S-waveband receiving multifunctional module based on HTCC packaging

Abstract

An S-band receiving multifunctional module based on HTCC packaging belongs to the technical field of microwave radio frequency circuits and comprises an HTCC circuit board, a carrier plate, an enclosure frame, pins and a cover plate. Wherein the HTCC circuit board comprises a top-layer circuit, a second-layer circuit, a third-layer circuit and a bottom-layer circuit which are sequentially arranged from top to bottom, and a dielectric layer is arranged between every two adjacent circuits; the top layer circuit comprises an amplitude limiter, a multifunctional chip, a filter and a power divider which are sequentially connected through a radio frequency transmission line; the top layer circuit is further provided with a driver and a low-frequency signal line. The second-layer circuit is provided with a radio frequency transmission line, a low-frequency signal line, a radio frequency input port, a radio frequency output port and a low-frequency input port; the third-layer circuit is provided with a low-frequency signal line; the bottom layer circuit is used for grounding, and the top layer circuit and the second layer circuit are both connected with the bottom layer circuit for grounding. According to the scheme, the number of chips is effectively reduced, the assembly difficulty is reduced, the structure is more compact, the consistency between the components is improved, the later debugging workload is reduced, and the cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of microwave radio frequency circuits, and in particular relates to an S-band receiving multifunctional module based on HTCC packaging. Background Art

[0002] The RF receiving circuit generally includes RF devices such as limiters, amplifiers, CNC attenuators, CNC phase shifters, filters, and RF switches. Traditional design methods often use multiple independent chips assembled on a circuit board to implement the RF receiving circuit. This type of circuit has a large number of chips, occupies a large volume, and is complex to assemble. The chips are interconnected by transmission lines, and the consistency between components is poor. The later debugging workload is large, and the multi-chip design makes the material and assembly costs higher. Utility Model Content

[0003] In order to solve the deficiencies of the prior art, the utility model provides an S-band receiving multifunctional module based on HTCC packaging, which effectively reduces the number of chips, simplifies the assembly process, reduces the assembly difficulty, has a more compact structure, is more convenient for airtight processing, and helps to improve the consistency between components, reduce the later debugging workload and reduce costs.

[0004] In order to achieve the purpose of this utility model, the following scheme is proposed:

[0005] An S-band receiving multifunctional module based on HTCC packaging includes: an HTCC circuit board, a carrier board, a frame, pins and a cover board. The HTCC circuit board as the main body of the receiving multifunctional module includes: a top-layer circuit, a second-layer circuit, a third-layer circuit and a bottom-layer circuit arranged in sequence from top to bottom, and an insulating dielectric layer is provided between adjacent circuits of the top-layer circuit, the second-layer circuit, the third-layer circuit and the bottom-layer circuit; wherein,

[0006] The top-level circuit consists of the following connected in sequence using RF transmission lines:

[0007] A limiter is used to limit the input high-power signal;

[0008] Multifunctional chip, which performs low-noise amplification, digitally controlled attenuation, digitally controlled phase shifting, gain adjustment, drive amplification and switch processing on the input signal;

[0009] Filter, filtering the signal;

[0010] The power divider performs two-way power division on the filtered signal and then outputs it in two ways;

[0011] And the ones connected to the multi-function chip using low-frequency signal lines:

[0012] The driver converts the input serial control signal into a parallel control signal to control the multi-function chip to realize the digital controlled attenuation and digital controlled phase shift functions;

[0013] At the same time, the top-level circuit also has low-frequency signal lines that directly power and control the multi-function chip;

[0014] The second-layer circuit is provided with a radio frequency transmission line and a low-frequency signal line, and the input and output ends of the radio frequency transmission line of the module and the input end of the low-frequency signal line are both arranged on the second-layer circuit; the radio frequency transmission line is connected to the top-layer circuit through a vertical interconnection structure, the low-frequency signal line is connected to the third-layer circuit through a vertical interconnection structure, and the third-layer circuit is vertically interconnected with the top-layer circuit;

[0015] The third-layer circuit is provided with a low-frequency signal line, which serves as a transfer layer for the low-frequency signal lines of the second-layer circuit and the top-layer circuit;

[0016] The bottom layer circuit is used for grounding, and the top layer circuit and the second layer circuit are both provided with grounding layers and are connected to the bottom layer circuit for grounding by vertical interconnection.

[0017] The carrier board is made of molybdenum copper, and the frame, pins and cover are made of Kovar alloy. The HTCC circuit board, carrier board, frame and pins are sintered into an integrated package shell, and the cover is welded to the frame using parallel seam welding to complete the airtight treatment.

[0018] The module is equipped with mounting holes and can be installed by screwing. The module dimensions (excluding the pin dimensions and mounting hole dimensions) are: length 16mm~19mm, width 11~13mm, height 5.5~7.5mm.

[0019] At the same time, a mirror version of the receiving multi-function module was designed. The module shape and the positions of the input and output ports are symmetrical along the short side of the module. The two modules have the same circuit principles and consistent circuit performance.

[0020] The beneficial effect of the utility model is that: through the above-mentioned design scheme, the number of chips in the module circuit is effectively reduced, the assembly difficulty is reduced, and because the number of chips is reduced, the transmission line interconnection structure between the chips is correspondingly reduced, which helps to improve the consistency between components and can reduce the later debugging workload and reduce costs. At the same time, the design of the mirror version makes the receiving component more flexible and convenient in using the receiving multi-function module layout. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0022] Figure 1 A circuit connection diagram of the multifunctional module of the present application is shown.

[0023] Figure 2 A three-dimensional structural diagram of the multifunctional module of the present application is shown.

[0024] Figure 3 An exploded view of the multifunctional module of the present application is shown.

[0025] Figure 4 The figure shows the distribution diagram of each functional circuit on the HTCC circuit board of the multifunctional module of the present application.

[0026] Figure 5 The diagram shows the distribution of various functional circuits on the HTCC circuit board of the mirror version of the multi-function module of the present application.

[0027] Markings in the figure: carrier board-1, HTCC circuit board-2, frame-3, pin-4, cover-5, limiter-6, multi-function chip-7, filter-8, power divider-9, driver-10, mounting hole-11. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the embodiments of the utility model clearer, the implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings, but the embodiments described in the utility model are only part of the embodiments of the utility model, rather than all the embodiments.

[0029] like Figures 2 to 5 As shown, an S-band receiving multifunctional module based on HTCC packaging is composed of an HTCC circuit board 2 as the module body, a carrier board 1, a frame 3, pins 4 and a cover plate 5. Except for the cover plate 5, the remaining components are formed into a package shell in the form of integrated sintering. After the internal circuit is assembled, the cover plate 5 is welded to the frame 3 by a parallel seam welding process to complete the airtight treatment of the module to ensure long-term reliability.

[0030] The peripheral side of the carrier board 1 is provided with mounting holes 11, which provide a screw-mounting installation method for the module, so that the module can be conveniently and quickly installed in the receiving component, simplifying the installation process.

[0031] like Figure 4 , Figure 5 As shown, in order to facilitate the layout and use of the modules in the receiving component, two receiving multi-function modules are designed at the same time, whose appearance and port positions are mirror-symmetrical along the short sides of the modules. The two modules have the same circuit principles and consistent circuit performances, and the mounting holes 11 and the port positions are mirror-symmetrical along the short sides of the modules, which can adapt to different port layouts in the receiving component to the greatest extent.

[0032] The HTCC circuit board 2 as the main body of the receiving multifunctional module includes: a top-layer circuit, a second-layer circuit, a third-layer circuit and a bottom-layer circuit arranged in sequence from top to bottom. An insulating dielectric layer is arranged between adjacent circuits of the top-layer circuit, the second-layer circuit, the third-layer circuit and the bottom-layer circuit to play a role in physical separation and signal isolation.

[0033] Specifically, the dielectric layer is a ceramic sheet, and the material of the ceramic sheet is preferably alumina.

[0034] like Figure 4 , Figure 5 As shown, the top-level circuit includes the following connected in sequence:

[0035] The limiter 6 limits the input high-power signal to protect the subsequent circuits; specifically, the limiter 6 includes three-stage limiting diodes interconnected by transmission lines;

[0036] The multifunctional chip 7 includes a low-noise amplifier circuit, a digitally controlled attenuation circuit, a digitally controlled phase shift circuit, a drive amplifier circuit and a switch circuit, and is used to perform low-noise amplification, digitally controlled attenuation, digitally controlled phase shift, drive amplification and switch processing on the input signal to realize the main functions of the module;

[0037] The filter 8 filters the signal output by the multifunctional chip 7, mainly suppressing the harmonic signal generated by the multifunctional chip 7;

[0038] The power divider 9 performs two-way power division processing on the filtered signal and then outputs it;

[0039] The driver 10 converts the input serial control signal into a parallel control signal to control the multifunctional chip 7 to implement corresponding functions, including digitally controlled phase shifting and digitally controlled attenuation.

[0040] Specifically, the multifunctional chip 7 includes a low-noise amplifier circuit, a digitally controlled attenuation circuit, a digitally controlled phase shift circuit, a gain adjustment circuit, a drive amplifier circuit, and an absorptive single-pole double-throw switch circuit, which are used to achieve low-noise amplification, seven-digital controlled attenuation, six-digital controlled phase shift, gain adjustment, drive amplification and switch control of the signal; the functions of the above circuits are integrated by the multifunctional chip 7, so that a circuit board that originally requires a larger layout area is replaced by a small-sized multifunctional chip 7, which greatly reduces the size of the RF link and helps to miniaturize the module.

[0041] The second-layer circuit is provided with an RF transmission line and a low-frequency signal line, and the input and output ends of the module's RF transmission line and the input end of the low-frequency signal line are all arranged on the second-layer circuit; the scheme arranges the output and input ends of the RF transmission line and the low-frequency signal line on the same layer, the purpose of which is to facilitate routing and connection with external circuits; the RF transmission line is connected to the top-layer circuit through a vertical interconnection structure, the low-frequency signal line is connected to the third-layer circuit through a vertical interconnection structure, and the third-layer circuit is vertically interconnected with the top-layer circuit.

[0042] The three-layer circuit is equipped with a low-frequency signal line.

[0043] The bottom layer circuit is used for grounding. Both the top layer circuit and the second layer circuit are provided with grounding layers, and the grounding layers are connected to the bottom layer circuit by vertical interconnection, so as to achieve the purpose of grounding the top layer circuit and the second layer circuit. Vertical interconnection usually adopts metal via structure to realize the connection between each layer circuit.

[0044] The above scheme arranges each circuit and chip in a multi-layer structure, effectively reducing the planar size of the module, and arranges the limiter 6, multi-function chip 7, filter 8, power divider 9 and driver 10 on the top circuit, and arranges part of the low-frequency signal line on the third circuit, and arranges a second circuit between the top circuit and the third circuit, and a dielectric layer between each circuit layer, effectively separating the low-frequency circuit from the radio frequency circuit to ensure the electromagnetic compatibility of the multi-function module; through the above design scheme, the number of chips in the module circuit is effectively reduced, the difficulty of assembly is reduced, and because the number of chips is reduced, the transmission line interconnection structure between the chips is correspondingly reduced, which helps to improve the consistency between components, and can reduce the workload of later debugging and reduce costs.

[0045] The circuit connection of the S-band receiving multifunctional module formed by this scheme is as follows Figure 1 As shown, the specific working method is as follows:

[0046] Radio frequency transmission: the radio frequency signal is input from the input end of the radio frequency transmission line on the second-layer circuit, and then transmitted on the radio frequency transmission line on the second-layer circuit, and then transmitted to the top-layer circuit through the vertical interconnection structure. The signal is transmitted and processed by the limiter 6, the multi-function chip 7, the filter 8, and the power divider 9 in the top-layer circuit. After the signal power is divided into two paths, they are respectively transmitted to the radio frequency transmission line on the second-layer circuit through the vertical interconnection method, and output through the output end of the radio frequency transmission line;

[0047] Low-frequency transmission, after the low-frequency signal is input from the input end of the low-frequency signal line on the second-layer circuit, it is transmitted on the low-frequency signal line on the second-layer circuit, and then transmitted to the third-layer circuit through the vertical interconnection structure, and transmitted through the low-frequency circuit on the third-layer circuit, and then transmitted to the top-layer circuit through the vertical interconnection structure. Part of the signal is input into the driver 10 to complete the transmission and processing of the low-frequency signal. The low-frequency signal processed by the driver 10 is input into the multi-function chip 7 to control the working state of the numerical control attenuation circuit and the numerical control phase shift circuit of the multi-function chip 7; part of the signal is directly input into the multi-function chip 7 to power on the multi-function chip 7 and control the working state of the driving amplifier circuit and the switching circuit in the multi-function chip 7.

[0048] Preferably, the limiter 6 includes three-stage limiting diodes cascaded in a transmission line to ensure that the module realizes a miniaturized circuit size while having good limiting capability.

[0049] Preferably, the multifunctional chip 7 further comprises a control circuit, which is used to control the digital controlled attenuation circuit, the digital controlled phase shift circuit, the drive amplifier circuit and the switch circuit respectively.

[0050] Preferably, the filter 8 and the power divider 9 are both configured as independent chip devices. In this way, all chip devices and RC / SI devices are assembled on the surface of the multifunctional module, and there are planar wiring on the surface and inside of the multifunctional module, and the electrical connection of the entire receiving circuit is completed through vertical interconnection holes, so that the entire receiving module is small in size and highly integrated.

[0051] Preferably, multiple dielectric layers are provided between the top-layer circuit, the second-layer circuit, the third-layer circuit and the bottom-layer circuit. As a specific preferred solution, the dielectric layers are overlapped to form ten layers, the top-layer circuit is provided on the top surface of the first dielectric layer, the second-layer circuit is provided on the top surface of any one of the second to sixth dielectric layers, the third-layer circuit is provided on the top surface of any one of the seventh to ninth dielectric layers, and the bottom-layer circuit is provided on the bottom surface of the tenth dielectric layer. This solution ensures the power resistance of the ceramic substrate by increasing the dielectric thickness between the circuit layers.

[0052] As a further preference, the bottom circuit is a grounding layer with a full-coverage structure, and the grounding layer is a tungsten layer plated with a gold layer, which is sintered and connected to the bottom carrier board 1 to achieve good grounding and heat dissipation effects.

[0053] Preferably, the input end and the output end of the radio frequency transmission line and the low frequency signal line are both connected with pins 4, and the pins 4 extend to the outside of the multi-function module to facilitate the connection of the multi-function module with an external circuit.

[0054] Further preferably, for the multifunctional module, three pins 4 for RF connection and eight pins 4 for low frequency connection are included. The three RF ports include one input port and two output ports, and the eight low frequency ports include a driver 10 latch input terminal, a driver 10 data input terminal, a driver 10 clock input terminal, two positive 5V voltage power-on terminals, a negative 5V voltage power-on terminal, a multifunctional chip 7 switch control terminal and a driver amplifier control terminal.

[0055] Preferably, the HTCC packaged S-band receiving multifunctional module further includes a carrier board 1, which is arranged on the bottom surface of the bottom circuit to enhance the structural strength of the entire module. The carrier board 1 is a molybdenum copper plate. Specifically, the multifunctional module is fixed to the molybdenum copper carrier board 1 by sintering through the bottom circuit.

[0056] The above is only a preferred embodiment of the utility model, and does not mean that it is the only one or limit the utility model. Those skilled in the art should understand that various changes or equivalent replacements made to the utility model without departing from the scope of the utility model are within the scope of protection of the utility model.

Claims

1. An S-band receiving multifunctional module based on HTCC packaging, characterized in that: It comprises a carrier board (1), an HTCC circuit board (2), a surrounding frame (3), pins (4) and a cover board (5); The HTCC circuit board (2) is provided with a top layer circuit, a second layer circuit, a third layer circuit and a bottom layer circuit in order from top to bottom, and an insulating dielectric layer is provided between the top layer circuit, the second layer circuit, the third layer circuit and the bottom layer circuit; wherein: The top-level circuit consists of the following connected in sequence using RF transmission lines: A limiter (6) for limiting the input high-power signal; The multifunctional chip (7) performs low-noise amplification, digitally controlled attenuation, digitally controlled phase shifting, gain adjustment, drive amplification and switch processing on the input signal, and the top-level circuit is provided with a low-frequency signal line for powering on and controlling the multifunctional chip (7); Filter (8), filtering the signal; A power divider (9) performs two-way power division on the filtered signal and then outputs it in two ways; A driver (10) converts an input serial control signal into a parallel control signal to control the multifunctional chip (7) to implement a corresponding function; The second-layer circuit is provided with a radio frequency transmission line and a low-frequency signal line, and both the radio frequency transmission line and the low-frequency signal line are provided with an output end and an input end; the radio frequency transmission line is connected to the top-layer circuit through a vertical interconnection structure, the low-frequency signal line is connected to the third-layer circuit through a vertical interconnection structure, and the third-layer circuit is vertically interconnected with the top-layer circuit; The three-layer circuit is equipped with a low-frequency signal line; The bottom layer circuit is used for grounding, and the top layer circuit and the second layer circuit are connected to the bottom layer circuit for grounding by vertical interconnection.

2. The S-band receiving multifunctional module based on HTCC packaging according to claim 1, characterized in that: The top layer circuit, the second layer circuit and the bottom layer circuit of the HTCC circuit board (2) are all provided with ground layers, and the ground layer of the bottom layer circuit is fully covered.

3. The S-band receiving multifunctional module based on HTCC packaging according to claim 1, characterized in that: One or more dielectric layers are provided between adjacent circuits of the top layer circuit, the second layer circuit, the third layer circuit and the bottom layer circuit of the HTCC circuit board (2).

4. The S-band receiving multifunctional module based on HTCC packaging according to claim 1, characterized in that: The filter (8) and the power divider (9) are both configured as independent circuit structures.

5. The S-band receiving multifunctional module based on HTCC packaging according to claim 1, characterized in that: The input end and the output end of the radio frequency transmission line and the low frequency signal line of the HTCC circuit board (2) are both connected to pins (4), and the pins (4) extend to the outside of the multifunctional module.

6. The S-band receiving multifunctional module based on HTCC packaging according to claim 1, characterized in that: The HTCC circuit board (2) is arranged on the top surface of the carrier board (1), and the carrier board (1), the HTCC circuit board (2), the surrounding frame (3) and the pins (4) are formed in an integrated sintering manner.

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