Wafer rotary drying device

Abstract

The utility model discloses a wafer rotary drying device. The wafer rotary drying device comprises a rotary platform; the multiple clamping jaws are distributed in the circumferential direction of the rotating platform at intervals. The clamping jaws are connected to the rotating platform through rotating shafts correspondingly. The side, facing the wafer, of the clamping jaw is provided with a horizontal placement face used for horizontally supporting the back face of the wafer. The climbing surface is arranged on the peripheral side of the horizontal placement surface; the clamping surface is arranged on the peripheral side of the climbing surface and can be matched with the climbing surface to clamp the edge of the wafer; when the rotating platform rotates, the upper portions of the clamping jaws rotate inwards and downwards, the clamping face and the climbing face of each clamping jaw are matched, and the multiple clamping jaws clamp the wafer together. The utility model also discloses a wafer rotary drying method. According to the utility model, the cleaning and drying effects of the back of the wafer are improved; the rotating platform does not participate in clamping of the wafer, so that the number of consumables is remarkably reduced; relative sliding of the wafer and the clamping jaw is effectively avoided, and rotation stability is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor integrated circuit chip manufacturing, in particular to a wafer rotary drying device. Background Art

[0002] With the continuous development of semiconductor production and processing technology, the importance of ultra-clean processing has become increasingly prominent. For Chemical Mechanical Planarization (CMP equipment), the requirements for cleanliness and drying are also constantly improving. In the process of processing wet wafers, a core requirement is to ensure that the wafers are thoroughly dried and effectively prevent the particles previously present in the solution from re-attaching to the wafer surface. If the wafer is not completely dried using appropriate methods, the particles in the solution may affect the characteristics of the semiconductor components, causing the equipment to fail to operate normally. Therefore, it is particularly important to take appropriate measures to remove the liquid on the wafer.

[0003] In most CMP equipment, the drying of wafers mainly relies on centrifugal spin drying. The operating principle of this method is to place the wafer on a flat base, and the motor drives the flat base to rotate. At the same time, the clamping claws holding the wafer rotate toward the center of the wafer under the action of centrifugal force until they contact and clamp the wafer. In this way, the liquid originally attached to the wafer is thrown off, thereby achieving wafer drying. Although this structure is simple, it has a significant defect: during the process of rotating and drying the wafer and the base, the back of the wafer always keeps in contact with the flat base. This means that this part of the back of the wafer in contact with the base cannot be effectively cleaned and dried during the rotation process. Therefore, back defects often occur on CMP machines that use centrifugal spin drying. For CMP equipment for high-process applications, the dryness and cleanliness of the back of the wafer are also one of the important indicators for evaluating the CMP process. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a wafer rotary drying device which only utilizes claws to clamp the wafer, and has better effects of wafer cleaning and drying.

[0005] The utility model solves the technical problem by adopting a technical solution: a wafer rotary drying device, comprising:

[0006] Rotating platform;

[0007] A plurality of claws are distributed at intervals along the circumference of the rotating platform;

[0008] The claws are connected to the rotating platform via rotating shafts respectively;

[0009] The claw has a side facing the wafer,

[0010] A horizontal placement surface, used for horizontally supporting the back side of the wafer;

[0011] A climbing surface, arranged on the outer peripheral side of the horizontal placement surface;

[0012] A clamping surface, disposed on the outer peripheral side of the climbing surface, and capable of cooperating with the climbing surface to clamp the edge of the wafer;

[0013] When the rotating platform rotates, the upper part of the clamping claw rotates inward and downward, and the clamping surface and the climbing surface of each clamping claw cooperate with each other, and multiple clamping claws clamp the wafer together.

[0014] Furthermore, the climbing surface is a curved climbing surface, or a straight climbing surface.

[0015] Furthermore, the climbing surface is an arc-shaped climbing surface, and a circle is drawn with the center of the rotating shaft as the center and the distance between the center of the rotating shaft and the intersection point of the arc-shaped climbing surface and the horizontal placement surface as the radius, and the arc-shaped climbing surface falls into the circle.

[0016] Furthermore, the multiple clamping claws are located at the same height plane, and the multiple clamping claws rotate around the rotation axis at the same angle to jointly clamp the wafer so that the wafer is horizontal.

[0017] Furthermore, the clamping surface and the climbing surface are in contact with the upper edge and the lower edge of the wafer edge respectively.

[0018] Furthermore, the number of the claws is three or more than three, and they are evenly spaced in the circumferential direction.

[0019] Furthermore, when the claws clamp the wafer, the angle between the horizontal placement surface and the back of the wafer is α, and α is ≥ 5°.

[0020] Furthermore, the angle between the clamping surface and the vertical plane is β, and β is 0°-45°.

[0021] Furthermore, the gravity of the claw is F G The force arm of the claw's gravity relative to the center of the claw's rotation axis is L G The pressure of the wafer on the horizontal surface is F w The force arm of the wafer pressure relative to the center of the claw shaft is L w , then F G *L G ≥F w *L w , so that when the wafer is placed still on the horizontal placement surface, the clamping claws are in a vertical state.

[0022] Furthermore, when the wafer is in an accelerating or decelerating rotation state, the rotational inertia of the wafer is I, the accelerating or decelerating angular velocity of the wafer is a, the radius of the wafer is R, and the driving force provided by the claw to the wafer is the static friction force F f , then F f *R≥I*a, so that the wafer and the claws rotate synchronously.

[0023] The utility model proposes an innovative centrifugal rotary drying device, which abandons the traditional flat base and adopts a clamp to simultaneously complete the task of supporting and clamping the wafer: when the wafer is placed statically on the clamp, the clamp contacts the back of the wafer, and the contact surface is in a flat state, which helps to keep the wafer horizontally placed and facilitates the pick-and-place operation; and when the wafer is rotary dried, the clamp is no longer in flat contact with the back of the wafer, but in inclined contact, and the upper and lower edges of the wafer are clamped on the upper and lower inclined surfaces of the clamp - the clamping surface and the climbing surface, to achieve clamping. In the process of high-speed rotary drying, the clamp actually only contacts the edge of the wafer, thereby avoiding scratches on the back of the wafer. At the same time, the back of the wafer and the clamp are always at a certain angle, which further improves the cleaning effect of the back of the wafer. This improvement not only improves the working efficiency of the CMP machine, but also provides a more reliable guarantee for the high-process application of the machine.

[0024] The beneficial effects of the utility model are: 1) the structure in which the back side of the wafer contacts the external interface in the traditional centrifugal rotation clamping method is changed, the cleaning and drying effects of the back side of the wafer are improved, more effective cleaning and drying effects are ensured, and the overall performance of the CMP machine is further improved; 2) the rotating platform does not participate in the clamping of the wafer, which significantly reduces the number of consumables, simplifies the maintenance and replacement process, reduces the cost of use, and improves the overall efficiency of use; 3) in the startup stage, the back side of the wafer is in surface contact with the horizontal placement surface, which provides a greater static friction force for the wafer, so that the claws can effectively avoid relative sliding between the wafer and the claws before the wafer is completely clamped, thereby improving the stability of the rotation, reducing potential safety hazards, effectively reducing the risk of debris and flying pieces, and improving the reliability and safety of the entire processing process; 4) the clamping surface The angle β with the vertical plane is not restricted. When the wafer is clamped by the claws and rotated at high speed, the force on it is relatively balanced, and the claws will not damage the wafer; 5) The height of the wafer will not change during the placement and rotation process, ensuring that the wafer is in a completely horizontal state, which is beneficial to achieving good cleaning and drying effects; 6) The horizontal placement surface can ensure that the wafer remains horizontal after placement, so that the wafer is aligned with the rotation axis, reducing vibration and instability factors caused by non-parallelism, thereby ensuring the stability and consistency of the wafer during rotation; the climbing surface can ensure that the height of the wafer remains unchanged at different rotation angles of the claws. No matter how the claws rotate, the distance between the wafer and the rotating platform remains constant, thereby avoiding problems such as uneven processing or poor drying effects due to height changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is structure 1 of a wafer rotary drying device in the prior art. At this time, the wafer is placed on a flat base, and the clamping claws do not press down on the wafer.

[0026] Figure 2 This is the second structure of the wafer rotary drying device in the prior art. At this time, the wafer is placed on a flat base, and the clamping claws press down the wafer.

[0027] Figure 3 The utility model provides a three-dimensional wafer rotary drying device Figure 1 , at this time the wafer is not clamped.

[0028] Figure 4 The utility model provides a three-dimensional wafer rotary drying device Figure 2 , the wafer will be clamped at this time.

[0029] Figure 5 This is a front view of the clamping claw provided by the utility model.

[0030] Figure 6 for Figure 5 A magnified view of the structure in Figure 2.

[0031] Figure 7 A three-dimensional diagram of the clamping claw provided by the utility model.

[0032] Figure 8 A partial schematic diagram of the cooperation between the wafer rotary drying device provided by the utility model and the wafer Figure 1 , at this time the wafer is located on the horizontal placement surface.

[0033] Fig. 9 for Figure 8 Enlarged view of the structure at point B in the figure.

[0034] Fig.10 A partial schematic diagram of the cooperation between the wafer rotary drying device provided by the utility model and the wafer Figure 2 , at this time the wafer is about to enter the climbing surface.

[0035] Fig.11 A partial schematic diagram of the cooperation between the wafer rotary drying device provided by the utility model and the wafer Figure 3 , at this time the wafer enters the climbing surface.

[0036] Fig.12 A partial schematic diagram of the cooperation between the wafer rotary drying device provided by the utility model and the wafer Figure 4 , at this time the wafer is located on the climbing surface.

[0037] Fig.13 for Fig.12 Enlarged view of the structure at D in .

[0038] Fig.14 A partial schematic diagram of the cooperation between the wafer rotary drying device provided by the utility model and the wafer Figure 5 At this time, the wafer is clamped by the clamping surface and the climbing surface.

[0039] Fig.15 for Fig.14 Enlarged view of the structure at F in .

[0040] Fig.16 This is a schematic diagram of local force analysis of the wafer rotary drying device and wafer provided by the utility model.

[0041] Among them, 1-rotating platform, 2-claw, 21-rotating shaft, 22-upper body, 23-lower body, 24-horizontal placement surface, 25-climbing surface, 26-clamping surface, 3-wafer, 31-wafer upper edge, 32-wafer lower edge. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the solution of the utility model, the following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0043] like Figure 1 , Figure 2 As shown, the wafer rotation drying device in the prior art includes a plurality of clamping claws and a planar base. Under normal working conditions, the motor is connected to the planar base, and the motor rotates to drive the planar base to rotate, while the clamping claws are fixed on the horizontal rotating shaft of the planar base. In order to ensure stability and reliability, the number of clamping claws is usually greater than 3. Since the center of mass of the clamping claws is located below the rotating shaft, when the clamping claws rotate, the centrifugal force will cause the part below the rotating shaft of the clamping claws to move in a direction away from the center of the wafer. At the same time, the part above the rotating shaft of the clamping claws will rotate toward the center of the wafer, thereby effectively fixing the wafer on the planar base. In the initial stationary and low-speed starting stage, the clamping claws do not clamp the wafer. At this time, the wafer is driven to rotate at a low speed by the static friction between the planar base and the wafer, such as Figure 1 As the motor accelerates, the flat base drives the claw to rotate faster, the centrifugal force on the claw increases, and the claw rotates clockwise until it contacts the wafer, so that the claw and the flat base cooperate to fix the wafer. Figure 2 At this time, due to the pressure brought by the clamping claws, the friction force driving the wafer to rotate increases, and the wafer can maintain stable rotation at a higher speed.

[0044] In the wafer rotation drying device in the prior art, the back of the wafer is in surface contact with the plane base, and this part of the wafer surface cannot be cleaned and dried, which limits the cleaning and drying effect of the back of the wafer. Once the plane base is designed as a slope structure, the problem of the back of the wafer contacting the base surface can be solved. However, during the startup phase of the motor rotation acceleration, due to the low rotation speed, the centrifugal force on the claws is insufficient, and the wafer is not clamped at this time. In addition, since the wafer and the base only provide rotational power through line contact, the static friction force is relatively small, and the motor cannot provide sufficient driving force for the wafer during the startup phase, which will cause the wafer and the plane base to slide relative to each other, thereby affecting the stability of the structure, and even causing the flying phenomenon, posing a threat to property and personal safety. It should also be emphasized that in the prior art, the claws and the plane base cooperate to clamp the wafer, and the number of components involved is large. While maintaining and replacing the claws, it is also necessary to maintain and replace the plane base, which increases operating costs.

[0045] For example Figure 1 , Figure 2As shown in the force analysis, due to the action of F4, the wafer will be subjected to an extrusion force F5. If the claw angle γ is reduced, the force arm L4 of the support force F4 from the claw shaft will be reduced, so that F4 will increase, causing the risk of crushing the wafer. If the angle γ is increased, the margin between the edge of the wafer and the claw will be reduced, which is not conducive to the claw's wafer placement operation. An angle γ that is too large may cause the wafer to be unable to effectively throw out the liquid during rotation, thereby affecting the cleaning and drying effects. Therefore, the prior art solution needs to comprehensively consider the drying effect and the risk of crushing the wafer when adjusting the angle γ. In the prior art solution, the angle γ is limited by the wafer extrusion force F5, which is generally above 15°, otherwise it is easy to cause F5 to be too large and the wafer to be broken.

[0046] like Figure 3 , Figure 4 As shown, a wafer rotary drying device comprises a rotating platform 1, and a plurality of claws 2 distributed at intervals along the circumference of the rotating platform 1, wherein the plurality of claws 2 are rotatably connected to the rotating platform 1 through a rotating shaft 21, and each claw 2 comprises an upper body 22 and a lower body 23 located at the upper and lower sides of the rotating shaft 21. In this embodiment, the number of the claws 2 is three, which are evenly distributed at intervals. Of course, in other embodiments, the number of the claws 2 can also be any number greater than three, or even two, without specific limitation.

[0047] Of course, the rotating platform 1 may not be provided, as long as the plurality of claws 2 are distributed at intervals along a circle of the wafer 3 and can move synchronously.

[0048] like Figure 5-Figure 7 As shown, the upper body 22 of the clamping claw 2 has a horizontal placement surface 24 on the side facing the wafer 3, a climbing surface 25 arranged on the peripheral side of the horizontal placement surface 24, and a clamping surface 26 arranged on the peripheral side of the climbing surface 25. The horizontal placement surface 24 is used to horizontally support the back of the wafer, and its horizontal refers to that when the clamping claw 2 is placed completely vertically, the horizontal placement surface 24 is completely horizontal or tends to be completely horizontal. Here, the peripheral side is relative to the center of the rotating platform 1. When the clamping claw 2 is placed vertically, the horizontal placement surface 24 is closer to the center of the rotating platform 1 than the climbing surface 25, and the climbing surface 25 or most of the climbing surface 25 is closer to the center of the rotating platform 1 than the clamping surface 26.

[0049] When the rotating platform 1 rotates, under the action of centrifugal force, the clamping claws 2 rotate around the rotating shaft 21, and the upper body 22 thereof rotates inward and downward, and the clamping surface 26 and the climbing surface 25 of each clamping claw 2 cooperate to clamp a part of the wafer 3, and multiple clamping claws 2 cooperate to clamp the wafer 3. Here, the inner side refers to the side where the center of the rotating platform 1 is located.

[0050] It should be noted that the plurality of claws 2 cooperate to clamp the wafer 3 without the intervention of the rotating platform 1, that is, the rotating platform 1 no longer supports the wafer 3. The clamping surface 26 and the climbing surface 25 cooperate to clamp the wafer 3, which means that the clamping surface 26 and the climbing surface 25 are in contact with the upper edge 31 and the lower edge 32 of the edge of the wafer 3, respectively. Fig.15 As shown; of course, the upper edge 31 and the lower edge 32 are not necessarily right-angled edges, they can also be rounded structures, mainly to illustrate that the surface of the wafer 3 will not contact the clamping surface 26 and the climbing surface 25, and there is no specific limitation. In other words, the upper and lower surfaces of the wafer 3 will not contact with external objects, so that the upper and lower surfaces of the wafer 3 are fully cleaned. Specifically, when the claw 2 clamps the wafer 3, the angle between the horizontal placement surface 24 and the back of the wafer 3 is α, and the α is ≥5°.

[0051] In this embodiment, multiple claws 2 are located at the same height plane, and in the process of multiple claws 2 jointly clamping the wafer 3, multiple claws 2 rotate around the rotating shaft 21 at the same angle, and the wafer 3 will not tilt due to the asynchronous rotation of different claws 2, thereby ensuring that the wafer 3 is clamped horizontally and avoiding the wafer 3 from being in a tilted state when clamped, which is beneficial to the centrifugal rotation drying of the wafer 3.

[0052] The climbing surface 25 can be a curved climbing surface or a straight climbing surface. In this embodiment, the climbing surface 25 is a curved climbing surface. Figure 8 , Fig. 9 As shown, the intersection point of the arc-shaped climbing surface 25 and the horizontal placement surface 24 is point O2, the center of the rotating shaft 21 is point O1, and a circle C is drawn with the center of the rotating shaft 21 as the center and the distance between the center of the rotating shaft 21 and the intersection point of the arc-shaped climbing surface 25 and the horizontal placement surface 24 as the radius, and the arc-shaped climbing surface 25 falls into the circle C. In other words, a circle C is drawn with point O1 as the center and the distance between point O1 and point O2 as the radius, and the entire arc-shaped climbing surface 25 falls into the circle C. Here, the intersection point of the arc-shaped climbing surface 25 and the horizontal placement surface 24 is also the intersection point of the farthest lower edge of the wafer 3 and the horizontal placement surface 24. Through the above structure, it is ensured that when the clamping claw 2 supports the wafer 3 at any rotation angle, the position and height of the wafer 3 do not change, and the stability of the wafer rotary drying device is further ensured.

[0053] Combination Fig.11 As shown, point P is the contact point between the lower edge 32 of the wafer and the climbing surface 25. Since the length of the line segment OP is equal to the radius of the arc and the horizontal distance OQ from the center point O of the rotating shaft 21 to the edge of the wafer 3 is constant, according to the Pythagorean theorem, the height PQ of the wafer 3 remains unchanged. It is ensured that the height of the wafer 3 remains unchanged at different rotation angles of the claw 2. No matter how the claw 2 rotates, the distance between the wafer 3 and the rotating platform 1 remains constant, avoiding the problem of uneven processing or poor drying effect caused by height changes.

[0054] by Fig. 9 Taking the direction shown as an example, the clamping surface 26 extends obliquely from bottom to top and from outside to inside. Specifically, the angle between the clamping surface 26 and the vertical plane is β, and β is 0°-45°.

[0055] like Fig.16 As shown, the clamping jaw 2 is balanced by the counterclockwise torque of gravity, the clockwise torque of centrifugal force, and the counterclockwise torque of the wafer 3 support force. When the upper and lower edges of the wafer 3 are clamped, they are respectively subjected to the upper edge support force F8 and the lower edge support force F9. At this time, no matter how the angle β between the clamping surface 26 of the clamping jaw 2 and the vertical plane changes, the wafer 3 is subjected to the squeezing force F 合 It must always be horizontally pointing to the center of wafer 3, so the support force F of wafer 3 合 The arm L3 of the distance torque remains unchanged, and the torque remains unchanged, so the extrusion force F on wafer 3 remains unchanged. 合 That is to say, since the wafer 3 is clamped by only one material, the claw 2, the design of the angle β of the claw 2 is no longer limited by the squeezing force of the wafer 3. This means that the angle of the claw 2 can be smaller than the safety angle of 15° usually considered in the traditional design, thereby providing more favorable conditions for the discharge of liquid when the wafer 3 is spun dry, and the liquid attached to the surface of the wafer 3 is more easily spun out, thereby improving the drying and cleaning effect.

[0056] In order to prevent the claws 2 from deflecting when the wafer 3 is placed on the horizontal placement surface 24, the horizontal placement surface 24 is ensured to be in a completely horizontal state. Fig.10 As shown, the gravity of claw 2 is F G The force arm of the weight of the jaw 2 relative to the center point O1 of the jaw 2 rotation axis 21 is L G The pressure of wafer 3 on horizontal placement surface 24 is F w , Wafer 3 pressure F w The force arm relative to the center O1 of the rotating shaft 21 of the clamping claw 2 is L w , then F G *L G ≥F w *L w , so that when the wafer 3 is placed on the horizontal placement surface 24, the claw 2 is in a vertical state, that is, the claw 2 will not be deflected by the gravity of the wafer 3. In the subsequent process, because the claw 2 and the wafer 3 are both horizontal, when the robot takes the wafer 3 after cleaning and drying, the wafer 3 is lifted up and collides with the tilted claw 2, avoiding the transmission stability problem caused by the collision and also avoiding secondary contamination.

[0057] A wafer rotary drying method is implemented based on the above-mentioned wafer rotary drying device, and comprises the following steps:

[0058] The wafer 3 is placed on the horizontal placement surface 24 of the plurality of claws 2. At this time, the claws 2 are in a vertical state, that is, the horizontal placement surface 24 is completely horizontal, and the wafer 3 is placed horizontally. Fig.10 As shown;

[0059] The rotating platform 1 rotates, driving the multiple claws 2 to rotate synchronously;

[0060] In the startup phase, the wafer 3 and the horizontal placement surface 24 are in surface contact, that is, the lower surface of the edge of the wafer 3 is in surface contact with the horizontal placement surface 24, and the horizontal placement surface 24 provides static friction for the wafer 3 to accelerate, so that the wafer 3 and the clamping claw 2 rotate synchronously; at this time, the rotation acceleration of the wafer 3 and the clamping claw 2 is the first acceleration;

[0061] In the above steps, in order to make the wafer 3 and the claw 2 rotate synchronously, when the wafer 3 is in an accelerated or decelerated rotation state, the rotational inertia of the wafer 3 is defined as I, the acceleration or deceleration angular velocity of the wafer 3 is defined as a, the radius of the wafer 3 is defined as R, and the driving force provided by the claw 2 to the wafer 3 is the static friction force F f , then the condition F is satisfied f *R≥I*a, so that when the wafer 3 rotates, the wafer 3 can be consistent with the acceleration of the driving motor, avoiding relative movement between the wafer 3 and the clamping claw 2 due to the speed difference, and ensuring that the wafer 3 is stably clamped;

[0062] During the acceleration phase of the rotation of the rotating platform 1, the centrifugal force of the clamping claw 2 increases until the centrifugal force of the clamping claw 2 reaches a critical value. Specifically, the critical value is that the centrifugal force torque of the clamping claw 2 is greater than the self-weight torque of the clamping claw 2. The upper body 22 of the clamping claw 2 rotates inward and downward, and the wafer 3 moves along the climbing surface 25 relative to the clamping claw 2. Fig.12 , Fig.13 As shown;

[0063] The plurality of claws 2 rotate around the rotating shaft 21 at the same angle, so that the clamping surfaces 26 and the climbing surfaces 25 of the plurality of claws 2 cooperate to clamp the wafer 3 together. Fig.14 , Fig.15 As shown, in this embodiment, a plurality of claws 2 together horizontally clamp the wafer 3, providing static friction for the wafer 3, so that the wafer 3 and the claws 2 rotate synchronously; at this time, the rotation acceleration of the wafer 3 and the claws 2 is the second acceleration, because the static friction provided by the claws 2 clamping the wafer 3 is greater than the friction provided by the horizontal placement surface 24, so the second acceleration is greater than the first acceleration;

[0064] After the wafer 3 has completed the spin drying, the rotating platform 1 slows down, the claw 2 returns to the vertical state, and the wafer 3 is located on the horizontal placement surface 24;

[0065] The robot grips the wafer 3 from bottom to top and transfers it vertically, so that the wafer 3 is separated from the clamping claws 2 and the rotating platform 1.

[0066] The above specific implementation modes are used to explain the present invention rather than to limit the present invention. Any modification and change made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A wafer rotary drying device, characterized in that: include: Rotating platform; A plurality of claws are distributed at intervals along the circumference of the rotating platform; The claws are connected to the rotating platform via rotating shafts respectively; The claw has a side facing the wafer, A horizontal placement surface, used for horizontally supporting the back side of the wafer; A climbing surface, arranged on the outer peripheral side of the horizontal placement surface; A clamping surface, disposed on the outer peripheral side of the climbing surface, and capable of cooperating with the climbing surface to clamp the edge of the wafer; When the rotating platform rotates, the upper part of the clamping claw rotates inward and downward, and the clamping surface and the climbing surface of each clamping claw cooperate with each other, and multiple clamping claws clamp the wafer together.

2. The wafer rotary drying device according to claim 1, characterized in that: The climbing surface is an arc-shaped climbing surface, or a straight-line climbing surface.

3. The wafer rotary drying device according to claim 1, characterized in that: The climbing surface is an arc-shaped climbing surface, and a circle is drawn with the center of the rotating shaft as the center and the distance between the center of the rotating shaft and the intersection point of the arc-shaped climbing surface and the horizontal placement surface as the radius, and the arc-shaped climbing surface falls into the circle.

4. The wafer rotary drying device according to claim 1, characterized in that: The plurality of clamping claws are located at the same height plane, and the plurality of clamping claws rotate at the same angle around the rotating shaft to clamp the wafer together, so that the wafer is level.

5. The wafer rotary drying device according to claim 1, characterized in that: The clamping surface and the climbing surface are in contact with the upper edge and the lower edge of the wafer edge respectively.

6. The wafer rotary drying device according to claim 1, characterized in that: The number of the clamping claws is three or more than three, and they are evenly spaced in the circumferential direction.

7. The wafer rotary drying device according to claim 1, characterized in that: When the clamping claws clamp the wafer, the angle between the horizontal placement surface and the back side of the wafer is α, and α is ≥5°.

8. The wafer rotary drying device according to claim 1, characterized in that: The included angle between the clamping surface and the vertical plane is β, and the β is 0°-45°.

9. The wafer rotary drying device according to claim 1, characterized in that: The weight of the claw is F G The force arm of the claw's gravity relative to the center of the claw's rotation axis is L G The pressure of the wafer on the horizontal surface is F w The force arm of the wafer pressure relative to the center of the claw shaft is L w , then F G *L G ≥F w *L w , so that when the wafer is placed still on the horizontal placement surface, the clamping claws are in a vertical state.

10. The wafer rotary drying device according to claim 1, characterized in that: When the wafer is in an accelerating or decelerating rotation state, the rotational inertia of the wafer is I, the acceleration or deceleration angular velocity of the wafer is a, the radius of the wafer is R, and the driving force provided by the claw to the wafer is the static friction force F f , then F f *R≥I*a, so that the wafer and the claws rotate synchronously.

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