Vapor chamber and electronic equipment

Abstract

The upper cover plate provided by the utility model is provided with a plurality of first raised lines, the plurality of first raised lines are arranged side by side along the first direction, and a first groove is formed between every two adjacent first raised lines. The lower cover plate is provided with second protruding strips, the multiple second protruding strips are arranged side by side in the first direction, and a second groove is formed between every two adjacent second protruding strips. The lower cover plate is in butt joint with the upper cover plate, so that the first grooves correspond to the second grooves in a one-to-one mode, and at least part of the first grooves and the corresponding second grooves are different in width so as to form liquid flow channels. The liquid flow channel is high in depth-to-width ratio, good in capillary performance and high in heat transfer capacity, meanwhile, a large circulation sectional area is provided, the flow of fluid is high, and the backflow capacity of the fluid is high. Through the arrangement that the widths of the first grooves and the second grooves are different, the liquid flow channel is of a step structure, the turbulent flow phenomenon is caused in the liquid flowing process, mixing and contact between the liquid and the solid surface can be increased through turbulent flow, and therefore the heat transfer efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat conduction, and more specifically to a heat spreader and electronic equipment. Background Art

[0002] With the advent of the 5G era, the power consumption and heat generation of mobile phones, servers and other equipment have increased dramatically, and the heat dissipation pressure is huge. Due to its high thermal conductivity and high heat dissipation efficiency, the heat spreader has become the mainstream solution for 5G smartphones and servers. Its heat dissipation limit depends on the capillary suction force that the internal wick structure can provide.

[0003] The micro-groove structure is one of the common vapor chamber wick structures. The smaller the groove width, the smaller the capillary radius, the larger the aspect ratio, the greater the capillary suction force provided, and the better the heat dissipation capacity of the vapor chamber. The etching method can be used to prepare very small grooves to provide a large capillary force. Due to process limitations, the aspect ratio is small, and the groove width is reduced, the flow cross-sectional area of ​​the liquid working medium is reduced, and the flow resistance of the liquid working medium will also increase. It is necessary to find a balance point for the contradiction between capillary force and flow resistance, improve the capillary suction force of the micro-groove wick structure, and strengthen the heat dissipation limit of the vapor chamber.

[0004] Therefore, it is necessary to provide a vapor chamber and an electronic device to at least partially solve the above problems. Utility Model Content

[0005] A series of simplified concepts are introduced in the utility model content section, which will be further described in detail in the detailed implementation section. The utility model content section of the utility model does not mean to attempt to define the key features and essential technical features of the technical solution claimed for protection, nor does it mean to attempt to determine the scope of protection of the technical solution claimed for protection.

[0006] In order to at least partially solve the above problems, the first aspect of the present invention provides a vapor chamber, characterized in that it comprises:

[0007] An upper cover plate, wherein the upper cover plate is provided with a first convex strip, a plurality of the first convex strips are arranged side by side along a first direction, and a first groove is formed between two adjacent first convex strips;

[0008] A lower cover plate, wherein the lower cover plate is provided with a second convex strip, a plurality of the second convex strips are arranged side by side along the first direction, and a second groove is formed between two adjacent second convex strips; wherein,

[0009] The lower cover plate is joined to the upper cover plate so that the first grooves correspond to the second grooves one by one, and at least part of the first grooves have different widths from the corresponding second grooves to form a liquid flow channel.

[0010] According to the heat spreader of the first aspect of the utility model, the utility model adopts the method of combining upper and lower covers to increase the depth-to-width ratio of the channel, improve the capillary force of the channel, and at the same time provide a larger flow cross-sectional area, a high fluid flow rate, and a strong fluid reflux capacity. By setting the first groove and the second groove with unequal widths, the flow cross-sectional area of ​​the flow channel is increased, and the flow resistance is reduced, thereby strengthening the reflux of the liquid working medium and improving the heat dissipation limit of the heat spreader. There is a step structure in the liquid flow channel, which causes turbulence during the flow of the liquid. Turbulence can increase the mixing and contact between the liquid and the solid surface, thereby accelerating the heat transfer efficiency. The first convex strip and the second convex strip act as reinforcing ribs, thereby improving the strength of the heat spreader.

[0011] Optionally, when D b <D t <D b +W b , and W t <W b When (H t +H b ) / D t ≥2; or

[0012] When D t <D b <D t +W t , and W b <W t When (H t +H b ) / D b ≥2;

[0013] Where D t is the width of the first groove, H t is the depth of the first groove, D b is the width of the second groove, H b is the depth of the second groove, W t is the width of the first ridge, W b is the width of the second convex strip.

[0014] Optionally, H t +H b ≥δ t ; and / or

[0015] H t +H b ≥δ d ;

[0016] In the formula, H t is the depth of the first groove, H b is the depth of the second groove, δ t is the thickness of the upper cover plate, δb is the thickness of the lower cover plate.

[0017] Optionally, the orthographic projection of the first groove on the plane where the upper cover plate is located is located within the orthographic projection of the second groove on the plane where the upper cover plate is located; or

[0018] The orthographic projection of the second groove on the plane where the upper cover plate is located is located within the orthographic projection of the first groove on the plane where the upper cover plate is located.

[0019] Optionally, the vapor chamber satisfies at least one of the following conditions:

[0020] The thickness of the upper cover plate and / or the lower cover plate is 0.1-0.3 mm;

[0021] The width of the first groove and / or the second groove is 1 μm-250 μm;

[0022] The depth of the first groove and / or the second groove is 1 μm-250 μm.

[0023] Optionally, at least a portion of the first grooves has the same width as the corresponding second grooves to form a gas flow channel.

[0024] Optionally, the upper cover plate is provided with a first support column, and a plurality of the first support columns are spaced apart and arranged in the first groove;

[0025] A second support column is arranged in the lower cover plate, and a plurality of the second support columns are arranged in the second groove at intervals; wherein,

[0026] The first support column and the second support column are both located in the gas flow channel, and a plurality of the first support columns correspond to a plurality of the second support columns one by one.

[0027] Optionally, the width of the gas flow channel is greater than the width of the liquid flow channel; and / or

[0028] The gas flow channel and the liquid flow channel are spaced apart from each other.

[0029] Optionally, the upper cover plate is welded to the lower cover plate; and / or

[0030] The upper cover plate and the lower cover plate are made of metal.

[0031] A second aspect of the present invention provides an electronic device, comprising the above-mentioned heat spreader.

[0032] According to the electronic device provided by the second aspect of the utility model, since the heat spreader has a stable structure and high heat dissipation efficiency, it is easy to be installed in the electronic device to stably dissipate heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The following drawings of the embodiments of the present invention are used as part of the present invention for understanding the present invention. The drawings show the embodiments of the present invention and their descriptions, and are used to explain the principles of the present invention. In the drawings,

[0034] Figure 1 This is an exploded schematic diagram of a vapor chamber according to a preferred embodiment of the present invention;

[0035] Figure 2 1 is a cross-sectional schematic diagram of a vapor chamber according to a preferred embodiment of the present invention, in which the liquid flow channel is located at an end of the vapor chamber along the width direction;

[0036] Figure 3 1 is a cross-sectional schematic diagram of a vapor chamber according to another preferred embodiment of the present invention, in which the liquid flow channel is located at an end of the vapor chamber along the width direction;

[0037] Figure 4 is a cross-sectional schematic diagram of a liquid flow channel in a first embodiment;

[0038] Figure 5 It is a schematic cross-sectional view of the liquid flow channel in the second embodiment.

[0039] Description of Reference Numerals

[0040] 10: Upper cover

[0041] 11: First ridge

[0042] 12: First groove

[0043] 13: First support column

[0044] 20: Lower cover

[0045] 21: Second ridge

[0046] 22: Second groove

[0047] 23: Second support column

[0048] 30: Liquid flow channel

[0049] 40: Gas flow channel

[0050] D1: First direction DETAILED DESCRIPTION

[0051] In the following description, a large number of specific details are given to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.

[0052] In this document, ordinal numbers such as "first" and "second" cited in the present invention are merely identifiers and do not have any other meanings, such as a specific order, etc. Moreover, for example, the term "first component" itself does not imply the existence of the "second component", and the term "second component" itself does not imply the existence of the "first component".

[0053] In this document, “upper”, “lower”, “front”, “back”, “left”, “right”, etc. are only used to indicate the relative position relationship between related parts, rather than to limit the absolute positions of these related parts.

[0054] In this document, “equal”, “same”, etc. are not strictly limited in a mathematical and / or geometric sense, but also include errors that can be understood by those skilled in the art and are allowed in manufacturing or use.

[0055] Unless otherwise stated, the numerical ranges herein include not only the entire range within its two endpoints but also include several sub-ranges contained therein.

[0056] Now, exemplary embodiments according to the present utility model will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in a variety of different forms and should not be interpreted as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present utility model thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art.

[0057] The heat spreader is a vacuum chamber with a groove structure on the inner wall, usually made of copper. When heat is transferred from the heat source to the evaporation zone, the coolant in the chamber begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat energy and expands rapidly in volume. The gas phase cooling medium quickly fills the entire chamber. When the gas phase working medium contacts a relatively cold area, condensation occurs. The heat accumulated during evaporation is released through condensation, and the condensed coolant returns to the evaporation heat source through the microstructured capillary channels. This operation will be repeated in the chamber.

[0058] The heat dissipation capacity of the ultra-thin heat spreader mainly depends on the capillary properties of the liquid wick structure. The liquid wick with a micro-channel structure has good wettability and capillary properties, which can effectively promote the reflux of liquid working fluid. The larger the aspect ratio of the micro-channel, that is, the smaller the width and the greater the depth, the better the capillary performance and the stronger the heat transfer capacity. However, when the thickness of the heat spreader is constant, the depth of the channel is limited, so the aspect ratio can only be increased by reducing the width of the channel. However, reducing the channel width will lead to a decrease in the flow cross-sectional area, thereby limiting the flow rate of the fluid.

[0059] Reference Figure 1-Figure 3 The utility model provides a heat spreader, comprising an upper cover plate 10 and a lower cover plate 20, wherein the upper cover plate 10 and the lower cover plate 20 are sealed and joined.

[0060] In some embodiments of the present invention, the upper cover plate 10 and the lower cover plate 20 are made of metal. The use of metal material can quickly transfer heat, thereby improving the overall heat conduction efficiency of the heat spreader; metal material is also easy to process and has good mechanical strength, can withstand greater external pressure and impact, and protect the internal structure from damage. Specifically, the material of the upper cover plate 10 and the lower cover plate 20 is one of stainless steel, aluminum alloy, copper alloy, and titanium alloy.

[0061] In some embodiments of the present invention, the upper cover plate 10 is welded to the lower cover plate 20. The welded connection can provide a higher connection strength and can provide excellent sealing to prevent liquid or gas leakage.

[0062] In the present utility model, if Figure 1 As shown, the upper cover plate 10 is provided with a first convex strip 11, and a plurality of first convex strips 11 are arranged side by side along the first direction D1, and a first groove 21 is formed between two adjacent first convex strips 11. The lower cover plate 20 is provided with a second convex strip 21, and a plurality of second convex strips 21 are arranged side by side along the first direction D1, and a second groove 22 is formed between two adjacent second convex strips 21. The lower cover plate 20 is docked with the upper cover plate 10, so that the plurality of first grooves 21 correspond to the plurality of second grooves 22 one by one, and at least part of the first grooves 21 and the corresponding second grooves 22 have different widths to form a liquid flow channel 30. The liquid flow channel 30 has a high aspect ratio, good capillary performance, and strong heat transfer capacity. At the same time, it provides a large flow cross-sectional area, a high flow rate of the fluid, and a strong fluid reflux capacity. Through the different widths of the first groove 21 and the second groove 22, the liquid flow channel 30 has a step structure, which causes turbulence during the flow of the liquid. The turbulence can increase the mixing and contact between the liquid and the solid surface, thereby accelerating the heat transfer efficiency. The first convex strips 11 and the second convex strips 21 function as reinforcing ribs, thereby increasing the strength of the vapor chamber.

[0063] In some embodiments of the present invention, at least a portion of the first grooves 21 and the corresponding second grooves 22 have the same width to form a liquid flow channel 30 .

[0064] like Figure 4 In the first embodiment shown, when D b <D t <D b +W b , and W t <W b When (H t +H b ) / D t ≥2; where D t is the width of the first trench 21, H t is the depth of the first trench 21, D b is the width of the second trench 22, H b is the depth of the second trench 22, W t is the width of the first ridge 11, W b is the width of the second convex strip 21. The liquid flow channel 30 is constructed as a structure that is wide at the top and narrow at the bottom. The aspect ratio of the total height of the liquid flow channel 30 to the width of the wider first groove 21 is greater than or equal to 2. The capillary capacity of the liquid flow channel 30 is enhanced, thereby enhancing the heat dissipation capacity of the heat spreader.

[0065] In some embodiments of the utility model, the orthographic projection of the second groove 22 on the plane where the upper cover plate 10 is located is located within the orthographic projection of the first groove 21 on the plane where the upper cover plate 10 is located. That is, the orthographic projection of the first convex strip 11 on the plane where the upper cover plate 10 is located is located within the orthographic projection of the second convex strip 21 on the plane where the upper cover plate 10 is located. The second convex strip 21 can provide reliable support, so that the connection between the upper cover plate 10 and the lower cover plate 20 is more reliable, and the lower cover plate 20 can provide sufficient support for the upper cover plate 10, so that the overall strength of the heat spreader is high.

[0066] like Figure 5 In the second embodiment shown, when D t <D b <D t +W t , and W b <W t When (H t +H b ) / D b ≥2; where D t is the width of the first trench 21, H t is the depth of the first trench 21, D b is the width of the second trench 22, H b is the depth of the second trench 22, W t is the width of the first ridge 11, Wb is the width of the second convex strip 21. The liquid flow channel 30 is configured as a structure that is narrow at the top and wide at the bottom. The aspect ratio of the total height of the liquid flow channel 30 to the width of the wider second groove 22 is greater than or equal to 2. The capillary capacity of the liquid flow channel 30 is enhanced, thereby enhancing the heat dissipation capacity of the heat spreader.

[0067] In some embodiments of the present invention, H t +H b ≥δ t ; and / or H t +H b ≥δ d Where H t is the depth of the first trench 21, H b is the depth of the second trench 22, δ t is the thickness of the upper cover plate 10, δ b is the thickness of the lower cover plate 20. The height of the liquid flow channel 30 is greater than the thickness of a single cover plate.

[0068] In some embodiments of the utility model, the orthographic projection of the first groove 21 on the plane where the upper cover plate 10 is located is located within the orthographic projection of the second groove 22 on the plane where the upper cover plate 10 is located. That is, the orthographic projection of the second convex strip 21 on the plane where the upper cover plate 10 is located is located within the orthographic projection of the first convex strip 11 on the plane where the upper cover plate 10 is located. The second convex strip 21 can provide reliable support, so that the connection between the upper cover plate 10 and the lower cover plate 20 is more reliable, and the lower cover plate 20 can provide sufficient support for the upper cover plate 10, so that the overall strength of the heat spreader is high.

[0069] In some embodiments of the present invention, the vapor chamber satisfies at least one of the following conditions:

[0070] The thickness of the upper cover plate 10 and / or the lower cover plate 20 is 0.1-0.3 mm. The cover plate is thinner and has a higher heat transfer efficiency.

[0071] The width of the first groove 21 and / or the second groove 22 is 1 μm-250 μm, and the width of the groove is reasonable to facilitate heat transfer and processing;

[0072] The depth of the first groove 21 and / or the second groove 22 is 1 μm-250 μm. The depth of the groove is reasonable to facilitate heat transfer and processing.

[0073] The reflux speed of the liquid working medium can be further increased, thereby further improving the heat dissipation power of the heat spreader.

[0074] In some embodiments of the present invention, at least a portion of the first grooves 21 and the corresponding second grooves 22 have the same width to form the gas flow channel 40. Optionally, the liquid flow channel 30 and the gas flow channel 40 are arranged side by side along the first direction D1.

[0075] In some embodiments of the present invention, the width of the gas flow channel 40 is greater than the width of the liquid flow channel 30 .

[0076] In some embodiments of the present invention, the gas flow channel 40 and the liquid flow channel 30 are spaced apart. Figure 2 As shown, the liquid flow channel 30 is located at the end of the heat spreader along the width direction, and the gas flow channel 40 is located in the middle of the heat spreader along the width direction. Figure 3 As shown, the liquid flow channel 30 is located in the middle of the heat spreader along the width direction, and the gas flow channel 40 is located at the end of the heat spreader along the width direction.

[0077] In some embodiments of the utility model, the upper cover plate 10 is provided with a first support column 13, and a plurality of first support columns 13 are arranged at intervals in the first groove 21; a second support column 23 is arranged in the lower cover plate 20, and a plurality of second support columns 23 are arranged at intervals in the second groove 22; wherein the first support column 13 and the second support column 23 are both located in the gas flow channel 40, and the plurality of first support columns 13 correspond to the plurality of second support columns 23 one by one. By providing the first support column 13 and the second support column 23, support is provided for the gas flow channel 40 to prevent collapse.

[0078] In some embodiments of the present invention, the first groove 21 of the upper cover plate 10 and the second groove 22 of the lower cover plate 20 are obtained by etching.

[0079] In the present invention, the electronic device may be a laptop computer, a server, or other device with high power heat dissipation requirements. The heat spreader may be disposed in the housing of the electronic device, and may be disposed close to components with high power consumption, such as a central processing unit, a graphics processing unit, and the like.

[0080] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art in the technical field of the present invention. The terms used herein are only for describing specific implementation purposes and are not intended to limit the present invention. Terms such as "setting" appearing in this article may indicate that one component is directly attached to another component, or that one component is attached to another component through an intermediate. Features described in this article in one embodiment may be applied to another embodiment alone or in combination with other features, unless the feature is not applicable in the other embodiment or otherwise specified.

[0081] The utility model has been described through the above embodiments, but it should be understood that the above embodiments are only for the purpose of example and description, and are not intended to limit the utility model to the described embodiments. It can be understood by those skilled in the art that more variations and modifications can be made according to the teachings of the utility model, and these variations and modifications all fall within the scope of the protection claimed by the utility model.

Claims

1. A heat sink, characterized in that: include: An upper cover plate, wherein the upper cover plate is provided with a first convex strip, a plurality of the first convex strips are arranged side by side along a first direction, and a first groove is formed between two adjacent first convex strips; A lower cover plate, wherein the lower cover plate is provided with a second convex strip, a plurality of the second convex strips are arranged side by side along the first direction, and a second groove is formed between two adjacent second convex strips; wherein, The lower cover plate is joined to the upper cover plate so that the first grooves correspond to the second grooves one by one, and at least part of the first grooves have different widths from the corresponding second grooves to form a liquid flow channel.

2. The vapor chamber according to claim 1, characterized in that: When D b <D t <D b +W b , and W t <W b When (H t +H b ) / D t ≥2; or When D t <D b <D t +W t , and W b <W t When (H t +H b ) / D b ≥2; Where D t is the width of the first groove, H t is the depth of the first groove, D b is the width of the second groove, H b is the depth of the second groove, W t is the width of the first ridge, W b is the width of the second convex strip.

3. The vapor chamber according to claim 1, characterized in that: H t +H b ≥δ t ; and / or H t +H b ≥δ d ; In the formula, H t is the depth of the first groove, H b is the depth of the second groove, δ t is the thickness of the upper cover plate, δ b is the thickness of the lower cover plate.

4. The vapor chamber according to any one of claims 1 to 3, characterized in that: The orthographic projection of the first groove on the plane where the upper cover plate is located is located within the orthographic projection of the second groove on the plane where the upper cover plate is located; or The orthographic projection of the second groove on the plane where the upper cover plate is located is located within the orthographic projection of the first groove on the plane where the upper cover plate is located.

5. The vapor chamber according to any one of claims 1 to 3, characterized in that: The vapor chamber meets at least one of the following conditions: The thickness of the upper cover plate and / or the lower cover plate is 0.1-0.3 mm; The width of the first groove and / or the second groove is 1 μm-250 μm; The depth of the first groove and / or the second groove is 1 μm-250 μm.

6. The vapor chamber according to claim 1, characterized in that: At least a portion of the first grooves has the same width as the corresponding second grooves to form a gas flow channel.

7. The vapor chamber according to claim 6, characterized in that: The upper cover plate is provided with a first support column, and a plurality of the first support columns are arranged in the first groove at intervals; A second support column is arranged in the lower cover plate, and a plurality of the second support columns are arranged in the second groove at intervals; wherein, The first support column and the second support column are both located in the gas flow channel, and a plurality of the first support columns correspond to a plurality of the second support columns one by one.

8. The vapor chamber according to claim 6, characterized in that: The width of the gas flow channel is greater than the width of the liquid flow channel; and / or The gas flow channel and the liquid flow channel are spaced apart from each other.

9. The vapor chamber according to claim 1, characterized in that: The upper cover plate is welded to the lower cover plate; and / or The upper cover plate and the lower cover plate are made of metal.

10. An electronic device, characterized in that: The invention comprises a heat diffusion plate according to any one of claims 1 to 9.

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