Chip defect detection equipment based on intelligent camera

Abstract

The utility model discloses chip defect detection equipment based on an intelligent camera, which comprises a chip, the chip is packaged in a chip braid, the chip braid is arranged on a chip braid bearing platform, the intelligent camera is arranged right above the chip braid, and the intelligent camera and the chip braid bearing platform are fixedly arranged on a shooting support. By using the equipment, chip defects in the chip braid can be detected, and the focusing angle can be adjusted by adjusting the bracket, so that the detection efficiency is improved, and the detection result is more accurate.

Description

Technical Field

[0001] The utility model relates to the field of chip detection, in particular to a chip defect detection device based on an intelligent camera. Background Art

[0002] With the rapid development of the semiconductor industry, defect detection in the chip manufacturing process has become a key link in ensuring chip quality. Traditional defect detection methods mainly rely on manual inspection, but due to the limitations of human eye detection, it is difficult to achieve high-speed, efficient and accurate defect detection. In addition, with the continuous advancement of semiconductor technology, the manufacturing accuracy and complexity of chips are constantly improving, the types and numbers of defects are increasing, and the technical requirements for defect detection are also getting higher and higher. Using smart cameras as chip defect detection systems can improve the accuracy and efficiency of detection. Smart cameras usually have characteristics such as high resolution, high frame rate, high sensitivity and low noise. They can collect high-quality image data, and through built-in image processing algorithms and artificial intelligence technology, they can realize automated and intelligent defect detection and processing. However, in actual operation, the lens often fails to focus and the camera needs to be adjusted. In general, there is still room for the chip inside the chip tape to move, making it difficult to fix the position of the chip and focusing becomes difficult. Utility Model Content

[0003] The utility model provides a chip defect detection device based on an intelligent camera, which can realize automatic and intelligent defect detection of chips in chip tapes.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A chip defect detection device based on a smart camera comprises a chip, wherein the chip is packaged in a chip tape, the chip tape is arranged on a chip tape carrying platform, a smart camera is arranged directly above the chip tape, and the smart camera and the chip tape carrying platform are fixedly arranged on a shooting bracket.

[0006] Furthermore, the shooting bracket is composed of an angle adjustment bracket and a position fine-tuning bracket.

[0007] Furthermore, a limiting column is arranged on the chip tape carrying platform to limit the chip tape.

[0008] Furthermore, a vibrator is provided at one end of the chip tape on the chip tape carrying platform.

[0009] Furthermore, an annular light source is provided between the smart camera and the chip, and the annular light source is fixedly arranged above the chip tape carrying platform.

[0010] The beneficial effects of the utility model are:

[0011] 1. By collecting image data of the chip surface in the chip tape through the smart camera, clearer and more accurate images can be obtained, which is conducive to improving the accuracy and reliability of defect detection.

[0012] 2. By using the angle adjustment bracket and the position fine-tuning bracket to adjust the chip, the chip can be accurately and quickly placed in the center of the camera lens with the vibrator.

[0013] 3. Use a ring light source to make photos clearer and speed up detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 Schematic diagram of the chip taping and chip defect detection system

[0015] In the picture, 1 is an angle adjustment bracket, 2 is a chip tape carrying platform, 3 is a ring light source, 4 is a vibrator, 5 is a smart camera, and 6 is a shooting position fine-tuning bracket. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work belong to the protection scope of the utility model.

[0017] like Figure 1 As shown, this embodiment provides a chip defect detection system, including a chip, wherein the chip is packaged in a chip tape, and is characterized in that the chip tape is arranged on a chip tape carrying platform, and a smart camera is arranged directly above the chip tape, and the smart camera and the chip tape carrying platform are fixedly arranged on a shooting bracket.

[0018] In this embodiment, the shooting bracket is composed of an angle adjustment bracket and a position fine-tuning bracket. The angle adjustment bracket can adjust the angle of the camera lens relative to the chip tape, and the position fine-tuning bracket can adjust the position of the camera relative to the chip tape.

[0019] In this embodiment, a limiting column is arranged on the chip tape carrying platform to limit the chip tape.

[0020] In this embodiment, a vibrator is provided on one end of the chip tape on the tape carrying platform. When the shooting bracket is tilted, if there is still space for the chip inside the chip tape to move, the chip will move downward due to gravity until the chip falls to the bottom. In order to ensure that the chip can run smoothly to the bottom of the tape, the vibrator is used to vibrate the tape at a certain frequency.

[0021] In this embodiment, a ring light source is provided between the smart camera and the chip to provide a brighter light source for the camera to take pictures, making the pictures clearer.

[0022] One implementation method of the utility model is as follows: placing the chip tape on the chip tape carrying platform, adjusting the angle of the bracket and the limiting platform to an optimal angle, lowering the chip to the bottom of the chip tape by a vibrator, and then adjusting the position of the smart camera by a position fine-tuning bracket. Finally, the smart camera focuses on the center of the chip through the aperture, and after taking the picture, the algorithm in the camera is used to determine whether there are defects in the tape and the chip.

[0023] It should be noted that the above description only represents the best embodiment of the present invention and should not limit the present invention. Any modification, equivalent replacement, improvement, etc. should be included in the protection scope of the present invention under the premise of complying with the spirit and principle of the present invention.

Claims

1. A chip defect detection device based on a smart camera, comprising a chip, wherein the chip is packaged in a chip tape, characterized in that: The chip tape is arranged on the chip tape carrying platform, a smart camera is arranged directly above the chip tape, and the smart camera and the chip tape carrying platform are fixedly arranged on a shooting bracket; The chip tape carrying platform is provided with a limiting post to limit the chip tape; A vibrator is arranged at one end of the chip tape on the chip tape carrying platform.

2. A chip defect detection device based on a smart camera as claimed in claim 1, characterized in that: The shooting bracket is composed of an angle adjustment bracket and a position fine-tuning bracket.

3. The chip defect detection device based on a smart camera as claimed in claim 1, characterized in that: An annular light source is arranged between the smart camera and the chip, and the annular light source is fixedly arranged above the chip tape carrying platform.

Images