Tray structure for silicon carbide epitaxial equipment

By designing a tray structure for silicon carbide epitaxial equipment, and utilizing the combined spherical and flat designs of screws and grooves, the effect of quickly adjusting the level of the graphite wafer carrier is achieved, which solves the difficulty of level adjustment in the existing technology. problems and improve the process yield.

CN222355111UActive Publication Date: 2025-01-14HUNAN UNITED SEMICON TECH CO LTD
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Patent Information

Application Number
CN202421152609.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-24
Publication Date
2025-01-14
Estimated Expiration
2034-05-24

AI Technical Summary

Technical Problem

In existing silicon carbide epitaxial equipment, the horizontal accuracy requirements of graphite wafer carrier disks are getting higher and higher, resulting in the difficulty of quickly adjusting the horizontality and affecting the process yield.

Method used

Design a tray structure. Three screw holes are provided on the air-floating tray, distributed at the vertices of the triangle. The first screw and the second screw are threadedly connected in the screw holes. Corresponding grooves are provided on the lower surface of the wafer carrier. The screws and the concave The groove design is a combination of spherical and flat surfaces, allowing rapid rotation to adjust the level of the wafer carrier.

Benefits of technology

By rotating the first screw and the second screw, the level of the wafer carrier can be quickly and accurately adjusted, improving the yield of the silicon carbide epitaxial process and reducing the difficulty of on-site processing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a tray structure for silicon carbide epitaxy equipment, which comprises an air floatation tray and a wafer carrying disc positioned above the air floatation tray, three screw holes are arranged on the air floatation tray, and the three screw holes are distributed at three vertex positions of a triangle; a first screw rod is in threaded connection in one screw hole, and second screw rods are in threaded connection in the other two screw holes; a first groove and two second grooves corresponding to the three screw holes are formed in the lower surface of the wafer carrying disc; the lower end of the first screw rod is in threaded connection with one of the screw holes, and the upper end of the first screw rod abuts against the first groove; the upper end of the second screw abuts against the second groove, the bottom face of the second groove is a spherical face, and the top face of the second screw is also a spherical face. According to the utility model, through the design of assembly between the air floating tray and the wafer carrying disc, the effect of rapidly adjusting the levelness of the wafer carrying disc is achieved.
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