Silicon wafer receiving device and silicon wafer receiving system

Abstract

The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer receiving device and a silicon wafer receiving system, the silicon wafer receiving device comprises a vertical displacement mechanism and a horizontal displacement mechanism, the vertical displacement mechanism comprises a vertical plate and at least two vertical sliding rails arranged on the vertical plate, each vertical sliding rail is connected with a supporting plate in a sliding mode, and the supporting plates are arranged on the vertical plate. A material receiving mechanism is borne on the supporting plate and comprises a material receiving bottom plate and a material receiving frame connected to the material receiving bottom plate; the horizontal displacement mechanism comprises a horizontal sliding rail and at least one horizontal sliding plate connected to the horizontal sliding rail in a sliding mode, and one end of the horizontal displacement mechanism is located below the vertical displacement mechanism so that the material receiving mechanism can be separated from the supporting plate and borne by the horizontal sliding plate when the supporting plate descends. According to the utility model, the silicon wafers are matched with the liftable supporting plate on the vertical displacement mechanism after being filled up, so that the material receiving mechanism is separated from the supporting plate when the material receiving mechanism descends on the supporting plate and is transferred after being horizontally borne, automatic collection and transfer of the silicon wafers are realized, and the silicon wafer material receiving efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer receiving device and a receiving system. Background Art

[0002] In the production process of solar cells, silicon rods need to be cut into silicon wafers first, and then the silicon wafers need to be cleaned. After cleaning, the silicon wafers need to be inspected. Generally, the silicon wafers are placed on a conveying device, and inspection devices are set on both sides of the conveying device to gradually inspect the dirt, hidden cracks, edge defects, warping, etc. on the surface of the silicon wafers. After the inspection is completed, the silicon wafers need to be sorted from the conveying device and placed in a storage box.

[0003] At present, the unloading mechanism of the sorting machine adopts a double material receiving box method. After the first material box is filled with silicon wafers, another material box is used to alternately receive materials, and the staff needs to manually take out the silicon wafers in the material box. Due to the manual material taking, there may be low work efficiency and damage to the silicon wafers. Therefore, the utility model proposes the silicon wafer receiving device and receiving system. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a silicon wafer receiving device and a receiving system. After the silicon wafers are full, they cooperate with the liftable tray on the vertical displacement mechanism, so that the receiving mechanism is separated from the tray when it is lowered and is transferred after being horizontally carried, thereby realizing automatic collection and transfer of silicon wafers and improving the silicon wafer receiving efficiency.

[0005] In the first aspect, the present scheme proposes a silicon wafer receiving device, including a vertical displacement mechanism and a horizontal displacement mechanism, the vertical displacement mechanism including a vertical upright plate and at least two vertical slide rails arranged on the vertical upright plate, each of the vertical slide rails is slidably connected with a pallet, and the pallet carries a receiving mechanism, the receiving mechanism includes a receiving bottom plate and a receiving frame connected to the receiving bottom plate; the horizontal displacement mechanism includes a horizontal slide rail and at least one horizontal slide plate slidably connected thereto, one end of the horizontal displacement mechanism is located below the vertical displacement mechanism, so that the receiving mechanism can be separated from the pallet when the pallet is lowered, and at least the area at the bottom of the receiving mechanism that is not carried by the pallet is carried by the horizontal slide plate. The present scheme uses the vertical displacement mechanism to carry the receiving frame loaded with silicon wafers, which automatically falls on the horizontal slide plate after descending and is carried, and then is horizontally transported by the horizontal slide rail, thereby realizing the process of collecting silicon wafers and automatically transferring them.

[0006] The technical solution further defined in the utility model is:

[0007] Furthermore, the material receiving frame includes a material receiving carrier plate and at least two material receiving side plates connected thereto, forming a receiving space with at least a top opening for placing silicon wafers.

[0008] Furthermore, the material receiving frame is tilted so that the material receiving side plates limit the silicon wafer at least on two adjacent sides. After the material receiving frame is tilted as a whole, the silicon wafer in the material receiving frame only needs to abut against the inner walls of two adjacent material receiving side plates to ensure the stability of the silicon wafer during vertical and horizontal displacement.

[0009] Furthermore, at least two positioning holes are provided on the upper and lower parts of the material receiving bottom plate, and positioning cylinders are respectively provided on the support plate and the horizontal slide plate to match the positioning holes of the material receiving bottom plate one by one. After the positioning cylinders are inserted into the positioning holes, the horizontal displacement of the material receiving bottom plate and the support plate / horizontal slide plate can be limited.

[0010] Furthermore, it also includes a mechanical material picking mechanism for upwardly extracting the material receiving mechanism on the horizontal slide. The mechanical material picking mechanism includes a lifting slide rail and a lifting frame slidably connected thereto. The lifting frame is connected to at least one clamping claw assembly to extract the material receiving mechanism, thereby realizing the process of upward extraction and transfer of the material receiving mechanism on the horizontal slide.

[0011] Furthermore, the clamping jaw assembly includes a clamping top plate, a two-way cylinder connected thereto, and material picking rods respectively connected to the two telescopic ends of the two-way cylinders, the ends of the material picking rods are connected to material picking hooks, the material picking hooks are provided with two V-shaped openings, and a material picking column adapted to the V-shaped opening is connected to the material receiving bottom plate, so that the V-shaped openings lift up each of the material picking columns when the clamping jaw assembly rises.

[0012] Furthermore, a directional slide rail is provided between the material picking rod and the clamping top plate, and the direction of the directional slide rail is consistent with the telescopic direction of the bidirectional cylinder, thereby improving the stability of the material picking rod when it moves outward or inward.

[0013] Furthermore, it also includes a material taking slide rail, and the lifting slide rail of the mechanical material taking mechanism is slidably connected to the material taking slide rail, so that after the material receiving mechanism is upwardly taken up on the horizontal slide plate, it is horizontally transported and transferred.

[0014] Furthermore, a workbench is included, and the vertical displacement mechanism and the horizontal displacement mechanism are both arranged on the workbench.

[0015] In the second aspect, the utility model proposes a silicon wafer receiving system, comprising at least two silicon wafer receiving devices as described in any scheme in the first aspect, and each of the mutually parallel silicon wafer receiving devices shares one mechanical material picking mechanism, and one mechanical material picking mechanism is used to transfer the receiving mechanisms in multiple silicon wafer receiving devices respectively.

[0016] The beneficial effects of the utility model are:

[0017] (1) The utility model utilizes the receiving frame in the receiving mechanism to load silicon wafers. When the silicon wafers are fully loaded, the receiving mechanism cooperates with the lifting and lowering support plate on the vertical displacement mechanism, so that when the receiving mechanism is lowered on the support plate, it is separated from the support plate and transferred after being horizontally carried, thereby realizing automatic collection and transfer of silicon wafers and improving the efficiency of silicon wafer receiving.

[0018] (2) The overall tilted design of the material receiving frame in the present invention allows the silicon wafer to be stabilized during vertical and horizontal displacement by only abutting against the inner walls of two adjacent material receiving side plates. The non-full frame design also facilitates the placement and removal of the silicon wafer within the frame.

[0019] (3) The utility model realizes the process of simultaneously extracting and transferring silicon wafers in two receiving frames by cooperating with the clamping claw assembly and the receiving mechanism, thereby improving the receiving efficiency of silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the silicon wafer receiving system in the embodiment of the utility model;

[0021] Figure 2 Schematic diagram of the vertical displacement mechanism in the embodiment of the utility model;

[0022] Figure 3 A top view of the vertical displacement mechanism in the embodiment of the utility model;

[0023] Figure 4 This is a schematic diagram of a material receiving mechanism in an embodiment of the utility model;

[0024] Figure 5 It is a schematic diagram of the horizontal displacement mechanism in the embodiment of the utility model;

[0025] Figure 6 It is a schematic diagram of another viewing angle of the horizontal displacement mechanism in the embodiment of the utility model;

[0026] Figure 7 It is a schematic diagram of the material taking slide rail and the mechanical material taking mechanism in the embodiment of the utility model;

[0027] Figure 8 This is a schematic diagram of a mechanical material taking mechanism in an embodiment of the utility model;

[0028] Fig. 9 A schematic diagram of a clamping jaw assembly in an embodiment of the present utility model;

[0029] Among them: 11, vertical stand; 12, vertical slide rail; 13, support plate; 21, material receiving bottom plate; 22, material receiving frame; 31, horizontal slide rail; 32, horizontal slide plate; 41, material taking slide rail; 42, lifting frame; 43, lifting extension plate; 44, clamping top plate; 45, two-way cylinder; 46, directional slide rail; 47, material taking rod; 48, material taking hook; 50, workbench;

[0030] 131, positioning cylinder; 211, positioning hole; 212, material taking column; 221, material receiving carrier plate; 222, material receiving side plate; 411, lifting slide rail. DETAILED DESCRIPTION

[0031] The silicon wafer receiving system provided in this embodiment is as follows: Figure 1 As shown, there is a material picking slide 41 and a mechanical material picking mechanism, and multiple parallel silicon wafer receiving devices, all of which are installed on a workbench 50. The mechanical material picking mechanism is slidably connected to the material picking slide 41 and is located above the silicon wafer receiving device. The layout direction of the material picking slide 41 is perpendicular to the layout direction of the horizontal slide 31 in the silicon wafer receiving device.

[0032] See also Figure 2-3 The vertical displacement mechanism in this embodiment includes a vertical upright plate 11 and two vertical slide rails 12 arranged on the vertical upright plate 11. Each vertical slide rail 12 is slidably connected to a support plate 13, and the support plate 13 carries a material receiving mechanism. This embodiment takes a C-shaped support plate as an example, but it can also be other shapes, as long as the support plate 13 does not carry the entire bottom of the material receiving mechanism, leaving a portion for the horizontal slide plate 32 to carry. For details, see Figure 4 The material receiving mechanism includes a material receiving bottom plate 21 and a material receiving frame 22 connected to the material receiving bottom plate 21. The material receiving frame 22 includes a material receiving carrier plate 221 and two material receiving side plates 222 connected thereto, forming a accommodating space for placing silicon wafers. The material receiving frame 22 is tilted so that the material receiving side plates 222 limit the silicon wafers at least at two adjacent sides. At least two positioning holes 211 are provided on the upper and lower parts of the material receiving bottom plate 21, and positioning cylinders 131 are respectively provided on the support plate 13 and the horizontal slide plate 32 to match the positioning holes 211 of the material receiving bottom plate 21 one by one.

[0033] like Figure 5-6 As shown, the horizontal displacement mechanism includes a horizontal slide rail 31 and at least one horizontal slide plate 32 slidably connected thereto, and one end of the horizontal displacement mechanism is located below the vertical displacement mechanism so that the material receiving mechanism can be separated from the vertical displacement mechanism when the support plate 13 is lowered and supported by the horizontal slide plate 32.

[0034] In this embodiment, a mechanical material taking mechanism is slidably connected to the material taking slide rail 41. Figure 7-8The mechanical material taking mechanism includes a lifting slide rail 411 and a lifting frame 42 slidably connected thereto. The bottom of the lifting frame 42 is connected to two clamping claw assemblies through a lifting extension plate 43 to simultaneously extract two material receiving mechanisms, such as Fig. 9 As shown, the clamping jaw assembly includes a clamping top plate 44, a two-way cylinder 45 connected thereto, and a material taking rod 47 connected to the two telescopic ends of the two-way cylinder 45, each end of the material taking rod 47 is connected to a material taking hook 48, and a directional slide rail 46 is also provided between the material taking rod 47 and the clamping top plate 44, and the direction of the directional slide rail 46 is consistent with the telescopic direction of the two-way cylinder 45, and the material taking hook 48 is provided with two V-shaped openings, and the material receiving bottom plate 21 is connected to a material taking column 212 adapted to the V-shaped opening, so that when the clamping jaw assembly rises, the V-shaped opening holds up each material taking hook 48. Column 212, specifically, when the mechanical material picking mechanism moves to above the horizontal slide 32, the lifting rail 411 drives the lifting frame 42 to descend, and at the same time, the two bidirectional cylinders 45 are both opened, and the material picking rods 47 and material picking hooks 48 at both ends are respectively extended outward, or the material picking rods 47 and material picking hooks 48 at both ends are retracted inward, and the positions are adjusted. When the V-shaped openings are located directly below the respective material picking columns 212, the lifting rail 411 is used to control the upper lifting and lowering frame 42, so that the material receiving mechanism can be completely extracted, and the extraction and lifting action of the two material receiving mechanisms can be realized at the same time.

[0035] It should be noted that the vertical displacement mechanism, horizontal displacement mechanism, material-retrieving slide rail 41 and lifting slide rail 411 described in this embodiment are each equipped with a driving source, such as a driving motor, a cylinder or a hydraulic cylinder, etc., and the driving motors such as DC motors, AC motors, servo motors and stepper motors can provide driving power for them. In addition, the vertical slide rail 12, horizontal slide rail 31, material-retrieving slide rail 41, directional slide rail 46 and lifting slide rail 411 described in this application all refer to slide rails including accessories such as rails, sliders, rollers or balls.

[0036] When the silicon wafer receiving system of this embodiment is in operation, after the silicon wafers in the receiving mechanism are full, they are lowered to the horizontal displacement mechanism through the vertical displacement mechanism, and are moved to the bottom of the clamping assembly through the horizontal displacement mechanism. The clamping assembly descends to pick up the entire receiving mechanism and bring back two empty receiving mechanisms (i.e., there are no silicon wafers in the receiving frame 22), thereby completing the cycle. Each silicon wafer receiving device can complete this process independently, which is completed by a material picking slide 41 cooperating with a mechanical material picking mechanism.

[0037] In addition to the above embodiments, the present invention may also have other implementation modes; any technical solutions formed by equivalent replacement or equivalent transformation shall fall within the protection scope required by the present invention.

Claims

1. A silicon wafer receiving device, comprising a vertical displacement mechanism and a horizontal displacement mechanism, characterized in that: The vertical displacement mechanism comprises a vertical upright plate (11) and at least two vertical slide rails (12) arranged on the vertical upright plate (11), each of the vertical slide rails (12) is slidably connected to a support plate (13), and the support plate (13) carries a material receiving mechanism, the material receiving mechanism comprises a material receiving bottom plate (21) and a material receiving frame (22) connected to the material receiving bottom plate (21); the horizontal displacement mechanism comprises a horizontal slide rail (31) and at least one horizontal slide plate (32) slidably connected thereto, one end of the horizontal displacement mechanism is located below the vertical displacement mechanism so that the material receiving mechanism is separated from the support plate (13) when the support plate (13) is lowered, and at least the area at the bottom of the material receiving mechanism that is not supported by the support plate (13) is supported by the horizontal slide plate (32).

2. The silicon wafer receiving device according to claim 1, characterized in that: The material receiving frame (22) comprises a material receiving carrier plate (221) and at least two material receiving side plates (222) connected thereto, forming a receiving space with at least a top opening for placing silicon wafers.

3. The silicon wafer receiving device according to claim 2, characterized in that: The material receiving frame (22) is arranged tilted so that the material receiving side plate (222) limits the position of the silicon wafer at least at two adjacent side edges thereof.

4. The silicon wafer receiving device according to claim 1, characterized in that: At least two positioning holes (211) are provided on the upper and lower sides of the material receiving bottom plate (21), and positioning cylinders (131) are respectively provided on the support plate (13) and the horizontal slide plate (32) to match the positioning holes (211) of the material receiving bottom plate (21) one by one.

5. The silicon wafer receiving device according to claim 1, characterized in that: It also includes a mechanical material taking mechanism for upwardly taking the material receiving mechanism on the horizontal slide plate (32), the mechanical material taking mechanism comprising a lifting slide rail (411) and a lifting frame (42) slidably connected thereto, the lifting frame (42) being connected to at least one clamping claw assembly for taking the material receiving mechanism.

6. The silicon wafer receiving device according to claim 5, characterized in that: The clamping jaw assembly comprises a clamping top plate (44), a two-way cylinder (45) connected thereto, and a material taking rod (47) connected to two telescopic ends of the two-way cylinder (45), each end of the material taking rod (47) is connected to a material taking hook (48), each of the material taking hooks (48) is provided with two V-shaped openings, and a material taking column (212) adapted to the V-shaped opening is connected to the material receiving bottom plate (21), so that the V-shaped opening can lift each of the material taking columns (212) when the clamping jaw assembly rises.

7. The silicon wafer receiving device according to claim 6, characterized in that: A directional slide rail (46) is also provided between the material taking rod (47) and the clamping top plate (44), and the direction of the directional slide rail (46) is consistent with the telescopic direction of the bidirectional cylinder (45).

8. The silicon wafer receiving device according to claim 5, characterized in that: It also includes a material taking slide rail (41), and the lifting slide rail (411) of the mechanical material taking mechanism is slidably connected to the material taking slide rail (41).

9. The silicon wafer receiving device according to claim 1, characterized in that: Also included is a workbench (50), on which the vertical displacement mechanism and the horizontal displacement mechanism are both arranged.

10. A silicon wafer receiving system, characterized in that: It comprises at least two silicon wafer receiving devices as described in any one of claims 5 to 8, and each of the silicon wafer receiving devices parallel to each other shares one mechanical material taking mechanism.

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