Heat dissipation structure, controller, electric drive assembly and electric equipment

Abstract

The utility model provides a heat dissipation structure, a controller, an electric drive assembly and electric equipment. The heat dissipation structure comprises a shell, the shell comprises two heat dissipation walls, each heat dissipation wall is provided with an installation face used for installing a power module, two flow channels are arranged in the shell, the two flow channels are used for allowing cooling liquid to circulate respectively, the two flow channels are arranged in parallel, and the two flow channels pass through the sides, deviating from the corresponding installation faces, of the two heat dissipation walls respectively. According to the technical scheme, the shell with the two heat dissipation walls is arranged, the two flow channels which are connected in parallel and arranged at intervals are arranged in the shell, and the two flow channels pass through the two heat dissipation walls respectively, so that cooling liquid in the two flow channels can dissipate heat of the power modules installed on the two heat dissipation walls respectively during use, mutual influence of heat generated by the two power modules is reduced, and the heat dissipation efficiency of the power modules is improved. Therefore, each power module can operate stably, and each power module can output peak power more stably.

Description

Technical Field

[0001] The present application belongs to the field of motor technology, and more specifically, relates to a heat dissipation structure, a controller, an electric drive assembly and an electric device. Background Art

[0002] Two power modules need to be set in the dual-motor controller to control the operation of the dual motors. However, when the power module is working, a lot of heat will be generated, which requires a heat dissipation structure to dissipate the heat of the power module. In the current dual-motor controller, water channels are generally set to pass through the two power modules in sequence to dissipate the heat of the two power modules. However, in this structure, the heat of the two power modules will affect each other, thereby affecting the peak output power of the power module. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a heat dissipation structure, a controller, an electric drive assembly and an electric device to solve the problem in the related art that the heat of the two power modules in the dual-motor controller may affect each other.

[0004] In a first aspect, an embodiment of the present application provides a heat dissipation structure, including a housing, the housing including two heat dissipation walls, each heat dissipation wall having a mounting surface for mounting a power module, and the housing having:

[0005] The two flow channels are respectively used for cooling liquid circulation, the two flow channels are arranged in parallel, and the two flow channels respectively pass through the two heat dissipation walls on one side away from the corresponding mounting surface.

[0006] In the technical solution of the embodiment of the present application, a shell with two heat dissipation walls is provided, and two parallel flow channels are provided in the shell, and the two flow channels are made to pass through the two heat dissipation walls respectively, so that when in use, the coolant in the two flow channels can respectively dissipate heat for the power modules installed on the two heat dissipation walls, thereby reducing the mutual influence of the heat generated by the two power modules, so that each power module can operate smoothly, so that each power module can output peak power more stably.

[0007] In some embodiments, the heat dissipation structure further includes a liquid inlet pipe, which is installed on the shell, and the inlet ends of the two flow channels are both connected to the liquid inlet pipe.

[0008] A liquid inlet pipe is provided to be connected to the inlet ends of the two flow channels, so as to facilitate connecting the inlet ends of the two flow channels in parallel and also facilitate supplying cooling liquid to the two flow channels.

[0009] In some embodiments, the heat dissipation structure further includes a liquid outlet pipe, which is installed on the shell, and the outlet ends of the two flow channels are both connected to the liquid outlet pipe.

[0010] A liquid outlet pipe is provided to be connected to the outlet ends of the two flow channels, so as to facilitate connecting the outlet ends of the two flow channels in parallel and also facilitate the discharge of the coolant in the two flow channels.

[0011] In some embodiments, the two heat dissipation walls are respectively disposed on two opposite sides along the width direction of the housing.

[0012] The two heat dissipation walls are arranged on opposite sides of the shell in the width direction. When in use, the power module can be installed on opposite sides of the shell in the width direction to reduce the length of the controller. It is also convenient to set the two flow channels in parallel and make the two flow channels share the height of the shell, thereby improving the integration and reducing the volume of the controller.

[0013] In some embodiments, the inlet end of each flow channel is located at one end of the shell in the length direction, and the outlet end of each flow channel is located at the other end of the shell in the length direction.

[0014] By arranging the inlet and outlet of the flow channel at two opposite ends in the length direction of the shell, the area of ​​the flow channel passing through the heat dissipation wall can be larger, thereby improving the heat dissipation efficiency of the power module.

[0015] In some embodiments, a housing cavity for installing a busbar capacitor is provided in the shell, the shell includes a plurality of heat-conducting walls surrounding the housing cavity, two flow channels pass through the sides of the housing cavity respectively, and each flow channel is spaced apart from the housing cavity by the heat-conducting walls on the corresponding sides.

[0016] An accommodating cavity is provided in the shell to install the busbar capacitor; and two flow channels pass through the side of the accommodating cavity. When in use, the coolant in the two flow channels can dissipate the heat of the busbar capacitor in the accommodating cavity.

[0017] In some embodiments, two heat dissipation walls are respectively disposed on opposite sides of the accommodating cavity, and each heat dissipation wall is spaced apart from the heat conducting wall on the corresponding side of the accommodating cavity to form a partial section of a flow channel.

[0018] Heat dissipation walls are arranged on opposite sides of the accommodating cavity, so that the overall length of the shell can be reduced and the integration level can be improved; and the heat dissipation wall and the heat-conducting wall on the corresponding side of the accommodating cavity are spaced so that the spacing space forms a partial section of the corresponding flow channel, which can further improve the integration level and reduce the volume of the manufactured controller; when in use, the coolant in each flow channel can simultaneously cool and dissipate the power module on the corresponding heat dissipation wall and the bus capacitor in the accommodating cavity.

[0019] In some embodiments, the two flow channels are arranged around the accommodating cavity in a height direction of the accommodating cavity.

[0020] The two flow channels surround the accommodating cavity, and when in use, the heat dissipation efficiency of the busbar capacitor in the accommodating cavity can be improved.

[0021] In some embodiments, at least one end of the accommodating cavity along the height direction is open for installation of the busbar capacitor and injection of curing glue.

[0022] Providing at least one end of the accommodating cavity in the height direction to be open can facilitate installation of the busbar capacitor in the accommodating cavity and also facilitate pouring of curing glue to fix the busbar capacitor in the accommodating cavity.

[0023] In some embodiments, openings for extending pins of the bus capacitor are provided at both ends of the housing along the height direction of the accommodating cavity.

[0024] Openings are provided at both ends of the housing, which facilitate the extension of the pins of the bus capacitor when in use, so as to be connected to the two power modules installed on the housing.

[0025] In a second aspect, an embodiment of the present application provides a controller, comprising the heat dissipation structure as described in the above embodiment.

[0026] In some embodiments, the controller further includes two power modules, and the two power modules are respectively mounted on two heat dissipation walls.

[0027] Setting up two power modules can facilitate the control of the operation of two motors; and the two power modules are installed on two heat dissipation walls to dissipate heat for the two power modules respectively, so as to reduce the mutual influence of the heat generation of the two power modules, so that each power module can output peak power more stably.

[0028] In some embodiments, each heat dissipation wall is provided with an opening connected to the corresponding flow channel, and a region surrounding the opening on the mounting surface is sealed with the corresponding power module.

[0029] An opening is provided on the heat dissipation wall to connect with the corresponding flow channel, so that the coolant in the flow channel can directly contact and dissipate heat to the power module installed on the heat dissipation wall, thereby improving the heat dissipation efficiency of the power module.

[0030] In some embodiments, a sealing ring is provided between each power module and the heat dissipation wall, and the sealing ring is arranged around the opening.

[0031] A sealing ring is provided to surround the corresponding opening so as to seal the power module and the heat dissipation wall and improve the sealing effect.

[0032] In some embodiments, each heat dissipation wall is provided with a positioning groove for positioning a corresponding sealing ring.

[0033] A positioning groove is provided on the heat dissipation wall to position the sealing ring, so as to facilitate sealing between the power module and the heat dissipation wall.

[0034] In some embodiments, each power module is provided with a heat dissipation fin, and the heat dissipation fin extends into an adjacent flow channel through a corresponding opening.

[0035] A heat dissipation fin is arranged on the power module and extends into the corresponding flow channel so that the coolant in the flow channel passes through the heat dissipation fin, thereby improving the heat dissipation efficiency of the power module.

[0036] In some embodiments, the controller further includes a bus capacitor, which is mounted on the housing and electrically connected to the two power modules.

[0037] Set the bus capacitor so that the controller bus voltage is smoother and the controller works more stably.

[0038] In some embodiments, pins are respectively extended from opposite ends of the bus capacitor, a power module is connected to the pins at one end of the bus capacitor, and another power module is connected to the pins at the other end of the bus capacitor.

[0039] Lead pins are respectively extended at opposite ends of the bus capacitor to facilitate connection with the two power modules, and the connection points between the two power modules and the bus capacitor are made far apart to reduce the mutual influence between the heat generated by the connection points between the two power modules and the bus capacitor, that is, in the two pairs of connections formed by the two power modules and the bus capacitor respectively: the mutual influence between the heat generated by the two pairs of connections is reduced.

[0040] In some embodiments, the controller further includes two pairs of conductive adapters, the two pairs of conductive adapters respectively correspond to the two power modules, and each pair of conductive adapters is connected to the corresponding power module.

[0041] A conductive adapter is provided to connect the power module so that the controller can be connected to external devices for easy use.

[0042] In a third aspect, an embodiment of the present application provides an electric drive assembly, including a controller as described in the above embodiment.

[0043] In a fourth aspect, an embodiment of the present application provides an electric device, including a controller as described in the above embodiment, or including an electric drive assembly as described in the above embodiment.

[0044] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or exemplary technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0046] Figure 1 A schematic structural diagram of a first vehicle for improving some embodiments of the present application;

[0047] Figure 2 A schematic diagram of the structure of a second vehicle improved according to some embodiments of the present application;

[0048] Figure 3 A schematic structural diagram of a third vehicle improved according to some embodiments of the present application;

[0049] Figure 4 The structure of the controller of some embodiments of the present application is shown as follows Figure 1 ;

[0050] Figure 5 The structure of the controller of some embodiments of the present application is shown as follows Figure 2 ;

[0051] Figure 6 It is a front view structural schematic diagram of a controller of some embodiments of the present application;

[0052] Figure 7 For along Figure 6 Schematic diagram of the cross-sectional structure along the AA line;

[0053] Figure 8 A schematic diagram of the decomposed structure of a controller according to some embodiments of the present application;

[0054] Fig. 9 The structure of the heat dissipation structure of some embodiments of the present application is shown in FIG. Figure 1 ;

[0055] Fig.10 Schematic diagram of the heat dissipation structure of some embodiments of the present application Figure 2 ;

[0056] Fig.11 It is a schematic cross-sectional structural diagram of the heat dissipation structure of some embodiments of the present application.

[0057] Among them, the main marks of the drawings in the figure are:

[0058] 1000-vehicle; 1010-electric drive assembly; 1001-motor; 1002-controller; 1003-battery; 1004-front wheel; 1005-rear wheel;

[0059] 100-heat dissipation structure; 10-housing; 11-heat dissipation wall; 110-mounting surface; 111-opening; 112-positioning groove; 12-flow channel; 13-accommodating cavity; 131-heat conduction wall; 132-opening; 133-opening;

[0060] 21-liquid inlet pipe; 22-liquid outlet pipe;

[0061] 30-power module; 31-power terminal; 311-positive terminal; 312-negative terminal; 32-heat sink;

[0062] 40-bus capacitor; 41-pin; 411-positive pin; 412-negative pin;

[0063] 51-curing glue; 52-sealing ring; 53-conductive adapter;

[0064] X-length direction; Y-width direction; Z-height direction. DETAILED DESCRIPTION

[0065] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0066] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0067] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0068] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments in any suitable manner.

[0069] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0070] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two), and similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces). "Several" means one or more than one, unless otherwise clearly and specifically defined.

[0071] In the description of the embodiments of the present application, the orientations or positional relationships indicated by technical terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", and "circumferential" are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0072] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0073] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or indirectly connected to the other element.

[0074] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the technical term "adjacent" refers to being close in position. 1 , A 2 A and B three parts, 1 The distance between B and A is greater than that between A and B. 2 The distance between A and B, then 2 Compared with A 1 For example, A 2 Closer to B, i.e. A 2 adjacent to B, or B adjacent to A 2 For example, when there are multiple C components, the multiple C components are C1 , C 2 ……C N , when one of the C components, such as C 2 If B is closer to component B than to other C components, then B is adjacent to C. 2 , or we can say C 2 Near B.

[0075] The drive structure that uses the motor as the power source is generally called an electric drive. The motor is integrated with one or more of the cooling system, speed change mechanism, controller and other components to form an electric drive assembly. The electric drive assembly is also called an electric drive assembly or an electric drive device. The electric drive assembly is the main power device of an electric vehicle. The electric drive assembly is used to convert the electrical energy provided by the battery into mechanical energy to drive the electric vehicle.

[0076] Motor is also called electric motor. It is generally composed of two parts: rotor and stator. It is a device that converts electrical energy into mechanical energy. It uses an energized coil to generate a rotating magnetic field and acts on the rotor to form a magnetic and electromotive force to rotate the torque.

[0077] The controller of the embodiment of the present application may also be called a motor controller, which converts the direct current of the battery into the electrical energy required to drive the motor to control the start-up and operation of the electric vehicle. The controller includes a power module. The power module is an integral module that packages electronic functional devices according to a certain functional combination, and is used to realize the conversion of direct current and alternating current to drive the motor to operate. Power terminals will be set on the power module. The power terminals are arranged in pairs, generally including a positive terminal and a negative terminal for electrical connection and transmission. The power terminals can be made of conductive parts such as copper busbars, so that larger currents and voltages can be transmitted well, reducing the resistance of the power terminals, and thereby reducing the heat at the power terminals.

[0078] Some motor controllers also include bus capacitors. In the motor controller, the DC power of the battery is used as the input power source and needs to be connected to the motor controller through a DC bus. This method is called DC support, and the capacitor is called bus capacitor or support capacitor. Since the motor controller obtains a pulse current with a very high effective value or peak value from the battery, a very high pulse voltage will be generated on the DC support, which makes it difficult for the motor controller to bear, so a bus capacitor needs to be selected for connection. The bus capacitor is generally connected to the power terminal of the power module to smooth the bus voltage so that the bus voltage of the motor controller is still relatively smooth when the power module is connected; reduce the inductance parameters of the line between the power module and the battery, and weaken the peak voltage of the bus; absorb the high pulse current at the bus end of the motor controller; reduce the impact of overcharge and transient voltage of the bus end voltage on the motor controller.

[0079] Vehicles that use motors to achieve driving operation are electric vehicles, and controllers are generally used in electric vehicles to control the operation of the motors. Some electric vehicles are equipped with dual motor drives. Correspondingly, two power modules are also set in the controller to control the operation of the two motors respectively. However, the power module generates a lot of heat when it is working. In order to make the power module run smoothly, a heat dissipation structure is set to dissipate heat and cool the power module. In particular, the dual-motor controller including two power modules will generate more heat. In the current dual-motor controller, a water channel is generally set in the housing of the controller, so that the water channel passes through the two power modules in sequence to dissipate heat for the two power modules. However, the heat of the two power modules in this heat dissipation structure will affect each other, thereby affecting the peak output power of the power module.

[0080] Based on the above considerations, in order to solve the problem that the heat of the two power modules in the dual-motor controller will affect each other, the embodiment of the present application provides a heat dissipation structure, by setting two heat dissipation walls on the shell to install the power module, and setting two parallel flow channels, so that the two flow channels pass through the two heat dissipation walls respectively, so that when in use, the coolant in the two flow channels can cool down and dissipate the two heat dissipation walls respectively, and then cool down and dissipate the two power modules installed on the heat dissipation walls. Since the two flow channels are connected in parallel, the heat of the two power modules can be taken away respectively, reducing the mutual influence of the heat generated by the two power modules, so that each power module can operate smoothly, so that each power module can output peak power more stably.

[0081] The heat dissipation structure disclosed in the embodiment of the present application can be applied to a controller, which can be a motor controller. Of course, the controller can also be a controller used to control other electrical equipment, such as a controller for a compressor or other equipment. Since the heat dissipation structure of the embodiment of the present application can be adapted to install two power modules, the controller using the heat dissipation structure can be a dual-motor controller. Of course, a power module can also be installed on the heat dissipation structure to adapt to control a single motor.

[0082] The controller disclosed in the embodiment of the present application can also be applied to an electric drive assembly, that is, the controller is integrated with the motor. Of course, the controller can also be installed separately in an electric device to control the operation of the motor.

[0083] The electric drive assembly disclosed in the embodiment of the present application can be used as a power source for electric devices, such as electric tools, electric bicycles, electric vehicles, ships, spacecraft, etc. Among them, the spacecraft may include airplanes, rockets, space shuttles, and spacecraft, etc.

[0084] For the convenience of explanation, an electric device is provided in some embodiments of the present application, and the electric device is explained by taking a vehicle as an example.

[0085] Please refer to Figure 1 , Figure 1 A schematic diagram of the structure of the first vehicle 1000 provided for some embodiments of the present application. The vehicle 1000 may be a new energy vehicle, which may be a pure electric vehicle, a hybrid vehicle, or an extended-range vehicle, etc. The interior of the vehicle 1000 is provided with two motors 1001, and the two motors 1001 may be both provided at the bottom, head, or tail of the vehicle 1000 to drive the vehicle 1000 to move forward. The vehicle 1000 may also include a controller 1002 and a battery 1003, wherein the controller 1002 is used to control the operation of the motor 1001, and the battery 1003 is used to power the motor 1001.

[0086] In some embodiments, one motor 1001 is respectively disposed at the head of the vehicle 1000 to drive two front wheels 1004 of the vehicle 1000. Another motor 1001 is disposed at the rear of the vehicle 1000 to drive two rear wheels 1005 of the vehicle 1000.

[0087] In some embodiments, the rated power of the motor 1001 at the head of the vehicle 1000 may be the same as or different from the rated power of the motor 1001 at the rear of the vehicle 1000. Since the power module 30 in the controller 1002 is used to control the operating power of the motor 1001, accordingly, the two power modules 30 in the controller 1002 respectively control the operation of the two motors 1001, and their rated output powers need to be adapted to the two motors 1001. For example, when the rated powers of the two motors 1001 are the same, the rated output powers of the two power modules 30 should also be the same. When the rated powers of the two motors 1001 are different, the rated output powers of the two power modules 30 may also be different.

[0088] See also Figure 2 , Figure 2 The schematic diagram of the structure of the second vehicle 1000 provided in some embodiments of the present application. In some embodiments, two motors 1001 are disposed at the rear of the vehicle 1000, and the two motors 1001 are respectively connected to two rear wheels 1005 to drive the two rear wheels 1005 to rotate.

[0089] In some embodiments, the two motors 1001 may also be disposed at the head of the vehicle 1000 , and the two motors 1001 are respectively connected to the two front wheels 1004 to respectively drive the two front wheels 1004 to rotate.

[0090] In some embodiments, two motors 1001 are used to drive two front wheels 1004 respectively, or two motors 1001 are used to drive two rear wheels 1005 respectively, and the rated output powers of the two power modules 30 of the controller 1002 also need to be the same.

[0091] See also Figure 3 , Figure 3A schematic diagram of the structure of a third vehicle 1000 provided in some embodiments of the present application. In some embodiments, two motors 1001 and a controller 1002 may be integrated to form an electric drive assembly 1010, thereby improving integration and reducing occupied space.

[0092] In some embodiments, the electric drive assembly 1010 is installed at the rear of the vehicle 1000, and the two motors 1001 of the electric drive assembly 1010 drive the two rear wheels 1005 respectively, so the rated output powers of the two power modules 30 of the controller 1002 also need to be the same.

[0093] In some embodiments, the electric drive assembly 1010 is installed at the front of the vehicle 1000, and the two motors 1001 of the electric drive assembly 1010 drive the two front wheels 1004 respectively, so the rated output powers of the two power modules 30 of the controller 1002 also need to be the same.

[0094] In some embodiments, the electric drive assembly 1010 is installed at the front of the vehicle 1000, and the two motors 1001 of the electric drive assembly 1010 are used to drive the two front wheels 1004. The rated powers of the two motors 1001 are different, so that the vehicle 1000 can be driven to operate under different working conditions so that the operating efficiency of the vehicle 1000 is higher. Then, the rated output powers of the two power modules 30 of the controller 1002 are also different.

[0095] In some embodiments, the electric drive assembly 1010 is installed at the rear of the vehicle 1000, and the two motors 1001 of the electric drive assembly 1010 are used to drive the two rear wheels 1005. The rated powers of the two motors 1001 are different so that the vehicle 1000 can be driven to operate under different working conditions so that the operating efficiency of the vehicle 1000 is higher. Then, the rated output powers of the two power modules 30 of the controller 1002 are also different.

[0096] In some embodiments, the rated powers of the two motors 1001 are the same, and the rated output powers of the two power modules 30 of the controller 1002 may also be set differently.

[0097] See also Figures 4 to 11 , Figure 4 This is a schematic structural diagram of the controller 1002 from one angle in some embodiments of the present application. Figure 5 This is a schematic structural diagram of the controller 1002 from another angle in some embodiments of the present application. Figure 6 This is a schematic diagram of the front view structure of the controller 1002 of some embodiments of the present application. Figure 7 For along Figure 6 Schematic diagram of the cross-sectional structure along line AA. Figure 8 This is a schematic diagram of the decomposed structure of the controller 1002 according to some embodiments of the present application. Fig. 9 It is a schematic structural diagram of a heat dissipation structure 100 at one angle according to some embodiments of the present application. Fig.10 This is a schematic structural diagram of the heat dissipation structure 100 from another angle in some embodiments of the present application. Fig.11 Schematic diagram of the cross-sectional structure of the heat dissipation structure 100 according to some embodiments of the present application.

[0098] An embodiment of the present application provides a controller 1002, including a heat dissipation structure 100 and a power module 30. The power module 30 is mounted on the heat dissipation structure 100. The heat dissipation structure 100 supports the power module 30 and dissipates the heat of the power module 30, so that when in use, the power module 30 can smoothly control the operation of the motor 1001.

[0099] For ease of description, see Figures 4 to 11 , based on the drawings, three directions in space are defined, and the three directions correspond to the length direction X, width direction Y, and height direction Z of the controller 1002, respectively. The three directions are defined based on the drawings for convenience of description, and do not mean that the controller 1002 must be installed and used in the three directions defined in the drawings. Specifically, the installation angle and position of the controller 1002 can be adjusted as needed. The height direction Z of the heat dissipation structure 100 is consistent with the height direction Z of the controller 1002, the length direction X of the heat dissipation structure 100 is consistent with the length direction X of the controller 1002, and the width direction Y of the heat dissipation structure 100 is consistent with the width direction Y of the controller 1002.

[0100] See also Figure 6 , Figure 7 and Figure 8 In some embodiments, there are two power modules 30, and both power modules 30 are mounted on the heat dissipation structure 100. The two power modules 30 can be arranged to facilitate the control of the operation of the two motors 1001, so that the controller 1002 forms a dual-motor controller that can control the operation of the two motors 1001.

[0101] See also Figures 4 to 8 In some embodiments, the controller 1002 further includes a bus capacitor 40, which is mounted on the heat dissipation structure 100, and the bus capacitor 40 is supported by the heat dissipation structure 100, and the bus capacitor 40 is cooled and dissipated by the heat dissipation structure 100, so that the bus capacitor 40 operates smoothly. The bus capacitor 40 is electrically connected to the power module 30 to smooth the bus voltage, so that the bus voltage of the controller 1002 is still relatively smooth when the power module 30 is connected; reduce the inductance parameters of the line between the power module 30 and the battery 1003, weaken the peak voltage of the bus; absorb the high pulse current at the bus end of the controller 1002; and reduce the influence of overcharge and transient voltage of the bus end voltage on the controller 1002.

[0102] In some embodiments, the bus capacitor 40 is electrically connected to the two power modules 30 so that the controller 1002 can smoothly control the operation of the two motors 1001 .

[0103] In some embodiments, pins 41 are respectively extended from opposite ends of the bus capacitor 40 , one power module 30 is connected to the pin 41 at one end of the bus capacitor 40 , and another power module 30 is connected to the pin 41 at the other end of the bus capacitor 40 .

[0104] The pin 41 refers to a conductive pin connected to the electrode end of the bus capacitor 40 so as to electrically connect the bus capacitor 40 to the circuit for installation and use of the bus capacitor 40. The pins 41 of the bus capacitor 40 are generally arranged in pairs, and a pair of pins 41 includes a positive pin 411 and a negative pin 412 to respectively connect the positive terminal and the negative terminal of the bus capacitor 40. The pin 41 can be made of conductive parts such as copper bars so that a large current and voltage can be transmitted well, the resistance of the pin 41 is reduced, and the heat at the pin 41 is reduced.

[0105] Pins 41 are led out from opposite ends of the bus capacitor 40, which means that a pair of pins 41 are led out from opposite ends of the bus capacitor 40 so as to be connected to the power terminals 31 of the corresponding power module 30; that is, the positive pin 411 of the pair of pins 41 is connected to the positive terminal 311 of the power module 30, and the negative pin 412 is connected to the negative terminal 312 of the power module 30.

[0106] Pins 41 are led out at opposite ends of the bus capacitor 40 to facilitate connection with the two power modules 30, and the connection between the two power modules 30 and the bus capacitor 40 is far away to reduce the mutual influence between the heat generated at the connection between the two power modules 30 and the bus capacitor 40.

[0107] See also Figure 4 and Figure 8 In some embodiments, the controller 1002 further includes two pairs of conductive adapters 53 , the two pairs of conductive adapters 53 respectively corresponding to the two power modules 30 , and each pair of conductive adapters 53 is connected to the corresponding power module 30 .

[0108] The conductive adapter 53 refers to a structural member made of conductive materials such as copper. The conductive adapter 53 is arranged in pairs, and a pair of conductive adapters 53 are respectively connected to the positive terminal 311 and the negative terminal 312 of the power module 30, and the conductive adapter 53 is connected to external devices such as the motor 1001, thereby connecting the power module 30 to the external device. The conductive adapter 53 can be made of conductive parts such as copper busbars, so that a large current and voltage can be transmitted well, the resistance of the conductive adapter 53 is reduced, and the heat generation of the conductive adapter 53 is reduced.

[0109] Since the controller 1002 includes two power modules 30 , the conductive adapters 53 are also provided in two pairs so as to correspond one-to-one with the power modules 30 , and each pair of conductive adapters 53 is connected to the corresponding power module 30 .

[0110] A conductive adapter 53 is provided to connect the power module 30 so as to facilitate the controller 1002 to connect to external devices for convenient use.

[0111] In some embodiments, the two conductive adapters 53 in a pair are spaced apart to facilitate installation and use of the two conductive adapters 53 .

[0112] In some embodiments, an insulating member is provided between two conductive transition members 53 in a pair to improve the insulation performance between the two conductive transition members 53. The insulating member refers to a structural member made of insulating material. The insulating material can be a material with insulating properties such as plastic, bakelite, rubber, etc.

[0113] See also Figures 7 to 11 According to some embodiments of the present application, the present application provides a heat dissipation structure 100, including a shell 10, the shell 10 includes two heat dissipation walls 11, each heat dissipation wall 11 is provided with a mounting surface 110 for mounting a power module 30, and the shell 10 is provided with: two flow channels 12, respectively used for circulating coolant, the two flow channels 12 are arranged in parallel, and the two flow channels 12 respectively pass through the two heat dissipation walls 11 on one side away from the corresponding mounting surface 110.

[0114] The housing 10 is the main body of the heat dissipation structure 100, and the housing 10 can be made of heat-conducting materials such as heat-conducting plastics and metals so that the housing 10 has good thermal conductivity. Of course, some areas on the housing 10 can also be made of heat-conducting materials to conduct heat at specific locations.

[0115] The heat dissipation wall 11 refers to a part of the side wall structure on the housing 10, and the side wall has heat conduction characteristics. The heat dissipation wall 11 is generally in a plate or sheet structure, has a certain structural strength, so as to support the power module 30, and can conduct the heat of the power module 30.

[0116] The heat dissipation wall 11 has at least two opposite side surfaces, the mounting surface 110 refers to one side surface of the heat dissipation wall 11 , and the mounting surface 110 can be used to install the power module 30 , so that the power module 30 can be installed on the heat dissipation wall 11 , so that the heat generated by the power module 30 can be conducted to the heat dissipation wall 11 .

[0117] The flow channel 12 refers to a channel through which liquid can flow. The flow channel 12 has two opposite ends, namely an inlet end and an outlet end. The liquid enters the flow channel 12 from the inlet end and then flows out of the flow channel 12 from the outlet end, so that the liquid flows through the flow channel 12. Coolant refers to a liquid used for cooling and heat dissipation, such as water, oil and other liquids. When in use, the coolant can flow through the flow channel 12.

[0118] The two flow channels 12 are arranged in parallel, which means that the two flow channels 12 are spaced apart from each other except for the inlet and outlet ends, and are not connected to each other, and the coolant in the main part of the two flow channels 12 will not flow through. The inlet ends of the two flow channels 12 can be connected, and the outlet ends of the two flow channels 12 can also be connected. Of course, the two flow channels 12 can also be spaced apart from each other, that is, the inlet ends of the two flow channels 12 can be spaced apart, and the outlet ends of the two flow channels 12 can also be spaced apart, so as to supply coolant separately, thereby forming a parallel structure.

[0119] The two flow channels 12 respectively pass through the two heat dissipation walls 11 on the side away from the corresponding mounting surface 110, which means that one flow channel 12 passes through the side of one heat dissipation wall 11 away from the corresponding mounting surface 110, and the other flow channel 12 passes through the side of the other heat dissipation wall 11 away from the corresponding mounting surface 110, which can make the heat dissipation wall 11 serve as the side wall of the corresponding flow channel 12. In this way, when in use, the coolant in the flow channel 12 will flow through the corresponding heat dissipation wall 11 to cool and dissipate the heat of the heat dissipation wall 11, and then dissipate the power module 30 on the heat dissipation wall 11 through the heat dissipation wall 11. The two flow channels 12 are arranged in parallel and flow through the two heat dissipation walls 11 respectively to dissipate the heat of the two power modules 30 respectively, so that the two power modules 30 can run smoothly, and the mutual influence of the heat generated by the two power modules 30 can be reduced.

[0120] In the technical solution of the embodiment of the present application, a shell 10 with two heat dissipation walls 11 is provided, and two parallel and spaced flow channels 12 are provided in the shell 10, and the two flow channels 12 pass through the two heat dissipation walls 11 respectively, so that when in use, the coolant in the two flow channels 12 can respectively dissipate heat for the power modules 30 installed on the two heat dissipation walls 11, thereby reducing the mutual influence of the heat generated by the two power modules 30, so that each power module 30 can operate smoothly, so that each power module 30 can output peak power more stably.

[0121] Since the shell 10 is the main body of the heat dissipation structure 100, the height direction Z of the heat dissipation structure 100 is consistent with the height direction Z of the shell 10, the length direction X of the heat dissipation structure 100 is consistent with the length direction X of the shell 10, and the width direction Y of the heat dissipation structure 100 is consistent with the width direction Y of the shell 10.

[0122] In some embodiments, see Figures 7 to 11The heat dissipation structure 100 further includes a liquid inlet pipe 21 , which is mounted on the housing 10 , and the inlet ends of the two flow channels 12 are both connected to the liquid inlet pipe 21 .

[0123] The liquid inlet pipe 21 refers to a pipeline structure for liquid to flow in. The liquid inlet pipe 21 is installed on the housing 10, and the housing 10 supports the liquid inlet pipe 21.

[0124] The inlet ends of the two flow channels 12 are both connected to the liquid inlet pipe 21 , which means that the liquid inlet pipe 21 is simultaneously connected to the inlet ends of the two flow channels 12 , so that part of the liquid entering from the liquid inlet pipe 21 enters one flow channel 12 and the other part enters the other flow channel 12 .

[0125] A liquid inlet pipe 21 is provided to be connected to the inlet ends of the two flow channels 12 , so as to facilitate connecting the inlet ends of the two flow channels 12 in parallel and also facilitate supplying cooling liquid to the two flow channels 12 .

[0126] In some embodiments, the liquid inlet pipe 21 can be fixed to the housing 10 by fasteners such as screws, so as to install the liquid inlet pipe 21.

[0127] In some embodiments, the liquid inlet pipe 21 may also be fixed to the housing 10 by laser welding, argon arc welding, friction welding or the like.

[0128] In some embodiments, see Figures 7 to 11 The heat dissipation structure 100 further includes a liquid outlet pipe 22 , which is mounted on the housing 10 , and outlet ends of the two flow channels 12 are both connected to the liquid outlet pipe 22 .

[0129] The liquid outlet pipe 22 refers to a pipe structure that allows liquid to flow out of the connected channel. The liquid outlet pipe 22 is installed on the housing 10, and the housing 10 supports the liquid outlet pipe 22.

[0130] The outlet ends of the two flow channels 12 are both connected to the liquid outlet pipe 22 , which means that the liquid outlet pipe 22 is simultaneously connected to the outlet ends of the two flow channels 12 , so that the liquid in each flow channel 12 flows out from the liquid outlet pipe 22 .

[0131] A liquid outlet pipe 22 is provided to be connected to the outlet ends of the two flow channels 12 , so as to facilitate connecting the outlet ends of the two flow channels 12 in parallel and also facilitate the discharge of the coolant in the two flow channels 12 .

[0132] In some embodiments, the liquid outlet pipe 22 can be fixed to the housing 10 by fasteners such as screws, so as to install the liquid outlet pipe 22.

[0133] In some embodiments, the liquid outlet pipe 22 may also be fixed to the housing 10 by laser welding, argon arc welding, friction welding or other welding methods.

[0134] In some embodiments, see Figures 7 to 11 The two heat dissipation walls 11 are respectively arranged on opposite sides along the width direction Y of the housing 10 .

[0135] The two heat dissipation walls 11 are respectively arranged on opposite sides along the width direction Y of the shell 10, which means that along the width direction Y of the shell 10, one heat dissipation wall 11 is located on one side of the shell 10, and the other heat dissipation wall 11 is located on the other side of the shell 10, and the direction of the shortest distance from one heat dissipation wall 11 to another heat dissipation wall 11 is the width direction Y of the shell 10.

[0136] The two heat dissipation walls 11 are arranged on opposite sides of the width direction Y of the shell 10. When in use, the power module 30 can be installed on opposite sides of the width direction Y of the shell 10 to reduce the length of the controller 1002. It is also convenient to set the two flow channels 12 in parallel and make the two flow channels 12 share the height of the shell 10, thereby improving the integration and reducing the volume of the controller 1002.

[0137] In some embodiments, see Figures 7 to 11 The inlet end of each flow channel 12 is located at one end of the length direction X of the shell 10, and the outlet end of each flow channel 12 is located at the other end of the length direction X of the shell 10.

[0138] The inlet end of the flow channel 12 refers to the end where the coolant enters the flow channel 12. The outlet end of the flow channel 12 refers to the end where the coolant flows out of the flow channel 12.

[0139] The inlet end of each flow channel 12 is located at one end of the length direction X of the shell 10, and the outlet end of each flow channel 12 is located at the other end of the length direction X of the shell 10. The direction from the inlet end of the flow channel 12 to the outlet end of the flow channel 12 is along the length direction X of the shell 10.

[0140] By disposing the inlet and outlet of the flow channel 12 at opposite ends of the length direction X of the housing 10 , the area of ​​the flow channel 12 passing through the heat dissipation wall 11 can be increased, thereby improving the heat dissipation efficiency of the power module 30 .

[0141] In some embodiments, see Figures 7 to 11 A housing 13 for mounting a busbar capacitor 40 is provided in the housing 10. The housing 10 includes a plurality of heat-conducting walls 131 surrounding the housing 13. The two flow channels 12 pass through the sides of the housing 13 respectively, and each flow channel 12 is separated from the housing 13 by the heat-conducting wall 131 on the corresponding side.

[0142] The accommodating cavity 13 refers to a chamber structure provided in the housing 10. The accommodating cavity 13 is used to install the bus capacitor 40. When the controller 1002 includes the bus capacitor 40, the bus capacitor 40 is installed in the accommodating cavity 13 so as to install and support the bus capacitor 40.

[0143] The heat-conducting wall 131 refers to a partial side wall structure of the housing 10 , and the side wall has a heat-conducting property. The heat-conducting wall 131 is a side wall of the accommodating cavity 13 , so that a plurality of heat-conducting walls 131 surround the accommodating cavity 13 .

[0144] The two flow channels 12 respectively pass through the side of the accommodating cavity 13 , which means that at least a part of each flow channel 12 is located at the side of the accommodating cavity 13 , so that the coolant in the flow channel 12 passes through the side of the accommodating cavity 13 .

[0145] Each flow channel 12 is separated from the accommodating cavity 13 by the heat-conducting wall 131 on the corresponding side, which means that since the accommodating cavity 13 is a chamber structure for installing the bus capacitor 40, and the flow channel 12 will pass through the side of the accommodating cavity 13, the accommodating cavity 13 and the flow channel 12 are separated by the heat-conducting wall 131 on the side passed by the flow channel 12, so that the coolant in the flow channel 12 will not enter the accommodating cavity 13, but will pass through the adjacent heat-conducting wall 131. This can also make the heat-conducting wall 131 form a partial side wall of the corresponding flow channel 12, so that each flow channel 12 at least partially passes through the heat-conducting wall 131 of the accommodating cavity 13. When in use, the coolant in the flow channel 12 can pass through the heat-conducting wall 131 to cool the heat-conducting wall 131, and the bus capacitor 40 is installed in the accommodating cavity 13, and the heat-conducting wall 131 is the side wall of the accommodating cavity 13. The heat generated by the bus capacitor 40 will be conducted to the heat-conducting wall 131, and then carried away by the coolant to achieve cooling and heat dissipation of the bus capacitor 40.

[0146] An accommodating cavity 13 is provided in the housing 10 for installing the bus capacitor 40 ; and the two flow channels 12 pass through the side of the accommodating cavity 13 , so that the coolant in the two flow channels 12 can dissipate the heat of the bus capacitor 40 in the accommodating cavity 13 when in use.

[0147] The accommodating chamber 13 is disposed in the shell 10 , the height direction Z of the accommodating chamber 13 is consistent with the height direction Z of the shell 10 , the length direction X of the accommodating chamber 13 is consistent with the length direction X of the shell 10 , and the width direction Y of the accommodating chamber 13 is consistent with the width direction Y of the shell 10 .

[0148] In some embodiments, the heat-conducting wall 131 can serve as the outer shell of the bus capacitor 40 to directly dissipate heat from the internal components of the bus capacitor 40 and improve heat dissipation efficiency.

[0149] In some embodiments, two heat dissipation walls 11 are respectively disposed on opposite sides of the accommodating cavity 13 , and each heat dissipation wall 11 is spaced apart from a heat conducting wall 131 on the corresponding side of the accommodating cavity 13 to form a partial section of a flow channel 12 .

[0150] The two heat dissipation walls 11 are respectively disposed on two opposite sides of the accommodating cavity 13 , which means that the accommodating cavity 13 is located between the two heat dissipation walls 11 .

[0151] Each heat dissipation wall 11 is spaced from the heat conduction wall 131 on the corresponding side of the accommodating cavity 13 , which means that the heat conduction wall 131 on the side adjacent to the accommodating cavity 13 and each heat dissipation wall 11 is spaced from the heat dissipation wall 11 .

[0152] Each heat dissipation wall 11 is spaced apart from the heat-conducting wall 131 on the corresponding side of the accommodating cavity 13 to form a partial section of a flow channel 12, which means that the heat dissipation wall 11 is spaced apart from the adjacent heat-conducting wall 131 so that a spacing space is formed between the heat dissipation wall 11 and the corresponding heat-conducting wall 131, and the spacing space belongs to a partial section of the flow channel 12 passing through the heat dissipation wall 11.

[0153] Heat dissipation walls 11 are provided on opposite sides of the accommodating cavity 13, so that the overall length of the shell 10 can be reduced and the integration degree can be improved; and the heat dissipation wall 11 and the heat-conducting wall 131 on the corresponding side of the accommodating cavity 13 are spaced apart so that the spacing space forms a partial section of the corresponding flow channel 12, which can further improve the integration degree and reduce the volume of the controller 1002; when in use, the coolant in each flow channel 12 can cool and dissipate the power module 30 on the corresponding heat dissipation wall 11 and the bus capacitor 40 in the accommodating cavity 13 at the same time.

[0154] In some embodiments, the two flow channels 12 are cooperatively arranged around the accommodating cavity 13 in the height direction Z of the accommodating cavity 13 .

[0155] The two flow channels 12 cooperate to be arranged around the accommodating cavity 13 in the height direction Z of the accommodating cavity 13 , which means that the two flow channels 12 cooperate to form an overall channel structure, which is around the height direction Z of the accommodating cavity 13 and is arranged around the accommodating cavity 13 .

[0156] The two flow channels 12 surround the accommodating cavity 13 , which can increase the area of ​​the two flow channels 12 passing through the side of the accommodating cavity 13 . When in use, the heat dissipation efficiency of the bus capacitor 40 in the accommodating cavity 13 can be improved.

[0157] In some embodiments, at least one end of the accommodating cavity 13 along the height direction Z is configured to be open 132 for installing the bus capacitor 40 and injecting curing glue.

[0158] The opening 132 refers to an opening structure formed directly at the end of the chamber by the side wall of the chamber, and no portion extending into the chamber to reduce the area of ​​the opening structure is provided at the end of the side wall.

[0159] Providing at least one end of the accommodating cavity 13 in the height direction Z as an open opening 132 can facilitate installation of the bus capacitor 40 in the accommodating cavity 13 and also facilitate injection of curing glue 51 to fix the bus capacitor 40 in the accommodating cavity 13 .

[0160] In some embodiments, one end of the accommodating cavity 13 in the height direction Z can be set to be open 132. Of course, both ends of the accommodating cavity 13 in the height direction Z can also be set to be open 132, which can be specifically set as needed.

[0161] In some embodiments, when assembling the bus capacitor 40, the bus capacitor 40 can be placed in the accommodating cavity 13, and then the curing glue 51 is poured into the accommodating cavity 13. After the curing glue 51 is cured, the bus capacitor 40 can be fixed in the accommodating cavity 13. The curing glue 51 can be epoxy resin, room temperature vulcanized silicone rubber, silicone gel, etc.

[0162] In some embodiments, the housing 10 is provided with openings 133 at both ends along the height direction Z of the accommodating cavity 13 for the pins 41 of the bus capacitor 40 to extend out.

[0163] The opening 133 refers to a hole structure provided at the end of the housing 10 along the height direction Z of the accommodating cavity 13 , and the hole structure is located at a position corresponding to the accommodating cavity 13 .

[0164] When the bus capacitor 40 is installed, the pins 41 of the bus capacitor 40 may extend out of the accommodating cavity 13 from the opening 133 , so that the bus capacitor 40 is connected to the power module 30 .

[0165] Openings 133 are provided at both ends of the housing 10 , which can facilitate the extension of the pins 41 of the bus capacitor 40 to connect with the two power modules 30 installed on the housing 10 when in use.

[0166] In some embodiments, one end of the accommodating cavity 13 is provided with an opening 132, and the other end of the accommodating cavity 13 is provided with an opening 133. When installing the bus capacitor 40, the pin 41 at one end of the bus capacitor 40 can be led out from the opening 132, and the pin 41 at the other end of the bus capacitor 40 can be extended from the opening 133, so that the curing glue 51 can be poured into the accommodating cavity 13 to fix the bus capacitor 40. In this way, the opening 132 at one end of the accommodating cavity 13 can also be used as the opening 133.

[0167] In some embodiments, an opening 132 is provided at one end of the accommodating cavity 13 , and a cover is provided on the opening 132 . An opening 133 may also be provided on the cover to allow the pins 41 of the bus capacitor 40 to extend out.

[0168] In some embodiments, each heat dissipation wall 11 is provided with an opening 111 communicating with the corresponding flow channel 12 .

[0169] The opening 111 refers to a through-opening structure provided on the heat dissipation wall 11 .

[0170] When in use, the power module 30 is mounted on the mounting surface 110 of each heat dissipation wall 11, and the area around the opening 111 on the mounting surface 110 is sealed with the corresponding power module 30, so that the coolant in the flow channel 12 directly contacts and dissipates heat to the power module 30 mounted on the heat dissipation wall 11, thereby improving the heat dissipation efficiency of the power module 30. The sealing between the area around the opening 111 on the mounting surface 110 and the corresponding power module 30 can reduce the risk of coolant leakage from the mounting surface 110.

[0171] In some embodiments, the area around the opening 111 on the mounting surface 110 and the corresponding power module 30 are sealed, and a sealing ring 52 may be provided between the power module 30 and the heat dissipation wall 11 , and the sealing ring 52 is provided around the opening 111 .

[0172] The sealing ring 52 is an annular or frame-shaped device with a certain elasticity. The sealing ring 52 is disposed between two adjacent structural members and is squeezed by the two structural members to seal the space between the two structural members.

[0173] A sealing ring 52 is disposed to surround the corresponding opening 111 so as to seal the power module 30 and the heat dissipation wall 11 and improve the sealing effect.

[0174] In some embodiments, each heat dissipation wall 11 is provided with a positioning groove 112 for positioning the corresponding sealing ring 52 .

[0175] The positioning groove 112 refers to a groove structure provided on the heat dissipation wall 11. One axial side of the sealing ring 52 can be placed in the positioning groove 112, and the other axial side of the sealing ring 52 will protrude from the positioning groove 112 to fit with the corresponding power module 30, thereby sealing the power module 30 and the mounting surface 110.

[0176] A positioning groove 112 is provided on the heat dissipation wall 11 to position the sealing ring 52 , so as to facilitate sealing between the power module 30 and the heat dissipation wall 11 .

[0177] In some embodiments, each power module 30 is provided with a heat dissipation fin 32 , and the heat dissipation fin 32 extends into the adjacent flow channel 12 through the corresponding opening 111 .

[0178] The heat dissipation fins 32 refer to a plurality of sheet-shaped or columnar heat-conducting structures protruding from the power module 30. The heat dissipation fins 32 are provided on the power module 30 to increase the heat dissipation area of ​​the power module 30.

[0179] The power module 30 is provided with heat dissipation fins 32 , and the heat dissipation fins 32 are extended into the corresponding flow channel 12 , so that the coolant in the flow channel 12 passes through the heat dissipation fins 32 , thereby improving the heat dissipation efficiency of the power module 30 .

[0180] According to some embodiments of the present application, the present application provides a heat dissipation structure 100, including a shell 10, a liquid inlet pipe 21 and a liquid outlet pipe 22; the shell 10 includes two heat dissipation walls 11, each heat dissipation wall 11 is provided with a mounting surface 110, and the mounting surface 110 is used to install a power module 30; the shell 10 is provided with: two flow channels 12, respectively used for the circulation of coolant, the two flow channels 12 are arranged in parallel, and the two flow channels 12 pass through the two heat dissipation walls 11 on the side away from the corresponding mounting surface 110. The liquid inlet pipe 21 is installed on the shell 10, and the inlet ends of the two flow channels 12 are both connected to the liquid inlet pipe 21. The liquid outlet pipe 22 is installed on the shell 10, and the outlet ends of the two flow channels 12 are both connected to the liquid outlet pipe 22. The shell 10 is provided with a accommodating cavity 13 for installing a busbar capacitor 40. The housing 10 includes a plurality of heat-conducting walls 131, which enclose a receiving cavity 13; two heat-dissipating walls 11 are respectively arranged on opposite sides of the receiving cavity 13, and each heat-dissipating wall 11 is spaced apart from the heat-conducting wall 131 on the corresponding side of the receiving cavity 13, and forms a partial section of a flow channel 12. The two flow channels 12 are arranged around the receiving cavity 13 in the height direction Z of the receiving cavity 13. A housing 10 with two heat-dissipating walls 11 is provided, and two flow channels 12 are arranged in parallel and spaced apart in the housing 10, and the two flow channels 12 pass through the two heat-dissipating walls 11 respectively, so that when in use, the coolant in the two flow channels 12 can respectively dissipate the heat of the power modules 30 installed on the two heat-dissipating walls 11, thereby reducing the mutual influence of the heat generated by the two power modules 30, so that each power module 30 can operate smoothly, so that each power module 30 can output peak power more stably. The heat dissipation walls 11 are arranged on opposite sides of the accommodating cavity 13, which can reduce the overall length of the housing 10 and improve the integration; and the heat dissipation wall 11 and the heat-conducting wall 131 on the corresponding side of the accommodating cavity 13 are spaced apart so that the spaced apart space forms a partial section of the corresponding flow channel 12, which can further improve the integration and reduce the volume of the controller 1002; when in use, the coolant in each flow channel 12 can simultaneously cool and dissipate the power module 30 on the corresponding heat dissipation wall 11 and the bus capacitor 40 in the accommodating cavity 13. The two flow channels 12 surround the accommodating cavity 13, which can increase the area of ​​the two flow channels 12 passing through the side of the accommodating cavity 13 together, and when in use, the heat dissipation efficiency of the bus capacitor 40 in the accommodating cavity 13 can be improved.

[0181] See also Figures 4 to 11 According to some embodiments of the present application, the present application provides a controller 1002, including the heat dissipation structure 100 as described in the above embodiments.

[0182] In some embodiments, the controller 1002 further includes two power modules 30, and the two power modules 30 are respectively mounted on the two heat dissipation walls 11. The two power modules 30 are provided to facilitate the control of the operation of the two motors 1001; and the two power modules 30 are mounted on the two heat dissipation walls 11 to dissipate heat from the two power modules 30 respectively, so as to reduce the mutual influence of the heat generated by the two power modules 30, so that each power module 30 can output peak power more stably.

[0183] In some embodiments, each heat dissipation wall 11 is provided with an opening 111 connected to the corresponding flow channel 12, and the area surrounding the opening 111 on the mounting surface 110 is sealed with the corresponding power module 30. The opening 111 is provided on the heat dissipation wall 11 to connect to the corresponding flow channel 12, so that the coolant in the flow channel 12 can directly contact and dissipate heat to the power module 30 installed on the heat dissipation wall 11, thereby improving the heat dissipation efficiency of the power module 30.

[0184] In some embodiments, a sealing ring 52 is disposed between each power module 30 and the heat dissipation wall 11, and the sealing ring 52 is disposed around the opening 111. The sealing ring 52 is disposed to surround the corresponding opening 111 to seal the power module 30 and the heat dissipation wall 11 and improve the sealing effect.

[0185] In some embodiments, each heat dissipation wall 11 is provided with a positioning groove 112 for positioning the corresponding sealing ring 52. The positioning groove 112 is provided on the heat dissipation wall 11 to position the sealing ring 52, so as to facilitate sealing between the power module 30 and the heat dissipation wall 11.

[0186] In some embodiments, each power module 30 is provided with a heat dissipation fin 32, and the heat dissipation fin 32 extends into the adjacent flow channel 12 through the corresponding opening 111. The heat dissipation fin 32 is provided on the power module 30, and the heat dissipation fin 32 is extended into the corresponding flow channel 12, so that the coolant in the flow channel 12 passes through the heat dissipation fin 32, thereby improving the heat dissipation efficiency of the power module 30.

[0187] In some embodiments, the controller 1002 further includes a bus capacitor 40, which is mounted on the housing 10. The bus capacitor 40 is provided so that the bus voltage of the controller 1002 is smoother and the controller 1002 works more stably.

[0188] In some embodiments, pins 41 are led out from opposite ends of the bus capacitor 40, one power module 30 is connected to the pin 41 at one end of the bus capacitor 40, and the other power module 30 is connected to the pin 41 at the other end of the bus capacitor 40. The pins 41 are led out from opposite ends of the bus capacitor 40 to facilitate connection with the two power modules 30, and the connection between the two power modules 30 and the bus capacitor 40 is far away to reduce the mutual influence between the heat generated at the connection between the two power modules 30 and the bus capacitor 40.

[0189] In some embodiments, the controller 1002 further includes two pairs of conductive adapters 53, the two pairs of conductive adapters 53 respectively corresponding to the two power modules 30, and each pair of conductive adapters 53 is connected to the corresponding power module 30. The conductive adapters 53 are provided to connect the power modules 30, so that the controller 1002 can be connected to external devices for easy use.

[0190] According to some embodiments of the present application, the present application provides an electric drive assembly 1010, including the controller 1002 as described in the above embodiments.

[0191] According to some embodiments of the present application, the present application provides an electric device, including the controller 1002 as described in the above embodiment, or including the electric drive assembly 1010 as described in the above embodiment.

[0192] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A heat dissipation structure, characterized in that: The housing comprises two heat dissipation walls, each of which is provided with a mounting surface for mounting a power module, and the housing is provided with: The two flow channels are respectively used for cooling liquid to flow, the two flow channels are arranged in parallel, and the two flow channels respectively pass through the two heat dissipation walls away from the corresponding mounting surface.

2. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure further comprises a liquid inlet pipe, which is mounted on the shell, and the inlet ends of the two flow channels are both connected to the liquid inlet pipe.

3. The heat dissipation structure according to claim 1 or 2, characterized in that: The heat dissipation structure further comprises a liquid outlet pipe, which is mounted on the shell, and outlet ends of the two flow channels are both connected to the liquid outlet pipe.

4. The heat dissipation structure according to any one of claims 1 to 3, characterized in that: The two heat dissipation walls are respectively arranged on two opposite sides along the width direction of the shell.

5. The heat dissipation structure according to claim 4, characterized in that: The inlet end of each flow channel is located at one end of the shell in the length direction, and the outlet end of each flow channel is located at the other end of the shell in the length direction.

6. The heat dissipation structure according to any one of claims 1 to 5, characterized in that: The shell is provided with a housing cavity for installing a busbar capacitor. The shell includes a plurality of heat-conducting walls surrounding the housing cavity. The two flow channels pass through the sides of the housing cavity respectively, and each flow channel is separated from the housing cavity by the heat-conducting wall on the corresponding side.

7. The heat dissipation structure according to claim 6, characterized in that: The two heat dissipation walls are respectively arranged on two opposite sides of the accommodating cavity, and each heat dissipation wall is spaced apart from the heat conduction wall on the corresponding side of the accommodating cavity to form a partial section of the flow channel.

8. The heat dissipation structure according to claim 6 or 7, characterized in that: The two flow channels are arranged around the accommodating cavity in a height direction of the accommodating cavity.

9. The heat dissipation structure according to any one of claims 6 to 8, characterized in that: At least one end of the accommodating cavity along the height direction is open for installation of the busbar capacitor and injection of curing glue.

10. The heat dissipation structure according to any one of claims 6 to 9, characterized in that: The shell is provided with openings at both ends along the height direction of the accommodating cavity for the pins of the busbar capacitor to extend out.

11. A controller, characterized in that: It comprises the heat dissipation structure as described in any one of claims 1 to 10.

12. The controller according to claim 11, characterized in that: The controller further comprises two power modules, and the two power modules are respectively mounted on the two heat dissipation walls.

13. The controller according to claim 12, characterized in that: An opening communicating with the corresponding flow channel is formed on each of the heat dissipation walls, and a region surrounding the opening on the mounting surface is sealed with the corresponding power module.

14. The controller according to claim 13, characterized in that: A sealing ring is provided between each of the power modules and the heat dissipation wall, and the sealing ring is arranged around the opening.

15. The controller according to claim 14, characterized in that: Each of the heat dissipation walls is provided with a positioning groove corresponding to the sealing ring.

16. The controller according to any one of claims 13 to 15, characterized in that: Each of the power modules is provided with a heat dissipation fin, and the heat dissipation fin extends into the adjacent flow channel through the corresponding opening.

17. The controller according to any one of claims 11 to 16, characterized in that: The controller further comprises a bus capacitor, which is installed on the housing and is electrically connected to the two power modules.

18. The controller according to claim 17, characterized in that: Pins are led out from opposite ends of the bus capacitor respectively, one power module is connected to the pin at one end of the bus capacitor, and the other power module is connected to the pin at the other end of the bus capacitor.

19. The controller according to any one of claims 12 to 18, characterized in that: The controller further includes two pairs of conductive adapters, the two pairs of conductive adapters correspond to the two power modules respectively, and each pair of conductive adapters is connected to the corresponding power module.

20. An electric drive assembly, characterized in that: Comprising a controller as described in any one of claims 11-19.

21. An electric device, characterized in that: Includes a controller as described in any one of claims 11-19, or includes an electric drive assembly as described in claim 20.

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