Packaging structure of chip and antenna module

Abstract

The utility model discloses a packaging structure of a chip and an antenna module, which comprises an isolation frame, a semiconductor chip, an antenna module and a plastic package body, the isolation frame is provided with a plurality of frame pins and a plurality of base islands, a gap is arranged between two adjacent base islands, the base islands are provided with the semiconductor chip, the antenna module is fixed on the base islands in an adhesive manner, and the plastic package body is arranged on the isolation frame. The semiconductor chip is electrically connected with the antenna module through the first bonding wire, the semiconductor chip is electrically connected with the frame pin, and the plastic package body wraps the semiconductor chip, the antenna module, the base island, the first bonding wire and part of the frame pin. The packaging structure of the chip and the antenna module is novel in structure, and the built-in and good electrical isolation of the antenna module are realized; a direct wire bonding mode is adopted to realize the connection between the chip and the antenna module, so that the packaging cost can be reduced, and the requirements of high-frequency signal transmission and complex peripheral wiring design can be met; and the antenna module is fixed on the base island in a gluing manner, so that the production consistency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, and in particular to a packaging structure of a chip and an antenna module. Background Art

[0002] For projects with high-frequency signals, built-in antennas or complex peripheral circuits (referring to the periphery of the chip in the package), the Flip Chip substrate packaging solution is generally used. Considering factors such as substrate warping and packaging strength, it is difficult to achieve complete electrical isolation with this type of packaging.

[0003] In order to achieve isolation performance that meets standard requirements, current isolation devices generally adopt the traditional packaging solution of frame + wire bonding, but this solution cannot meet design requirements such as high-frequency signal transmission and built-in antennas. Utility Model Content

[0004] The technical problem solved by the utility model is to provide a packaging structure of a chip and an antenna module with good electrical isolation performance, wherein the packaging structure can realize the built-in antenna and transmit high-frequency signals.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is: a packaging structure of a chip and an antenna module, comprising an isolation frame, a semiconductor chip, an antenna module and a plastic package body, the isolation frame having a plurality of frame pins and a plurality of base islands, a gap between two adjacent base islands, the semiconductor chip being arranged on the base islands, the antenna module being adhesively fixed to the base islands, the semiconductor chip being electrically connected to the antenna module through a first bonding wire, the semiconductor chip being electrically connected to the frame pins, and the plastic package body covering the semiconductor chip, the antenna module, the base islands, the first bonding wires and part of the frame pins.

[0006] In one embodiment, the semiconductor chip is electrically connected to the frame pin via a second bonding wire, and the plastic package body covers the second bonding wire.

[0007] In one embodiment, the bottom surface of the antenna module is bonded and fixed to the base island by insulating glue.

[0008] In one embodiment, the bottom surface of the antenna module is bonded and fixed to the base island by double-sided adhesive.

[0009] In one embodiment, a radiation element is disposed on the top surface of the antenna module.

[0010] In one embodiment, a connection point between the first bonding wire and the antenna module is located on a top surface of the antenna module.

[0011] In one embodiment, the gap between any two adjacent base islands is greater than or equal to 2 mm.

[0012] In one embodiment, a partial area of ​​the plastic package body fills the gap between two adjacent base islands.

[0013] In one embodiment, the antenna module is a millimeter wave antenna component.

[0014] In one embodiment, the antenna module and the semiconductor chip are located on the same side of the base island.

[0015] The beneficial effects of the utility model are as follows: the packaging structure of the chip and the antenna module is novel, which realizes the internal integration of the antenna module and good electrical isolation; the direct wire bonding method is used to connect the chip and the antenna module, which can reduce the packaging cost and meet the requirements of high-frequency signal transmission and complex peripheral routing design; the base islands distributed in the package body for placing the antenna module and the semiconductor chip have no limit on the number and can be modified according to the circuit design, so that the package body has good scalability; the antenna module is fixed to the base island by gluing, which can effectively prevent the displacement of the antenna module during the packaging process and help improve production consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0017] Figure 1 This is a top view of the packaging structure of the first embodiment of the utility model (after hiding the plastic packaging body);

[0018] Figure 2 for Figure 1 Section view along line AA.

[0019] Description of Figure Numbers:

[0020] 1. Isolation frame; 11. Frame pins; 12. Base island; 13. Outer frame;

[0021] 2. Semiconductor chips;

[0022] 3. Antenna module; 31. Radiating element;

[0023] 4. Plastic sealing body;

[0024] 5. Gap;

[0025] 6. First bonding wire;

[0026] 7. Second bonding wire;

[0027] 8. Insulating glue. DETAILED DESCRIPTION

[0028] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0032] In addition, if the meaning of "and / or" appears in the full text is to include three parallel solutions, taking "and / or" as an example, it includes solutions, or solutions, or solutions that are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] Embodiment 1

[0035] Please refer to Figure 1 and Figure 2 , Embodiment 1 of the present utility model is: a packaging structure of a chip and an antenna module, comprising an isolation frame 1, a semiconductor chip 2, an antenna module 3 and a plastic package 4, the isolation frame 1 having a plurality of frame pins 11 and a plurality of base islands 12, a gap 5 between two adjacent base islands 12, the semiconductor chip 2 being arranged on the base island 12, the antenna module 3 being glued and fixed on the base island 12, a radiation element 31 being arranged on the top surface of the antenna module 3, the radiation element 31 including but not limited to a radiation metal sheet, the semiconductor chip 2 being electrically connected to the antenna module 3 via a first bonding wire 6, the semiconductor chip 2 being electrically connected to the frame pin 11, the plastic package 4 covering the semiconductor chip 2, the antenna module 3, the base island 12, the first bonding wire 6 and part of the frame pin 11.

[0036] In this embodiment, the antenna module 3 and the semiconductor chip 2 are located on the same side of the base island 12, and the base island 12, the antenna module 3, and the semiconductor chip 2 are all two in number, and the three are arranged in a one-to-one correspondence. Specifically, the isolation frame 1 also includes an outer frame 13, and the frame pins 11 and the base island 12 are both inside the outer frame 13 and connected to the outer frame 13 respectively. During the processing, after the plastic package 4 is formed, the outer frame 13 is removed by cutting the ribs, so that each frame pin 11 is independent.

[0037] To facilitate processing and manufacturing, the semiconductor chip 2 is electrically connected to the frame pin 11 via a second bonding wire 7 , and the plastic package 4 covers the second bonding wire 7 .

[0038] The bottom surface of the antenna module 3 is bonded and fixed to the base island 12 by an insulating adhesive 8, and the insulating adhesive 8 forms an isolation layer between the antenna module 3 and the base island 12, thereby improving the electrical isolation performance of the packaging structure to a greater extent. Optionally, the bottom surface of the antenna module 3 is bonded and fixed to the base island 12 by a double-sided adhesive. In the actual processing process, the antenna module 3 can be bonded to the base island 12 after tearing off the release paper on the bottom surface of the antenna module 3. The operation is simple, which is conducive to improving production efficiency and reducing production costs.

[0039] The connection point between the first bonding wire 6 and the antenna module 3 is located on the top surface of the antenna module 3 , which can facilitate the bonding operation between the first bonding wire 6 and the antenna module 3 .

[0040] The size of the gap 5 between two adjacent base islands 12 is designed according to the pressure resistance requirements of the product, that is, the gap 5 between two adjacent base islands 12 is not limited to a certain numerical range, but to ensure good electrical isolation performance, preferably, the gap 5 between any two adjacent base islands 12 is greater than or equal to 2 mm, and if necessary, the gap 5 between two adjacent base islands 12 can be at the centimeter level; a partial area of ​​the plastic package body 4 fills the gap 5 between two adjacent base islands 12.

[0041] Optionally, the antenna module 3 is a millimeter wave antenna component.

[0042] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A chip and antenna module packaging structure, characterized in that: It includes an isolation frame, a semiconductor chip, an antenna module and a plastic package. The isolation frame has multiple frame pins and multiple base islands. There is a gap between two adjacent base islands. The semiconductor chip is arranged on the base island. The antenna module is glued and fixed on the base island. The semiconductor chip is electrically connected to the antenna module through a first bonding wire. The semiconductor chip is electrically connected to the frame pins. The plastic package covers the semiconductor chip, the antenna module, the base island, the first bonding wire and part of the frame pins.

2. The chip and antenna module packaging structure according to claim 1, characterized in that: The semiconductor chip is electrically connected to the frame pin via a second bonding wire, and the plastic package body covers the second bonding wire.

3. The chip and antenna module packaging structure according to claim 1, characterized in that: The bottom surface of the antenna module is bonded and fixed to the base island by insulating glue.

4. The chip and antenna module packaging structure according to claim 3, characterized in that: The bottom surface of the antenna module is bonded and fixed to the base island by double-sided adhesive.

5. The chip and antenna module packaging structure according to claim 1, characterized in that: A radiation element is disposed on the top surface of the antenna module.

6. The chip and antenna module packaging structure according to claim 1, characterized in that: The connection point between the first bonding wire and the antenna module is located on the top surface of the antenna module.

7. The chip and antenna module packaging structure according to claim 1, characterized in that: The gap between any two adjacent base islands is greater than or equal to 2 mm.

8. The chip and antenna module packaging structure according to claim 7, characterized in that: Part of the plastic package body fills the gap between two adjacent base islands.

9. The chip and antenna module packaging structure according to claim 1, characterized in that: The antenna module is a millimeter wave antenna component.

10. The chip and antenna module packaging structure according to claim 1, characterized in that: The antenna module and the semiconductor chip are located on the same side of the base island.

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