Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate, a bearing part, an optical chip, a light-transmitting adhesive layer and a high-reflection adhesive layer. The bearing part is arranged on the substrate and comprises at least two cavity structures. The optical chip is arranged on the substrate and in the cavity structure. At least one optical chip is arranged in the cavity structure. The light-transmitting glue layer covers the optical chip. And the high-reflection glue layer covers the reflecting surface or covers the reflecting surface and the side surface of the optical chip. According to the utility model, the reflecting surface is covered with the high-reflection glue layer, so that the light incident to the interface of the reflecting surface and the high-reflection glue layer is emitted towards the direction close to the optical axis of the optical chip, the light energy can be fully utilized, the brightness is high, and the detection accuracy of the sensor device is further improved. Meanwhile, the whole structure is more stable and reliable in connection due to the high-reflection glue layer.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is composed of at least two optical chips that emit and receive light. The light emitting chip emits a light beam, which passes through the optical system and irradiates the object to be measured. The light beam reflected or absorbed by the object passes through the optical system and irradiates the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and then output.

[0003] Existing sensor devices have problems such as low light energy utilization, low brightness, low accuracy and poor structural reliability.

[0004] Based on the above, a sensor device with a simple, reasonable and stable structure, high light energy utilization, high brightness and high accuracy is currently required. Utility Model Content

[0005] The utility model aims to provide a sensor device, aiming to solve the problems of low light energy utilization rate, low brightness, low accuracy and poor overall structural reliability of the sensor device in the prior art.

[0006] The utility model is implemented as follows: a sensor device comprises:

[0007] substrate;

[0008] A receiving portion, which is arranged on the substrate, and includes at least two cavity structures;

[0009] An optical chip is disposed on the substrate and in the cavity structure, and at least one optical chip is disposed in the cavity structure;

[0010] A light-transmitting adhesive layer, which is arranged in the cavity structure and covers the optical chip, and a side surface of the light-transmitting adhesive layer is arranged as a reflecting surface for reflecting edge large-angle light;

[0011] A high-reflective adhesive layer covers the reflective surface or covers the reflective surface and the side surface of the optical chip.

[0012] Furthermore, the upper surface of the light-transmitting adhesive layer is configured as a flat surface or a convex curved surface.

[0013] Furthermore, the high-reflective adhesive layer covers part or all of the upper surface of the substrate.

[0014] Furthermore, a light-transmitting hole or a lens is provided on a side of the cavity structure away from the substrate corresponding to the light-transmitting adhesive layer.

[0015] Furthermore, the lens is a convex lens, a concave lens or a plane lens.

[0016] Furthermore, the lens is a Fresnel lens.

[0017] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0018] The utility model is provided with a reflective surface 41, and a high-reflective adhesive layer 7 is tightly surrounded around the reflective surface 41, so that the light incident on the interface between the reflective surface 41 and the high-reflective adhesive layer 7 is fully reflected to the front of the optical chip 3 or the photosensitive area of ​​the optical chip 3, and the refracted light is cut off, thereby reducing the design difficulty and manufacturing accuracy of the reflective surface 41, making full use of light energy, improving brightness, and thus improving the accuracy of sensor device detection. The high-reflective adhesive layer 7 has a better effect of cutting off edge emission. The high-reflective adhesive layer 7 can connect the optical chip 3 and the substrate 1. When the high-reflective adhesive layer 7 extends to the inner wall of the receiving part 2, the high-reflective adhesive layer 7 can also connect the receiving part 2 and the substrate 1, making the entire structural connection more stable and reliable.

[0019] The high-reflective adhesive layer 7 covers the side of the optical chip 3, so that the optical chip 3 can dissipate heat through the substrate 1 connected to the bottom surface, and can also dissipate heat through the high-reflective adhesive layer 7 connected to the side surface, thereby increasing the heat dissipation channel of the optical chip 3 and extending the service life of the product. The lens 6 can perform optical shaping on the outgoing light / incident light to achieve a preset optical effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0021] Figure 2 The utility model provides Figure 1 A local enlarged view of the sensor device;

[0022] Figure 3 It is a schematic cross-sectional structure diagram of the first embodiment of the sensor device provided by the utility model;

[0023] Figure 4 It is a cross-sectional structural schematic diagram of the second embodiment of the sensor device provided by the utility model;

[0024] Figure 5 It is a cross-sectional structural schematic diagram of the third embodiment of the sensor device provided by the utility model;

[0025] In the figure: 1-substrate; 2-receiving part; 21-cavity structure; 3-optical chip; 4-light-transmitting adhesive layer; 41-reflecting surface; 5-light-transmitting hole; 6-lens; 7-high-reflective adhesive layer. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0027] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0028] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0029] Reference Figure 1-5 As shown, it is a preferred embodiment provided by the utility model.

[0030] A sensor device, referring to Figure 1-2 , including a substrate 1, a receiving portion 2, an optical chip 3 and a light-transmitting adhesive layer 4. The receiving portion 2 is arranged on the substrate 1, and includes at least two cavity structures 21. The cavity structure 21 is used to accommodate the optical chip 3 and light propagation. The optical chip 3 is arranged in the cavity structure 21 on the substrate 1, and each cavity structure 21 is provided with at least one optical chip 3. The utility model is only described by taking two cavity structures 21 corresponding to two optical chips 3 as an example, and three or more cavity structures 21 can be arranged as needed, and each cavity structure 21 can accommodate multiple optical chips 3, and multiple optical chips 3 are regularly displayed or irregularly arrayed in the cavity structure 21. The above situations are all within the concept of the utility model.

[0031] The optical chip 3 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The sensor device of the utility model integrates a light-emitting chip for emitting light. When the emitted light is incident on the object to be detected or the object to be sensed, reflection occurs. The emitted light is incident on the photosensitive area of ​​the photosensitive chip and is received. The photosensitive chip converts the optical signal into an electrical signal, thereby making corresponding feedback. In order to prevent the emitted light and the received light of the light-emitting chip and the photosensitive chip from interfering with each other and preventing light from being transmitted, the receiving part 2 can be set as a light-absorbing part of an opaque material (such as black glue). According to the different functional requirements of different application scenarios, the receiving part 2 can also be set to be made of a translucent material. There is no limit on the height of the receiving part 2.

[0032] In order to improve light extraction, the optical chip 3 is coated with a light-transmitting adhesive layer 4. The light-transmitting adhesive layer 4 can be set to cover only the upper surface of the optical chip 3; it can also be set to cover the upper surface of the optical chip 3, as well as part or all of the side surfaces, and the light-transmitting adhesive layer 4 can also extend to the upper surface of the substrate 1. A light-transmitting hole 5 or a lens 6 is correspondingly arranged above the light-transmitting adhesive layer 4 on the side of the cavity structure 21 away from the substrate 1. The cross-section of the light-transmitting hole 5 can be set to a rectangular shape, an inverted "convex" shape, etc. The light-transmitting hole 5 is used for light transmission. The receiving portion 2 near the light-transmitting hole 5 can limit the divergence range of light as needed to obtain a preset light spot shape.

[0033] In order to improve the utilization rate of light energy and enhance the brightness, the side of the light-transmitting adhesive layer 4 is configured as a reflective surface 41 for reflecting edge light at a large angle (refer to Figure 2 ), the reflecting surface 41 is a plane or a curved surface in the shape of an inverted cone, that is, the side of the light-transmitting adhesive layer 4 is set as a plane or a curved surface at a certain angle to the upper surface of the optical chip 3. The above-mentioned setting increases the incident angle, and the edge large-angle light is incident on the reflecting surface 41, which satisfies the incident angle greater than or equal to the critical angle, and total reflection is easy to occur. After total reflection, the light propagates in the direction close to the optical axis, and finally emerges from the front of the optical chip 3 or is incident on the photosensitive area of ​​the optical chip 3. This setting utilizes the large-angle edge light that is not easily utilized on the edges around, which is beneficial to the utilization rate of light energy and improves the overall brightness. At the same time, the setting of the reflecting surface 41 can reduce the light output angle range, which is easy for optical design. The upper surface of the light-transmitting adhesive layer 4 is set to a plane or a curved surface.

[0034] The reflective surface 41 or the side of the reflective surface 41 and the optical chip 3 is surrounded by a high-reflective adhesive layer 7. The high-reflective adhesive layer 7 is arranged in the cavity structure 21 on the substrate 1. The high-reflective adhesive layer 7 covers part or all of the upper surface of the substrate 1 and can be arranged to be connected to the inner wall of the receiving part 2. The high-reflective adhesive layer 7 is used to cut off the large-angle emitted light from the side or edge, and also plays a role in fixing the optical chip 3 and the receiving part 2 to the substrate 1, making the entire structure more stable and reliable.

[0035] In order to optically shape the outgoing light or incident light of the light-transmitting adhesive layer 4 to meet the preset angle, brightness, uniformity and spot shape of the outgoing light / incident light, a lens 6 is arranged in the cavity structure 21. The lens 6 is arranged on the side of the cavity structure 21 away from the substrate 1 and above the corresponding light-transmitting adhesive layer 4. The lens 6 is set as a convex lens, a concave lens, or a plane lens whose incident surface and the outgoing surface are both planes as required. The lens 6 corresponding to the optical chip 3 receiving the light energy is a Fresnel lens. Through the converging effect of the Fresnel lens, the area of ​​the optical chip 3 for receiving the incident light energy is greatly reduced, thereby reducing the cost. In addition, 1. The Fresnel lens can match the optical chip 3 with a relatively small size; 2. The volume of the Fresnel lens is smaller than that of other convex lenses, so the volume of the overall device is greatly reduced, and it is easy to integrate the design. Specifically, the lens 6 includes a first lens set corresponding to the light-emitting chip 3 and a second lens set corresponding to the photosensitive chip. The first lens and the second lens are respectively used to optically adjust the outgoing light of the light-emitting chip and the received light of the photosensitive chip. The first lens and the second lens can be configured as lenses of the same type or different types to meet the needs of different optical functions.

[0036] Example 1: Reference Figure 3 The sensor device includes a substrate 1, a receiving portion 2, an optical chip 3, a light-transmitting adhesive layer 4 and a highly reflective adhesive layer 7. The receiving portion 2 is arranged on the substrate 1, and includes at least two cavity structures 21. The optical chip 3 is arranged in the cavity structure 21 on the substrate 1, and the optical chip 3 corresponds to the cavity structure 21 one by one. The light-transmitting adhesive layer 4 covers the upper surface of the optical chip 3. The upper surface of the light-transmitting adhesive layer 4 is set as a convex curved surface, and the side of the light-transmitting adhesive layer 4 is provided with a reflective surface 41. The reflective surface 41 and the side of the optical chip 3 are tightly covered with a highly reflective adhesive layer 7. The reflective adhesive layer 7 covers the entire upper surface of the substrate 1 and part of the side wall of the receiving portion 2. A light-transmitting light hole 5 is arranged in the cavity structure 21 and above the light-transmitting adhesive layer 4. The cross section of the light-transmitting hole 5 is set as a rectangle. The diameter of the light-transmitting hole 5 is smaller than the diameter of the cavity structure 21, and the light-transmitting hole 5 is used to reduce the angle range of the outgoing or incident light.

[0037] Example 2: Reference Figure 4 , which is mainly different from the first embodiment: the reflective adhesive layer 7 covers part of the upper surface of the substrate 1. A transparent lens 6 is arranged in the cavity structure 21 and above the transparent adhesive layer 4. The lens 6 is spaced apart from the transparent adhesive layer 4, that is, there is a gas layer between the two. The lens 6 is a convex lens. The other settings are the same as those of the first embodiment.

[0038] Example 3: Reference Figure 5 , which is mainly different from the second embodiment: the upper surface of the light-transmitting adhesive layer 4 is set to be a plane. The lens 6 is a Fresnel lens. The Fresnel lens itself is small in size, and the volume of the optical chip 3 used is also reduced, making the entire sensor device small in size and easy to optically integrate. The other settings are the same as those of the second embodiment.

[0039] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: substrate(1); A receiving portion (2) disposed on the substrate (1), the receiving portion (2) comprising at least two cavity structures (21); An optical chip (3) disposed on the substrate (1) and in the cavity structure (21), wherein at least one optical chip (3) is disposed in the cavity structure (21); A light-transmitting adhesive layer (4), which is arranged in the cavity structure (21) and covers the optical chip (3), and a side surface of the light-transmitting adhesive layer (4) is arranged as a reflection surface (41) for reflecting edge large-angle light; A high-reflective adhesive layer (7) covers the reflective surface (41) or covers the reflective surface (41) and the side surface of the optical chip (3).

2. The sensor device according to claim 1, characterized in that The upper surface of the light-transmitting adhesive layer (4) is configured as a flat surface or a convex curved surface.

3. The sensor device according to claim 1, characterized in that: The high-reflective adhesive layer (7) covers part or all of the upper surface of the substrate (1).

4. The sensor device according to any one of claims 1 to 3, characterized in that: A light-transmitting hole (5) or a lens (6) is provided on a side of the cavity structure (21) away from the substrate (1) corresponding to the light-transmitting adhesive layer (4).

5. The sensor device according to claim 4, characterized in that: The lens (6) is a convex lens, a concave lens, or a plane lens.

6. The sensor device according to claim 5, characterized in that The lens (6) is a Fresnel lens.

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