Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate and at least two optical chips arranged on the substrate. And at least two light-transmitting glue layers are tightly bonded on the optical chip. The light-transmitting glue layer sequentially comprises a first light-transmitting glue layer and a second light-transmitting glue layer in the direction away from the optical chip. Fence parts are arranged between the light-transmitting glue layers covering the adjacent optical chips and around the light-transmitting glue layers. The bottom of the fence part is connected with the base plate. The sensor device provided by the utility model is high in light energy utilization rate and high in brightness; the precision is high, and the response speed is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is a collection of at least two or two groups of optical chips that emit and receive light. The light-emitting chip emits a light beam, which passes through the optical system to illuminate the object to be measured. The light beam reflected or absorbed by the object passes through the optical system to illuminate the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and output. In order to prevent the emitted light and the received light from interfering with each other, a light-absorbing structure made of opaque material is usually used to isolate them. The existing sensor devices are as follows:

[0003] Prior art 1, reference Figure 3 , the substrate 1 is provided with two optical chips 2, and a light-transmitting adhesive layer 3 is covered on the top of the optical chips 2. A blocking portion 4 is provided between the light-transmitting adhesive layers 3 covering the adjacent optical chips 2 and around the light-transmitting adhesive layers 3, and the bottom surface of the blocking portion 4 is connected to the substrate 1. The blocking portion 4 is formed on the substrate 1 and around the light-transmitting adhesive layer 3 by dispensing, injection molding or molding. Therefore, the blocking portion 4 is tightly connected to the light-transmitting adhesive layer 3.

[0004] Prior art 2, refer to Figure 4 The main difference from the prior art 1 is the way the enclosure 4 is formed on the substrate 1. The enclosure 4 is preformed first, and then the formed enclosure 4 is pasted on the substrate 1, so there is a space margin for assembly between the enclosure 4 and the light-transmitting adhesive layer 3. The other structures are the same as the prior art 1.

[0005] The sensor devices of the prior art 1 and 2 are only provided with a light-transmitting adhesive layer 3, and the optical adjustment capability is limited, resulting in poor light control effect, low accuracy and insensitive response.

[0006] Based on the above, the problem to be solved at present is: to provide a sensor device with good light control effect, high precision and sensitive response. Utility Model Content

[0007] The utility model aims to provide a sensor device, aiming to solve the problems in the prior art that the sensor device has poor light control effect, low accuracy and insensitive response.

[0008] The utility model is implemented as follows: a sensor device comprises: a substrate and at least two optical chips arranged on the substrate; at least two light-transmitting adhesive layers are tightly attached to the optical chip; the light-transmitting adhesive layers sequentially comprise a first light-transmitting adhesive layer and a second light-transmitting adhesive layer in a direction away from the optical chip;

[0009] A blocking portion is provided between the light-transmitting adhesive layers covering adjacent optical chips and around the light-transmitting adhesive layers, and the bottom of the blocking portion is connected to the substrate.

[0010] Furthermore, the first light-transmitting adhesive layer covers the upper surface and side surfaces of the optical chip; and the second light-transmitting adhesive layer covers part or all of the upper surface of the first light-transmitting adhesive layer.

[0011] Furthermore, the optical interface of the second light-transmitting adhesive layer away from the first light-transmitting adhesive layer is set to be a plane or a curved surface.

[0012] Furthermore, the refractive index of the second light-transmitting adhesive layer is greater than the refractive index of the first light-transmitting adhesive layer.

[0013] Furthermore, the optical chip includes a light-emitting chip and a photosensitive chip.

[0014] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0015] The sensor devices of the prior art 1 and 2 are only provided with a layer of light-transmitting adhesive layer 3 for encapsulating the optical chip 2, and the optical adjustment capability is limited, and the light energy utilization and light control effects are not good. The optical chip 2 of the sensor device of the utility model is covered with at least a first light-transmitting adhesive layer 31 and a second light-transmitting adhesive layer 32. The first light-transmitting adhesive layer 31 and the second light-transmitting adhesive layer 32 are tightly combined into a "double lens" structure. The refractive index of the first light-transmitting adhesive layer 31 and the second light-transmitting adhesive layer 32 are different. The principle of light refraction at the interface of the "double lens" is used to optically shape the incident light / outgoing light to achieve the desired optical effect, such as achieving a small angle range of the outgoing light / received light, a more precise light irradiation position, etc., so that the sensor device of the utility model has a high light energy utilization rate and a good light control effect. In the same optical angle range, the utility model is smaller in size than the prior art, easier to optically design, higher in accuracy, and faster in response. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0017] Figure 2 It is a schematic cross-sectional structure diagram of another sensor device provided by the utility model;

[0018] Figure 3 It is a schematic diagram of the cross-sectional structure of a sensor device of prior art 1;

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of a sensor device of the second prior art;

[0020] In the figure: 1-substrate; 2-optical chip; 3-light-transmitting adhesive layer; 31-first light-transmitting adhesive layer; 32-second light-transmitting adhesive layer; 4-enclosing portion. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0023] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0024] Reference Figure 1-2 As shown, it is a preferred embodiment provided by the utility model.

[0025] A sensor device includes a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3 and a blocking portion 4, referring to Figure 1 . The optical chip 2 includes at least two and is arranged on the substrate 1. At least two layers of transparent adhesive layers 3 are sequentially covered on the optical chip 2, and the transparent adhesive layers 3 are used to encapsulate the optical chip 2 and optically shape the optical chip 2. The transparent adhesive layer 3 includes a first transparent adhesive layer 31 and a second transparent adhesive layer 32 in a direction away from the optical chip 2. The refractive index of the second transparent adhesive layer 32 is preferably greater than the refractive index of the first transparent adhesive layer 31. On the one hand, the provision of the transparent adhesive layer 3 can improve the light extraction rate; on the other hand, the light is controlled by utilizing the principle of refraction when propagating at the interface of the first transparent adhesive layer 31 and the second transparent adhesive layer 32 with different refractive indices, so as to achieve a preset optical effect and improve the accuracy and reaction speed of the sensor device. The optical chip 2 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The transparent adhesive layer 3 covering the light-emitting chip and the photosensitive chip is used to optically adjust the emitted light and the received light, respectively.

[0026] The enclosure 4 is provided on the substrate 1 and surrounds between the light-transmitting adhesive layers 3 covering the adjacent optical chips 2 and around the light-transmitting adhesive layers 3. The enclosure 4 can be provided with a light-absorbing portion made of a light-absorbing material to prevent light interference from the adjacent optical chips 2. Of course, the enclosure 4 can also be provided with a non-light-absorbing portion made of a non-light-absorbing material as needed, as long as it has the structure of the utility model, it is within the concept of the utility model.

[0027] The enclosure 4 can be formed in the following ways:

[0028] Method 1: Formed on the substrate 1 around the first light-transmitting adhesive layer 31 by dispensing, injection molding or molding. Therefore, the enclosure 4 is tightly connected to the light-transmitting adhesive layer 3. Figure 1 .

[0029] Method 2: First, preform the enclosure 4, and then paste the formed enclosure 4 on the substrate 1, so there is a space margin for assembly between the enclosure 4 and the first light-transmitting adhesive layer 31, that is, the enclosure 4 covers the first light-transmitting adhesive layer 31 at intervals, referring to Figure 2 .

[0030] Furthermore, the first light-transmitting adhesive layer 31 tightly covers the upper surface and side surfaces of the optical chip 2 and is placed on the substrate 1. The second light-transmitting adhesive layer 32 can be configured to: 1. cover part of the upper surface of the first light-transmitting adhesive layer 31; 2. cover the entire upper surface of the first light-transmitting adhesive layer 31. The upper surface of the second light-transmitting adhesive layer 32 can be configured to be a plane or a curved surface to achieve a preset optical angle range, brightness, and light spot shape.

[0031] The second light-transmitting adhesive layer 32 is formed in the following ways: Method 1: the first light-transmitting adhesive layer 31 is glued or molded and then cured; Method 2: the second light-transmitting adhesive layer 32 is preformed and then bonded to the upper surface of the first light-transmitting adhesive layer 31 .

[0032] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: A substrate (1) and at least two optical chips (2) arranged on the substrate (1); at least two light-transmitting adhesive layers (3) are tightly bonded to the optical chips (2); the light-transmitting adhesive layers (3) sequentially comprise a first light-transmitting adhesive layer (31) and a second light-transmitting adhesive layer (32) in a direction away from the optical chip (2); A blocking portion (4) is provided between the light-transmitting adhesive layers (3) covering adjacent optical chips (2) and around the light-transmitting adhesive layers (3), and the bottom of the blocking portion (4) is connected to the substrate (1).

2. The sensor device according to claim 1, characterized in that The first light-transmitting adhesive layer (31) covers the upper surface and side surfaces of the optical chip (2); and the second light-transmitting adhesive layer (32) covers part or all of the upper surface of the first light-transmitting adhesive layer (31).

3. The sensor device according to claim 1, characterized in that: The optical interface of the second light-transmitting adhesive layer (32) away from the first light-transmitting adhesive layer (31) is arranged to be a plane or a curved surface.

4. The sensor device according to claim 1, characterized in that The refractive index of the second light-transmitting adhesive layer (32) is greater than the refractive index of the first light-transmitting adhesive layer (31).

5. The sensor device according to claim 1, characterized in that The optical chip (2) comprises a light-emitting chip and a photosensitive chip.

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