Passive electronic tag device

Abstract

The utility model discloses a passive electronic tag device, which belongs to the field of electronic tags and comprises a passive electronic tag, a storage substrate for storing the passive electronic tag is arranged on the periphery of the passive electronic tag, and a vacuum adsorption device is arranged below the storage substrate. The storage substrate is pasted in a shell of the vacuum adsorption device through glue. Compared with the prior art, the passive electronic tag device has the advantages that the passive electronic tag device is adsorbed on the surface of a product through the vacuum adsorption device, tearing marks can be prevented from being left when the passive electronic tag device is taken down from some products with high appearance requirements, and only the adsorption shell needs to be rotated during installation; therefore, the passive electronic tag device can be tightly attached to the outer wall of the product.

Description

Technical Field

[0001] The utility model relates to the field of electronic tags, in particular to a passive electronic tag device. Background Art

[0002] In the daily production process, in order to facilitate classification and statistics, people often use labels to classify and record different products. At the beginning, most of them used paper labels. With the development of the electronics industry, labels have gradually developed into active electronic tags, semi-active electronic tags and passive electronic tags, among which passive electronic tag devices have the widest application range.

[0003] In the existing passive electronic tag device, the passive electronic tag is usually attached to a storage substrate by means of conductive adhesive, and then the storage substrate is attached to the outer wall of the product by means of glue.

[0004] Although current passive electronic tag devices can be used to classify and manage product shelves, when facing some products with high appearance requirements such as transparent glass, if the passive electronic tag devices are pasted with glue or tape, it will inevitably leave marks on these products when they are torn off. If tools such as scrapers are used to remove the glue marks, the products may be damaged, thus affecting the overall appearance. Utility Model Content

[0005] The technical problem to be solved by the utility model is that the existing passive electronic tag device cannot be disassembled and assembled without traces.

[0006] In order to solve the above technical problems, the technical solution provided by the utility model is: a passive electronic tag device, including a passive electronic tag, a storage substrate for storing the passive electronic tag is arranged around the passive electronic tag, a vacuum adsorption device is arranged under the storage substrate, and the storage substrate is adhered to the shell of the vacuum adsorption device by glue.

[0007] As an improvement, the passive electronic tag includes a chip, a capacitor and a coil from inside to outside, and the chip and the coil are connected to the capacitor through a wire.

[0008] As an improvement, the storage substrate is connected to the passive electronic tag by means of conductive adhesive, and an upper shell for sealing the passive electronic tag is provided above the storage substrate.

[0009] As an improvement, the vacuum adsorption device includes an adsorption shell, a hollow EVC foam ring glued to the bottom surface of the adsorption shell by glue, an adsorption plate connected to the bottom of the adsorption shell by a bolt structure, and an adsorption film located on the bottom surface of the adsorption plate, the adsorption film is glued to the bottom surface of the adsorption plate by glue, the adsorption plate passes through the inner circle of the hollow EVC foam ring, the bottom surface of the adsorption shell is provided with a plate groove for storing the adsorption plate, and the threaded rod is connected to the plate groove by a bolt structure.

[0010] As an improvement, a threaded rod passing through the bottom surface of the plate groove is provided on the surface opposite to the adsorption film of the adsorption plate, and a tear notch is provided on one side of the adsorption film.

[0011] As an improvement, the adsorption shell is a one-way open shell, and the open end of the adsorption shell is provided with a substrate groove for placing and storing the substrate, and the storage substrate is adhered to the bottom surface of the substrate groove by glue.

[0012] The advantages of the utility model compared with the prior art are: the device absorbs the passive electronic tag device on the surface of the product through a vacuum adsorption device, which can avoid leaving tear marks when removing the passive electronic tag device on some products with high appearance requirements, and during installation, only the adsorption shell needs to be rotated to make the passive electronic tag device close to the outer wall of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a general structural diagram of a passive electronic tag device of the utility model.

[0014] Figure 2 It is an exploded view of a passive electronic tag of a passive electronic tag device of the utility model.

[0015] Figure 3 It is an exploded view of a vacuum adsorption device of a passive electronic tag device of the utility model.

[0016] Figure 4 It is a cross-sectional view of a vacuum adsorption device of a passive electronic tag device of the utility model.

[0017] As shown in the figure: 1. Passive electronic tag; 11. Chip; 12. Capacitor; 13. Coil; 2. Storage substrate; 21. Upper shell; 3. Vacuum adsorption device; 31. Adsorption shell; 311. Substrate groove; 32. Hollow EVC foam ring; 33. Adsorption plate; 331. Threaded rod; 34. Adsorption film; 341. Tear; 35. Plate groove. DETAILED DESCRIPTION

[0018] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0019] As the instruction manual Figure 1 , 2As shown, it includes a passive electronic tag 1, and a storage substrate 2 for storing the passive electronic tag 1 is arranged around the passive electronic tag 1, a vacuum adsorption device 3 is arranged below the storage substrate 2, and the storage substrate 2 is adhered to the shell of the vacuum adsorption device 3 by glue. The passive electronic tag 1 includes a chip 11, a capacitor 12 and a coil 13 from the inside to the outside, and the chip 11 and the coil 13 are connected to the capacitor 12 by wires. The storage substrate 2 is adhered and connected to the passive electronic tag 1 by conductive glue, and an upper shell 21 for sealing the passive electronic tag 1 is arranged above the storage substrate 2, and the upper shell 21 is connected to the side wall of the storage substrate 2 by glue.

[0020] As the instruction manual Figure 1 , 3 As shown in Figure 4, the vacuum adsorption device 3 includes an adsorption shell 31, a hollow EVC foam ring 32 adhered to the bottom surface of the adsorption shell 31 by glue, an adsorption plate 33 connected to the bottom of the adsorption shell 31 by a bolt structure, and an adsorption membrane 34 located on the bottom surface of the adsorption plate 33, the adsorption membrane 34 is adhered to the bottom surface of the adsorption plate 33 by glue, the adsorption plate 33 passes through the inner circle of the hollow EVC foam ring 32, the bottom surface of the adsorption shell 31 is provided with a plate groove 35 for storing the adsorption plate 33, the opposite surface of the adsorption plate 33 of the adsorption membrane 34 is provided with a threaded rod 331 passing through the bottom surface of the plate groove 35, and one side of the adsorption membrane 34 is provided with There is a tear 341, and the threaded rod 331 is connected to the plate groove 35 through a bolt structure. The adsorption shell 31 is a one-way open shell. The open end of the adsorption shell 31 is provided with a substrate groove 311 for placing and storing the substrate 2. The storage substrate 2 is glued to the bottom surface of the substrate groove 311 by glue. By rotating the adsorption shell 31, the adsorption plate 33 is driven by the threaded rod 331 to move upward to the groove hole of the plate groove 35, and the central part of the adsorption film 34 under the adsorption plate 33 is also offset, so that the central part of the adsorption film 34 and the outer wall of the adsorption product form a vacuum area, so that the adsorption shell 31 is hung on the outer wall of the adsorption product.

[0021] In the specific implementation of the utility model, the chip 1 is adhered to the storage substrate 2 through conductive glue, and the capacitor 12 and the coil 13 are connected in sequence by wires; the notched line segment of the capacitor 12 is welded to the line interface of the chip 1 through wires; conductive glue is applied to the connection parts of the capacitor 12, the coil 13 and the storage substrate 2, glue is applied to the outer periphery of the upper shell 21, the upper shell 21 is merged on the storage substrate 2, and the passive electronic tag 1 is located in the inner shell of the upper shell 21; glue is applied to the bottom surface of the substrate groove 311, and the assembled passive electronic tag 1 is pasted In the substrate groove 311, glue is applied on one side of the hollow EVC foam ring 32 and pasted on the bottom surface of the adsorption shell 31, and the inner ring of the hollow EVC foam ring is located on the outside of the cavity of the plate groove 35; the threaded rod 331 above the adsorption plate 33 is screwed into the threaded hole inside the plate groove 35, and the bottom surface height of the adsorption plate 33 is not lower than the ring thickness of the hollow EVC foam ring 32; glue is applied on the bottom surface of the adsorption plate 33, and the adsorption film 34 is pasted on the bottom surface of the adsorption plate 33, and the size of the adsorption film 34 is not less than the size of the hollow EVC foam ring.

[0022] When in use, use a towel to wipe the label application part of the product, apply the adsorption film 34 of the device to the label application part of the product, rotate the adsorption shell 31, and the adsorption plate 33 moves into the cavity inside the plate groove 35 under the action of the internal threaded hole and the threaded rod 331 of the plate groove 35, and the central part of the adsorption film 34 under the adsorption plate 33 is also offset, and the edge of the adsorption film 34 remains unchanged under the pressure of the hollow EVC foam ring 32, so that the central part of the adsorption film 34 and the outer wall of the adsorption product form a vacuum area, so that the adsorption shell 31 is hung on the outer wall of the adsorption product. After the product is sold, the adsorption shell 31 of the device is reversed to make the adsorption plate 33 rebound, and the vacuum area between the adsorption film 34 and the product disappears, and the adsorption film 34 is torn off from the product through the tear 341 at the edge of the adsorption film 34 and placed in the storage area for reuse.

[0023] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A passive electronic tag device, comprising a passive electronic tag (1), wherein a storage substrate (2) for storing the passive electronic tag (1) is arranged around the passive electronic tag (1), characterized in that: A vacuum adsorption device (3) is provided below the storage substrate (2), and the storage substrate (2) is adhered to the housing of the vacuum adsorption device (3) by means of glue.

2. A passive electronic tag device according to claim 1, characterized in that: The passive electronic tag (1) comprises, from inside to outside, a chip (11), a capacitor (12) and a coil (13); the chip (11) and the coil (13) are both connected to the capacitor (12) via a wire.

3. A passive electronic tag device according to claim 1, characterized in that: The storage substrate (2) is connected to the passive electronic tag (1) by adhesive bonding via conductive adhesive, and an upper shell (21) for sealing the passive electronic tag (1) is provided above the storage substrate (2).

4. A passive electronic tag device according to claim 1, characterized in that: The vacuum adsorption device (3) comprises an adsorption shell (31), a hollow EVC foam ring (32) adhered to the bottom surface of the adsorption shell (31) by glue, an adsorption plate (33) connected to the bottom of the adsorption shell (31) by a bolt structure, and an adsorption film (34) located on the bottom surface of the adsorption plate (33), wherein the adsorption film (34) is adhered to the bottom surface of the adsorption plate (33) by glue, the adsorption plate (33) passes through the inner ring of the hollow EVC foam ring (32), and the bottom surface of the adsorption shell (31) is provided with a plate groove (35) for storing the adsorption plate (33).

5. A passive electronic tag device according to claim 4, characterized in that: A threaded rod (331) passing through the bottom surface of the plate slot (35) is provided on the opposite side of the adsorption film (34) of the adsorption plate (33), and a tear notch (341) is provided on one side of the adsorption film (34). The threaded rod (331) is connected to the plate slot (35) via a bolt structure.

6. A passive electronic tag device according to claim 4, characterized in that: The adsorption shell (31) is a one-way open shell, and the open end of the adsorption shell (31) is provided with a substrate groove (311) for placing and storing the substrate (2), and the storage substrate (2) is adhered to the bottom surface of the substrate groove (311) by glue.

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