Uniform temperature flow channel of TPAK power device

Abstract

A uniform-temperature flow channel of a TPAK power device comprises a heat dissipation bottom plate, a heat dissipation water channel covering the heat dissipation bottom plate and a plurality of chips welded on the heat dissipation water channel, the heat dissipation water channel comprises a body, an inlet formed in one side of the body, and an outlet formed in the other side of the body. The inlet is formed in the body, the outlet is formed in the side, away from the inlet, of the body, the first area is formed in the body, the second area is formed in one side of the first area, and the third area is formed in one side of the second area. The flow channel controls the flowing water flow speed in the first area, the second area and the third area through the first interval and the second interval, the first area, the second area and the third area correspond to three phases of the TPAK double-row double-tube power device respectively, and therefore the temperature difference between chips corresponding to the areas is reduced. The flow channel not only can improve the overall flowing water flow velocity, but also can reduce the temperature difference between the chips.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of power modules, in particular to a temperature-averaging flow channel of a TPAK power device. Background Art

[0002] The power module is a power electronic device that is combined with certain functions and then encapsulated into a module. With the rapid development of modern science and technology, the market demand for power modules is increasing rapidly, and the heat dissipation effect of the power module will affect the use of the module, so the heat dissipation problem of the power module has become a top priority. For example, Chinese patent CN201721513164.X discloses an IGBT power module and a power module comprising it, which includes a plurality of IGBT power module submodules and two cooling substrates, and the plurality of IGBT power module submodules are arranged along the length direction of the cooling substrate at a predetermined interval and encapsulated between the two cooling substrates through a package body, and the cooling substrate includes a first cooling substrate and a second cooling substrate, and the first cooling substrate and the second cooling substrate are formed with a cooling portion consisting of a plurality of protrusions on the surface that does not contact the IGBT power module submodule, and the first cooling substrate and the second cooling substrate are respectively provided with openings at both ends that are interconnected to form a first water guide port and a second water guide port respectively. The module reduces the risk of overheating failure and improves the output electrical performance of the power module through uniform contact between the coolant and the wing pins. However, since the coolant undergoes heat exchange after entering from the inlet, the temperature of the coolant rises near the outlet, resulting in a decrease in the heat dissipation effect. This causes a large temperature difference in the chips on the module, uneven temperature distribution, and reduced outflow capacity. Utility Model Content

[0003] In view of this, the utility model provides a temperature-averaging flow channel for a TPAK power device to solve the above-mentioned problem.

[0004] A temperature-averaging flow channel for a TPAK power device comprises a heat dissipation base plate, a heat dissipation water channel covered on the heat dissipation base plate, and a plurality of chips welded on the heat dissipation water channel, wherein the heat dissipation water channel comprises a body, an inlet opened on one side of the body, an outlet opened on a side of the body away from the inlet, a first area opened on the body, a second area opened on one side of the first area, and a third area opened on one side of the second area, wherein two outer side walls of the first area are provided with obliquely arranged ramps, the ramp of the ramps gradually shrinks with the flow of water, a first opening is provided between the middle section of the ramp and the first area, a second opening is provided between the end of the ramp away from the inlet and the second area, the width of the first opening is greater than the width of the second opening, a first spacing is provided between the first and second areas, a second spacing is provided between the second and third areas, and the width of the second spacing is less than the width of the first spacing.

[0005] Furthermore, a plurality of heat dissipation fins are arranged at intervals on one side of the heat dissipation bottom plate facing the heat dissipation water channel.

[0006] Furthermore, the shape of the heat dissipating fins may be cylindrical, elliptical or raindrop-shaped.

[0007] Furthermore, a plurality of the heat dissipation fins are arranged to form six areas.

[0008] Furthermore, a side of the main body having the first region abuts against and is fixedly connected to a side of the heat dissipation base plate having the heat dissipation fins.

[0009] Compared with the prior art, the temperature-averaging flow channel of the TPAK power device provided by the utility model controls the flow rate of the water in the first, second and third regions through the first and second spacings, and the first, second and third regions correspond to each of the three phases of the TPAK double-row double-tube power device, so as to reduce the temperature difference between the chips corresponding to each region. The temperature-averaging flow channel can not only increase the overall flow rate of the water and reduce the overall junction temperature, but also reduce the temperature difference between the chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of the structure of the temperature-averaging flow channel of the TPAK power device provided by the utility model.

[0011] Figure 2 for Figure 1 A schematic plan view of the heat dissipation base plate of the temperature-averaging flow channel of the TPAK power device.

[0012] Figure 3 for Figure 1Schematic diagram of the structure of the heat dissipation channel of the TPAK power device's temperature equalizing channel. DETAILED DESCRIPTION

[0013] The following is a further detailed description of the specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0014] like Figure 1 As shown, it is a schematic diagram of the structure of the temperature-averaging flow channel of the TPAK power device provided by the utility model. The temperature-averaging flow channel of the TPAK power device includes a heat dissipation base plate 10, a heat dissipation channel 20 covered on the heat dissipation base plate 10, and a plurality of chips 30 welded on the heat dissipation channel 20. It can be imagined that the temperature-averaging flow channel of the TPAK power device also includes some other functional modules, such as electrical device modules, power supply modules, etc., which are technologies well known to those skilled in the art and will not be described one by one here.

[0015] Please also read Figures 2 to 3 It should be noted that the TPAK double-row double-tube power device of the present invention is composed of three phases, and the upper and lower bridges in each phase are respectively connected in parallel by two of the chips 30, so as to achieve the required current output capacity of the power module.

[0016] A plurality of heat dissipation fins 11 are arranged at intervals on one side of the heat dissipation base plate 10 facing the heat dissipation water channel 20. The shape of the heat dissipation fins 11 can be cylindrical, elliptical or raindrop-shaped. The plurality of heat dissipation fins 11 are arranged to form six areas, which correspond to the upper and lower bridges of the three phases in the TPAK double-row double-tube power device, and specifically, the heat dissipation fins 11 in one area correspond to two chips 30 connected in parallel.

[0017] The heat dissipation water channel 20 includes a main body 21, an inlet 22 opened on one side of the main body 21, an outlet 23 opened on a side of the main body 21 away from the inlet 22, a first area 24 opened on the main body 21, a second area 25 opened on one side of the first area 24, and a third area 26 opened on one side of the second area 25.

[0018] The side of the main body 21 having the first area 24 is abutted and fixedly connected to the side of the heat dissipation base plate 10 having the heat dissipation fins 11, so that the heat dissipation fins 11 can be respectively located in the first, second and third areas 24, 25 and 26, so that the water flowing into the first, second and third areas 24, 25 and 26 can pass through the heat dissipation fins 11, thereby achieving a heat dissipation effect.

[0019] Water flows in from the inlet 22 , passes through the first, second and third areas 24 , 25 and 26 , and then flows out from the outlet 23 .

[0020] The first, second and third regions 24 , 25 and 26 correspond to each of the three phases of the TPAK double-row double-tube power device, and each contains two groups of regions consisting of a plurality of the heat dissipation fin pins 11 .

[0021] The two outer side walls of the first area 24 are provided with obliquely arranged ramps 27. A first opening 271 is provided between the middle section of the ramp 27 and the first area 24, and a second opening 272 is provided between the end of the ramp 27 away from the inlet 22 and the second area 25. The width of the first opening 271 is greater than the width of the second opening 272, thereby accelerating the flow rate of water flowing into the second area 25, so that the heat dissipation effect in the second area 25 is stronger than the heat dissipation effect in the first area 24. The ramp of the ramp 27 gradually shrinks with the water flow, thereby accelerating the flow rate of water flowing into the first and second areas 24 and 25. And because the ramp 27 at the second opening 272 is higher than the ramp 27 at the first opening 271, the flow rate of water flowing into the second area 25 is stronger than the flow rate of water flowing into the first area 24, thereby further improving the heat dissipation effect in the second area 25, so that the heat dissipation effect in the second area 25 is stronger than the heat dissipation effect in the first area 24.

[0022] There is a first spacing 28 between the first and second regions 24, 25, and the width of the first spacing 28 can affect the flow distribution between the first and second regions 24, 25, so that the flow velocity changes in the first and second regions 24, 25 can be controlled, and the difference in heat dissipation effects between the first and second regions 24, 25 can be controlled, so that the temperature difference between the chips 30 corresponding to the first and second regions 24, 25 can be controlled to reduce the temperature difference between the chips 30.

[0023] There is a second spacing 29 between the second and third regions 25 and 26, and the width of the second spacing 29 is smaller than the width of the first spacing 28, so that the flow rate of water in the third region 26 is faster than that in the second region 25, so that the heat dissipation effect of the heat dissipation fins 11 in the third region 26 is stronger than that of the heat dissipation fins 11 in the second region 25. And the width of the second spacing 29 directly affects the flow rate of water in the third region 26, so that the heat dissipation effect of the heat dissipation fins 11 in the third region 26 is controlled, thereby reducing the temperature difference between the chips 30 corresponding to the second and third regions 25 and 26.

[0024] The chip 30 is welded to a side of the heat dissipation base plate 10 away from the heat dissipation fin pins 11 . The chip 30 itself is a prior art, and its working principle is not described in detail here.

[0025] Compared with the prior art, the temperature-averaging flow channel of the TPAK power device provided by the present invention controls the flow rate of the water in the first, second and third regions 24, 25 and 26 through the first and second spacings 28 and 29, and the first, second and third regions 24, 25 and 26 correspond to each of the three phases of the TPAK double-row double-tube power device, so as to reduce the temperature difference between the chips 30 corresponding to each region. The temperature-averaging flow channel can not only increase the overall flow rate of the water and reduce the overall junction temperature, but also reduce the temperature difference between the chips 30.

[0026] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A temperature-averaging channel for a TPAK power device, characterized in that: The temperature-averaging flow channel of the TPAK power device includes a heat dissipation base plate, a heat dissipation water channel covered on the heat dissipation base plate, and a plurality of chips welded on the heat dissipation water channel. The heat dissipation water channel includes a body, an inlet opened on one side of the body, an outlet opened on a side of the body away from the inlet, a first area opened on the body, a second area opened on one side of the first area, and a third area opened on one side of the second area. The two outer side walls of the first area are provided with obliquely arranged ramps, and the ramp of the ramp gradually shrinks with the water flow. A first opening is provided between the middle section of the ramp and the first area, and a second opening is provided between the end of the ramp away from the inlet and the second area. The width of the first opening is greater than the width of the second opening. A first spacing is provided between the first and second areas, and a second spacing is provided between the second and third areas. The width of the second spacing is less than the width of the first spacing.

2. The temperature-averaging channel of the TPAK power device according to claim 1, characterized in that: A plurality of heat dissipation fin pins are arranged at intervals on one side of the heat dissipation bottom plate facing the heat dissipation water channel.

3. The temperature-averaging channel of the TPAK power device according to claim 2, characterized in that: The heat dissipation fin pins may be in the shape of a cylinder, an elliptical cylinder or a raindrop.

4. The temperature-averaging channel of the TPAK power device according to claim 2, characterized in that: A plurality of the heat dissipation fins are arranged to form six areas.

5. The temperature-averaging channel of the TPAK power device according to claim 2, characterized in that: The side of the main body having the first area abuts against and is fixedly connected to the side of the heat dissipation base plate having the heat dissipation fins.

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