Circuit board with water-cooling and air-cooling heat dissipation systems

Abstract

The utility model discloses a circuit board with a water-cooling and air-cooling heat dissipation system. The circuit board comprises a PCB main body and an edge covering shell, the edge covering shell is provided with at least one air inlet, and the shell surface of the edge covering shell is provided with at least one air outlet. The circuit board further comprises a heat dissipation system, and the heat dissipation system comprises an air cooling heat dissipation system and a water cooling heat dissipation system. The air cooling heat dissipation system comprises at least one fan module, the fan module is fixed to the installation cavity through a common-mode base plate, and the water cooling heat dissipation system comprises a water inlet quick connector, a water outlet quick connector and a heat conduction water tank arranged in the installation cavity. The heat conduction water tank is fixed on the common mode seat plate, one surface of the heat conduction water tank is attached to the main heating source of the PCB main body, and heat conduction paste is arranged between the heat conduction water tank and the main heating source. The circuit board is provided with a water-cooling and air-cooling combined heat dissipation system, heat of the processor is efficiently discharged through double heat dissipation by water-cooling heat absorption and air exhaust through the fan, and the purpose of stable operation of the processor is achieved.

Description

Technical Field

[0001] The utility model relates to a circuit board, in particular to a circuit board with a water cooling and air cooling heat dissipation system. Background Art

[0002] Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, and military weapon systems, as long as it has electronic components such as integrated circuits, must use circuit boards to make electrical interconnections between the various components. The circuit board consists of an insulating base plate, connecting wires, and pads for assembling and welding electronic components, and has the dual functions of a conductive line and an insulating base plate.

[0003] However, with the continuous increase in industrial demand, highly integrated circuits have caused the power consumption density of processors to increase exponentially in the same area, resulting in a sharp increase in heat generation. At the same time, due to the low thermal conductivity of the insulating dielectric layer between the circuits, this will cause problems such as heat concentration, local overheating, and even high-temperature failure in the processor. Research data shows that more than 50% of electronic device failures are caused by heat dissipation problems. When the temperature of the device exceeds 80°C, the reliability of the device decreases by 5% for every 1°C increase in temperature. The traditional cooling method is through external microchannel heat sink technology and fan heat dissipation technology, but the existing heat dissipation technology can no longer effectively remove the heat generated by the device.

[0004] In view of this, it is necessary to improve the heat dissipation system of the existing highly integrated circuit circuit board. Utility Model Content

[0005] In view of the deficiencies in the prior art, the technical problem to be solved by the utility model is to provide a circuit board with a water cooling and air cooling heat dissipation system. The purpose of designing the circuit board is to improve the heat dissipation efficiency, prevent the processor temperature from being too high, and thus prevent the performance of the processor from being reduced.

[0006] In order to solve the above technical problems, the utility model is implemented by the following scheme: a circuit board with a water-cooling and air-cooling heat dissipation system of the utility model comprises a PCB body, and also comprises an edge-wrapped shell connected to the PCB body, the edge-wrapped shell fully covers the component mounting surface of the PCB body and forms a mounting cavity in the edge-wrapped shell, the shell side of the edge-wrapped shell is provided with at least one air inlet and the shell surface of the edge-wrapped shell is provided with at least one air outlet;

[0007] The circuit board also includes a heat dissipation system, which includes an air-cooling heat dissipation system and a water-cooling heat dissipation system;

[0008] The air-cooling heat dissipation system includes at least one set of fan modules, which are fixed to the installation cavity through a common mold base plate, and an air duct is formed between the air inlet, the fan module, and the air outlet;

[0009] The water cooling system includes a water inlet quick connector and a water outlet quick connector provided on the outside of the edge shell, and a heat conduction water tank provided in the installation cavity, the heat conduction water tank is fixed to the common mold base plate, one side of the heat conduction water tank is attached to the main heat source of the PCB body, and a thermal conductive paste is provided between the heat conduction water tank and the main heat source, and the water inlet quick connector, the heat conduction water tank, and the water outlet quick connector are connected by a pipeline;

[0010] The fan module and the heat conduction water tank are arranged back to back and the air duct passes through the heat conduction water tank.

[0011] Furthermore, the air ducts between the air inlet and the air outlet are arranged in a one-to-one pairing.

[0012] Furthermore, an air inlet end of the fan module is connected to an air guide duct, and the air guide duct is directly opposite to the air inlet.

[0013] Furthermore, the fan modules are provided with two groups, and the two groups of fan modules are equipped with two groups of the common-mode seat plates;

[0014] The heat conduction water tanks are provided with two groups, and the two groups of heat conduction water tanks are installed one-to-one on the two groups of common mold base plates.

[0015] Furthermore, the two groups of heat conduction water tanks are connected by two pipe groups, and the pipe groups include two L-shaped pipes and a group of intermediate flexible transfer pipes. The two L-shaped pipes are installed one-to-one on the two groups of heat conduction water tanks, and the two L-shaped pipes are connected by a flexible transfer pipe.

[0016] Furthermore, one group of the heat conduction water tanks is connected to the water inlet quick connector via a first pipeline, and the other group of the heat conduction water tanks is connected to the water outlet quick connector via a second pipeline.

[0017] Furthermore, rotatable clips are connected to both ends of one side of the edging shell.

[0018] Furthermore, the fan of the fan module is a worm gear fan.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] 1. The circuit board of the utility model is provided with a heat dissipation system combining water cooling and air cooling, which absorbs heat through water cooling and exhausts air through a fan, thereby achieving double heat dissipation, so that the heat of the processor can be discharged efficiently, thereby achieving the purpose of stable operation of the processor.

[0021] 2. The circuit board of the utility model is fixed by an edge-wrapped shell, which is convenient for installing a heat dissipation system.

[0022] 3. The heat dissipation system of the utility model can meet the heat dissipation requirements of a circuit board with multiple processors. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional diagram of the visible etching surface of the circuit board of the utility model.

[0024] Figure 2 This is a top view of the visible etching surface of the circuit board of the utility model.

[0025] Figure 3 This is a three-dimensional diagram of the visible air outlet of the circuit board of the utility model.

[0026] Figure 4 This is an installation structure diagram of the fan module and the common-mode base plate of the utility model.

[0027] Figure 5 This is a structural diagram of the fan module of the utility model.

[0028] Figure 6 This is an installation structure diagram of the water cooling and heat dissipation system and the common mold base plate of the utility model.

[0029] Markings in the accompanying drawings: PCB body 1, air inlet 2, edging shell 3, clip 4, water inlet quick connector 5, signal socket 6, water outlet quick connector 8, common mode seat plate 9, heat conduction water tank 10, first pipeline 12, second pipeline 13, flexible transfer pipeline 14, air outlet 31, fan air inlet 71, and air guide duct 72. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model, so that the advantages and features of the utility model can be more easily understood by those skilled in the art, thereby making a clearer and more explicit definition of the protection scope of the utility model. Obviously, the embodiments described in the utility model are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0031] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] Embodiment 1, the specific structure of the utility model is as follows (hereinafter described by taking a circuit board with two processors as an example):

[0033] Please refer to the attached Figure 1-6The utility model provides a circuit board with a water-cooling and air-cooling heat dissipation system, comprising a PCB body 1, and also comprising an edge shell 3 connected to the PCB body 1, wherein the edge shell 3 fully covers the component mounting surface of the PCB body 1 and forms a mounting cavity in the edge shell 3, and the shell side of the edge shell 3 is provided with at least one air inlet 2 and the shell surface of the edge shell 3 is provided with at least one air outlet 31; Figure 1 As shown, two air inlets 2 are provided, and the air inlets 2 are realized by openings on the side of the edging shell 3 .

[0034] The edge shell 3 of the utility model is made of aluminum material with good thermal conductivity, and except for one side of the air inlet 2, the other three sides are set to an L-shaped structure. Among the three L-shaped sides of the edge shell 3, the L-shaped side away from the air inlet 2 is provided with two rectangular holes, and the signal sockets 6 installed on the PCB body 1 are provided in the two rectangular holes.

[0035] like Figure 3 As shown, there are two air outlets 31, and the air outlet 31 is composed of a plurality of strip holes arranged in parallel and equidistantly.

[0036] The circuit board also includes a heat dissipation system, which includes an air-cooling heat dissipation system and a water-cooling heat dissipation system;

[0037] The air-cooling heat dissipation system includes at least one set of fan modules 7, which are fixed to the installation cavity through a common mold base plate 9, and an air duct is formed between the air inlet 2, the fan module 7, and the air outlet 31; the fan of the fan module 7 adopts a worm fan, and the fan air inlet 71 of the worm fan is connected to the air duct 72, and the air duct 72 is directly opposite to the air inlet 2. When the worm fan is working, the external cold air enters from the air inlet 2, passes through the air duct 72, the worm fan, and is finally discharged from the air outlet 31.

[0038] The water cooling system includes a water inlet quick connector 5 and a water outlet quick connector 8 arranged outside the edge shell 3 and a heat conduction water tank 10 arranged in the installation cavity, the heat conduction water tank 10 is fixed to the common mold base plate 9 and one side of the heat conduction water tank 10 is attached to the main heat source of the PCB body 1 and a thermal conductive paste is arranged between the heat conduction water tank 10 and the main heat source, and the water inlet quick connector 5, the heat conduction water tank 10 and the water outlet quick connector 8 are connected by a pipeline;

[0039] The fan module 7 and the heat-conducting water tank 10 are arranged opposite to each other and the air duct passes through the heat-conducting water tank 10. When the processor is working, a large amount of heat will be generated, most of which will be absorbed by the heat-conducting water tank 10 and radiated to the air duct and the surrounding area. Since the air duct passes through the heat-conducting water tank 10, the cold air will pass through the air duct and discharge the heat, thereby achieving the purpose of efficient heat dissipation.

[0040] A preferred technical solution of this embodiment: Figure 3 As shown, two groups of air inlets 2 and air outlets 31 are provided, and the air ducts between the air inlets 2 and the air outlets 31 are arranged in a one-to-one pairing.

[0041] The fan modules 7 are provided with two groups, and the two groups of fan modules 7 are equipped with two groups of the common-mode seat plates 9;

[0042] The heat conducting water tanks 10 are provided with two groups, and the two groups of heat conducting water tanks 10 are installed one-to-one on the two groups of common mold base plates 9. The two groups of heat conducting water tanks 10 correspond to two processors respectively.

[0043] like Figure 6 As shown, the two groups of heat conduction tanks 10 are connected by two pipe groups, and the pipe groups include two L-shaped pipes 11 and a group of intermediate flexible transfer pipes 14. The two L-shaped pipes 11 are installed one-to-one on the two groups of heat conduction tanks 10, and the two L-shaped pipes 11 are connected by the flexible transfer pipe 14.

[0044] A preferred technical solution of this embodiment: one group of heat conduction water tanks 10 is connected to the water inlet quick connector 5 via a first pipeline 12 , and another group of heat conduction water tanks 10 is connected to the water outlet quick connector 8 via a second pipeline 13 .

[0045] The water cooling system of the utility model is a circulating water and uses pure water. Pure water is a weak dielectric and does not conduct electricity under normal conditions. Figure 6 As shown, when the water pump in the water cooling system is working, pure water will enter the first pipeline 12 through the water inlet quick connector 5 and reach the first heat transfer water tank 10. Figure 6 Both sides of the left heat conduction water tank 10 are connected to L-shaped pipes 11. Figure 6 The pure water in the left heat conduction water tank 10 will pass through Figure 6 The two L-shaped tubes 11 on the left are then fed into the Figure 6 The two L-shaped tubes 11 on the right side, Figure 6 The two L-shaped pipes 11 on the right are connected Figure 6 In the heat transfer water tank 10 on the right, pure water absorbs heat and is finally sent to the second pipe 13 through the second pipe 13, and then sent to the water pump through the return pipe to realize the water circulation process.

[0046] The utility model adopts the flexible transfer pipe 14 to facilitate the connection of the waterway.

[0047] In addition, the two heat conduction tanks 10 of the present invention are made of aluminum or copper. Aluminum and copper are both good conductive materials.

[0048] A preferred technical solution of this embodiment: both ends of one side of the edge shell 3 are connected with rotatable clips 4, and the two clips 4 are used to position the circuit board.

[0049] In summary, the circuit board of the utility model is provided with a heat dissipation system combining water cooling and air cooling, which absorbs heat through water cooling and exhausts air through a fan, thereby achieving double heat dissipation, so that the heat of the processor is efficiently discharged, thereby achieving the purpose of stable operation of the processor. The circuit board of the utility model is fixed by an edge-wrapped shell, which is convenient for installing the heat dissipation system. The heat dissipation system of the utility model can meet the heat dissipation requirements of a circuit board with multiple processors.

[0050] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A circuit board with a water-cooling and air-cooling heat dissipation system, comprising a PCB body (1), characterized in that , further comprising an edge shell (3) connected to the PCB body (1), the edge shell (3) completely covering the component mounting surface of the PCB body (1) and forming a mounting cavity in the edge shell (3), the shell side of the edge shell (3) being provided with at least one air inlet (2) and the shell surface of the edge shell (3) being provided with at least one air outlet (31); The circuit board also includes a heat dissipation system, which includes an air-cooling heat dissipation system and a water-cooling heat dissipation system; The air-cooling heat dissipation system comprises at least one set of fan modules (7), the fan modules (7) being fixed to the installation cavity via a common-mode seat plate (9), and an air duct being formed between the air inlet (2), the fan module (7) and the air outlet (31); The water cooling and heat dissipation system comprises a water inlet quick connector (5) and a water outlet quick connector (8) arranged on the outside of the edge shell (3), and a heat conduction water tank (10) arranged in the installation cavity, the heat conduction water tank (10) is fixed to the common mold base plate (9), one side of the heat conduction water tank (10) is attached to the main heat source of the PCB body (1), and a thermal conductive paste is arranged between the heat conduction water tank (10) and the main heat source, and the water inlet quick connector (5), the heat conduction water tank (10), and the water outlet quick connector (8) are connected by a pipeline; The fan module (7) and the heat conduction water tank (10) are arranged opposite to each other and the air duct passes through the heat conduction water tank (10).

2. A circuit board with a water cooling and air cooling system according to claim 1, characterized in that: The air ducts between the air inlet (2) and the air outlet (31) are arranged in a one-to-one pairing.

3. The circuit board with water cooling and air cooling system according to claim 1, characterized in that: The air inlet end of the fan module (7) is connected to an air guide duct (72), and the air guide duct (72) is directly opposite to the air inlet (2).

4. A circuit board with a water cooling and air cooling system according to claim 3, characterized in that: The fan modules (7) are provided with two groups, and the two groups of fan modules (7) are equipped with two groups of common-mode seat plates (9); The heat conduction water tanks (10) are provided in two groups, and the two groups of heat conduction water tanks (10) are installed one-to-one on the two groups of common mold base plates (9).

5. A circuit board with a water cooling and air cooling system according to claim 4, characterized in that: The two groups of heat transfer tanks (10) are connected via two pipe groups, the pipe groups comprising two L-shaped pipes (11) and a group of intermediate flexible transfer pipes (14), the two L-shaped pipes (11) are installed one-to-one on the two groups of heat transfer tanks (10), and the two L-shaped pipes (11) are connected via the flexible transfer pipe (14).

6. A circuit board with a water cooling and air cooling system according to claim 5, characterized in that: One group of heat transfer water tanks (10) is connected to a water inlet quick connector (5) via a first pipeline (12), and the other group of heat transfer water tanks (10) is connected to a water outlet quick connector (8) via a second pipeline (13).

7. The circuit board with water cooling and air cooling system according to claim 1, characterized in that: Both ends of one side of the edging shell (3) are connected with rotatable clips (4).

8. The circuit board with water cooling and air cooling system according to claim 1, characterized in that: The fan of the fan module (7) is a worm gear fan.

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