Small-spacing and high-brightness display device

Abstract

The utility model relates to the technical field of semiconductor display, and particularly discloses a small-spacing and high-brightness display device which comprises a substrate which is divided into a substrate front face and a substrate back face. The plurality of upper chip areas are arranged on the front surface of the substrate; the plurality of bonding pads are arranged on the back surface of the substrate; the light-emitting chip is fixed in the upper chip area through solder paste and is electrically connected with the substrate; the plastic package body wraps the front surface of the substrate and is used for sealing and protecting the light-emitting chip; solder resist ink is arranged on the substrate front face area and the substrate back face area except the upper core area and the bonding pad, and direction identification ink is further arranged on the back face of the substrate. According to the utility model, by reducing the number of chips and using double G light, under the control of software and programs, the display effect is the same as that of a conventional display device (12 chips), and the cost is effectively saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor display, and in particular relates to a small-pitch, high-brightness display device. Background Art

[0002] With the development of display technology, the requirements for low cost, low power consumption, high brightness, high contrast, high reliability, high efficiency and color consistency of display devices are increasing. LED display devices are important components of display modules, which are used in important places such as real-time display of data, images, dynamics, etc. on the display screen, and stable display effects need to be guaranteed.

[0003] Conventional four-in-one display devices (12 chips) have a large number of chips, low production efficiency, low packaging yield, high cost, and high power consumption, which can no longer meet the requirements of consumers. Therefore, it is very necessary to develop a small-pitch, high-brightness display device. Utility Model Content

[0004] The purpose of the utility model is to provide a small pitch, high brightness display device to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A small pitch, high brightness display device, comprising:

[0007] A substrate, wherein the substrate is divided into a substrate front side and a substrate back side;

[0008] A plurality of upper core regions are arranged on the front side of the substrate;

[0009] A plurality of pads are arranged on the back side of the substrate;

[0010] The light-emitting chip is fixed in the upper core area by solder paste and is electrically connected to the substrate;

[0011] The plastic package is coated on the front side of the substrate and is used to seal and protect the light-emitting chip;

[0012] The front and back areas of the substrate are both provided with solder resist ink except the upper core area and the pad, and the back of the substrate is also provided with direction marking ink.

[0013] Preferably, the substrate is made of a BT board, and both the front and back sides thereof are covered with a metal layer, wherein the metal layer is Cu, Ni, Ag and Au, and the required circuit is formed by electroplating and electrochemical deposition processes.

[0014] Preferably, the thickness of the substrate is one of T0.12mm, T0.18mm, T0.28mm and T0.48mm, and the circuits on the front side of the substrate and the back side of the substrate are electrically connected by mechanical drilling and electroplating hole filling processes.

[0015] Preferably, the light-emitting chip is a flip-chip FC chip for displaying conventional three primary colors.

[0016] Preferably, the adjacent distances of several of the light-emitting chips are the same, and they are arranged in a clockwise closed-loop mixing light arrangement in the order of R-G1-B-G2, and the spacing between them is one of 0.397 mm, 0.47 mm, 0.625 mm and 0.794 mm.

[0017] Preferably, the light-emitting chips are interconnected by one of common cathode and common anode.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] (1) The utility model reduces the number of chips and uses dual G light, and under the control of software and programs, makes the display effect the same as that of a conventional display device (12 chips), effectively saving costs.

[0020] (2) The utility model reduces the number of chips and online processing time, thereby effectively improving production efficiency and product reliability.

[0021] (3) The utility model reduces the number of chips, reduces the power consumption of display devices and the temperature of the display screen, thereby effectively increasing the service life and reducing energy loss.

[0022] (4) The utility model effectively improves the color consistency of the display screen by arranging the RG1BG2 chip inside the display device in a clockwise closed-loop light mixing order according to the R-G1-B-G2 sequence.

[0023] (5) The utility model adopts flip-chip FC chip solder paste welding to effectively improve the brightness and reliability of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the complete BT board structure of the utility model;

[0025] Figure 2 It is a side view of a single structure of the utility model;

[0026] Figure 3 This is a front view schematic diagram of a single structure of the utility model;

[0027] Figure 4 It is a schematic diagram of the back side of a single structure of the utility model;

[0028] In the figure: 1. substrate; 2. solder paste; 3. light-emitting chip; 4. plastic package; 5. front side of substrate; 6. back side of substrate; 7. upper core area; 8. solder resist ink; 9. pad; 10. direction marking ink. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Embodiment 1:

[0031] See also Figure 1-Figure 4 As shown, a small pitch, high brightness display device comprises:

[0032] A substrate 1, wherein the substrate 1 is divided into a substrate front side 5 and a substrate back side 6;

[0033] A plurality of upper core regions 7, arranged at the front side 5 of the substrate;

[0034] A plurality of pads 9 are arranged on the back side 6 of the substrate;

[0035] The light emitting chip 3 is fixed in the upper core area 7 by the solder paste 2 and is electrically connected to the substrate 1. The solder paste 2 realizes electrical functional connection by the eutectic reflow process;

[0036] The plastic package 4 is made of epoxy resin material and is coated on the front side 5 of the substrate to seal and protect the light-emitting chip;

[0037] The front side 5 and the back side 6 of the substrate are both provided with solder resist ink 8 except for the upper core area 7 and the pad 9 , and the back side 6 of the substrate is also provided with direction marking ink 10 in white color.

[0038] Depend on Figure 1-Figure 4 It can be seen that the substrate 1 is composed of a BT board, and the front and back sides thereof are covered with metal layers, and the metal layers are Cu, Ni, Ag and Au, and the required circuits are formed by electroplating and electrochemical deposition processes, and full plating and selective plating processes can be selected to improve the air tightness of the product, reduce the area of ​​precious metals used and reduce costs;

[0039] The thickness of the substrate 1 is one of T0.12mm, T0.18mm, T0.28mm and T0.48mm, and the corresponding finished product dimensions are: 0.69X0.69mm, 0.8X0.8mm, 1.0X1.0mm, 1.408X1.408mm, and the circuits on the front side 5 and the back side 6 of the substrate are electrically connected by mechanical drilling and electroplating hole filling processes;

[0040] The light-emitting chip 3 is a flip-chip FC RG1BG2 chip, which is used to display the three conventional primary colors and can form any color. The G1 and G2 chips are the same chip, which improves the color authenticity and display effect of the screen. Under the control of software and programs, under the same combination different from the surrounding display devices, the effect displayed by the conventional display device is achieved with the least chips. Compared with the conventional display device four-in-one (12 chips), the processing efficiency is high and the process is simple, which saves costs for the packaging factory;

[0041] The adjacent distances of the plurality of light emitting chips 3 are the same, and they are arranged in a clockwise closed-loop light mixing sequence of R-G1-B-G2, and the spacing between them is one of 0.397 mm, 0.47 mm, 0.625 mm and 0.794 mm;

[0042] The light emitting chips 3 are interconnected in a cathode-common manner or an anode-common manner.

[0043] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A small pitch, high brightness display device, characterized in that: include: A substrate (1), wherein the substrate (1) is divided into a substrate front side (5) and a substrate back side (6); A plurality of upper core regions (7) are arranged on the front side (5) of the substrate; A plurality of solder pads (9) are arranged on the back side (6) of the substrate; The light-emitting chip (3) is fixed in the upper core area (7) by means of solder paste (2) and is electrically connected to the substrate (1); A plastic package (4) is coated on the front side of the substrate (5) and is used to seal and protect the light-emitting chip; The front side (5) and back side (6) of the substrate are both provided with solder resist ink (8) except for the upper core area (7) and the pad (9), and the back side (6) of the substrate is also provided with direction marking ink (10).

2. A small pitch, high brightness display device according to claim 1, characterized in that: The substrate (1) is made of a BT board, and both the front and back sides thereof are covered with metal layers, wherein the metal layers are Cu, Ni, Ag and Au, and the required circuits are formed through electroplating and electrochemical deposition processes.

3. A small pitch, high brightness display device according to claim 1, characterized in that: The thickness of the substrate (1) is one of T0.12mm, T0.18mm, T0.28mm and T0.48mm, and the circuits on the front side (5) and the back side (6) of the substrate are electrically connected by mechanical drilling and electroplating hole filling processes.

4. A small pitch, high brightness display device according to claim 1, characterized in that: The light-emitting chip (3) is a flip-chip FC chip, which is used to display conventional three primary colors.

5. A small pitch, high brightness display device according to claim 1, characterized in that: The adjacent distances of the plurality of light-emitting chips (3) are the same, and they are arranged in a clockwise closed-loop light mixing sequence of R-G1-B-G2, and the spacing between the plurality of light-emitting chips is one of 0.397 mm, 0.47 mm, 0.625 mm and 0.794 mm.

6. A small pitch, high brightness display device according to claim 1, characterized in that: The plurality of light-emitting chips (3) are interconnected in one of a common cathode interconnection and a common anode interconnection.

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