Silicon wafer feeding device of packaging machine

Abstract

The utility model discloses a silicon wafer feeding device of a packing machine, which relates to the technical field of silicon wafer carrying and comprises a material taking assembly, an arrangement assembly, a detection assembly and a first material moving assembly. The material taking assembly is used for picking up silicon wafers; the arrangement assembly is arranged on a moving path of the material taking assembly, and the arrangement assembly is provided with a first placing position used for bearing and arranging the silicon wafers; the detection assembly is provided with a second placement position for bearing and detecting the silicon wafer; the first material moving assembly is used for transferring silicon wafers, and the moving path of the first material moving assembly covers the arrangement assembly and the detection assembly. According to the silicon wafer feeding device of the packaging machine, automatic stacking and arrangement of silicon wafers can be achieved, and qualified silicon wafers can be screened for equipment plastic package.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer transportation, in particular to a silicon wafer feeding device for a bagging machine. Background Art

[0002] In the process of manufacturing crystalline silicon solar cells, silicon wafers are needed, and the silicon wafers need to be plastic-sealed. When performing the plastic-sealing operation of silicon wafers, the silicon wafers need to be taken out of the material box and stacked, and then tested for abnormalities, and finally placed in the plastic sealing machine for plastic sealing.

[0003] Currently, there is no device that can completely and automatically realize the removal, stacking, inspection and loading of silicon wafers. If it relies on manual operation, the loading efficiency is low and it is easy to make mistakes during operation and damage the silicon wafers. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a silicon wafer feeding device for a packaging machine, which can realize automatic stacking and sorting of silicon wafers and screen qualified silicon wafers for plastic packaging of the equipment.

[0005] The silicon wafer loading device of the bagging machine according to the embodiment of the utility model comprises: a material taking component, the material taking component is used to pick up the silicon wafer;

[0006] A sorting component, the sorting component is arranged on the moving path of the material taking component, and the sorting component has a first placement position for carrying and sorting silicon wafers;

[0007] A detection component, wherein the detection component has a second placement position for carrying and detecting the silicon wafer;

[0008] A first material moving component is used to transfer silicon wafers, and a moving path of the first material moving component covers the sorting component and the detection component.

[0009] The silicon wafer loading device of the packaging machine according to the embodiment of the utility model has at least the following beneficial effects: the material picking component picks up the silicon wafers from the material box and can place them on the sorting component, and the stacked silicon wafers are sorted and arranged by the sorting component, that is, the side edges of the stacked silicon wafers are in the same plane; the first material moving component can transfer the sorted silicon wafers from the sorting component to the detection component for detection. After the detection is passed, the first material moving component can also transfer the silicon wafers to the plastic sealing equipment, so as to realize automatic stacking and sorting of silicon wafers, and screen qualified silicon wafers for plastic sealing by the equipment.

[0010] According to some embodiments of the present invention, a second material moving assembly is provided, a moving path of the second material moving assembly covers the detection assembly, and the second material moving assembly is used to transfer silicon wafers.

[0011] According to some embodiments of the present invention, a transmission component is provided, which is arranged in the moving path of the second material moving component, and the transmission component is used to carry and transport silicon wafers.

[0012] According to some embodiments of the utility model, the sorting component includes a flipping mechanism, a first loading platform and a plurality of limit blocks, the first loading platform is connected to the flipping mechanism, the flipping mechanism is used to drive the first loading platform to switch between a horizontal plane and a vertical plane, and the plurality of limit blocks are arranged on the first loading platform and surround the first placement position.

[0013] According to some embodiments of the present invention, the sorting component further includes a plurality of beating mechanisms, which are arranged around the first placement position, and the beating mechanisms can reciprocate toward the inner side of the first placement position to be used for beating the side edges of the silicon wafer.

[0014] According to some embodiments of the utility model, the flapping mechanism includes a flapping block and a first driving member, the flapping block is connected to the first driving member, the contact surface of the flapping block is parallel to the contact surface of the limit block, and the first driving member can drive the flapping block to move back and forth.

[0015] According to some embodiments of the present invention, the first loading platform is provided with an air blowing mechanism, and the air outlet of the air blowing mechanism faces the first placement position.

[0016] According to some embodiments of the utility model, the blowing mechanism includes a second driving member and a fixed plate, the air outlet is arranged on the fixed plate, the fixed plate is connected to the second driving member, and the second driving member is used to drive the fixed plate to move in a direction perpendicular to the surface of the first loading platform.

[0017] According to some embodiments of the utility model, the material picking assembly includes a driving mechanism and a clamping mechanism, the driving mechanism has a first movable axis arranged along the X direction, a second movable axis arranged along the Z direction, and a third movable axis, wherein the X and Z directions are perpendicular to each other, the angle between the third movable axis and the X direction is an acute angle, and the third movable axis is perpendicular to the Z direction, the clamping mechanism is connected to the driving mechanism, and the clamping mechanism is used to pick up silicon wafers.

[0018] According to some embodiments of the present invention, the clamping mechanism includes a connecting plate, and a plurality of clamping jaws are arranged around the connecting plate. The clamping jaws can be retracted inwardly to clamp the material.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0021] Figure 1 This is a structural schematic diagram of a silicon wafer loading device for a bagging machine according to an embodiment of the utility model;

[0022] Figure 2 It is a schematic diagram of the structure of the first material moving assembly and the second material moving assembly in the embodiment of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the finishing assembly in the embodiment of the utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the flapping mechanism in the embodiment of the utility model;

[0025] Figure 5 This is a structural schematic diagram of the blowing mechanism in the embodiment of the utility model;

[0026] Figure 6 This is a structural schematic diagram of a material taking component in an embodiment of the utility model;

[0027] Figure 7 It is a structural schematic diagram of the clamping mechanism in an embodiment of the utility model.

[0028] Figure Number:

[0029] The material picking assembly 100, the driving mechanism 110, the clamping mechanism 120, the connecting plate 121, the clamping claw member 122, the sorting assembly 200, the flipping mechanism 210, the first loading platform 220, the limit block 230, the slapping mechanism 240, the slapping block 241, the first driving member 242, the blowing mechanism 250, the second driving member 251, the fixing plate 252, the detection assembly 300, the first material moving assembly 400, the second material moving assembly 500, and the transmission assembly 600. DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] In the description of the present invention, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0032] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0034] Reference Figure 1 and Figure 2 As shown, a silicon wafer loading device of a bagging machine according to an embodiment of the utility model comprises a material taking component 100, and the material taking component 100 is used to pick up silicon wafers;

[0035] The arranging component 200 is arranged on the moving path of the material taking component 100, and the arranging component 200 has a first placement position for carrying and arranging silicon wafers;

[0036] A detection assembly 300, the detection assembly 300 has a second placement position for carrying and detecting the silicon wafer;

[0037] The first material moving component 400 is used to transfer silicon wafers, and the moving path of the first material moving component 400 covers the sorting component 200 and the detection component 300.

[0038] The material taking component 100 can take out the silicon wafer from the material box. In this embodiment, it is preferred to take out the silicon wafer by lifting. Specifically, the material taking component 100 takes out the silicon wafer by lifting. The material taking component 100 lifts the silicon wafer from the bottom of the silicon wafer. Since sulfur-free paper is generally arranged between the silicon wafers, the surface of the silicon wafer will not be damaged when the material taking component 100 lifts the silicon wafer from the bottom. When the material taking component 100 lifts the silicon wafer, it will not contact the side of the silicon wafer.

[0039] The silicon wafers picked up by the material taking component 100 will be placed at the first placement position of the sorting component 200. The sorting component 200 will arrange the multiple stacked silicon wafers so that the silicon wafers are neatly stacked, that is, the sides of the silicon wafers are all in the same plane, which is convenient for subsequent inspection operations. After the silicon wafers are stacked, the posture of the silicon wafers can be adjusted, for example, the silicon wafers can be turned to a vertical posture, and the silicon wafers can be moved by gravity so that the sides of the silicon wafers abut against the limiting surface, so that the sides of the silicon wafers can be in the same plane.

[0040] The sorted silicon wafers continue to be transferred by the first material moving component 400. Preferably, the first material moving component 400 also adopts the method of lifting the silicon wafer from the bottom to move the silicon wafer to the second placement position of the detection component 300. While lifting the silicon wafer, the first material moving component 400 will also contact the side of the silicon wafer to prevent the stacked silicon wafers from being scattered again. One of the detection methods is color difference detection. A light source can be set at the second placement position, and the light source is irradiated on the silicon wafer, and then a color difference comparison is performed. The qualified silicon wafer is qualified. The qualified silicon wafer can continue to be transferred by the first material moving component 400, and finally transported to the plastic packaging equipment to complete the loading of the silicon wafer.

[0041] Reference Figure 2 As shown, it can be understood that a second material moving assembly 500 is provided, the moving path of the second material moving assembly 500 covers the detection assembly 300, and the second material moving assembly 500 is used to transfer silicon wafers.

[0042] The second material moving assembly 500 is also used to transfer silicon wafers, but the second material moving assembly 500 is specifically used to transfer abnormal silicon wafers. If the detection assembly 300 detects the presence of an abnormal silicon wafer, the first material moving assembly 400 will no longer operate, and the second material moving assembly 500 will transfer the abnormal silicon wafer. The additional second material moving assembly 500 is provided to handle abnormal silicon wafers, which can simplify the structure of the first material moving assembly 400 and avoid the movement path of the first material moving assembly 400 being too complicated.

[0043] It can be understood that a transmission component 600 is provided, and the transmission component 600 is arranged in the moving path of the second material moving component 500, and the transmission component 600 is used to carry and transport silicon wafers.

[0044] Further, in order to reduce the moving path of the second material moving assembly 500 and improve the mobility of the second material moving assembly 500, a transmission assembly 600 can be further provided to carry and transport abnormal silicon wafers and send the abnormal silicon wafers to a centralized processing position. In this structure, the second material moving assembly 500 is only used to transfer the abnormal silicon wafers between the detection assembly 300 and the transmission assembly 600, and the transmission assembly 600 is used to transport the abnormal silicon wafers. The transmission assembly 600 can use a belt conveyor line, which has a simple structure and is easy to arrange.

[0045] Reference Figure 3As shown, it can be understood that the sorting component 200 includes a flipping mechanism 210, a first loading platform 220 and a plurality of limit blocks 230, the first loading platform 220 is connected to the flipping mechanism 210, the flipping mechanism 210 is used to drive the first loading platform 220 to switch between the horizontal plane and the vertical plane, and the plurality of limit blocks 230 are arranged on the first loading platform 220 and surround a first placement position.

[0046] In the initial posture, the first loading platform 220 is in a horizontal state, the material picking component 100 places multiple silicon wafers on the first loading platform 220, and the silicon wafers are in the first placement position surrounded by multiple limit blocks 230, and then the flipping mechanism 210 is activated to turn the first loading platform 220 from a horizontal state to a vertical state. Under the action of gravity, the silicon wafers move downward and are abutted by the limit blocks 230. The side edges of the silicon wafers collide with the contact surfaces of the limit blocks 230 to achieve the side edges being in the same plane, and the silicon wafers are neatly arranged. Finally, the flipping mechanism 210 turns the first loading platform 220 to a horizontal state again, waiting for the first material moving component 400 to pick them up.

[0047] Reference Figure 4 As shown, it can be understood that the sorting component 200 also includes a plurality of beating mechanisms 240, which are arranged around the first placement position. The beating mechanisms 240 can reciprocate toward the inner side of the first placement position to be used for beating the side of the silicon wafer.

[0048] When the first loading platform 220 is in a vertical state, the flapping mechanism 240 can also flap the sides of the silicon wafers back and forth to promote the rapid arrangement of the silicon wafers. If the adjacent silicon wafers are too close together to form a vacuum area, the silicon wafers cannot be moved due to overcoming gravity, so the flapping mechanism 240 is required to flap the silicon wafers.

[0049] Reference Figure 4 As shown, it can be understood that the flapping mechanism 240 includes a flapping block 241 and a first driving member 242, the flapping block 241 is connected to the first driving member 242, the contact surface of the flapping block 241 is parallel to the contact surface of the limit block 230, and the first driving member 242 can drive the flapping block 241 to move back and forth.

[0050] The first driving member 242 is used to drive the slapping block 241 to move back and forth. The first driving member 242 can be driven by a cylinder. By adjusting the air pressure on both sides of the cylinder piston, the piston can be controlled to extend or retract, so that the slapping block 241 moves back and forth. The contact surface between the slapping block 241 and the silicon wafer is parallel to the contact surface between the limit block 230 and the silicon wafer, so as to assist the limit block 230 in abutting and arranging the silicon wafer.

[0051] It is understandable that the first loading platform 220 is provided with a blowing mechanism 250, and the air outlet of the blowing mechanism 250 faces the first placement position.

[0052] The air blowing mechanism 250 is used to blow air flow to the stacked silicon wafers to reduce the friction between the multiple silicon wafers.

[0053] Reference Figure 5 As shown, it can be understood that in one embodiment, the blowing mechanism 250 includes a second driving member 251 and a fixed plate 252, the air outlet is arranged on the fixed plate 252, the fixed plate 252 is connected to the second driving member 251, and the second driving member 251 is used to drive the fixed plate 252 to move in a direction perpendicular to the surface of the first loading platform 220.

[0054] The second driving member 251 is used to drive the fixing plate 252 to move in a direction perpendicular to the surface of the first loading platform 220 , that is, to move in the direction of the silicon wafer stacking, so that all silicon wafers on the first loading platform 220 can be affected by the airflow blown out by the blowing mechanism 250 .

[0055] Reference Figure 6 As shown, it can be understood that the material picking assembly 100 includes a driving mechanism 110 and a clamping mechanism 120, the driving mechanism 110 has a first moving axis arranged along the X direction, a second moving axis arranged along the Z direction, and a third moving axis, wherein the X and Z directions are perpendicular to each other, the angle between the third moving axis and the X direction is an acute angle, and the third moving axis is perpendicular to the Z direction, and the clamping mechanism 120 is connected to the driving mechanism 110, and the clamping mechanism 120 is used to pick up silicon wafers.

[0056] The driving mechanism 110 is used to drive the clamping mechanism 120 to move in space.

[0057] Let the direction perpendicular to both the X direction and the Z direction be the Y direction, that is, the X, Y, Z coordinate system. The angle between the third movable axis and the X direction is an acute angle rather than a right angle. When the clamping mechanism 120 moves along the third movable axis set in this way, the position of the clamping mechanism 120 in the X direction and the Y direction can be changed at the same time. For example, the adjacent two sides of the silicon wafer in the material box are in contact with the side walls of the material box. When the clamping mechanism 120 picks up the silicon wafer and moves along the third movable axis, it can control the silicon wafer to change the position in the X direction and the Y direction at the same time, that is, the two sides of the silicon wafer are away from the side walls of the material box at the same time. The subsequent movement of the clamping mechanism 120 along the second movable axis can remove the silicon wafer from the material box without scratching, thereby avoiding damage to the silicon wafer.

[0058] Reference Figure 7 As shown, it can be understood that the clamping mechanism 120 includes a connecting plate 121, and a plurality of clamping jaws 122 are arranged around the connecting plate 121. The clamping jaws 122 can be retracted inwardly to clamp the material.

[0059] The plurality of clamping jaws 122 can be retracted inwards to surround and clamp the silicon wafer. Compared with the suction cup structure to absorb the silicon wafer, the clamping jaws 122 can clamp multiple stacked silicon wafers at a time, which is more efficient in transporting the silicon wafer and does not need to touch the surface of the silicon wafer, further protecting the silicon wafer.

[0060] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A silicon wafer feeding device for a bagging machine, characterized in that: include: A material picking assembly (100), the material picking assembly (100) being used to pick up silicon wafers; A tidying component (200), the tidying component (200) being arranged on a moving path of the material taking component (100), the tidying component (200) having a first placement position for carrying and tidying up silicon wafers; A detection component (300), wherein the detection component (300) has a second placement position for carrying and detecting a silicon wafer; A first material moving component (400), the first material moving component (400) is used to transfer silicon wafers, and the moving path of the first material moving component (400) covers the sorting component (200) and the detection component (300).

2. The silicon wafer loading device for a bagging machine according to claim 1, characterized in that: A second material moving component (500) is provided, the moving path of the second material moving component (500) covers the detection component (300), and the second material moving component (500) is used to transfer silicon wafers.

3. The silicon wafer loading device for a bagging machine according to claim 2, characterized in that: A transmission component (600) is provided, and the transmission component (600) is arranged on the moving path of the second material moving component (500), and the transmission component (600) is used to carry and transport silicon wafers.

4. The silicon wafer loading device for a bagging machine according to claim 1, characterized in that: The sorting component (200) comprises a flipping mechanism (210), a first loading platform (220) and a plurality of limit blocks (230); the first loading platform (220) is connected to the flipping mechanism (210); the flipping mechanism (210) is used to drive the first loading platform (220) to switch between a horizontal plane and a vertical plane; the plurality of limit blocks (230) are arranged on the first loading platform (220) and surround the first placement position.

5. The silicon wafer loading device for a bagging machine according to claim 4, characterized in that: The arranging component (200) further comprises a plurality of beating mechanisms (240), wherein the plurality of beating mechanisms (240) are arranged around the first placement position, and the beating mechanisms (240) can reciprocate toward the inner side of the first placement position to be used for beating the side edges of the silicon wafer.

6. The silicon wafer loading device for a bagging machine according to claim 5, characterized in that: The flapping mechanism (240) comprises a flapping block (241) and a first driving member (242), wherein the flapping block (241) is connected to the first driving member (242), a contact surface of the flapping block (241) is parallel to a contact surface of the limit block (230), and the first driving member (242) can drive the flapping block (241) to move back and forth.

7. The silicon wafer loading device for a bagging machine according to claim 4, characterized in that: The first material loading platform (220) is provided with an air blowing mechanism (250), and the air outlet of the air blowing mechanism (250) faces the first placement position.

8. The silicon wafer loading device for a bagging machine according to claim 7, characterized in that: The blowing mechanism (250) comprises a second driving member (251) and a fixed plate (252), the air outlet is arranged on the fixed plate (252), the fixed plate (252) is connected to the second driving member (251), and the second driving member (251) is used to drive the fixed plate (252) to move in a direction perpendicular to the surface of the first loading platform (220).

9. The silicon wafer loading device for a bagging machine according to claim 1, characterized in that: The material picking assembly (100) comprises a driving mechanism (110) and a clamping mechanism (120), wherein the driving mechanism (110) has a first movable axis arranged along the X direction, a second movable axis arranged along the Z direction, and a third movable axis, wherein the X and Z directions are perpendicular to each other, the angle between the third movable axis and the X direction is an acute angle, and the third movable axis is perpendicular to the Z direction, and the clamping mechanism (120) is connected to the driving mechanism (110), and the clamping mechanism (120) is used to pick up silicon wafers.

10. The silicon wafer loading device for a bagging machine according to claim 9, characterized in that: The clamping mechanism (120) comprises a connecting plate (121), and a plurality of clamping jaws (122) are arranged around the connecting plate (121). The clamping jaws (122) can be retracted inwards to clamp materials.

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