Packaging structure of photoelectric coupler and photoelectric coupler

Abstract

The utility model discloses a packaging structure of a photoelectric coupler and the photoelectric coupler, the packaging structure of the photoelectric coupler comprises a packaging substrate, a first adhesive layer and a second adhesive layer, the first adhesive layer covers the packaging substrate, and the second adhesive layer covers the packaging substrate and the first adhesive layer; the packaging substrate comprises a first base material and a second base material, and the second base material is stacked on the top surface of the first base material; a first circuit connecting layer and a second circuit connecting layer are arranged on the first base material; a first patch pin, a second patch pin, a third patch pin and a fourth patch pin are arranged on the bottom surface of the first base material, the first patch pin and the second patch pin are connected with the first line connecting layer, and the third patch pin and the fourth patch pin are connected with the second line connecting layer. The utility model has the advantages of simple manufacturing process, good appearance consistency, low cost and high product yield.

Description

Technical Field

[0001] The utility model relates to the technical field of photoelectric couplers, in particular to a packaging structure of a photoelectric coupler and a photoelectric coupler. Background Art

[0002] As a safety device for electric-optical-electrical conversion isolation, the photocoupler has a wide range of market applications and environments. Usually, the light-emitting chip and the photosensitive chip in the photocoupler are encapsulated and coated in the same package, and the internal structure of the package is generally contrasting or reflective. In the existing manufacturing technology, whether it is a contrasting or reflective structure, it is necessary to open the metal lead frame mold, which is costly and has a long production cycle; and the existing structure generally uses a double layer of colloid to completely cover, or only covers the light-emitting chip, the photosensitive chip and part of the bonding wire, which has poor air tightness, and after the colloid is coated, special equipment is required to perform operations such as applying glue, removing waste glue, cutting metal ribs, and bending the pins. The manufacturing process is relatively complicated and the device consistency is poor. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art. The utility model provides a packaging structure of a photoelectric coupler and a photoelectric coupler, which does not require a metal lead frame mold, has a simple manufacturing process, low cost, a short manufacturing cycle, good consistency in device appearance, and effectively improves product manufacturing efficiency and yield.

[0004] The utility model provides a packaging structure of a photoelectric coupler, the packaging structure of the photoelectric coupler comprises a packaging substrate, a first adhesive layer, and a second adhesive layer, wherein the first adhesive layer covers the packaging substrate, and the second adhesive layer covers the packaging substrate and the first adhesive layer;

[0005] The packaging substrate comprises a first substrate and a second substrate, wherein the second substrate is stacked on the top surface of the first substrate;

[0006] A first circuit connection layer and a second circuit connection layer are provided on the first substrate, the first circuit connection layer covers the top surface and the left side surface of the first substrate, and the second circuit connection layer covers the top surface and the right side surface of the first substrate;

[0007] The bottom surface of the first substrate is provided with a first SMD pin, a second SMD pin, a third SMD pin and a fourth SMD pin. The first SMD pin and the second SMD pin are connected to the first circuit connection layer, and the third SMD pin and the fourth SMD pin are connected to the second circuit connection layer.

[0008] Furthermore, a first cavity and a second cavity are provided in the second substrate, a first chip is provided in the first cavity, a second chip is provided in the second cavity, the first chip is connected to the first circuit connection layer based on bonding wires, and the second chip is connected to the second circuit connection layer based on bonding wires.

[0009] Furthermore, the first chip is a light-emitting chip, and the second chip is a photosensitive chip;

[0010] Or the first chip is a photosensitive chip, and the second chip is a light-emitting chip.

[0011] Furthermore, the first cavity and the second cavity are filled with silica gel, and the silica gel covers the first chip, the second chip and the bonding wires.

[0012] Furthermore, a first through hole is provided in the first substrate, a second through hole is provided in the second substrate, the second through hole is overlapped on the first through hole, and the first adhesive layer fills the first through hole and the second through hole.

[0013] Furthermore, the first substrate and the second substrate are made of a light-proof insulator;

[0014] The material of the first adhesive layer is light-transmitting epoxy resin;

[0015] The material of the second adhesive layer is opaque epoxy resin;

[0016] The reflective layer is a titanium dioxide reflective material coating or a silicon dioxide reflective material coating.

[0017] Further, the middle distance between the first SMD pin and the second SMD pin is 1.27 mm, and the middle distance between the third SMD pin and the fourth SMD pin is 1.27 mm; or the middle distance between the first SMD pin and the second SMD pin is 2.54 mm, and the middle distance between the third SMD pin and the fourth SMD pin is 2.54 mm;

[0018] The distance between the first SMD pin and the third SMD pin is greater than 11.8 mm, and the distance between the second SMD pin and the fourth SMD pin is greater than 11.8 mm.

[0019] Furthermore, a distance between the first circuit connection layer and the second circuit connection layer is greater than 7.0 mm.

[0020] Furthermore, the width of the first through hole is greater than 0.4 mm.

[0021] Furthermore, the width of the second through hole is greater than the width of the first through hole and less than the distance between the first circuit connection layer and the second circuit connection layer, and the length of the second through hole is greater than the length of the first through hole.

[0022] Furthermore, two side edges of the first adhesive layer do not exceed two side edges of the second substrate.

[0023] Furthermore, the second adhesive layer covers the upper surface and side surfaces of the first adhesive layer.

[0024] Furthermore, the packaging structure of the photoelectric coupler also includes a reflective layer, and the reflective layer covers the first adhesive layer.

[0025] The utility model also provides a photoelectric coupler, and the photoelectric coupler comprises the packaging structure of the photoelectric coupler mentioned above.

[0026] The utility model provides a packaging structure of a photoelectric coupler and a photoelectric coupler, which adopts a packaging substrate with a double-layer substrate, and does not need a metal lead frame mold; a first glue layer, a second glue layer and a reflective layer are provided, and a circuit connection layer and a patch type pin are provided on the first substrate; at the same time, based on silicone-coated chips and bonding wires, subsequent operations such as applying glue paths, removing waste glue, cutting off metal ribs, and bending and forming pins are avoided, the manufacturing process is relatively simple, the cost is low, the manufacturing cycle is short, the device appearance consistency is good, and the product manufacturing efficiency and yield are effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 is a schematic cross-sectional view of the packaging structure of the optocoupler in the first embodiment of the utility model;

[0029] Figure 2 This is a schematic diagram of the packaging substrate structure in the first embodiment of the utility model;

[0030] Figure 3 It is a schematic diagram of the first substrate structure in Example 1 of the utility model. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Embodiment 1

[0033] The embodiment of the utility model provides a packaging structure of a photoelectric coupler, which includes a packaging substrate, a first adhesive layer, and a second adhesive layer. The first adhesive layer covers the packaging substrate, and the second adhesive layer covers the packaging substrate and the first adhesive layer.

[0034] In an optional implementation of this embodiment, Figure 1 As shown, Figure 1 A cross-sectional schematic diagram of the packaging structure of the optocoupler in the first embodiment of the utility model is shown, wherein the packaging structure of the optocoupler includes a packaging substrate, a first adhesive layer 3, and a second adhesive layer 5, wherein the first adhesive layer 3 covers the packaging substrate, and the second adhesive layer 5 covers the packaging substrate and the first adhesive layer 3.

[0035] In an optional implementation of this embodiment, the packaging substrate includes a first substrate 1 and a second substrate 2 , and the second substrate 2 is stacked on the top surface of the first substrate 1 .

[0036] Specifically, Figure 2 As shown, Figure 2 A schematic diagram of the packaging substrate structure in the first embodiment of the present invention is shown, in which the second substrate 2 is stacked on the top surface of the first substrate 1 , and the edge of the second substrate 2 slightly exceeds the edge of the first substrate 1 .

[0037] In an optional implementation of this embodiment, the first substrate 1 and the second substrate 2 are made of a light-proof insulator.

[0038] Specifically, the material of the first substrate 1 is preferably resin, and the material of the second substrate 2 is preferably resin, such as BT (Bismaleimide Triazine), EMC (Epoxy Molding Compound), and PPA (Polyphthalamide).

[0039] It should be noted that the materials of the first substrate 1 and the second substrate 2 can be the same or different.

[0040] In an optional implementation of this embodiment, Figure 3 As shown, Figure 3A schematic diagram of the first substrate structure in Embodiment 1 of the present invention is shown, wherein a first circuit connection layer 12 and a second circuit connection layer 13 are provided on the first substrate 1, wherein the first circuit connection layer 12 covers the top surface and the left side surface of the first substrate 1, and the second circuit connection layer 13 covers the top surface and the right side surface of the first substrate 1.

[0041] In an optional implementation of the present embodiment, arc-shaped openings are provided at the edges of the first substrate 1 and the second substrate 2, and the portions of the first circuit connection layer 12 located on the top surface and the side surface of the first substrate 1 are connected through the arc-shaped openings, and the same is true for the second circuit connection layer 13.

[0042] An arc-shaped opening is provided here to facilitate tinning and ensure good consistency of the device's external dimensions.

[0043] In an optional implementation of this embodiment, the first circuit connection layer 12 and the second circuit connection layer are metal circuit connection layers.

[0044] In an optional implementation of the present embodiment, a first cavity 61 and a second cavity 62 are provided in the second substrate 2, that is, the first substrate 1, the second substrate 2 and the first adhesive layer 3 cooperate to form a first cavity 61 and a second cavity 62, and the first cavity 61 and the second cavity 62 are symmetrically arranged, that is, the second substrate 2 has two symmetrically arranged hollow structures, and the two symmetrical hollow structures are the first cavity 61 and the second cavity 62.

[0045] In an optional implementation of this embodiment, a first chip 71 is disposed in the first cavity 61, and a second chip 72 is disposed in the second cavity 62. The first chip 71 is connected to the first circuit connection layer 12 based on bonding wires 73, and the second chip 72 is connected to the second circuit connection layer 13 based on bonding wires 73.

[0046] Specifically, a portion of the first circuit connection layer 12 disposed on the top surface of the first substrate 1 extends into the first cavity 61 , and the first chip 71 is connected to the first circuit connection layer 12 based on bonding wires 73 .

[0047] Furthermore, a portion of the second circuit connection layer 13 disposed on the top surface of the first substrate 1 extends into the second cavity 62 , and the second chip 72 is connected to the second circuit connection layer 13 via bonding wires 73 .

[0048] In an optional implementation of this embodiment, the first cavity 61 and the second cavity 62 are filled with silica gel, and the silica gel covers the first chip 71 , the second chip 72 and the bonding wires 73 .

[0049] In an optional implementation of the present embodiment, the first chip 71 is a light-emitting chip and the second chip 72 is a photosensitive chip, or the first chip 71 is a photosensitive chip and the second chip 72 is a light-emitting chip. In the present embodiment, the first chip 71 is a light-emitting chip and the second chip 72 is a photosensitive chip.

[0050] It should be noted that the height of the first cavity 61 and the second cavity 62 is equal to the height of the second substrate 2, and the height of the second substrate 2 satisfies the overall height of the first chip 71, the second chip 72 and the bonding wire 73 after die bonding.

[0051] Silicone is used here to cover the chip and bonding wires as a whole, which has good structural consistency and airtightness, thus improving the protection effect.

[0052] In an optional implementation of this embodiment, the first circuit connection layer 12 is a transmitting end circuit connection layer connected to the light-emitting chip, and the second circuit connection layer 13 is a receiving end circuit connection layer connected to the photosensitive chip.

[0053] In an optional implementation of this embodiment, the portion of the first circuit connection layer 12 located in the first cavity 61 and the portion of the second circuit connection layer 13 located in the second cavity 62 are provided with an electroplated metal layer, and the material may be a silver-plated layer or a gold-plated layer.

[0054] In an optional implementation of the present embodiment, a first through hole 11 is provided in the first substrate 1. The first through hole 11 may be a rectangular hole, a diamond hole, a circular hole, etc., and is a rectangular hole in the present embodiment.

[0055] In an optional implementation of this embodiment, a second through hole 21 is provided in the second substrate 2, and the second through hole 21 is superimposed on the first through hole 11. The second through hole 21 can be a rectangular hole, a diamond hole, a circular hole, etc., and is a rectangular hole in this embodiment.

[0056] It should be noted that the length of the second through hole 21 is greater than the length of the first through hole 11 , and the width of the second through hole 21 is greater than the width of the first through hole 11 .

[0057] In an optional implementation of this embodiment, the first adhesive layer 3 fills the first through hole 11 and the second through hole 12 .

[0058] A double-layer packaging substrate is used here. The chip is placed on the first substrate and a line connection layer is set for circuit wiring. Holes are opened in the second substrate. The manufacturing process is simple, the cycle is short, and the cost is low. It eliminates the need for mold customization of existing metal lead frames, which in turn leads to the disadvantages of long cycle and high cost.

[0059] In an optional implementation of the present embodiment, the bottom surface of the first substrate 1 is provided with a first chip pin 14, a second chip pin 15, a third chip pin 16, and a fourth chip pin 17, wherein the first chip pin 14 and the second chip pin 15 are connected to the first circuit connection layer 12, and the third chip pin 16 and the fourth chip pin 17 are connected to the second circuit connection layer 13.

[0060] Specifically, the first SMD pin 14 , the second SMD pin 15 , the third SMD pin 16 , and the fourth SMD pin 17 are metal circuit connection layers.

[0061] It should be noted that in Figure 1 The first SMD pin 14 and the second SMD pin 15 are overlapped, and the third SMD pin 16 and the fourth SMD pin 17 are overlapped, so Figure 1 Only the identification of the second SMD pin 15 and the fourth SMD pin 17 is shown.

[0062] In an optional implementation of this embodiment, the first SMD pin 14 and the second SMD pin 15 are input pins connected to the first circuit connection layer 12 , and the third SMD pin 16 and the fourth SMD pin 17 are output pins connected to the second circuit connection layer 13 .

[0063] In an optional implementation of the present embodiment, a tin-plated layer is provided on the surfaces of the first circuit connection layer 12 , the second circuit connection layer 13 , the first patch pin 14 , the second patch pin 15 , the third patch pin 16 , and the fourth patch pin 17 .

[0064] In an optional implementation of this embodiment, two side edges of the first adhesive layer 3 do not exceed two side edges of the second substrate 2 .

[0065] In this embodiment, the width of the second adhesive layer 5 is greater than the width of the first adhesive layer 3 , and the second adhesive layer 5 covers the upper surface and side surfaces of the first adhesive layer 3 .

[0066] In an optional implementation of this embodiment, the material of the first adhesive layer 3 is light-transmitting epoxy resin.

[0067] In an optional implementation of this embodiment, the second adhesive layer 5 is made of opaque epoxy resin.

[0068] Furthermore, the second adhesive layer 5 can be configured to be epoxy resin having a light-reflecting effect.

[0069] Here, resin is used as the glue layer to cover the packaging substrate. There is no need for subsequent tedious operations such as applying glue, removing waste glue, cutting metal ribs, and bending pins. After the second glue layer is formed, it is polished and removed, and the device can be separated by slicing. The production process is simple, and the process control is convenient and efficient.

[0070] In an optional implementation of this embodiment, the packaging structure of the optocoupler further includes a reflective layer 4 , and the reflective layer 4 covers the first adhesive layer 3 .

[0071] In an optional implementation of this embodiment, the reflective layer 4 is a titanium dioxide reflective material coating or a silicon dioxide reflective material coating.

[0072] The reflective layer 4 is provided here to better reflect the light emitted by the light-emitting chip, so that the photosensitive chip receives more light and the photoelectric conversion efficiency is higher.

[0073] In an optional implementation of this embodiment, Figure 3 As shown, the middle distance d between the first SMD pin 14 and the second SMD pin 15 is 1 is 1.27 mm, and the middle distance d between the third SMD pin 16 and the fourth SMD pin 17 is 2 is 1.27 mm; or the middle distance d between the first SMD pin 14 and the second SMD pin 15 1 is 2.54 mm, and the middle distance d between the third SMD pin 16 and the fourth SMD pin 17 is 2 is 2.54 mm, and d 1 =d 2 .

[0074] In an optional implementation of this embodiment, Figure 3 As shown, the distance d between the first SMD pin 14 and the third SMD pin 16 is 3 The distance d between the second SMD pin 15 and the fourth SMD pin 17 is greater than 11.8 mm. 4 Greater than 11.8 mm, and d 3 =d 4 .

[0075] Specifically, since the first SMD pin 14, the second SMD pin 15, the third SMD pin 16, and the fourth SMD pin 17 are SMD pins, the spacing between the pins is set according to the standard requirements of the SMD pins, and the middle spacing refers to the spacing between the center points of two pins.

[0076] The surface-mount pins are provided here to avoid the subsequent pin bending and forming operations and simplify the manufacturing process.

[0077] In an optional implementation of this embodiment, Figure 3 As shown, the distance d between the first wiring connection layer 12 and the second wiring connection layer 13 is 5 Greater than 7.0mm.

[0078] Specifically, the distance d between the first circuit connection layer 12 and the second circuit connection layer 13 is 5 is the distance between the closest parts of the first circuit connection layer 12 and the second circuit connection layer 13 on the top surface of the first substrate 1 .

[0079] In an optional implementation of this embodiment, Figure 3 As shown, the width w of the first through hole 11 is 1 Greater than 0.4mm.

[0080] In an optional implementation of this embodiment, Figure 2 As shown, the width w of the second through hole 21 is 2 Greater than the width w of the first through hole 11 1 , and is smaller than the distance d between the first circuit connection layer 12 and the second circuit connection layer 13 5 .

[0081] In an optional implementation of this embodiment, Figure 2 As shown, the length l of the first through hole 11 1 Greater than the lateral width w of the first circuit connection layer 12 3 and the lateral width w of the second wiring connection layer 13 4 .

[0082] In an optional implementation of this embodiment, Figure 2 As shown, the length l of the second through hole 21 2 Greater than the length l of the first through hole 11 1 .

[0083] Working principle: The first SMD pin 14 and the second SMD pin 15 are connected to the external input circuit, the third SMD pin 16 and the fourth SMD pin 17 are connected to the external output circuit, the first chip 71 emits light, passes through the first adhesive layer 3, and after being reflected by the reflective layer 4, the second chip 72 receives the light and converts it into a current signal output.

[0084] In an optional implementation of this embodiment, the packaging structure of the photoelectric coupler is suitable for a single-channel photoelectric coupler and can be superimposed according to actual design conditions to adapt to a multi-channel photoelectric coupler.

[0085] In summary, the first embodiment of the utility model provides a packaging structure of an optocoupler, which adopts a packaging substrate with a double-layer substrate, and does not require a metal lead frame mold; a first glue layer, a second glue layer and a reflective layer are provided, and a circuit connection layer and a surface-mount pin are provided on the first substrate. At the same time, based on the silicone-coated chip and bonding wire, subsequent operations such as applying glue, removing waste glue, cutting off metal ribs, and bending and forming pins are eliminated. The manufacturing process is relatively simple, the cost is low, the production cycle is short, the device appearance consistency is good, and the product manufacturing efficiency and yield are effectively improved.

[0086] Embodiment 2

[0087] The second embodiment of the present invention provides a photoelectric coupler, and the photoelectric coupler includes the packaging structure of the photoelectric coupler described in the first embodiment.

[0088] In summary, the second embodiment of the utility model provides a photoelectric coupler, including the packaging structure of the photoelectric coupler described in the first embodiment, and adopts a packaging substrate with a double-layer substrate, without the need for metal lead frame mold opening; a first glue layer, a second glue layer and a reflective layer are provided, and a circuit connection layer and a surface-mount pin are provided on the first substrate. At the same time, based on the silicone-coated chip and bonding wire, subsequent operations such as applying glue, removing waste glue, cutting off metal ribs, and bending and forming pins are eliminated. The manufacturing process is relatively simple, the cost is low, the production cycle is short, the device appearance consistency is good, and the product manufacturing efficiency and yield are effectively improved.

[0089] The above is a detailed introduction to the packaging structure of an optocoupler and an optocoupler provided by an embodiment of the present invention. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for general technicians in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A packaging structure of a photocoupler, characterized in that: The packaging structure of the photoelectric coupler includes a packaging substrate, a first adhesive layer, and a second adhesive layer, wherein the first adhesive layer covers the packaging substrate, and the second adhesive layer covers the packaging substrate and the first adhesive layer; The packaging substrate comprises a first substrate and a second substrate, wherein the second substrate is stacked on the top surface of the first substrate; A first circuit connection layer and a second circuit connection layer are provided on the first substrate, the first circuit connection layer covers the top surface and the left side surface of the first substrate, and the second circuit connection layer covers the top surface and the right side surface of the first substrate; The bottom surface of the first substrate is provided with a first SMD pin, a second SMD pin, a third SMD pin and a fourth SMD pin. The first SMD pin and the second SMD pin are connected to the first circuit connection layer, and the third SMD pin and the fourth SMD pin are connected to the second circuit connection layer.

2. The packaging structure of the optocoupler according to claim 1, characterized in that: The second substrate is provided with a first cavity and a second cavity, the first cavity is provided with a first chip, the second cavity is provided with a second chip, the first chip is connected to the first circuit connection layer based on bonding wires, and the second chip is connected to the second circuit connection layer based on bonding wires.

3. The packaging structure of the optocoupler according to claim 2, characterized in that: The first chip is a light-emitting chip, and the second chip is a photosensitive chip; Or the first chip is a photosensitive chip, and the second chip is a light-emitting chip.

4. The packaging structure of the optocoupler according to claim 3, characterized in that: The first cavity and the second cavity are filled with silica gel, and the silica gel covers the first chip, the second chip and the bonding wires.

5. The packaging structure of the optocoupler according to claim 1, wherein: A first through hole is disposed in the first substrate, a second through hole is disposed in the second substrate, the second through hole is overlapped on the first through hole, and the first adhesive layer fills the first through hole and the second through hole.

6. The packaging structure of the optocoupler according to claim 1, characterized in that: The packaging structure of the photoelectric coupler further includes a reflective layer, and the reflective layer covers the first adhesive layer; The materials of the first substrate and the second substrate are light-proof insulators; The material of the first adhesive layer is light-transmitting epoxy resin; The material of the second adhesive layer is opaque epoxy resin; The reflective layer is a titanium dioxide reflective material coating or a silicon dioxide reflective material coating.

7. The packaging structure of the optocoupler according to claim 1, characterized in that: The middle distance between the first SMD pin and the second SMD pin is 1.27 mm, and the middle distance between the third SMD pin and the fourth SMD pin is 1.27 mm; or the middle distance between the first SMD pin and the second SMD pin is 2.54 mm, and the middle distance between the third SMD pin and the fourth SMD pin is 2.54 mm; The distance between the first SMD pin and the third SMD pin is greater than 11.8 mm, and the distance between the second SMD pin and the fourth SMD pin is greater than 11.8 mm.

8. The packaging structure of the optocoupler according to claim 1, wherein: The distance between the first circuit connection layer and the second circuit connection layer is greater than 7.0 mm.

9. The packaging structure of the optocoupler according to claim 5, characterized in that: The width of the first through hole is greater than 0.4 mm.

10. The packaging structure of the optocoupler according to claim 9, characterized in that: The width of the second through hole is greater than the width of the first through hole and less than the distance between the first circuit connection layer and the second circuit connection layer. The length of the second through hole is greater than the length of the first through hole.

11. The packaging structure of the optocoupler according to claim 1, characterized in that: The two side edges of the first adhesive layer do not exceed the two side edges of the second substrate.

12. The packaging structure of the optocoupler according to claim 1, wherein: The second adhesive layer covers the upper surface and side surfaces of the first adhesive layer.

13. A photoelectric coupler, characterized in that: The photoelectric coupler comprises the packaging structure of the photoelectric coupler according to any one of claims 1 to 12.

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