flip chip

Abstract

The application provides a kind of Cof, and Cof includes body part and first reinforcing part, body part includes sequentially connected first binding part, connecting part and second binding part;First reinforcing part is connected with first binding part, and extends in the direction away from first binding part along at least one end of opposite two ends of first binding part to form first extension;First binding part is provided with a plurality of spaced first binding terminals, second binding part is provided with a plurality of spaced second binding terminals, first extension is provided with at least one third binding terminal, first binding terminal is electrically connected with corresponding second binding terminal, and third binding terminal is insulated from second binding terminal;The application sets reinforcing part on the end of the binding part of Cof to alleviate the problem of peeling risk at the binding part of existing Cof and display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a flip-chip film. Background Technology

[0002] With the advancement of display technology, high screen-to-body ratio displays are gradually becoming the mainstream trend in the market, and to achieve a high screen-to-body ratio, the bezels need to be narrowed. Among them, the use of Chip On Film (COF) technology can effectively narrow the bezels. COF technology uses flexible circuit boards as packaging chip carriers to bond chips to flexible circuit board circuits.

[0003] In recent years, curved monitors have become increasingly popular due to their stylish appearance and superior visual effects. Furthermore, with the development of curved display technology, curved monitors have upgraded from the previous R4000 / R3500 technology to R1500 / R1000. However, as the curvature of the curved monitor decreases, the stress of the COF (Copper Frame) twisting deformation increases, making the bonding between the COF and the display panel more prone to peeling. Summary of the Invention

[0004] This application provides a flip-chip film to alleviate the technical problem of peeling risk at the bonding interface between existing COF and display panels.

[0005] To solve the above problems, the technical solution provided in this application is as follows:

[0006] This application provides a flip-chip thin film, which includes:

[0007] The body portion includes a first binding portion, a connecting portion, and a second binding portion connected in sequence, wherein the connecting portion is connected to the first binding portion and the second binding portion; and

[0008] A first reinforcing portion is connected to the first binding portion and extends away from the first binding portion along at least one of the two opposite ends of the first binding portion to form a first extension portion;

[0009] The first binding portion is provided with a plurality of first binding terminals arranged at intervals, the second binding portion is provided with a plurality of second binding terminals arranged at intervals, and the first extension portion is provided with at least one third binding terminal. The first binding terminals are electrically connected to the corresponding second binding terminals, and the third binding terminals are insulated from the second binding terminals.

[0010] In the flip-chip film provided in this application embodiment, the first reinforcing part and the first bonding part have an overlapping area. In the corresponding overlapping area, the first reinforcing part is provided with at least two first alignment marks, and the first bonding part is provided with a second alignment mark corresponding to the first alignment marks, so that the first reinforcing part and the first bonding part are aligned and bonded.

[0011] In the flip-chip film provided in the embodiments of this application, the first reinforcing portion and the first bonding portion are integrally disposed, and the first reinforcing portion is formed by extending the first bonding portion in a direction away from the first bonding portion.

[0012] In the flip-chip film provided in this application embodiment, a plurality of third bonding terminals are provided on the first extension portion, and the interval between the third bonding terminals is greater than the interval between the first bonding terminals.

[0013] In the flip-chip film provided in this application embodiment, the length of the first extension beyond the first bonding portion is greater than 1.5 mm.

[0014] In the flip-chip film provided in the embodiments of this application, the two opposite ends of the first bonding portion are a first end and a second end, and the first reinforcing portion includes a first sub-extension formed extending from the first end in a direction away from the first bonding portion and a second sub-extension formed extending from the second end in a direction away from the first bonding portion.

[0015] In the flip-chip film provided in the embodiments of this application, at least one third alignment mark is provided on both the first sub-extension and the second sub-extension.

[0016] In the flip-chip film provided in the embodiments of this application, the length of the first bonding portion is equal to the length of the second bonding portion along the extending direction of the first reinforcing portion.

[0017] In the flip-chip film provided in the embodiments of this application, along the extension direction of the first reinforcing portion, the end of the connecting portion is recessed relative to the end of the first binding portion and / or the end of the second binding portion, and the recessed depth of the connecting portion is less than the extension length of the first reinforcing portion.

[0018] In the flip-chip film provided in the embodiments of this application, the flip-chip film further includes a second reinforcing portion, which is connected to the second bonding portion and extends along at least one of the two opposite ends of the second bonding portion in a direction away from the second bonding portion to form a second extension portion.

[0019] The beneficial effects of this application are as follows: The flip-chip film provided in this application includes a body portion and a first reinforcing portion. The body portion includes a first bonding portion, a connecting portion, and a second bonding portion connected in sequence. The connecting portion is connected to the first bonding portion and the second bonding portion. The first reinforcing portion is connected to the first bonding portion and extends away from the first bonding portion along at least one of the two opposite ends of the first bonding portion to form a first extension portion. The first bonding portion is provided with a plurality of spaced-apart first bonding terminals, the second bonding portion is provided with a plurality of spaced-apart second bonding terminals, and the first extension portion is provided with at least one third bonding terminal. The first bonding terminal is electrically connected to the corresponding second bonding terminal, and the third bonding terminal is insulated from the second bonding terminal. This application increases the bonding area of ​​the flip-chip film during bonding by providing a reinforcing portion at the end of the bonding portion of the flip-chip film, thereby increasing the adhesion of the flip-chip film during bonding, thus increasing the peel force of the flip-chip film, improving the anti-torsion ability of the flip-chip film in curved state, and thus reducing the risk of peeling between the flip-chip film and the display panel. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a top view of a display module provided in an embodiment of this application.

[0022] Figure 2 This is a top view of a flip-chip thin film provided in an embodiment of this application.

[0023] Figure 3 for Figure 2 A schematic diagram of the disassembled structure of a crystal thimble film.

[0024] Figure 4 for Figure 2 A partially enlarged structural diagram of the first binding part.

[0025] Figure 5 This is a stress variation curve of the bonding portion of a flip-chip thin film in a related technology.

[0026] Figure 6 for Figure 2 Another disassembly diagram of the crystal thixotropic thin film.

[0027] Figure 7This is a top view schematic diagram of another flip-chip thin film provided in an embodiment of this application.

[0028] Figure 8 This is a top view schematic diagram of another flip-chip thin film provided in the embodiments of this application. Detailed Implementation

[0029] The following descriptions of the embodiments are based on the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0030] Please refer to Figures 1 to 5 , Figure 1 This is a top view of a display module provided in an embodiment of this application. Figure 2 This is a top view schematic diagram of a flip-chip thin film provided in an embodiment of this application. Figure 3 for Figure 2 A schematic diagram of the disassembly structure of a crystal-thin film. Figure 4 for Figure 2 A partially enlarged structural diagram of the first binding part. Figure 5 This is a stress variation curve of the bonding portion of a flip-chip thin film in a related technology. (Refer to...) Figure 1 The display module 1000 includes a display panel 100, a printed circuit board 200, and at least one flip-chip film 300. The display panel 100 is electrically connected to the printed circuit board 200 through the flip-chip film 300.

[0031] Optionally, the printed circuit board 200 includes a PCBA (Printed Circuit Board Assembly) board, which is formed by soldering electronic components onto the printed circuit board 200. The material of the printed circuit board 200 includes resin materials, etc. The printed circuit board 200 is used to process the input signals of the display panel 100 and then input them to the display panel 100 through the flip-chip film 300, thereby realizing the processing of in-plane signals and power supply of the display panel 100.

[0032] The flip-chip film 300 includes a body portion 10 and a first reinforcing portion 20. The body portion 10 includes a first bonding portion 11, a connecting portion 12, and a second bonding portion 13 connected in sequence. The connecting portion 12 is connected to the first bonding portion 11 and the second bonding portion 13. The first reinforcing portion 20 is connected to the first bonding portion 11 and extends along at least one of the two opposite ends of the first bonding portion 11 in a direction away from the first bonding portion 11 to form a first extension portion (e.g., ...). Figure 2 The first sub-extension 21 and the second sub-extension 22 are shown. The first bonding part 11 and the first extension of the first reinforcing part 20 are bonded together to the display panel 100, and the second bonding part 13 is bonded to the printed circuit board 200.

[0033] The display panel 100 includes a display area AA and a bonding area BA located on one side of the display area AA. The first bonding part 11 and the first extension of the first reinforcing part 20 are bonded together to the bonding area BA of the display panel 100. Optionally, the display panel 100 includes a liquid crystal display panel, an organic light-emitting diode display panel, etc. Taking the liquid crystal display panel as an example, the liquid crystal display panel typically includes a backlight module, a liquid crystal cell, and a polarizer, etc. The liquid crystal cell includes an array substrate and a color filter substrate, as well as a liquid crystal layer located between the array substrate and the color filter substrate. However, this application is not limited to this. The display panel 100 of this application can adopt various conventional liquid crystal display panels, which will not be described in detail here.

[0034] Reference Figure 2 The first binding part 11 is provided with a plurality of first binding terminals 41 arranged at intervals, the second binding part 13 is provided with a plurality of second binding terminals 42 arranged at intervals, and the first extension part is provided with at least one third binding terminal 43. The first binding terminal 41 is electrically connected to the corresponding second binding terminal 42, and the third binding terminal 43 is insulated from the second binding terminal 42.

[0035] The flip-chip film 300 further includes a driver integrated circuit (IC) 30, which is bonded to the connection portion 12. The first bonding terminal 41 is electrically connected to the corresponding second bonding terminal 42 through the driver integrated circuit 30. Specifically, the connection portion 12 is also provided with multiple connection traces. The first bonding terminal 41 is electrically connected to the driver integrated circuit 30 through the corresponding connection traces, and the second bonding terminal 42 is also electrically connected to the driver integrated circuit 30 through the corresponding connection traces, so as to realize the electrical connection between the first bonding terminal 41 and the second bonding terminal 42.

[0036] The first bonding part 11 is bonded to the display panel 100 via the first bonding terminal 41, and the second bonding part 13 is bonded to the printed circuit board 200 via the second bonding terminal 42, thereby achieving an electrical connection between the display panel 100 and the printed circuit board 200. Naturally, the bonding area BA of the display panel 100 is provided with a bonding terminal (not shown in the figure) corresponding to the first bonding terminal 41 to achieve bonding between the first bonding part 11 and the display panel 100; the printed circuit board 200 is also provided with a bonding terminal (not shown in the figure) corresponding to the second bonding terminal 42 to achieve bonding between the second bonding part 13 and the printed circuit board 200.

[0037] The insulation between the third binding terminal 43 and the second binding terminal 42 means that there is no electrical connection between the third binding terminal 43 and the second binding terminal 42, so that the third binding terminal 43 does not have the function of transmitting signals, while the first binding terminal 41 has the function of transmitting signals. Thus, the third binding terminal 43 and the first binding terminal 41 have different functions.

[0038] The first extension is bonded to the display panel 100 via the third bonding terminal 43, thereby binding the first reinforcing part 20 to the display panel 100. Naturally, the display panel 100 also has a bonding terminal (not shown) corresponding to the third bonding terminal 43. The bonding terminal on the display panel 100 that is bonded to the third bonding terminal 43 is not connected to any signal lines within the display panel 100.

[0039] In this embodiment, by providing a first reinforcing part 20 connected to the first bonding part 11, and by also bonding the first reinforcing part 20 to the display panel 100, the first bonding part 11 is reinforced, thereby increasing the bonding area when the flip-chip film 300 is bonded to the display panel 100, and thus increasing the adhesion when the flip-chip film 300 is bonded to the display panel 100. This increases the peel force of the flip-chip film 300 and improves the anti-torsion ability of the flip-chip film 300 in curved state, thereby reducing the risk of peeling at the bonding point between the flip-chip film 300 and the display panel 100.

[0040] Optionally, the two opposite ends of the first bonding portion 11 are a first end 111 and a second end 112. The first reinforcing portion 20 includes a first sub-extension 21 extending from the first end 111 in a direction away from the first bonding portion 11 and a second sub-extension 22 extending from the second end 112 in a direction away from the first bonding portion 11. By providing two extensions, the reinforcing effect of the first reinforcing portion 20 can be improved, making the flip-chip film 300 more firmly bonded to the display panel 100. The first sub-extension 21 and the second sub-extension 22 are symmetrical about the first bonding portion 11.

[0041] Furthermore, in conjunction with reference Figure 2 and Figure 3 The first reinforcing portion 20 includes a first sub-extension 21, a second sub-extension 22, and a fixing portion 24 located between the first sub-extension 21 and the second sub-extension 22. The fixing portion 24 is connected to the first sub-extension 21 and the second sub-extension 22. The fixing portion 24 is fixedly connected to the first binding portion 11, and the fixing portion 24 is disposed on the side of the first binding portion 11 opposite to the first binding terminal 41. Optionally, the fixing portion 24 and the first binding portion 11 can be fixedly connected by adhesive bonding.

[0042] The fixing part 24 is fitted to the first binding part 11, such that the first reinforcing part 20 and the first binding part 11 have an overlapping area. Within the corresponding overlapping area, the first reinforcing part 20 is provided with at least two first alignment marks 25, and the first binding part 11 is provided with a second alignment mark 113 corresponding to the first alignment marks 25, so that the first reinforcing part 20 and the first binding part 11 are aligned and fitted. The first alignment mark 25 is located at one end of the fixing part 24 near the first extension, and the second alignment mark 113 is located in the area of ​​the first binding part 11 near the first end 111 or the second end 112, so as to improve the accuracy of the alignment and fitting of the first reinforcing part 20 and the first binding part 11.

[0043] Optionally, the fixing portion 24, the first sub-extension 21, and the second sub-extension 22 are integrally formed. The materials of the fixing portion 24, the first sub-extension 21, and the second sub-extension 22 include polycarbonate (PC), polyethylene terephthalate (PET), and other materials with high flexibility, resistance to torsional deformation, and low stress. The thickness of the fixing portion 24, the first sub-extension 21, and the second sub-extension 22 ranges from 0.08 mm to 0.15 mm.

[0044] Optionally, at least one third alignment mark 23 is provided on both the first sub-extension 21 and the second sub-extension 22. The bonding area BA of the display panel 100 is provided with an alignment mark (not shown) corresponding to the third alignment mark 23. By aligning the third alignment mark 23 with the alignment mark on the display panel 100, the flip-chip film 300 is bonded to the display panel 100. The third alignment mark 23 is located at the end of the first sub-extension 21 or the second sub-extension 22 away from the fixing part 24, so as to improve the accuracy of the alignment and bonding of the flip-chip film 300 and the display panel 100.

[0045] Of course, the third alignment mark 23 is not limited to being disposed on the first reinforcing portion 20; the third alignment mark 23 may also be disposed on the first binding portion 11. Alternatively, the third binding terminal 43 on the first extension portion may also be reused as the third alignment mark 23.

[0046] Reference Figure 4 Optionally, the first extension is provided with a plurality of spaced-apart third bonding terminals 43, the spacing between the third bonding terminals 43 being greater than the spacing between the first bonding terminals 41, to simplify the manufacturing process. Since the third bonding terminals 43 are not used for signal transmission, but mainly for bonding the first reinforcing part 20 to the display panel 100, the design of the third bonding terminals 43 does not need to follow the rules of the first bonding terminals 41, thereby reducing the manufacturing difficulty of the third bonding terminals 43.

[0047] Optionally, when the first extension is provided with a plurality of the third binding terminals 43, at least one of the third binding terminals 43 can be designed differently so that the differentiated third binding terminal 43 can be reused as the third alignment mark 23, thereby eliminating the need to design the third alignment mark 23 separately.

[0048] Optionally, the length of the first extension beyond the first binding portion 11 is greater than 1.5 mm. Taking the first sub-extension 21 as an example, the length L1 of the first sub-extension 21 is greater than 1.5 mm, so as to improve the reinforcement effect of the first reinforcing portion 20 on the first binding portion 11.

[0049] It should be noted that, referring to Figure 5 Through simulation, the inventors of this application discovered that, without the first reinforcing part 20 as described in this application, the two ends of the flip-chip film are subjected to greater stress in the area where the flip-chip film is bonded to the display panel. Figure 5 The stress variation at one end of the flip-chip thin film is shown, from... Figure 5It can be seen that the stress on the flip-chip film decreases as the distance increases, and the stress on the flip-chip film tends to stabilize after 1.5 mm. The distance refers to the distance from a point on the flip-chip film to the end of the flip-chip film.

[0050] Therefore, the first extension portion is made to extend beyond the first bonding portion 11 by more than 1.5 mm to bear the torsional stress on the flip-chip film 300, thereby reducing the torsional stress on the first bonding portion 11 and preventing the bonding point between the first bonding portion 11 and the display panel 100 from peeling off.

[0051] Furthermore, in order to reduce the deformation of the flip-chip film 300 under torsional stress and to release some of the torsional stress borne by the first extension, the connecting portion 12 of the flip-chip film 300 can be specially designed. Optionally, along the extending direction of the first reinforcing portion 20, the end of the connecting portion 12 is recessed relative to the end of the first binding portion 11 and / or the end of the second binding portion 13 to release torsional stress.

[0052] Optionally, the inward depth of the connecting portion 12 is less than the extension length of the first reinforcing portion 20, so that the connecting portion 12 can satisfy the torsional stress borne by the first extension portion while also ensuring sufficient width to enrich the wiring space on the connecting portion 12.

[0053] It should be noted that when designing the inward depth of the connecting portion 12 and the extension length of the first reinforcing portion 20, the inward depth of the connecting portion 12 can be negatively correlated with the extension length of the first reinforcing portion 20. For example, when the extension length of the first reinforcing portion 20 is longer, that is, when the length of the first extension is longer, the reinforcement effect of the first reinforcing portion 20 is better, reducing the risk of separation between the first bonding portion 11 and the display panel 100. In this case, the first reinforcing portion 20 can withstand greater torsional stress, and the connecting portion 12 can be set with a smaller inward depth to release less torsional stress, thus allowing the connecting portion 12 to have sufficient space for wiring. Conversely, when the extension length of the first reinforcing portion 20 is shorter, that is, when the length of the first extension is shorter, the reinforcement effect of the first reinforcing portion 20 is limited. In this case, to avoid separation between the first bonding portion 11 and the display panel 100, the connecting portion 12 can be set with a larger inward depth to release more torsional stress.

[0054] Specifically, continue to refer to Figure 2The second binding portion 13 has two opposite ends, a third end 131 and a fourth end 132. The third end 131 corresponds to the first end 111 of the first binding portion 11, and the fourth end 132 corresponds to the second end 112 of the first binding portion 11. The connecting portion 12 has two opposite ends, a fifth end 121 and a sixth end 122. The fifth end 121, the first end 111, and the third end 131 are located on the same side of the body portion 10, and the fifth end 121 is recessed relative to the first end 111 and the third end 131. The sixth end 122, the second end 112, and the fourth end 132 are located on the same side of the body portion 10, and the sixth end 122 is recessed relative to the second end 112 and the fourth end 132.

[0055] Optionally, along the extending direction of the first reinforcing portion 20, the length of the first bonding portion 11 is equal to the length of the second bonding portion 13, and the end of the first bonding portion 11 is flush with the end of the second bonding portion 13. In the extending direction perpendicular to the first reinforcing portion 20, the width of the first reinforcing portion 20 is smaller than the width of the first bonding portion 11. This ensures effective bonding between the flip-chip film 300 and the display panel 100 while reducing the bonding area, thereby reducing the bezel of the display panel 100.

[0056] In one embodiment, please refer to the reference. Figures 1 to 6 , Figure 6 for Figure 2 Another disassembly diagram of the flip-chip thin film. Unlike the embodiment described above, the fixing portion 24 of the first reinforcing portion 20 is divided into two parts with a gap between them. One part of the fixing portion 24 is connected to the first sub-extension portion 21, and the other part is connected to the second sub-extension portion 22. This reduces the overlap area between the fixing portion 24 and the first binding portion 11, thereby reducing the area of ​​the first reinforcing portion 20 and saving costs.

[0057] In addition, both the first sub-extension 21 and the second sub-extension 22 are provided with a third binding terminal 43, which is elongated to further reduce the manufacturing difficulty of the third binding terminal 43. Moreover, when only one third binding terminal 43 is provided, it can also be reused as the third alignment mark 23. Other descriptions are as described in the above embodiments and will not be repeated here.

[0058] In one embodiment, please refer to the reference. Figures 1 to 7 , Figure 7This is another top view schematic diagram of the flip-chip film provided in this application embodiment. Unlike the above embodiments, in the flip-chip film 301 of this embodiment, the first reinforcing portion 20 and the first bonding portion 11 are integrally formed, with the first reinforcing portion 20 extending from the first bonding portion 11 in a direction away from the first bonding portion 11. This avoids the need for proper alignment and bonding between the first reinforcing portion 20 and the first bonding portion 11, simplifying the process. Other descriptions are as described in the above embodiments and will not be repeated here.

[0059] In one embodiment, please refer to the reference. Figures 1 to 8 , Figure 8 This is another top view schematic diagram of the flip-chip film provided in this application embodiment. Unlike the above embodiment, in the flip-chip film 302 of this embodiment, the flip-chip film 302 further includes a second reinforcing portion 50. The second reinforcing portion 50 is connected to the second bonding portion 13 and extends along at least one of the two opposite ends of the second bonding portion 13 in a direction away from the second bonding portion 13 to form a second extension portion, thereby improving the bonding strength between the second bonding portion 13 and the printed circuit board 200 and preventing the second bonding portion 13 from peeling off from the printed circuit board 200 at the bonding point.

[0060] Specifically, the second reinforcing portion 50 includes a third sub-extension 51 extending from the third end 131 of the second bonding portion 13 in a direction away from the second bonding portion 13, and a fourth sub-extension 52 extending from the fourth end 132 of the second bonding portion 13 in a direction away from the second bonding portion 13. At least one fourth bonding terminal 44 and at least one fourth alignment mark 53 are provided on both the third sub-extension 51 and the fourth sub-extension 52 for alignment and bonding of the flip-chip film 300 to the printed circuit board 200.

[0061] It should be noted that the specific structure of the second reinforcing part 50 and the relationship between the second reinforcing part 50 and the second binding part 13 can be referred to the relevant description of the first reinforcing part 20 in the above embodiments, and will not be repeated here.

[0062] As can be seen from the above embodiments:

[0063] The flip-chip film and display module provided in this application include a body portion and a first reinforcing portion. The body portion includes a first bonding portion, a connecting portion, and a second bonding portion connected sequentially along a first direction. The connecting portion is connected to the first bonding portion and the second bonding portion. The first reinforcing portion is connected to the first bonding portion and extends away from the first bonding portion along at least one of the two opposite ends of the first bonding portion to form a first extension portion. The first bonding portion is provided with a plurality of spaced-apart first bonding terminals, the second bonding portion is provided with a plurality of spaced-apart second bonding terminals, and the first extension portion is provided with at least one third bonding terminal. The first bonding terminal is electrically connected to the corresponding second bonding terminal, and the third bonding terminal is insulated from the second bonding terminal. This application increases the bonding area of ​​the flip-chip film during bonding by providing a reinforcing portion at the end of the bonding portion of the flip-chip film, thereby increasing the adhesion of the flip-chip film during bonding, increasing the peel force of the flip-chip film, improving the anti-torsion ability of the flip-chip film in curved state, and thus reducing the risk of peeling between the flip-chip film and the display panel.

[0064] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0065] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A flip-chip thin film, characterized in that, include: The main body includes a first binding part, a connecting part, and a second binding part connected in sequence, wherein the connecting part is connected to the first binding part and the second binding part; as well as A first reinforcing portion is connected to the first binding portion and extends away from the first binding portion along at least one of the two opposite ends of the first binding portion to form a first extension portion; The first binding part is provided with a plurality of first binding terminals arranged at intervals, the second binding part is provided with a plurality of second binding terminals arranged at intervals, the first extension part is provided with at least one third binding terminal, the first binding terminal is electrically connected to the corresponding second binding terminal, and the third binding terminal is insulated from the second binding terminal. The first reinforcing part includes a fixing part that connects to the first extension part. The fixing part is fixedly connected to the first binding part, and the fixing part is disposed on the side of the first binding part away from the first binding terminal. The third binding terminal is used for binding and connecting to the display panel.

2. The flip-chip thin film according to claim 1, characterized in that, The first reinforcing part and the first binding part have an overlapping area. Within the overlapping area, the first reinforcing part is provided with at least two first alignment marks, and the first binding part is provided with a second alignment mark corresponding to the first alignment marks, so that the first reinforcing part and the first binding part are aligned and fitted.

3. The flip-chip thin film according to claim 1, characterized in that, The first reinforcing part and the first binding part are integrally formed, and the first reinforcing part is formed by extending the first binding part in a direction away from the first binding part.

4. The flip-chip thin film according to claim 1, characterized in that, The first extension is provided with a plurality of third binding terminals arranged at intervals, and the interval between the third binding terminals is greater than the interval between the first binding terminals.

5. The flip-chip thin film according to claim 1, characterized in that, The first extension extends beyond the first binding portion by more than 1.5 mm.

6. The flip-chip thin film according to any one of claims 1 to 5, characterized in that, The two opposite ends of the first binding portion are a first end and a second end. The first reinforcing portion includes a first sub-extension formed extending from the first end in a direction away from the first binding portion and a second sub-extension formed extending from the second end in a direction away from the first binding portion.

7. The flip-chip thin film according to claim 6, characterized in that, At least one third alignment mark is provided on both the first sub-extension and the second sub-extension.

8. The flip-chip thin film according to claim 6, characterized in that, Along the extending direction of the first reinforcing portion, the length of the first binding portion is equal to the length of the second binding portion.

9. The flip-chip thin film according to claim 8, characterized in that, Along the extension direction of the first reinforcing portion, the end of the connecting portion is recessed relative to the end of the first binding portion and / or the end of the second binding portion, and the recessed depth of the connecting portion is less than the extension length of the first reinforcing portion.

10. The flip-chip thin film according to claim 6, characterized in that, The flip-chip film further includes a second reinforcing portion, which is connected to the second bonding portion and extends along at least one of the two opposite ends of the second bonding portion in a direction away from the second bonding portion to form a second extension portion.

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