External protection device for electronic material

Abstract

The utility model relates to the technical field of electronic material protection, in particular to an external protection device for electronic materials, which comprises a storage box, a plurality of storage drawers are slidably mounted in the storage box, and a temperature and humidity sensor is mounted on the inner top wall of the storage box. A temperature control mechanism used for adjusting the temperature in the storage box is installed on the rear side wall of the storage box, and a controller is installed outside the storage box. Through the arrangement of the temperature control mechanism, the temperature in the storage box can be automatically controlled, the situation that the temperature in the storage box is too high or too low, and consequently the electrical performance and stability of semiconductor materials are affected is prevented, and when the temperature in the storage box is lowered or raised, air in the storage box can be dehumidified; the humidity in the storage box is reduced while the temperature is regulated and controlled, the materials are prevented from being affected with damp, and the protection effect of equipment on the materials is enhanced.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic material protection, and particularly relates to an external protection device for electronic materials. Background Art

[0002] Electronic materials refer to materials used in electronic technology and microelectronics technology, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloy materials, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials, and other related materials.

[0003] In the Chinese patent with the publication number CN216333539U, an external protection device for electronic materials is mentioned. In this patent, the device has multiple storage boxes slidably connected to a storage box. The cross-section of the storage box is in the shape of "匚". A handle is fixedly connected to the side of the storage box. A tray is slidably connected to the inner wall of the storage box. There are multiple support springs between the tray and the storage box, and the two ends of the support spring are respectively fixed to the side walls of the tray and the storage box. The electronic board is placed in the storage box for storage, which is convenient for storage and protection. Since there are multiple storage boxes, different electronic boards can be classified and stored, and it is easy to use.

[0004] When the device of this patent stores semiconductor materials, semiconductor materials are highly sensitive to temperature and humidity. In a high-temperature environment, the organic substances in semiconductor materials are likely to volatilize or oxidize. In a low-temperature environment, the electron movement ability of semiconductor materials is likely to decrease. In an environment with excessive humidity, the materials are likely to get damp. However, this device cannot control the temperature inside the storage box and remove the moisture inside the storage box, resulting in the electrical performance and stability of the materials being easily reduced when the device stores semiconductor materials, and the protection effect on the materials is poor. Summary of the Utility Model

[0005] The purpose of the utility model is to provide an external protection device for electronic materials to solve the problem that in the prior art, when the device stores semiconductor materials, it is easily affected by temperature and humidity, resulting in a reduction in the electrical performance and stability of the materials and a poor protection effect on the materials.

[0006] To achieve the above purpose, the utility model provides the following technical solutions:

[0007] An external protection device for electronic materials includes a storage box. A plurality of storage drawers are slidably installed inside the storage box. A temperature and humidity sensor is installed on the inner top wall of the storage box. A temperature control mechanism for adjusting the temperature inside the storage box is installed on the rear side wall of the storage box. A controller is installed outside the storage box.

[0008] The temperature control mechanism includes a mounting plate, which is mounted on the back of the storage box by fastening bolts. A condensing plate, a semiconductor refrigeration plate and a heat sink are fixedly mounted side by side on one side of the mounting plate. The condensing plate is mounted on the cooling surface of the semiconductor refrigeration plate, and the heat sink is mounted on the heating surface of the semiconductor refrigeration plate.

[0009] Preferably, one side of the mounting plate is also fixedly connected to a support box, the support box is arranged below the semiconductor refrigeration sheet, a fan is fixedly mounted on one side of the support box, and a slope is arranged on the other side of the support box.

[0010] Preferably, a guide hole is opened inside the mounting plate, and the guide hole is arranged between the slope and the condensing plate. A drain pipe is installed on the back of the mounting plate, and the drain pipe is connected to the guide hole.

[0011] Preferably, a heat dissipation hole for dissipating heat from the semiconductor refrigeration plate is provided on the back of the mounting plate.

[0012] Preferably, the temperature and humidity sensor, semiconductor cooling sheet and fan are all electrically connected to the controller.

[0013] Preferably, an insertion box for inserting labels is installed on the front side of the storage drawer.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] 1. The utility model can automatically control the temperature in the storage box by setting a temperature control mechanism to prevent the temperature in the storage box from being too high or too low, which will affect the electrical properties and stability of the semiconductor materials. When lowering or raising the temperature in the storage box, the air in the storage box can be dehumidified to reduce the humidity in the storage box while regulating the temperature, thereby preventing the materials from getting damp and enhancing the protective effect of the equipment on the materials.

[0016] 2. The utility model provides an insert box in which a label can be placed. The label can indicate important information such as the name, batch, and production date of the material. When taking the material, the staff does not need to open the storage drawers one by one to search, which is convenient for the staff to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is one of the three-dimensional diagrams of the utility model;

[0018] Figure 2 This is the second stereogram of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the storage box of the utility model;

[0020] Figure 4This is one of the structural schematic diagrams of the temperature control mechanism of the utility model;

[0021] Figure 5 This is the second structural schematic diagram of the temperature control mechanism of the utility model;

[0022] Figure 6 It is a structural schematic diagram of the storage drawer of the present utility model.

[0023] In the figure:

[0024] 1. Storage box;

[0025] 2. Storage drawers;

[0026] 3. Temperature and humidity sensor;

[0027] 4. Controller;

[0028] 5. Temperature control mechanism; 51. Mounting plate; 52. Semiconductor cooling plate; 53. Condenser plate; 54. Heat dissipation plate; 55. Diversion hole; 56. Support box; 57. Fan; 58. Slope; 59. Drain pipe; 510. Heat dissipation hole;

[0029] 6. Plug in box. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] Reference Figure 1-Figure 6As shown, an external protection device for electronic materials includes a storage box 1, a plurality of storage drawers 2 are slidably installed inside the storage box 1, the storage drawers 2 are used to store semiconductor materials and protect the semiconductor materials, a temperature and humidity sensor 3 is installed on the inner top wall of the storage box 1, the temperature and humidity sensor 3 is used to detect the temperature and humidity in the storage box 1, the temperature and humidity sensor 3 is a prior art, and its specific structure and working principle are not described in detail here, a temperature control mechanism 5 for adjusting the temperature in the storage box 1 is installed on the rear side wall of the storage box 1, a controller 4 is installed outside the storage box 1, and a display screen is provided on the controller 4, and the temperature and humidity sensor 3 can transmit the detected information to the display on the controller 4 The screen is displayed to facilitate the staff to understand the temperature and humidity information in the storage box 1, and the controller 4 can compare the detected values. In the initial state, the temperature threshold of the controller 4 is set at 20°-30° by default (in subsequent use, the staff can adjust the temperature threshold according to the stored materials). When the temperature exceeds the threshold set by the controller 4, the temperature control mechanism 5 can be driven to adjust the temperature in the storage box 1 to avoid the temperature in the storage box 1 being too high or too low, affecting the electrical properties and stability of the materials. In addition, the moisture in the air in the storage box 1 can be removed during the adjustment process to avoid the humidity in the storage box 1 being too high, causing the materials to be damp, thereby strengthening the protective effect of the equipment on the materials.

[0032] Specifically, the temperature control mechanism 5 includes a mounting plate 51, which is mounted on the back of the storage box 1 by fastening bolts. A condensing sheet 53, a semiconductor refrigeration sheet 52 and a heat sink 54 are fixedly mounted side by side on one side of the mounting plate 51. A plurality of water guide grooves are provided on the surface of the condensing sheet 53, and a plurality of groups of heat sinks are provided on the surface of the heat sink 54. The condensing sheet 53 is mounted on the cooling surface of the semiconductor refrigeration sheet 52, and the heat sink 54 is mounted on the heating surface of the semiconductor refrigeration sheet 52. The semiconductor refrigeration sheet 52 can both heat and cool. When the temperature in the storage box 1 is too high, the controller 4 controls the semiconductor refrigeration sheet 52 to cool and lower the temperature in the storage box 1. At the same time, the condensing sheet 53 can condense water vapor in the air into water droplets to reduce the humidity in the air. When the temperature in the storage box 1 is too low, the controller 4 controls the semiconductor refrigeration sheet 52 to heat, and the heat sink 54 dissipates heat to the air in the storage box 1, thereby increasing the temperature in the storage box 1.

[0033] More specifically, one side of the mounting plate 51 is also fixedly connected to a support box 56, which is disposed below the semiconductor cooling plate 52. A fan 57 is fixedly mounted on one side of the support box 56, and a slope 58 is disposed on the other side of the support box 56. The heat sink 54 dissipates heat into the air in the storage box 1. Driving the fan 57 can disperse the dry hot air around the heat sink 54 into the storage box 1, thereby accelerating the circulation of hot air and reducing the humidity in the storage box 1.

[0034] Furthermore, a guide hole 55 is opened inside the mounting plate 51, and the guide hole 55 is arranged between the slope 58 and the condensing sheet 53. A drain pipe 59 is installed on the back of the mounting plate 51, and the drain pipe 59 is connected with the guide hole 55. The water droplets on the condensing sheet 53 flow along the water guide groove of the condensing sheet 53 to the slope 58, and can flow into the guide hole 55 from the slope 58, and finally be discharged from the drain pipe 59, so that the water droplets can be discharged into the storage box 1.

[0035] Furthermore, a heat dissipation hole 510 for dissipating heat from the semiconductor cooling plate 52 is provided on the back of the mounting plate 51 . The heat dissipation hole 510 is used to dissipate heat from the semiconductor cooling plate 52 body to ensure the normal operation of the semiconductor cooling plate 52 .

[0036] Furthermore, the temperature and humidity sensor 3, the semiconductor refrigeration plate 52 and the fan 57 are all electrically connected to the controller 4. The temperature and humidity sensor 3 transmits the temperature and humidity information in the storage box 1 to the controller 4. The controller 4 can automatically control the start-up of the semiconductor refrigeration plate 52 and the fan 57 without manual monitoring, thereby reducing the workload of the staff. A control button is provided on the controller 4. In the event of a sudden accident, the staff can also manually control the start and stop of the temperature control mechanism 5.

[0037] In order to facilitate personnel to observe the material information in the storage drawer 2, the following settings are made: a plug-in box 6 for inserting labels is installed on the front side of the storage drawer 2. The label can mark important information such as the name, batch, production date, etc. of the material. When taking materials, the staff does not need to open the storage drawers 2 one by one to search, which is convenient for the staff to use.

[0038] Working principle: When in use, the temperature and humidity sensor 3 detects the temperature and humidity in the storage box 1. When it is detected that the temperature exceeds the set threshold, the controller 4 controls the temperature control mechanism 5 to adjust the temperature in the storage box 1. At the same time, the moisture in the storage box 1 can be removed through the condensing sheet 53 or the heat sink 54 and the fan 57 to prevent the semiconductor material from being affected by temperature or humidity, thereby enhancing the protection of the equipment to the material.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An external protection device for electronic materials, comprising a storage box (1), characterized in that: A plurality of storage drawers (2) are slidably mounted inside the storage box (1), a temperature and humidity sensor (3) is mounted on the inner top wall of the storage box (1), a temperature control mechanism (5) for adjusting the temperature inside the storage box (1) is mounted on the rear side wall of the storage box (1), and a controller (4) is mounted outside the storage box (1); The temperature control mechanism (5) comprises a mounting plate (51), wherein the mounting plate (51) is mounted on the back of the storage box (1) by means of fastening bolts, and a condensing plate (53), a semiconductor cooling plate (52) and a heat sink (54) are fixedly mounted side by side on one side of the mounting plate (51), wherein the condensing plate (53) is mounted on the cooling surface of the semiconductor cooling plate (52), and the heat sink (54) is mounted on the heating surface of the semiconductor cooling plate (52).

2. The external protection device for electronic materials according to claim 1, characterized in that: A support box (56) is also fixedly connected to one side of the mounting plate (51), and the support box (56) is arranged below the semiconductor cooling plate (52). A fan (57) is fixedly mounted on one side of the support box (56), and a slope (58) is arranged on the other side of the support box (56).

3. The external protection device for electronic materials according to claim 2, characterized in that: A guide hole (55) is provided inside the mounting plate (51), and the guide hole (55) is arranged between the slope (58) and the condensing plate (53). A drainage pipe (59) is installed on the back of the mounting plate (51), and the drainage pipe (59) is connected to the guide hole (55).

4. The external protection device for electronic materials according to claim 1, characterized in that: The back of the mounting plate (51) is provided with a heat dissipation hole (510) for dissipating heat from the semiconductor cooling plate (52).

5. The external protection device for electronic materials according to claim 1, characterized in that: The temperature and humidity sensor (3), the semiconductor cooling sheet (52) and the fan (57) are all electrically connected to the controller (4).

6. The external protection device for electronic materials according to claim 1, characterized in that: An insertion box (6) for inserting labels is installed on the front side of the storage drawer (2).

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