Air-cooled heat pipe radiator for electronic component

Abstract

The utility model relates to the technical field of radiators, in particular to an electronic component air-cooled heat pipe radiator, which comprises an air cooling assembly, a heat dissipation plate, heat dissipation fins and a cleaning assembly, the air cooling assembly comprises an air duct, a mounting pipe and a fan, the heat dissipation plate is embedded below the air duct, a ventilation cavity is arranged in the air duct, and the heat dissipation fins are arranged in the ventilation cavity. The upper portion of the heat dissipation plate extends into the air channel and is provided with a plurality of sets of heat dissipation fins, one end of the upper portion of the air channel is provided with an installation pipe, the installation pipe is communicated with the ventilation cavity, and the installation pipe is further provided with the draught fan. The motor drives the screw rod to rotate, the driving plate drives the scraping plate to scrape dust on the heat dissipation fins and the top wall of the heat dissipation plate to the filtering frame, the lifter is started, the filtering frame carries out the dust, the heat dissipation efficiency of the equipment is guaranteed, and cleaning is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, in particular to an air-cooled heat pipe radiator for electronic components. Background Art

[0002] As we all know, electronic components have the characteristics of small size and high heat dissipation density, and their own operating performance is affected by the working temperature. In order to ensure the working environment of electronic components, they need to be cooled. If liquid cooling is used for heat dissipation, liquid leakage will cause damage to electronic components;

[0003] When air cooling is used, the blown-in air contains dust, which can easily affect the heat dissipation effect of the equipment, is difficult to clean, and is inconvenient to use. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the utility model provides an air-cooled heat pipe radiator for electronic components.

[0006] (II) Technical solution

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an air-cooled heat pipe radiator for electronic components, comprising an air-cooling assembly, a heat sink, heat sink fins and a cleaning assembly, the air-cooling assembly comprising an air duct, a mounting pipe and a fan, a heat sink is embedded below the air duct, a ventilation cavity is arranged in the air duct, the heat sink extends into the air duct above and is provided with a plurality of groups of heat sink fins, a mounting pipe is arranged at one end above the air duct, the mounting pipe is connected with the ventilation cavity, the fan is also arranged on the mounting pipe, the cleaning assembly comprises an exhaust assembly and a driving assembly, the driving assembly comprises a screw, a motor, a driving plate and a scraper, a slide groove is arranged at the center below the top wall in the air duct, the driving plate is in an inverted T shape, the top of the driving plate extends into the slide groove and is threadedly connected with the screw, the driving plate is arranged between the top wall in the air duct and the heat sink, a scraper is also arranged below the driving plate, a plurality of groups of scraping holes matching the heat sink fins are arranged on the scraper, and the exhaust assembly is also arranged at the other end of the air duct.

[0008] In order to facilitate dust cleaning, the utility model is improved in that the discharge assembly includes a support frame, a lifter and a filter frame, the air duct is provided with a discharge groove that passes through the ventilation cavity, the support frame is arranged on the air duct, the lifter passes through the top wall of the support frame and is connected to the top wall of the filter frame, and the filter frame is slidably connected to the discharge groove.

[0009] Preferably, the motor is a servo motor.

[0010] In order to ensure the heat dissipation efficiency, the utility model is improved in that the heat dissipation fins and the heat dissipation holes are arranged in a plurality of groups.

[0011] Preferably, arc-shaped grooves for assembling pipes are provided below the heat dissipation plate and the air duct.

[0012] Preferably, the arc-shaped grooves are arranged in several groups.

[0013] (III) Beneficial effects

[0014] Compared with the prior art, the utility model provides an air-cooled heat pipe radiator for electronic components, which has the following beneficial effects:

[0015] The electronic component air-cooled heat pipe radiator starts the motor after the equipment has been used for a long time. The motor drives the screw to rotate, and the drive plate drives the scraper to scrape the dust on the cooling fins and the top wall of the cooling plate onto the filter frame. The lifter is started and the filter frame takes the dust out, thereby ensuring the heat dissipation efficiency of the equipment and facilitating cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a first main view schematic diagram of the structure of the utility model;

[0017] Figure 2 It is a partial bottom view schematic diagram of the structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the connection between the scraper and the drive plate of the utility model structure;

[0019] Figure 4 It is a second front view schematic diagram of the structure of the utility model.

[0020] In the figure: 1. heat sink; 2. heat sink fins; 3. air duct; 4. mounting pipe; 5. fan; 6. screw; 7. motor; 8. drive plate; 9. scraper; 10. support frame; 11. lifter; 12. filter frame. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4, an air-cooled heat pipe radiator for electronic components, comprising an air-cooling assembly, a heat sink 1, heat sink fins 2 and a cleaning assembly, the air-cooling assembly comprising an air duct 3, a mounting pipe 4 and a fan 5, a heat sink 1 is embedded below the air duct 3, a ventilation cavity is arranged in the air duct 3, the heat sink 1 extends into the air duct 3 above and is provided with a plurality of groups of heat sink fins 2, a mounting pipe 4 is arranged at one end above the air duct 3, the mounting pipe 4 is connected with the ventilation cavity, the fan 5 is also arranged on the mounting pipe 4, the cleaning assembly comprises an exhaust assembly Parts and a driving assembly, the driving assembly includes a screw 6, a motor 7, a driving plate 8 and a scraper 9. A slide groove is arranged at the center below the inner top wall of the air duct 3. The driving plate 8 is in an inverted T shape. The upper part of the driving plate 8 extends into the slide groove and is threadedly connected with the screw 6. The driving plate 8 is arranged between the inner top wall of the air duct 3 and the heat dissipation fins 2. A scraper 9 is also arranged below the driving plate 8. The scraper 9 is provided with several groups of scraping holes adapted to the heat dissipation fins 2. The other end of the air duct 3 is also provided with the discharge assembly.

[0023] Initially, the lower side of the heat sink 1 is in contact with the object to be dissipated, and the heat is transferred through the heat sink fins 2 to release the heat into the ventilation cavity. The fan 5 sends air into the installation tube 4, and the air then enters the ventilation cavity and is finally discharged from the exhaust component. Initially, the installation tube 4 is located between the exhaust component and the scraper 9. The motor 7 is started, and the motor 7 drives the screw 6 to rotate, and the driving plate 8 drives the scraper 9 to move. The dust on the heat sink fins 2 and the upper wall of the heat sink 1 is sent to the exhaust component by the scraper 9 for discharge. The heat sink fins 2 and the heat dissipation holes are arranged in several groups, and arc grooves for assembling pipes are arranged under the heat sink 1 and the air duct 3. The arc grooves are arranged in several groups to ensure the efficiency of heat dissipation. In this embodiment, the motor 7 adopts a servo motor 7 with stable operation.

[0024] In this embodiment, a filter net or a ventilation filter pad is embedded in the filter frame 12, and the discharge component includes a support frame 10, a lifter 11 and a filter frame 12. The air duct 3 is provided with a discharge groove that passes through the ventilation cavity. The support frame 10 is arranged on the air duct 3, and the lifter 11 passes through the top wall of the support frame 10 and is connected to the top wall of the filter frame 12. The filter frame 12 is slidably connected to the discharge groove. The support frame 10 provides stable support for the lifter 11. The scraper 9 has an L-shaped cross-section to ensure the operating stability of the scraper 9 and stably deliver the dust into the filter frame 12. The lifter 11 then drives the filter frame 12 to slide out of the air duct 3 for centralized processing.

[0025] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0026] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.

[0027] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An air-cooled heat pipe radiator for electronic components, comprising an air-cooling assembly, a heat sink (1), heat sink fins (2) and a cleaning assembly, characterized in that: The air cooling component comprises an air duct (3), a mounting tube (4) and a fan (5); a heat sink (1) is embedded below the air duct (3); a ventilation cavity is arranged in the air duct (3); the heat sink (1) extends into the air duct (3) and is provided with a plurality of groups of heat dissipation fins (2); a mounting tube (4) is arranged at one end above the air duct (3); the mounting tube (4) is connected to the ventilation cavity; the fan (5) is also arranged on the mounting tube (4); the cleaning component comprises a discharge component and a drive component; the drive component comprises a screw (6), an electric motor (7); and a plurality of cooling fins (2) are arranged on the mounting tube (4). The air duct (3) is provided with a machine (7), a driving plate (8) and a scraper (9), a slide groove is arranged at the center below the inner top wall of the air duct (3), the driving plate (8) is in an inverted T-shape, the upper part of the driving plate (8) extends into the slide groove and is threadedly connected with the screw rod (6), the driving plate (8) is arranged between the inner top wall of the air duct (3) and the heat dissipation fins (2), a scraper (9) is also arranged below the driving plate (8), and a plurality of scraper holes are arranged on the scraper (9) which are compatible with the heat dissipation fins (2), and the exhaust component is also arranged at the other end of the air duct (3).

2. The air-cooled heat pipe radiator for electronic components according to claim 1, characterized in that: The discharge assembly comprises a support frame (10), a lifter (11) and a filter frame (12); the air duct (3) is provided with a discharge groove penetrating the ventilation cavity; the support frame (10) is arranged on the air duct (3); the lifter (11) penetrates the top wall of the support frame (10) and is connected to the top wall of the filter frame (12); and the filter frame (12) is slidably connected to the discharge groove.

3. The air-cooled heat pipe radiator for electronic components according to claim 2, characterized in that: The motor (7) is a servo motor.

4. The air-cooled heat pipe radiator for electronic components according to claim 3, characterized in that: The heat dissipation fins (2) and the heat dissipation holes are arranged in a plurality of groups.

5. The air-cooled heat pipe radiator for electronic components according to claim 4, characterized in that: Arc-shaped grooves for assembling pipes are provided below the heat dissipation plate (1) and the air duct (3).

6. The air-cooled heat pipe radiator for electronic components according to claim 5, characterized in that: The arc-shaped grooves are arranged in a plurality of groups.

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