion 230. In addition, the digitizer 200 may further include a shielding layer 240.

[0084] The first non-folding portion 210 may overlap at least a portion of the first non-folding area NFA1. The second non-folding portion 220 may overlap at least a portion of the second non-folding area NFA2. The folding portion 230 may overlap the folding area FA. Therefore, the folding portion 230 may be disposed between the first non-folding portion 210 and the second non-folding portion 220.

[0085] The folding portion 230 of the digitizer 200 may define a plurality of holes HL that penetrate the digitizer 200 in the third direction DR3. For example, the plurality of holes HL may penetrate from the top to the back of the digitizer 200 and be defined in the folding portion 230. The plurality of holes HL may correspond to the folding area FA and be spaced apart from each other along the first direction DR1 and the second direction DR2.

[0086] The shielding layer 240 may include a first shielding layer 241 and a second shielding layer 242. The first shielding layer 241 may overlap a portion of the folding portion 230 and the first non-folding portion 210, and the second shielding layer 242 may overlap another portion of the folding portion 230 and the second non-folding portion 220. The first shielding layer 241 and the second shielding layer 242 may be spaced apart from each other along the first direction DR1 within the folding area FA. However, the present invention is not limited thereto, and the shielding layer 240 may be disposed in the entire area of ​​the folding area FA to cover the hole HL.

[0087] In the present embodiment, the shielding layer 240 may include a metal. For example, the shielding layer 240 may include a magnetic metal powder (MMP). However, the material of the shielding layer 240 is not limited thereto, and may include any one of an alloy of nickel (Ni) and iron (Fe), i.e., permalloy, invar, and stainless steel.

[0088] According to the present invention, when the electronic device 1000 repeatedly operates in the first mode and the second mode, the shape of the display module 100 can be deformed to substantially correspond to the shape of the digitizer 200 .

[0089] The substrate layer to be configured with the sensing coil in the digitizer 200 according to an embodiment may include a reinforced fiber composite material. The digitizer 200 may include a reinforcing fiber configured on the inner side of the substrate portion. The reinforcing fiber may be a carbon fiber or a glass fiber. The substrate portion may include a polymer resin. The substrate portion may include a thermoplastic resin. The sensing coil may include sensing coils configured on the front and back sides of the substrate layer and insulated from each other.

[0090] That is, the digitizer 200 according to the present invention can simultaneously function as a protective component and a sensing component for sensing input from an electronic pen. The functions of the protective component and the sensing component will be described later.

[0091] The buffer layer 300 may be disposed below the digitizer 200. Figure 3 Different from the above, the buffer layer 300 can be disposed above the digitizer 200. The buffer layer 300 can protect the display module 100 from the impact transmitted from the bottom of the display module 100. The buffer layer 300 can include foamed foam or sponge. The foamed foam can include polyurethane foam or thermoplastic polyurethane foam. In the case where the buffer layer 300 includes foamed foam, the buffer layer 300 can be attached with a barrier film as a base layer, and the foaming agent can be foamed on the barrier film to form the buffer layer 300.

[0092] The buffer layer 300 may include a first buffer layer 310 and a second buffer layer 320. The first buffer layer 310 may overlap a portion of the folding portion 230 and the first non-folding portion 210. The second buffer layer 320 may overlap another portion of the folding portion 230 and the second non-folding portion 220. The first buffer layer 310 and the second buffer layer 320 may be spaced apart from each other along the first direction DR1 within the folding area FA.

[0093] When the electronic device 1000 is in the first mode, the first buffer layer 310 and the second buffer layer 320 may prevent foreign matter from flowing into the hole HL defined in the folding portion 230. When the electronic device 1000 is in the second mode, even if the folding portion 230 has a predetermined curvature and is folded, the shape of the digitizer 200 may be easily deformed according to the first buffer layer 310 and the second buffer layer 320 being spaced apart from each other in the region overlapping the folding portion 230.

[0094] The window 400 may be disposed on the display module 100. The window 400 may be combined with a housing (not shown) to define an appearance and protect the display module 100. The window 400 may include an optically transparent substance so that light provided from the display module 100 can be transmitted. The window 400 provides a display surface FS (refer to FIG. 1 ) of the electronic device 1000. Figure 1a ).

[0095] The window body 400 may include a first layer 410, a second layer 420, and a bezel pattern BZ. The first layer 410 may include glass.

[0096] The second layer 420 is disposed on the first layer 410. The second layer 420 may include a substance having a relatively lower modulus than the first layer 410. For example, the second layer 420 may be a film including an organic substance. The second layer 420 may have a relatively higher thickness than the first layer 410. Thus, the second layer 420 may protect the upper surface of the first layer 410.

[0097] The second layer 420 may include at least one functional layer, and the functional layer may include at least one of a window protection layer, a fingerprint prevention layer, and a reflection prevention layer.

[0098] The window 400 can transmit the image from the display module 100 while relieving external impact, thereby preventing the display module 100 from being damaged or malfunctioning due to external impact.

[0099] The window 400 according to an embodiment may include thin-film glass or synthetic resin film. In the case where the window 400 includes thin-film glass, the thickness of the window 400 may be 100 μm or less. For example, the thickness of the window 400 may be 30 μm, but is not limited thereto.

[0100] In the case where the window 400 includes a synthetic resin film, the window 400 may include a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0101] The window 400 may have a multi-layer structure or a single-layer structure. For example, the window 400 may include a plurality of synthetic resin films bonded by an adhesive, or include a glass substrate and a synthetic resin film bonded by an adhesive.

[0102] The window 400 may be made of a flexible material. Thus, the window 400 may be folded or unfolded with the folding axis AX as the center. That is, according to the operation of the first mode and the second mode, the shape of the window 400 may also be deformed corresponding to the digitizer 200.

[0103] The optical layer OPL may be disposed between the display module 100 and the window 400. The optical layer OPL may be combined with the window 400 through the first adhesive layer AD1. In addition, the optical layer OPL may be combined with the display module 100 through the second adhesive layer AD2.

[0104] The optical layer OPL may reduce the reflectivity of external light. The optical layer OPL may include a stretched synthetic resin film. For example, the optical layer OPL may be provided by dyeing an iodine compound on a polyvinyl alcohol film (PVA film). In addition, the optical layer OPL may also include a color filter. If the optical layer OPL can reduce the reflectivity of external light, it may include various layers, not limited to any one embodiment.

[0105] The panel protection layer PFL may be disposed between the display module 100 and the digitizer 200. The panel protection layer PFL and the display module 100 may be bonded by a third adhesive layer AD3. The panel protection layer PFL may be disposed on the lower side of the display module 100 to protect the lower side of the display module 100. The panel protection layer PFL may include a flexible plastic material. For example, the panel protection layer PFL may include polyethylene terephthalate. In this specification, the panel protection layer PFL may be referred to as a protective layer and the same reference numerals may be used.

[0106] The digitizer 200 and the panel protection layer PFL may be combined by a fourth adhesive layer AD4. The fourth adhesive layer AD4 may include a 4-1st adhesive layer AD4-1 and a 4-2nd adhesive layer AD4-2. The 4-1st adhesive layer AD4-1 and the 4-2nd adhesive layer AD4-2 may be separated from each other via the folding area FA.

[0107] It can be that the 4-1st adhesive layer AD4-1 can be arranged between the digitizer 200 and the panel protection layer PFL corresponding to the first unfolding area NFA1, and the 4-2nd adhesive layer AD4-2 can be arranged between the digitizer 200 and the panel protection layer PFL corresponding to the second unfolding area NFA2. Through this, it can be that the 4-1st adhesive layer AD4-1 combines the first unfolding portion 210 with a part of the panel protection layer PFL, and the 4-2nd adhesive layer AD4-2 combines the second unfolding portion 220 with another part of the panel protection layer PFL.

[0108] The electronic device 1000 may further include a metal plate CS, an insulating layer TP, and a step compensation component AS disposed on the lower side of the buffer layer 300. The metal plate CS may absorb external impact and protect the display module 100. The metal plate CS may include stainless steel. The metal plate CS may include a first metal layer CS1 and a second metal layer CS2. The first shielding layer 241 may be combined with the first buffer layer 310 through a portion of the fifth adhesive layer AD5, and the second shielding layer 242 may be combined with the second buffer layer 320 through another portion of the fifth adhesive layer AD5.

[0109] The insulating layer TP may be disposed under the metal plate CS. The insulating layer TP may prevent static electricity from flowing into the metal plate CS. The insulating layer TP may be an insulating film. The insulating layer TP may be provided as a first insulating layer TP1 and a second insulating layer TP2, thereby being bonded to each of the first metal layer CS1 and the second metal layer CS2.

[0110] The step compensation part AS is bonded to the lower side of the buffer layer 300. The step compensation part AS may be a double-sided tape or an insulating film. The step compensation part AS may be provided as a first step compensation part AS1 and a second step compensation part AS2, so as to be bonded to each of the first buffer layer 310 and the second buffer layer 320.

[0111] The electronic device 1000 according to an embodiment may omit at least any one of the metal plate CS, the insulating layer TP, and the step compensation part AS, without being limited to any one embodiment.

[0112] Figure 4a It is a plan view of a digitizer according to an embodiment of the utility model. Figure 4b It is a rear view of a digitizer according to an embodiment of the utility model. Figure 5a Is magnification Figure 4a Floor plan of the AA' area. Figure 5b is a cross-sectional view of a digitizer according to an embodiment of the utility model. Figure 6a It is a cross-sectional view of a base layer according to an embodiment of the present utility model. Figure 6b It is a plan view of a base layer according to an embodiment of the utility model.

[0113] Figure 4a The sensing coils configured at the front 200 -U of the digitizer 200 are shown as an example. Figure 4b The sensing coils configured on the back side 200 -B of the digitizer 200 are shown as an example. Figure 4a As shown in FIG. 2 , a plurality of first sensing coils RF are configured at the front 200-U of the digitizer 200. Figure 4b 2 shows that a plurality of second sensing coils CF are arranged on the back side 200 -B of the digitizer 200 . However, the embodiment is not limited thereto, and a plurality of second sensing coils CF may be arranged on the front side 200 -U of the digitizer 200 , and a plurality of first sensing coils RF may be arranged on the back side 200 -B of the digitizer 200 .

[0114] Reference Figure 4a as well as Figure 4bThe digitizer 200 may include an active area AA and a peripheral area NAA. The active area AA may be defined as an area for sensing pen input, and the peripheral area NAA is an area for configuring connection wiring for each loop of the sensing coils RF and CF. The digitizer 200 may include a plurality of sensing coils RF and CF and a connector CT.

[0115] Each of the plurality of first sensing coils RF may include a long side portion and a short side portion. Each of the long side portions of the plurality of first sensing coils RF may extend in the first direction DR1 and may be separated from each other along the second direction DR2. The short side portion of the first sensing coil RF may be connected to the end of each of the long side portions to connect the long side portions separated from each other. Therefore, each of the plurality of first sensing coils RF may form a loop.

[0116] The long side portion and the short side portion of each of the plurality of first sensing coils RF may be arranged on the same layer, but is not limited thereto. For example, the long side portion and the short side portion may be arranged on different layers from each other. In addition, the plurality of first sensing coils RF forming a loop may be arranged spaced apart from each other, and the long side portions of the coils adjacent to each other in the plurality of first sensing coils RF forming a loop may also be arranged alternately with each other.

[0117] In one embodiment, each of the plurality of first sensing coils RF may include a first portion RF1, a second portion RF2, and a third portion RF3 connected to each other. In one embodiment, the first portion RF1 and the second portion RF2 may be configured to be separated along the first direction DR1. The third portion RF3 may be configured between the first portion RF1 and the second portion RF2 to connect the first portion RF1 and the second portion RF2. For example, the first portion RF1 may be configured at the first non-folding portion 210, the second portion RF2 may be configured at the second non-folding portion 220, and the third portion RF3 may be configured at the folding portion 230.

[0118] Each of the plurality of second sensing coils CF may include a long side L2-1, L2-2 extending in the second direction DR2 and a routing wiring RL extending in the first direction DR1 and connecting one end of each of the long sides L2-1, L2-2 separated in the first direction DR1. In one embodiment, the long sides L2-1, L2-2 of the plurality of second sensing coils CF may be disposed in the first and second non-folding portions 210, 220, but not in the folding portion 230.

[0119] One end of each of the second sensing coils CF extending to the peripheral area NAA may be connected to the connector CT.

[0120] In the present embodiment, the plurality of first sensing coils RF may be referred to as sensing coils, and the plurality of second sensing coils CF may be referred to as driving coils, but it is not limited thereto, and it may be the other way around. In addition, the plurality of first sensing coils RF may be referred to as first coils, and the plurality of second sensing coils CF may be referred to as second coils. If current flows in the plurality of second sensing coils CF, magnetic lines of force may be induced between the plurality of second sensing coils CF and the plurality of first sensing coils RF. The plurality of first sensing coils RF may sense the induced electromagnetic force emitted from the electronic pen and output it as a sensing signal to one terminal of each of the plurality of first sensing coils RF. One terminal of each of the plurality of first sensing coils RF may be connected to a signal line arranged in the peripheral area NAA.

[0121] Figure 5a Is magnification Figure 4a Floor plan of the AA' area. Figure 5b is a cross-sectional view of a digitizer according to an embodiment of the present utility model. Figure 5a When the digitizer of one embodiment is viewed from a plan view, the first insulating layer IL1 is omitted and illustrated, which corresponds to a plan view of a base layer.

[0122] exist Figure 5a The first and second wirings L-1 and L-2 are exemplarily shown in FIG. The first and second wirings L-1 and L-2 may be arranged on the base layer BG. Each of the first and second wirings L-1 and L-2 may be connected to the reference Figure 4a The first sensing coil FR may correspond to any one of the first sensing coils FR described above. For example, the first and second wirings L-1 and L-2 may correspond to the first and second non-folded portions 210 and 220. The first and second wirings L-1 and L-2 may correspond to the third portion RF3.

[0123] Refer to Figures 4a to 5b , each of the first and second wirings L-1, L-2 arranged in the first and second non-folding portions 210, 220 may extend in the first direction DR1 and be arranged spaced apart from each other along the second direction DR2. The first and second wirings L-1, L-2 may be arranged adjacent to each other on a plane and form a first group of wirings. In one embodiment, the plurality of first sensing coils RF may be a first group of wirings of the first and second wirings L-1, L-2 arranged along the second direction DR repeatedly arranged. The spacing distance between the first wiring L-1 and the second wiring L-2 included in different first groups of wirings in two first groups of wirings arranged adjacently along the second direction DR2 may be greater than the spacing distance between the first wiring L-1 and the second wiring L-2 included in the same first group of wirings.

[0124] Each of the holes HL defined in the folding portion 230 may have a first width in the first direction DR1 smaller than a second width in the second direction DR2 on a plane defined by the first direction DR1 and the second direction DR2 .

[0125] The plurality of holes HL may be provided as a plurality of columns. In one embodiment, the plurality of holes HL may include a first group of holes H1 and a second group of holes H2. For example, the first group of holes H1 may include a 1-1 hole H1-1 and a 1-2 hole H1-2 arranged in the second direction DR2. The second group of holes H2 may be spaced apart from the first group of holes H1 along the first direction DR1, including a 2-1 hole H2-1 and a 2-2 hole H2-2 arranged in the second direction DR2.

[0126] In one embodiment, the second group of holes H2 may be shifted from the first group of holes H1 by a predetermined distance in the second direction DR2. According to one embodiment, the shift distance may be less than half of the second width. Therefore, the shape of the remaining portion of the folding portion 230 except the holes HL may have a lattice-like slit shape.

[0127] In addition, the plurality of holes HL may be provided in a plurality of rows. For example, each of the plurality of 1-1 holes H1-1 arranged in a row may be spaced apart from each other in the first direction DR1 and extend in the second direction DR2. Each of the plurality of 2-1 holes H2-1 arranged in a row may be spaced apart from each other in the first direction DR1 and extend in the second direction DR2.

[0128] The plurality of holes HL may be formed by various methods, such as by a laser process or a micro sandblasting process, but is not limited thereto.

[0129] In one embodiment, the base layer BG may include a plurality of engraved patterns PP disposed in the folded portion 230. The first and second wirings L-1 and L-2 disposed in the folded portion 230 may be disposed in the plurality of engraved patterns PP. The engraved pattern PP may be a shape that is recessed in the thickness direction of the base layer BG.

[0130] According to one embodiment, the first and second wirings L-1 and L-2 arranged in the plurality of engraved patterns PP may include liquid metal. Liquid metal is a metallic substance with a low melting point and can maintain a liquid phase at room temperature, such as gallium alloy, EGain (Eutectic Gallium-Indium), gallium indium tin alloy (Galinstan), etc. Liquid metal can have an electrical conductivity (about 1×10 3 S / m~1×10 7 S / m) and exhibited a resistivity (volume resistance) of 1×10 -4The low resistance of less than Ω shows excellent wiring sensitivity. According to one embodiment of the utility model, since the wiring arranged in the folding part 230 is formed of liquid metal, cracks and disconnections of the wiring can be prevented even in multiple folding operations. Thus, the electronic device 1000 of one embodiment can prevent resistance increase and driving defects at the folding part.

[0131] In one embodiment, the third portion RF3 corresponding to the first and second wirings L-1 and L-2 configured in the folding portion 230 may include liquid metal and be configured in a plurality of engraved patterns PP. For example, the third portion RF3 may be configured in a plurality of engraved patterns PP and include at least one of gallium alloy, EGain (Eutectic Gallium-Indium; eutectic gallium-indium alloy) and gallium indium tin alloy (Galinstan). For example, the third portion RF3 may be a gallium alloy. By molding and filling the plurality of engraved patterns PP according to the third portion RF3, the fluidity of the liquid metal may be prevented.

[0132] In addition, liquid metal has high surface tension, so when the first and second wirings L-1 and L-2 are arranged in a plurality of engraved patterns PP, the height of the first and second wirings L-1 and L-2 can be higher than the top of the base layer BG. That is, the base layer BG of one embodiment can be arranged in a plurality of engraved patterns PP, and the top of the third part RF3 in the thickness direction is located at a position higher than the top of the base layer BG. Through this, the first and second wirings L-1 and L-2 arranged in the folding portion 230 can be in direct contact with the first and second wirings L-1 and L-2 arranged in the first and second non-folding portions 210 and 220. Therefore, the electronic device 1000 of one embodiment can prevent the sensitivity from being improved due to the increase in resistance generated by the oxide film even if the folding portion 230 includes wiring made of liquid metal.

[0133] In one embodiment, each of the plurality of engraved patterns PP may include a plurality of first patterns P1 and a plurality of second patterns P2 configured to surround a portion of a corresponding hole HL among the plurality of holes HL. Each of the plurality of first patterns P1 may be arranged along the first direction DR1, and two adjacent first patterns P1 may be connected by a third pattern P3. Each of the plurality of second patterns P2 may be arranged along the first direction DR1, and two adjacent second patterns P2 may be connected by a fourth pattern P4. Each of the plurality of first patterns P1 may be configured to be separated from the plurality of second patterns P2 in the second direction DR2.

[0134] Each of the first patterns P1 may include a 1-1 pattern P1-1, a 1-2 pattern P1-2, and a 1-3 pattern P1-3. Each of the 1-1 pattern P1-1 and the 1-2 pattern P1-2 may extend in the second direction DR2 and be arranged in the first direction DR1 separated by any one of the plurality of holes HL. The 1-3 pattern P1-3 may connect the 1-1 pattern P1-1 and the 1-2 pattern P1-2 which are arranged separated by one hole. For example, the 1-1 pattern P1-1 may be arranged separated from the 1-2 pattern P1-2 in the first direction DR1 separated by the 2-2 hole H2-2. In addition, the 1-3 pattern P1-3 may connect the 1-1 pattern P1-1 and the 1-2 pattern P1-2 which are arranged on both sides of the 2-2 hole H2-2 along the first direction DR1.

[0135] Each of the second patterns P2 may include a 2-1st pattern P2-1, a 2-2nd pattern P2-2, and a 2-3rd pattern P2-3. Each of the 2-1st pattern P2-1 and the 2-2nd pattern P2-2 may extend in the second direction DR2 and be arranged in a spaced relationship in the first direction DR1 across any one of the plurality of holes HL. The 2-3rd pattern P2-3 may connect the 2-1st pattern P2-1 and the 2-2nd pattern P2-2, which are arranged in a spaced relationship across one hole. For example, the 2-1st pattern P2-1 may be arranged in a spaced relationship from the 2-2nd pattern P2-2 across the 2-2nd hole H2-2 in the first direction DR1. In addition, the 2-3rd pattern P2-3 may connect the 2-1st pattern P2-1 and the 2-2nd pattern P2-2, which are arranged on both sides of the 2-2nd hole H2-2 along the first direction DR1.

[0136] According to an embodiment, any two engraved patterns PP among the plurality of engraved patterns PP on a plane may extend in the first direction DR1 and be spaced apart in the second direction DR2 across any one of the plurality of holes HL. The first spacing distance dt1 between the two engraved patterns PP arranged on both sides of any one of the holes along the second direction DR2 may be greater than 5.5 mm and less than 7.5 mm. For example, the 1-3 pattern P1-3 and the 2-3 pattern may be spaced apart along the second direction DR2, and the first spacing distance dt1 between the 1-3 pattern P1-3 and the 2-3 pattern P2-3 may be greater than 5.5 mm and less than 7.5 mm.

[0137] According to an embodiment, any two engraved patterns PP among the plurality of engraved patterns PP on a plane may extend in the second direction DR2 and be spaced apart in the first direction DR1 across any one of the plurality of holes HL. In this case, the second spacing distance dt2 between the two engraved patterns PP arranged on both sides of any one of the holes along the first direction DR1 may be greater than 0.1 mm and less than 0.6 mm. For example, the second spacing distance dt2 between the 1-1 pattern P1-1 and the 1-2 pattern P1-2 spaced apart in the first direction DR1 may be greater than 0.1 mm and less than 0.6 mm.

[0138] According to an embodiment, the plurality of engraved patterns PP may include any two engraved patterns PP extending in the first direction DR1 and spaced apart in the second direction DR2 between two holes HL adjacent to each other in the second direction DR2 among the plurality of holes HL on a plane. Two engraved patterns PP spaced apart from each other between holes HL adjacent to each other in the second direction DR2 included in the same group of holes may have a third spacing distance dt3 and a fourth spacing distance dt4. In an embodiment, the third spacing distance dt3 may be a spacing distance between the two engraved patterns PP excluding the width of each of the two engraved patterns PP. The fourth spacing distance dt4 may be a spacing distance between the two engraved patterns PP including the width of each of the two engraved patterns PP.

[0139] In one embodiment, the third separation distance dt3 may be greater than 0.01 mm. For example, the third separation distance dt3 may be greater than 0.01 mm and less than 0.18 mm. The fourth separation distance dt4 may be less than 0.2 mm. For example, the fourth separation distance dt4 may be greater than 0.02 mm and less than 0.2 mm.

[0140] For example, the third spacing distance dt3 between the 1-3 pattern P1-3 and the 2-3 pattern P2-3 disposed between the 2-1 hole H2-1 and the 2-2 hole H2-2 adjacently disposed in the second direction DR2 may be greater than 0.01 mm, and the fourth spacing distance dt4 may be less than 0.2 mm.

[0141] In one embodiment, the engraved pattern PP may have a predetermined width dt5. For example, each engraved pattern PP may have a width dt5 of 0.01 mm or more and 0.09 mm or less.

[0142] Reference Figure 5b According to an embodiment, the digitizer 200 may include a base layer BG, first and second sensing coils RF and CF disposed on the base layer BG, and a first insulating layer IL1 and a second insulating layer IL2 disposed on the base layer BG and covering the corresponding first and second sensing coils RF and CF.

[0143] A first sensing coil RF may be disposed on one surface of the base layer BG. A second sensing coil CF may be disposed on the other surface of the base layer BG facing the one surface. Figure 5b In the figure, the first sensing coil RF is arranged in front of the base layer BG, and the second sensing coil CF is arranged on the back of the base layer BG, but this is exemplary and the embodiment is not limited thereto. For example, the first sensing coil RF may be arranged on the back of the base layer BG, and the second sensing coil CF may be arranged in front of the base layer BG.

[0144] The hole HL defined in the folded portion 230 of the digitizer 200 may be formed from the front surface to the back surface of the base layer BG.

[0145] The first insulating layer IL1 may be disposed in front of the digitizer 200 to cover the first sensing coil RF. The first insulating layer IL1 may define a first opening corresponding to the hole HL.

[0146] The second insulating layer IL2 may be disposed on the back side of the digitizer 200 to cover the second sensing coil CF. The second insulating layer IL2 may define a second opening corresponding to the hole HL.

[0147] Since the first opening, the hole HL, and the second opening are penetrated by the same process, the corresponding first opening, the hole HL, and the second opening may be aligned along the third direction DR3.

[0148] According to the present embodiment, the first and second insulating layers IL1 and IL2 may have a predetermined color. For example, the first and second insulating layers IL1 and IL2 may have a black color. This may be formed by coating an insulating material including a dye / pigment on the base layer BG. Each of the first and second insulating layers IL1 and IL2 may include a single layer or multiple layers of an inorganic layer or an organic layer, not limited to any one embodiment.

[0149] Figure 6a It is a cross-sectional view of a base layer according to an embodiment of the present utility model. Figure 6b is a plan view of a base layer according to an embodiment of the present utility model. Figures 1a to 5b The same / similar structures as described in the description will be marked with the same / similar reference numerals, and repeated description will be omitted.

[0150] Reference Figure 6a as well as Figure 6b , the base layer BG according to an embodiment may include a matrix MT including a filler, and fiber lines FL1 , FL2 in a woven shape arranged inside the matrix MT.

[0151] The fiber lines FL1 and FL2 may be arranged alternately along the first direction DR1 and the second direction DR2 to have a fabric shape on a plane. Each of the fiber lines FL1 and FL2 may be provided in the form of a bundle of a plurality of glass fibers GL. The diameter of a strand of glass fiber GL included in one fiber line may be greater than 3 um and less than 10 um.

[0152] The fiber lines FL1 and FL2 may be glass fiber reinforced plastic (GFRP). The fiber lines FL1 and FL2 may be disposed inside the matrix MT. According to an embodiment, the matrix MT may include at least any one of epoxy, polyester, polyamide, polycarbonate, polypropylene, polybutylene, and vinyl ester.

[0153] The matrix MT may include a filler. The filler may include at least any one of silica, barium sulfate, sintered talc, barium titanate, titanium oxide, clay, alumina, mica, boehmite, zinc borate, and zinc titanate.

[0154] According to one embodiment, the digitizer 200 (see Figure 2 ) can be configured to protect the display module 100 (see Figure 2 ) below.

[0155] Therefore, the digitizer 200 of the present invention can be a structure that functions as a protective component and a sensing component at the same time. Thus, a separate metal plate for protecting the display module 100 can be omitted, and a separate digitizer disposed in the folding portion 230 can be omitted. Therefore, costs can be saved and a slim electronic device 1000 can be provided.

[0156] Figure 7a to Figure 7h is a cross-sectional view exemplarily showing a method for manufacturing a digitizer according to an embodiment of the present utility model. Figures 2 to 6b The same / similar structures as described in the description will be marked with the same / similar reference numerals, and repeated description will be omitted.

[0157] Reference Figure 7a According to an embodiment of the digitizer manufacturing method, a plurality of engraved patterns PP may be formed on the front of the base layer BG. The plurality of engraved patterns PP may be formed on the folding portion 230 of the digitizer (refer to Figure 3 wait).

[0158] Reference Figure 7b According to an embodiment of the digitizer manufacturing method, a first conductive layer RF' may be formed in front of the base layer BG, and a second conductive layer CF' may be formed on the back of the base layer BG. The first conductive layer RF' and the second conductive layer CF' may include copper. The first conductive layer RF' and the second conductive layer CF' may be respectively Figure 4a The first and second parts RF1, RF2 and the second sensing coil CF described above correspond to each other.

[0159] Afterwards, refer to Figure 7c , which may include the step of patterning the conductive layers RF', CF'.

[0160] The first conductive layer RF′ may be patterned to form the first sensing coil RF disposed in the first and second unfolding regions 210 and 220 ( Figure 4a ) first part RF1 and second part RF2, the second conductive layer CF' is patterned to form a second sensing coil CF. The first part RF1, the second part RF2 and the second sensing coil CF can be connected to the Figure 4a as well as Figure 4b The configurations and shapes of the first part RF1, the second part RF2 and the second sensing coil CF correspond.

[0161] Afterwards, refer to Figure 7d , may include the step of filling the plurality of engraved patterns PP with liquid metal. The liquid metal filled in the plurality of engraved patterns PP may be disposed in the folding portion 230 ( Figure 4a The liquid metal filled in the plurality of engraving patterns PP may have a high surface tension and be filled to a height higher than the upper surface of the base layer BG, thereby directly contacting the first portion RF1 and the second portion RF2.

[0162] Afterwards, refer to Figure 7e , may include the step of forming a contact hole CT1 in the base layer BG. The contact hole CT1 may be formed through the front and back sides of the base layer BG. The contact hole CT1 may be formed in Figure 4a The area is defined as NAA.

[0163] Afterwards, refer to Figure 7f, may include the step of plating the contact hole CT1. According to the plating process of the contact hole CT1, the inside of the contact hole CT1 may be filled with a metal material. Thus, a part of the coil arranged in front of the base layer BG among the coils arranged in the peripheral area NAA may be connected to the coil arranged on the back of the base layer BG.

[0164] Afterwards, refer to Figure 7g , may include the steps of forming insulating layers IL1 and IL2 on the base layer BG. The first insulating layer IL1 may be disposed in front of the base layer BG, covering the first sensing coil RF. The second insulating layer IL2 may be disposed on the back of the base layer BG, covering the second sensing coil CF. The insulating layers IL1 and IL2 may have a black color. This may be formed by coating an insulating substance including a dye / pigment on the base layer BG.

[0165] Afterwards, refer to Figure 7h , may include the step of forming a plurality of holes HL penetrating the base layer BG. By removing the first and second insulating layers IL1 and IL2 simultaneously in the process of forming the plurality of holes HL, an opening corresponding to the plurality of holes HL may be formed in each of the first and second insulating layers IL1 and IL2. Thus, the openings formed in the first and second insulating layers IL1 and IL2 corresponding to the plurality of holes HL may be aligned with each other in the third direction DR3.

[0166] The above description is made with reference to the preferred embodiments of the utility model, but a skilled person in the technical field or a person with general knowledge in the technical field will understand that various modifications and changes can be made to the utility model without departing from the concept of the utility model and the scope of the technical field as recorded in the attached claims.

[0167] Therefore, the technical scope of the present invention is not limited by the contents described in the detailed description of the specification, and should be determined only by the claims.

Claims

1. An electronic device, characterized in that: include: The display module comprises: a first non-folding area and a second non-folding area arranged along a first direction; and a folding area arranged between the first non-folding area and the second non-folding area and folded based on an imaginary folding axis extending along a second direction intersecting the first direction; and A digitizer is disposed below the display module. The digitizer comprises: The base layer comprises: a first unfolded portion overlapping the first unfolded area; a second unfolded portion overlapping the second unfolded area; and a folded portion overlapping the folded area and defining a plurality of holes; a plurality of first coils, each provided on one side of the base layer, and comprising: a first portion overlapping the first non-folded portion and extending in the first direction; a second portion overlapping the second non-folded portion and extending in the first direction; and a third portion overlapping the folded portion and surrounding a corresponding hole among the plurality of holes; and A plurality of second coils are provided on the other side of the base layer facing the one side, The base layer includes a plurality of engraved patterns arranged on the folded portion, The third portion is formed of liquid metal and is disposed within the engraved pattern.

2. The electronic device according to claim 1, characterized in that: The liquid metal is any one of a gallium alloy, a eutectic gallium-indium alloy, and a gallium-indium-tin alloy.

3. The electronic device according to claim 1, characterized in that: The first portion and the second portion are formed of copper.

4. The electronic device according to claim 1, characterized in that: Each of the plurality of engraved patterns includes: a plurality of first patterns and a plurality of second patterns, configured to surround a portion of a corresponding hole among the plurality of holes, The plurality of engraving patterns also include: a third pattern connecting two first patterns arranged adjacent to each other along the first direction; and a fourth pattern connecting two second patterns arranged adjacent to each other along the first direction, Each of the first patterns comprises: The 1-1 pattern and the 1-2 pattern each extend in the second direction and are arranged along the first direction with a hole between them; and the 1-3 pattern connects the 1-1 pattern and the 1-2 pattern, Each of the second patterns comprises: The 2-1 pattern and the 2-2 pattern each extend in a direction opposite to the second direction and are arranged along the first direction with the one hole interposed therebetween; and the 2-3 pattern connects the 2-1 pattern and the 2-2 pattern.

5. The electronic device according to claim 1, characterized in that: On a plane, the plurality of engraved patterns include two engraved patterns extending in the first direction and spaced apart in the second direction via a hole. The spacing distance between the two engraving patterns is greater than 5.5 mm and less than 7.5 mm.

6. The electronic device according to claim 1, characterized in that: On a plane, each of the plurality of engraved patterns includes two engraved patterns extending in the second direction and spaced apart in the first direction via a hole. The spacing distance between the two engraving patterns is greater than 0.1 mm and less than 0.6 mm.

7. The electronic device according to claim 1, characterized in that: On a plane, the plurality of engraved patterns include two engraved patterns each extending in the first direction and spaced apart in the second direction between holes adjacent to each other in the second direction among the plurality of holes, The separation distance between the two engraved patterns, excluding the width of each of the two engraved patterns, is greater than 0.01 mm, The separation distance between the two engraved patterns including the width of each of the two engraved patterns is less than 0.2 mm.

8. The electronic device according to claim 1, characterized in that: The width of each of the engraved patterns is 0.01 mm or more and 0.09 mm or less.

9. The electronic device according to claim 1, characterized in that: Each of the plurality of holes includes a first group of holes and a second group of holes extending in the second direction and arranged spaced apart from each other along the second direction, The second group of holes is displaced from the first group of holes in the second direction by a predetermined distance.

10. The electronic device according to claim 1, characterized in that: The base layer includes: a matrix including a filler; and a woven fiber line arranged inside the matrix, The matrix is ​​any one of epoxy resin, polyester, polyamide, polycarbonate, polypropylene, polybutylene and vinyl ester, The filler is any one of silicon dioxide, barium sulfate, sintered talc, barium titanate, titanium oxide, clay, alumina, mica, boehmite, zinc borate, and zinc titanate.

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