Display module and display device thereof

Abstract

The embodiment of the utility model provides a display module and a display device thereof. The display module comprises a display panel, a flexible circuit board, a pressing part and a bonding layer, the display panel comprises a first binding area, the flexible circuit board comprises a first binding part, and the first binding part comprises a second binding area. The second binding area is in binding connection with the first binding area to divide the first binding area into an attaching part attached to the display panel and a free part located outside the display panel, the free part comprises a middle sub-part and edge sub-parts located on the two sides of the middle sub-part, and the pressing part is located on the side, away from the display panel, of the flexible circuit board; the bonding layer is located between the flexible circuit board and the pressing part, the bonding layer comprises a first adhesive layer area, the attaching part is bonded with the pressing part through the first adhesive layer area, and the bonding layer is provided with a first avoiding area corresponding to the edge sub-part to prevent the edge sub-part from being bonded with the bonding layer. According to the technical scheme, the edge sub-part can be prevented from being taken up by the pressing part, and the risk of stripping between the attaching part and the display panel is reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of display devices, and in particular to a display module and a display device thereof. Background Art

[0002] In the related art, the display module includes a display panel and a circuit board that is bound and connected to the display panel through a flexible circuit board. The display panel is bound and connected to one end of the flexible circuit board, and the circuit board is bound and connected to the other end of the flexible circuit board. Some areas of the flexible circuit board are not attached to the display panel. During the production process of the display module, after the flexible circuit board is bound to the display panel, part of the flexible circuit board is in a suspended state. In this way, during the rework process of the display module, there may be a risk that the flexible circuit board and the display panel are easily peeled off at the edge corners, resulting in abnormal display module problems. Utility Model Content

[0003] The embodiments of the present disclosure provide a display module and a display device thereof to solve or alleviate one or more technical problems in the prior art.

[0004] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a display module, including:

[0005] The display panel includes a first binding area;

[0006] The flexible circuit board comprises a first binding portion, the first binding portion comprises a second binding area, the second binding area is bound and connected to the first binding area to divide the first binding portion into a bonding portion bonded to the display panel and a free portion located outside the display panel, the free portion comprises a middle sub-portion and edge sub-portions located on both sides of the middle sub-portion;

[0007] A pressing portion, located on a side of the flexible circuit board away from the display panel;

[0008] The bonding layer is located between the flexible circuit board and the laminating part, the bonding layer includes a first adhesive layer area, the laminating part is bonded to the laminating part through the first adhesive layer area, and the bonding layer is provided with a first avoidance area corresponding to the edge sub-part to prevent the edge sub-part from bonding to the bonding layer.

[0009] In some possible implementations, the adhesive layer is provided with a first hollow in the first avoidance area; or a first anti-adhesion insulating film located in the first avoidance area is adhered to the adhesive surface of the adhesive layer on the side facing the flexible circuit board.

[0010] In some possible implementations, a dimension of the edge sub-portion in the extension direction of the first binding portion is 1 cm-2 cm; and / or a dimension of the edge sub-portion in the extension direction perpendicular to the first binding portion is 1 cm-2 cm.

[0011] In some possible implementations, the bonding layer further includes a second bonding layer area, the second bonding layer area corresponds to the middle sub-portion, and the middle sub-portion is bonded to the second bonding layer area.

[0012] In some possible implementations, the bonding layer is provided with a second avoidance area corresponding to the middle sub-portion to prevent the middle sub-portion from bonding with the bonding layer.

[0013] In some possible implementations, the bonding layer is provided in the second avoidance area as a second hollowing; or,

[0014] A second anti-adhesion insulating film located in the second avoidance area is adhered to the adhesive surface of the adhesive layer on the side facing the flexible circuit board.

[0015] In some possible implementations, the adhesive layer further includes a third adhesive layer area, and the third adhesive layer area is located on a side of a boundary of the edge sub-portion away from the middle sub-portion.

[0016] In some possible implementations, the flexible circuit board further includes a connecting portion and a second binding portion, one end of the connecting portion is connected to the middle sub-portion, and the other end of the connecting portion is connected to the second binding portion;

[0017] The display module also includes a circuit board, and the second binding portion is connected to the circuit board;

[0018] The adhesive layer is further provided with a third avoidance area corresponding to the connecting portion to prevent the connecting portion from being bonded to the adhesive layer.

[0019] In some possible implementations, the display module further includes a backlight module, the backlight module is located on a side of the display panel away from the first binding area, the circuit board is arranged at one end of the backlight module, and the adhesive layer is arranged as a third hollow in the third avoidance area; or,

[0020] A third anti-adhesion insulating film located in a third avoidance area is adhered to the adhesive surface of the adhesive layer facing the flexible circuit board.

[0021] In some possible implementations, the display module further includes:

[0022] A backlight module, wherein the display panel is supported and arranged on one side of the backlight module through a supporting part;

[0023] Packaging tape, the edge of the backlight module and the edge of the display panel are wrapped with the packaging tape, and the packaging tape is partially pressed on the side of the flexible circuit board away from the display panel to form a pressing part;

[0024] The frame is bonded to the side of the pressing part away from the display panel through a fixed adhesive layer.

[0025] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device, comprising the display module of any embodiment of the present disclosure.

[0026] The technical solution of the embodiment of the present disclosure can achieve the following beneficial effects: the display module of the embodiment of the present disclosure can prevent the edge sub-portion from being lifted up by the pressing portion, reduce the risk of peeling between the bonding portion and the display panel, and avoid poor touch.

[0027] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0029] Figure 1 This is a schematic diagram of a normal assembly state of a display module in the related art;

[0030] Figure 2 A schematic diagram of a state where a flexible circuit board and a display panel of a display module are peeled off in the related art;

[0031] Figure 3 It is a planar schematic diagram of binding a flexible circuit board and a display panel in the related art;

[0032] Figure 4 This is a schematic diagram of a normal assembly of a display module according to an embodiment of the present disclosure;

[0033] Figure 5 It is a plan view schematic diagram of the flexible circuit board and the display panel being bound (with an adhesive layer) according to an embodiment of the present disclosure;

[0034] Figure 6 It is a plan view schematic diagram of the flexible circuit board and the display panel being bound (without an adhesive layer) according to an embodiment of the present disclosure;

[0035] Figure 7 It is a schematic plan view of a flexible circuit board according to an embodiment of the present disclosure;

[0036] Figure 8 This is a plan view schematic diagram of binding a flexible circuit board and a display panel according to another embodiment of the present disclosure;

[0037] Fig. 9 This is a plan view schematic diagram of binding a flexible circuit board and a display panel according to another embodiment of the present disclosure;

[0038] Fig.10This is a plan view schematic diagram of binding a flexible circuit board and a display panel according to another embodiment of the present disclosure;

[0039] Fig.11 It is a schematic plan view of a flexible circuit board according to an embodiment of the present disclosure;

[0040] Fig.12 This is a plan view schematic diagram of binding a flexible circuit board and a display panel according to an embodiment of the present disclosure;

[0041] Fig.13 The figure is a plan view of binding a flexible circuit board and a display panel according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0042] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0043] Figure 1 This is a schematic diagram of a normal assembly state of a display module in the related art. Figure 2 This is a schematic diagram of a state where a flexible circuit board and a display panel of a display module are peeled off in the related art. Figure 3 FIG. 1 is a plan view of a flexible circuit board and a display panel in a related art. Figures 1 to 3 As shown, the display module includes a display panel 1, a flexible circuit board 2, a backlight module 3 and a cell tape 4. The display panel 1 is supported and arranged on one side of the backlight module 3 by a support portion (Panel Spacer).

[0044] like Figure 3 As shown, the display panel 1 includes a first binding area 11, the flexible circuit board 2 includes a first binding portion 21, the first binding portion 21 includes a second binding area 22, and the second binding area 22 is connected to the first binding area 21 to divide the first binding portion 21 into a bonding portion 211 bonded to the display panel 1 and a free portion 212 located outside the display panel 1. The free portion 212 includes a middle sub-portion 2121 and edge sub-portions 2122 located on both sides of the middle sub-portion 2121.

[0045] like Figure 1 As shown, the packaging tape 4 wraps the edge of the backlight module 3 and the edge of the display panel 1, and a portion of the packaging tape 4 is pressed onto the side of the flexible circuit board 2 facing away from the display panel to form a pressing portion, and the pressing portion of the packaging tape 4 is bonded to the flexible circuit board 2 through the adhesive layer TP1, the adhesive layer TP1 is bonded to the bonding portion 211, and the adhesive layer TP1 is also bonded to the edge sub-portion 2122.

[0046] Exemplarily, the display panel 1 is a liquid crystal display panel, and the display panel 1 includes a liquid crystal box and an optical film layer and other structures. The liquid crystal box includes an array substrate 5, a color filter substrate 6, and a liquid crystal layer located between the array substrate 5 and the color filter substrate 6. The optical film layer includes a polarizer 7 (POL). One end of the flexible circuit board 2 is bound and connected to the color filter substrate 6, and the other end of the flexible circuit board 2 is bound and connected to the circuit board 8 (PCB). Figure 1 As shown, the display module further includes a frame 9 (Bezel), which is bonded to the laminating portion and the side of the polarizer 7 away from the display panel 1 through a fixed adhesive layer TP2. When the display module is assembled, the frame 9 is attached to the packaging tape 4 and the laminating portion through the fixed adhesive layer TP2.

[0047] During the assembly process, there may be an action of reworking the frame 9, such as Figure 2 As shown, during the tearing process of the frame 9, the frame 9 may cause the pressed portion of the packaging tape 4 to be pulled upward. Since the edge sub-portion 2122 of the flexible circuit board 2 is in a suspended state and bonded to the packaging tape 4 through the adhesive layer TP1, the edge sub-portion 2122 of the flexible circuit board 2 is easily pulled up along with the packaging tape 4, resulting in the risk of peeling off at the bonding portion between the display panel 1 and the flexible circuit board 2, thereby causing poor touch of the display module.

[0048] In order to solve the problem of peeling of the bonding part of the flexible circuit board and the display panel in the related art, the embodiment of the present disclosure provides a display module. The technical solution of the present disclosure is described in detail below through embodiments.

[0049] Figure 4 is a schematic diagram of a normal assembly of a display module according to an embodiment of the present disclosure, Figure 5 Schematic diagram of a plan view of a display panel and a flexible circuit board bound (with an adhesive layer) according to an embodiment of the present disclosure. Figure 6 Schematic diagram of the binding (without adhesive layer) of the display panel and the flexible circuit board according to the embodiment of the present disclosure. Figure 7 FIG. 1 is a plan view of a flexible circuit board according to an embodiment of the present disclosure. Figures 4 to 7 As shown, an embodiment of the present disclosure provides a display module, which includes a display panel 10 , a flexible circuit board 20 , a pressing portion 30 and a bonding layer 40 .

[0050] like Figures 5 to 7As shown, exemplarily, the display panel 10 includes a first binding area 11, the flexible circuit board 20 includes a first binding portion 21, the first binding portion 21 includes a second binding area 22, and the second binding area 22 is bound and connected to the first binding area 11 to divide the first binding portion 21 into a bonding portion 211 bonded to the display panel 10 and a free portion 212 located outside the display panel 10. The free portion 212 includes a middle sub-portion 2121 and edge sub-portions 2122 located on both sides of the middle sub-portion 2121. The pressing portion 30 is located on the side of the flexible circuit board 20 away from the display panel 10. The adhesive layer 40 is located between the flexible circuit board 20 and the pressing portion 30.

[0051] like Figure 5 As shown, exemplarily, the bonding layer 40 includes a first bonding layer area 41, the laminating portion 211 is bonded to the laminating portion 30 via the first bonding layer area 41, and the bonding layer 40 is provided with a first avoidance area 42 corresponding to the edge sub-portion 2122 to prevent the edge sub-portion 2122 from bonding to the bonding layer 40.

[0052] Figure 3 In the display module of the related technology shown, the pressing portion of the packaging tape 4 is bonded to the flexible circuit board 2 through the adhesive layer TP1, and the edge sub-portion 2122 is also bonded to the adhesive layer TP1. In this way, the packaging tape 4 can easily lift up the edge sub-portion 2122 during rework, causing the bonding portion 211 to peel off from the display panel 1. Figure 5 The display module of the disclosed embodiment shown in the figure designs the adhesive surface of the adhesive layer 40 so that the bonding portion 211 is bonded to the pressing portion 30 through the first adhesive layer area 41 to improve the stability of the flexible circuit board 20 in the binding area, and the area corresponding to the adhesive layer 40 and the edge sub-portion 2122 is set as the first avoidance area 42. The first avoidance area 42 is non-sticky to prevent the edge sub-portion 2122 from bonding to the adhesive layer 40, ensuring that the edge sub-portion 2122 is not lifted up by the pressing portion 30 during the tearing off process of the pressing portion 30, thereby reducing the risk of peeling between the bonding portion 211 and the display panel 10 and avoiding poor touch of the display panel.

[0053] In the display module of the disclosed embodiment, the first binding area 11 of the display panel 10 and the second binding area 22 of the flexible circuit board 20 are bound and connected, and the first binding portion 21 of the flexible circuit board 20 is divided into a bonding portion 211 bonded to the display panel 10 and a free portion 212 located outside the display panel 10, the free portion 212 includes a middle sub-portion 2121 and edge sub-portions 2122 located on both sides of the middle sub-portion 2121, a bonding layer 40 is arranged between the pressing portion 30 and the flexible circuit board 20, the bonding layer 40 includes a first glue layer area 41, the bonding portion 211 is bonded to the pressing portion 30 through the first glue layer area 41, and the bonding layer 40 is provided with a first avoidance area 42 corresponding to the edge sub-portion 2122 to prevent the edge sub-portion 2122 from bonding to the bonding layer 40. In this way, during the rework of the display module, since the edge sub-portion 2122 corresponds to the first avoidance area 42, it can avoid that the edge sub-portion 2122 is bonded to the adhesive layer 40, which causes the pressing portion to be lifted up, resulting in the position of the edge sub-portion 2122 being lifted up, thereby causing the bonding area between the bonding portion 211 and the display panel 10 to be torn apart, thereby reducing the risk of peeling between the bonding portion 211 and the display panel 10 and avoiding poor touch of the display panel.

[0054] Exemplarily, the display panel 10 includes a display area and a first binding area 11 located on one side of the display area. The display area can be used to perform a display function, and the first binding area 11 can be provided with a first binding pin for electrically connecting to the flexible circuit board 20. The display panel 10 can be a liquid crystal display panel (LCD) or an organic light emitting diode display panel (OLED).

[0055] For example, the display panel in the embodiment of the present disclosure is a liquid crystal display panel, and the liquid crystal display panel includes structures such as a backlight module, a liquid crystal box, and an optical film layer. The liquid crystal box includes an array substrate, a color film substrate, and a liquid crystal layer located between the array substrate and the color film substrate. The display panel of the embodiment of the present disclosure can be set according to actual use requirements, which is not limited here. Exemplarily, the display module also includes an optical film layer, which is located on the light-emitting side of the display panel. The optical film layer may include a diffusion film layer, a polarizer, a uniform light film layer, etc. The specific structure of the optical film layer in the embodiment of the present disclosure is not limited here and can be set according to actual use requirements.

[0056] Exemplarily, the flexible circuit board 20 further includes a driving chip, one end of the flexible circuit board 20 is bound and connected to the first binding area 11 of the display panel 10, and the other end of the flexible circuit board 20 is bound and connected to the circuit board, and the driving chip is located on the flexible circuit board 20. The flexible circuit board 20 and the driving chip form a chip-on-film.

[0057] Exemplarily, the color filter substrate can be a touch substrate, the edge of the color filter substrate is located on the inner side of the edge of the array substrate, and the edge of the color filter substrate is bound to the flexible circuit board 20. The adhesive surface design of the adhesive layer 40 of the embodiment of the present invention can prevent the bonding portion 211 and the display panel 10 from being torn apart, thereby reducing the risk of peeling between the bonding portion 211 and the color filter substrate and avoiding poor touch.

[0058] Exemplarily, the first adhesive layer area 41 is a double-sided adhesive tape, the first adhesive layer area 41 covers the binding connection area between the second binding area 22 and the first binding area 11, and the pressing part 30 is pressed on the first adhesive layer area 41. In this way, the pressing part 30 is connected to the binding area through the first adhesive layer area 41, so that the second binding area 22 is pressed between the display panel 10 and the pressing part 30 through the pressing part 30, which can effectively prevent the second binding area 22 and the first binding area 11 from warping and peeling, and can improve the stability of the binding connection between the first binding area 11 and the second binding area 22, and reduce the risk of the flexible circuit board 20 being pulled and peeled off in the binding area.

[0059] Reference Figure 5 As shown, exemplarily, the area of ​​the first adhesive layer area 41 is larger than the area of ​​the first binding area 11 and the second binding area 22, and the edge area of ​​the first adhesive layer area 41 is bonded to the display panel 10. The orthographic projection of the pressing portion 30 on the display panel coincides with the orthographic projection of the first adhesive layer area 41 on the display panel, so that there is a large contact area between the first adhesive layer area 41 and the pressing portion 30 and between the first adhesive layer area 41 and the second binding area 22, thereby ensuring that the pressing portion 30 presses the first binding area 11 and the second binding area 22 tightly, and preventing the first binding area 11 and the second binding area 22 from warping and peeling.

[0060] Exemplarily, the first binding area 11 has a corresponding first binding pin, and the second binding area 2 has a corresponding second binding pin, so that the first binding pin is connected to the second binding pin accordingly, so that the circuit on the display panel is connected to the circuit on the flexible circuit board 20 accordingly. For example, the first binding area 11 and the second binding area 22 can be connected to each other by binding glue.

[0061] Reference Figure 5 and Figure 6 As shown, in one embodiment, the bonding layer 40 is provided in the first avoidance area 42 as a first hollow 42 a , and the first hollow 42 a corresponds to the edge sub-portion 2122 .

[0062] Exemplarily, the specific shape of the first hollow 42a can be a rectangular long hole, or the first hollow 42a can also be an elliptical or circular long hole, the first hollow 42a can also be other irregular shapes, the specific shape of the first hollow 42a is not limited here, and can be set according to actual usage requirements.

[0063] Figure 8 FIG. 2 is a plan view of binding a flexible circuit board to a display panel according to another embodiment of the present disclosure. In one embodiment, a first anti-adhesion insulating film 42 b located in the first avoidance area 42 is adhered to the adhesive surface of the adhesive layer 40 facing the flexible circuit board 20 .

[0064] Exemplarily, the material of the first anti-adhesion insulating film 42b can be polyethylene terephthalate (PET) or polyimide. The first anti-adhesion insulating film 42b is arranged in the same layer as the first adhesive layer area 41. It should be noted that A and B are arranged in the same layer, which can be understood as A and B are located on the surface of the same film layer. For example, the first anti-adhesion insulating film 42b and the first adhesive layer area 41 can be located on the surface of the flexible circuit board 20 away from the display panel. The first anti-adhesion insulating film 42b is located in the corresponding area of ​​the edge sub-portion 2122, and the first adhesive layer area 41 is located in the corresponding area of ​​the bonding portion. The edge sub-portion 2122 can be prevented from bonding with the pressing portion by the first anti-adhesion insulating film 42b, so that the edge sub-portion 2122 in a suspended state can be further prevented from being torn open, resulting in film peeling in the binding area between the display panel and the flexible circuit board. Moreover, the first anti-adhesion insulating film 42b can further play an insulating role.

[0065] Exemplarily, the specific shape of the first anti-sticking insulating film 42b can correspond to the edge sub-portion 2122. For example, the first anti-sticking insulating film 42b can be a rectangular strip, or the first anti-sticking insulating film 42b can also be an ellipse or a circle, or the first anti-sticking insulating film 42b can also be other irregular shapes. The specific shape of the first anti-sticking insulating film 42b is not limited here and can be set according to actual practical needs.

[0066] In one embodiment, the dimension of the edge sub-portion 2122 in the extension direction of the first binding portion 21 is 1cm-2cm, that is, the length of the edge sub-portion 2122 is 1cm-2cm. The first avoidance area 42 corresponds to the edge sub-portion 2122, and the dimension of the first avoidance area 42 in the extension direction of the first binding portion 21 corresponds to the dimension of the edge sub-portion 2122 in the extension direction of the first binding portion 21, and the dimension of the first avoidance area 42 in the extension direction of the first binding portion 21 is 1cm-2cm. The length dimensions of the edge sub-portion 2122 and the first avoidance area 42 are set within this range, which can prevent the edge sub-portion 2122 from being lifted up by the pressing portion 30, reduce the risk of peeling between the bonding portion 211 and the display panel 10, and avoid display module abnormalities.

[0067] Exemplarily, the dimensions of the edge sub-portion 2122 in the extension direction of the first binding portion 21 are 1 cm, 1.2 cm, 1.4 cm, 1.6 cm, 1.8 cm, and 2.0 cm. The specific length of the edge sub-portion 2122 is not limited here and can be set according to actual usage.

[0068] In one embodiment, the dimension of the edge sub-portion 2122 in the direction perpendicular to the extension of the first binding portion 21 is 1cm-2cm, that is, the width of the edge sub-portion 2122 is 1cm-2cm. The first avoidance area 42 corresponds to the edge sub-portion 2122, and the dimension of the first avoidance area 42 in the direction perpendicular to the extension of the first binding portion 21 corresponds to the dimension of the edge sub-portion 2122 in the direction perpendicular to the extension of the first binding portion 21, and the dimension of the first avoidance area 42 in the direction perpendicular to the extension of the first binding portion 21 is 1cm-2cm. The width dimensions of the edge sub-portion 2122 and the first avoidance area 42 are set within this range, which can prevent the edge sub-portion 2122 from being lifted up by the pressing portion 30, reduce the risk of peeling between the bonding portion 211 and the display panel 10, and avoid display module abnormalities.

[0069] Exemplarily, the dimensions of the edge sub-portion 2122 in the extension direction perpendicular to the first binding portion 21 are 1 cm, 1.2 cm, 1.4 cm, 1.6 cm, 1.8 cm, and 2.0 cm. The specific width dimensions of the edge sub-portion 2122 are not limited here and can be set according to actual usage.

[0070] In one embodiment, the size of the edge sub-portion 2122 in the extension direction of the first binding portion 21 is 1 cm-2 cm, and the size of the edge sub-portion 2122 in the extension direction perpendicular to the first binding portion 21 is 1 cm-2 cm. Exemplarily, the size of the edge sub-portion 2122 in the extension direction of the first binding portion 21 is 1 cm, 1.2 cm, 1.4 cm, 1.6 cm, 1.8 cm, 2.0 cm, and the size of the edge sub-portion 2122 in the extension direction perpendicular to the first binding portion 21 is 1 cm, 1.2 cm, 1.4 cm, 1.6 cm, 1.8 cm, 2.0 cm.

[0071] In the display module of the disclosed embodiment, the width and length of the edge sub-portion 2122 are both 1cm-2cm, that is, the width and length of the first avoidance portion 41 can be 1cm-2cm. The size of the edge sub-portion 2122 is set within this range, which can prevent the edge sub-portion 2122 from bonding with the adhesive layer 40 and reduce the impact on the bonding effect of the pressing portion.

[0072] Fig. 9 This is a plan view of a flexible circuit board and a display panel bound together according to another embodiment of the present disclosure, referring to Fig. 9As shown, in one embodiment, the bonding layer 40 further includes a second bonding layer area 43 , the second bonding layer area 43 corresponds to the middle sub-portion 2121 , and the middle sub-portion 2121 is bonded to the second bonding layer area 43 .

[0073] In the display module of the disclosed embodiment, the laminating portion 211 is bonded to the pressing portion 30 through the first adhesive layer area 41, and the middle sub-portion 2121 of the free portion 212 is bonded to the pressing portion 30 through the second adhesive layer area 43. In this way, when the pressing portion is torn off, the edge sub-portion 2122 is not bonded to the pressing portion 30, thereby preventing the flexible circuit board from being torn off from the edge sub-portion 2122, and the middle sub-portion 2121 is bonded to the second adhesive layer area 43, which can further ensure the binding stability of the flexible circuit board 20 and the display panel.

[0074] Reference Figure 5 and Figure 8 As shown, in one embodiment, the adhesive layer 40 is provided with a second avoidance area 44 corresponding to the middle sub-portion 2121 to prevent the middle sub-portion 2121 from adhering to the adhesive layer 40. The edge sub-portion 2122 corresponds to the first avoidance area 41, and the middle sub-portion 2121 corresponds to the second avoidance area 44, so that there is no adhesion between the corresponding area of ​​the free portion 212 and the pressing portion 30, thereby preventing the free portion 212 in a suspended state from being driven when the pressing portion 30 is torn off, reducing the risk of peeling between the laminating portion 211 and the display panel 10, and avoiding abnormality of the display module.

[0075] Reference Figure 5 and Figure 8 As shown, in one embodiment, the bonding layer 40 is set as a second hollow 44a in the second avoidance area 44. Exemplarily, the specific shape of the second hollow 44a can be a rectangular long strip hole, or the second hollow 44a can also be an elliptical or circular long strip hole, the second hollow 44a can also be other irregular shapes, the specific shape of the second hollow is not limited here, and can be set according to actual use requirements.

[0076] Fig.10 This is a plan view of a flexible circuit board and a display panel bound together in another embodiment of the present disclosure. Fig.10 As shown, in one embodiment, a second anti-adhesion insulating film 44 b located in the second avoidance area 44 is adhered to the adhesive surface of the adhesive layer 40 facing the flexible circuit board 20 .

[0077] Exemplarily, the material of the second anti-adhesion insulating film 44b can be polyethylene terephthalate (PET) or polyimide. The second anti-adhesion insulating film 44b is arranged in the same layer as the first adhesive layer area 41. It should be noted that A and B are arranged in the same layer, which can be understood as A and B are located on the surface of the same film layer. For example, the second anti-adhesion insulating film 44b and the first adhesive layer area 41 can be located on the surface of the flexible circuit board 20 away from the display panel. The second anti-adhesion insulating film 44b is located in the corresponding area of ​​the middle sub-section 2121. The middle sub-section 2121 can be prevented from bonding with the pressing part by the second anti-adhesion insulating film 44b, which can further prevent the middle sub-section 2121 in a suspended state from being torn open, resulting in film peeling in the binding area between the display panel and the flexible circuit board. Moreover, the second anti-adhesion insulating film 44b can further play an insulating role.

[0078] Exemplarily, the specific shape of the second anti-sticking insulating film 44b can correspond to the middle sub-portion 2121. For example, the second anti-sticking insulating film 44b can be a rectangular strip, or the second anti-sticking insulating film 44b can also be an ellipse or a circle, or the second anti-sticking insulating film 44b can also be other irregular shapes. The specific shape of the second anti-sticking insulating film is not limited here and can be set according to actual practical needs.

[0079] Reference Figure 5 , Figure 8 , Fig. 9 as well as Fig.10 As shown, in one embodiment, the adhesive layer 40 further includes a third adhesive layer area 45, and the third adhesive layer area 45 is located on the boundary side of the edge sub-portion 2122 away from the middle sub-portion 2121. The third adhesive layer area 45 is located on the boundary side of the edge sub-portion 2122 away from the middle sub-portion 2121, and the third adhesive layer area 45 does not overlap with the edge sub-portion 2122. The third adhesive layer area 45 is bonded to the pressing portion, thereby improving the bonding stability of the pressing portion, which can reduce the risk of peeling between the pressing portion and the flexible circuit board, thereby further reducing the risk of peeling between the flexible circuit board and the display panel. It should be noted that the specific shape and size of the third adhesive layer area 45 are not limited here, and can be set according to actual usage.

[0080] Fig.11 FIG. 1 is a schematic plan view of a flexible circuit board according to an embodiment of the present disclosure. Fig.11As shown, in one embodiment, the flexible circuit board 20 further includes a connecting portion 23 and a second binding portion 24, one end of the connecting portion 23 is connected to the middle sub-portion 2121, and the other end of the connecting portion 23 is connected to the second binding portion 24. Exemplarily, the width of the connecting portion 23 may be smaller than the width of the first binding portion and the second binding portion 24, one end of the connecting portion 23 is connected to the middle sub-portion 2121, and the other end of the connecting portion 23 is connected to the second binding portion 24, the connecting portion 23 may be a flexible material, and the connecting portion 23 may be bent. The driver chip may be disposed on the connecting portion.

[0081] Fig.12 This is a plan view of a flexible circuit board and a display panel being bound together according to an embodiment of the present disclosure. Fig.13 This is a plan view of a flexible circuit board and a display panel bound together according to an embodiment of the present disclosure. Figure 4 , Fig.12 and Fig.13 As shown, the display module also includes a backlight module 50, which is located on a side of the display panel 10 away from the first binding area 11. A circuit board 51 is provided at one end of the backlight module 50, and the second binding portion 24 is connected to the circuit board 51. The bonding layer 40 is also provided with a third avoidance area 46 corresponding to the connection portion 23 to prevent the connection portion 23 from bonding with the bonding layer 40. Exemplarily, the circuit board 51 is connected to the display panel through the flexible circuit board 20, for example, the circuit board 51 is connected to the color film substrate of the display panel through the flexible circuit board, and the color film substrate can be controlled to perform touch operation through the circuit board 51. The bonding layer 40 is also provided with a third avoidance area 46 corresponding to the connection portion 23, and the third avoidance area 46 can reduce the setting of the glue layer area without affecting the binding effect of the flexible circuit board 20 and the display panel.

[0082] Reference Fig.12 As shown, in one embodiment, the bonding layer 40 is provided as a third hollow 46a in the third avoidance area 46. Exemplarily, the specific shape of the third hollow 46a can be a rectangular long strip hole, or the third hollow 46a can also be an elliptical or circular long strip hole, the third hollow 46a can also be other irregular shapes, and the specific shape of the third hollow 46a is not limited here, and can be set according to actual use requirements.

[0083] Reference Fig.13As shown, in one embodiment, a third anti-bonding insulating film 46b located in the third avoidance area 46 is pasted on the bonding surface of the bonding layer 40 facing the side of the flexible circuit board 20. Exemplarily, the material of the third anti-bonding insulating film 46b can be polyethylene terephthalate (PET) or polyimide. The third anti-bonding insulating film 46b is arranged in the same layer as the first adhesive layer area 41. It should be noted that A and B are arranged in the same layer, which can be understood as A and B are located on the surface of the same film layer. For example, the third anti-bonding insulating film 46b and the first adhesive layer area 41 can both be located on the surface of the flexible circuit board 20 away from the display panel. The third anti-bonding insulating film 46b is located in the corresponding area of ​​the connecting portion 23. The connecting portion 23 can be prevented from bonding with the pressing portion by the second anti-bonding insulating film 46b, so that the connecting portion 23 in a suspended state can be prevented from being torn off, resulting in film peeling in the binding area between the display panel and the flexible circuit board. Moreover, the third anti-bonding insulating film 46b can further play an insulating role.

[0084] Reference Figure 4 As shown, in one embodiment, the display module further includes a backlight module 50, a packaging tape 60 and a frame 70, and the display panel 10 is supported and arranged on one side of the backlight module 50 by a support portion 80. The edge of the backlight module 50 and the edge of the display panel 10 are wrapped by the packaging tape 60, and the packaging tape 60 is partially pressed on the side of the flexible circuit board 20 away from the display panel to form a pressing portion 30. The frame 70 is bonded to the side of the pressing portion 30 away from the display panel through a fixed adhesive layer 90.

[0085] The display module of the embodiment of the present disclosure requires rework of the frame during the assembly of the whole machine. During the removal of the frame 70, a first hollow or first anti-adhesion insulating film is provided in the edge sub-portion area corresponding to the pressed portion of the packaging tape to ensure that the edge sub-portion is not lifted by the packaging tape during the removal of the packaging tape, thereby reducing the risk of peeling off between the display panel and the flexible circuit board and avoiding abnormalities of the display module.

[0086] Based on the inventive concept of the aforementioned embodiment, the embodiment of the present disclosure further provides a display device, which includes the display module of any embodiment of the present disclosure. The display device can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0087] Other structures of the display module and the display device of the above-mentioned embodiment can adopt various technical solutions known to ordinary technicians in this field now and in the future, and will not be described in detail here.

[0088] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0089] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0090] In the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0091] In the present disclosure, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being “above”, “above”, and “above” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0092] The disclosure above provides many different embodiments or examples to implement different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0093] The above are only specific embodiments of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The display panel includes a first binding area; A flexible circuit board, comprising a first binding portion, wherein the first binding portion comprises a second binding area, wherein the second binding area is bound and connected to the first binding area to divide the first binding portion into a bonding portion bonded to the display panel and a free portion located outside the display panel, wherein the free portion comprises a middle sub-portion and edge sub-portions located on both sides of the middle sub-portion; A pressing portion, located at a side of the flexible circuit board away from the display panel; The bonding layer is located between the flexible circuit board and the laminating portion, the bonding layer includes a first adhesive layer area, the laminating portion is bonded to the laminating portion via the first adhesive layer area, and the bonding layer is provided with a first avoidance area corresponding to the edge sub-portion to prevent the edge sub-portion from bonding to the bonding layer.

2. The display module according to claim 1, characterized in that: The adhesive layer is configured as a first hollow in the first avoidance area; or, a first anti-adhesion insulating film located in the first avoidance area is adhered to the adhesive surface of the adhesive layer on the side facing the flexible circuit board.

3. The display module according to claim 1, characterized in that: The dimension of the edge sub-portion in the extension direction of the first binding portion is 1 cm-2 cm; and / or the dimension of the edge sub-portion in the extension direction perpendicular to the first binding portion is 1 cm-2 cm.

4. The display module according to claim 1, characterized in that: The bonding layer further includes a second bonding layer area, the second bonding layer area corresponds to the middle sub-portion, and the middle sub-portion is bonded to the second bonding layer area.

5. The display module according to claim 1, characterized in that: The adhesive layer is provided with a second avoidance area corresponding to the middle sub-portion to prevent the middle sub-portion from being bonded to the adhesive layer.

6. The display module according to claim 5, characterized in that: The bonding layer is configured as a second hollow in the second avoidance area; or, A second anti-adhesion insulating film located in the second avoidance area is adhered to the adhesive surface of the adhesive layer on the side facing the flexible circuit board.

7. The display module according to claim 1, characterized in that: The bonding layer further includes a third adhesive layer area, and the third adhesive layer area is located on a side of the edge sub-portion away from a boundary of the middle sub-portion.

8. The display module according to claim 1, characterized in that: The flexible circuit board further comprises a connecting portion and a second binding portion, one end of the connecting portion is connected to the middle sub-portion, and the other end of the connecting portion is connected to the second binding portion; The display module further includes a circuit board, and the second binding portion is connected to the circuit board; The adhesive layer is further provided with a third avoidance area corresponding to the connecting portion to prevent the connecting portion from being bonded to the adhesive layer.

9. The display module according to claim 8, characterized in that: The display module further includes a backlight module, the backlight module is located at a side of the display panel away from the first binding area, the circuit board is arranged at one end of the backlight module, and the bonding layer is arranged as a third hollow in the third avoidance area; or, A third anti-adhesion insulating film located in the third avoidance area is adhered to the adhesive surface of the adhesive layer on the side facing the flexible circuit board.

10. The display module according to claim 8, characterized in that: The display module also includes: A backlight module, wherein the display panel is supported and arranged on one side of the backlight module by a supporting part; Packaging tape, the edge of the backlight module and the edge of the display panel are wrapped by the packaging tape, and the packaging tape is partially pressed on the side of the flexible circuit board away from the display panel to form the pressing part; A frame is bonded to a side of the pressing portion away from the display panel through a fixed adhesive layer.

11. A display device, characterized in that: Comprising the display module as described in any one of claims 1 to 10.

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