CEM connector, circuit board assembly and computing device

Abstract

The embodiment of the utility model provides a CEM connector, a circuit board assembly and computing equipment. The CEM connector includes a housing and two rows of conductive pins. The shell comprises a top, a bottom and a circuit board slot. The circuit board slot is provided with a plug-in port located at the top. And along the width direction of the circuit board slot, one row of conductive pins and the other row of conductive pins are arranged at intervals. The conductive pins comprise an inner pin and an outer pin. The inner pins face the circuit board slot. And the outer pin penetrates out of the bottom. The outer pin comprises a pin root part and a pin toe part. The pin toe part is connected to the end part of the pin root part away from the bottom part. In the width direction of the circuit board slot, the toe leading parts of one row of conductive pins and the toe leading parts of the other row of conductive pins extend oppositely. According to the CEM connector, the circuit board assembly and the computing device provided by the embodiment of the invention, the difficulty of arranging the CEM connector on the board edge of the circuit board can be reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of computing devices, and in particular to a CEM connector, a circuit board assembly, and a computing device. Background Art

[0002] The computing device includes a circuit board and an electrical connector. The electrical connector is connected to the circuit board. When the external circuit board and the electrical connector are electrically connected, signals can be transmitted between the external circuit board and the electrical connector, for example, high-speed signals can be transmitted. The electrical connector can be a CEM (card electromechanical) connector. The CEM connector includes a housing and two rows of external pins. The external pins are located at the bottom of the housing. The circuit board includes conductive contacts and metal leads. For a CEM connector, two rows of conductive contacts need to be correspondingly arranged on the circuit board. The correspondingly arranged external pins are welded to the conductive contacts. The correspondingly arranged metal leads are connected to the conductive contacts, and the metal leads extend in a direction away from the housing. Signals can be transmitted between the metal leads, the conductive contacts and the external pins.

[0003] However, since the metal leads are located outside the conductive contacts, when the CEM connector needs to be set at the edge of the circuit board, the wiring space between the conductive contacts and the edge of the circuit board is small, which increases the difficulty of leading out the metal leads, and even makes it impossible to set the metal leads, thereby increasing the difficulty of setting the CEM connector at the edge of the circuit board. Therefore, how to effectively reduce the difficulty of setting the CEM connector at the edge of the circuit board in a computing device has become an urgent problem to be solved. Utility Model Content

[0004] The embodiments of the present application provide a CEM connector, a circuit board assembly, and a computing device, which are helpful in reducing the difficulty of setting a CEM connector on the edge of a circuit board.

[0005] A first aspect of an embodiment of the present application provides a CEM connector, which includes a housing and two rows of conductive pins.

[0006] The housing comprises a top, a bottom and a circuit board slot. The circuit board slot has an insertion interface located at the top.

[0007] Along the width direction of the circuit board slot, one row of conductive pins is arranged at intervals from another row of conductive pins. The conductive pins include inner pins and outer pins. The inner pins are arranged facing the circuit board slot. The outer pins pass through the bottom. The outer pins include a pin root and a pin toe. The pin toe is connected to the end of the pin root away from the bottom. Along the width direction of the circuit board slot, the pin toes of one row of conductive pins extend toward the pin toes of another row of conductive pins.

[0008] The CEM connector of the embodiment of the present application includes a shell and conductive pins. Two rows of conductive pins are arranged at the bottom of the CEM connector. The outer pins of the conductive pins are folded inward. Along the width direction of the shell, the pin roots of the outer pins are inclined toward the central area of ​​the bottom, and the pin toes extend toward the central area of ​​the bottom along the width direction of the shell. Along the width direction of the circuit board slot, the pin toes of one row of conductive pins and the pin toes of another row of conductive pins extend toward each other. Two rows of conductive contacts and corresponding metal leads are correspondingly arranged on the circuit board adapted to the CEM connector. Along the width direction of the shell, the spacing between the two rows of pin toes is relatively small, so that the spacing between the two rows of conductive contacts correspondingly arranged on the circuit board is relatively small. At the same time, the metal leads on the circuit board can be arranged between the two rows of conductive contacts, that is, the metal leads are led out from the inner side of the conductive contacts, so that the metal leads can use the board surface between the two rows of conductive contacts without occupying the board surface outside the conductive contacts.

[0009] When the CEM connector is connected to the edge of the circuit board, the long side of the CEM connector is close to the edge of the circuit board. Two rows of conductive contacts are set corresponding to the area close to the edge of the circuit board. The metal lead is located below the bottom of the housing. Since the metal lead can be set between the two rows of conductive contacts, when the space between the conductive contact and the edge of the board is small, the conductive contact can still transmit the signal through the metal lead, thereby effectively solving the problem of difficulty in setting the metal lead in the space between the conductive contact and the edge of the board, reducing the difficulty of setting the CEM connector on the edge of the circuit board, and at the same time, there is no need to use the POFV process to change the layer to lead out the metal routing, reducing the difficulty of processing and manufacturing, and saving processing costs.

[0010] In addition, along the width direction of the shell, the spacing between the toes of the two rows of pins is relatively small, so that the spacing between the two corresponding rows of conductive contacts on the circuit board is relatively small, so that the board area occupied by the two rows of conductive contacts is smaller, and at the same time, the metal routing does not occupy the board area outside the conductive contacts, so that the board area utilization rate of the circuit board is relatively high, effectively avoiding board area waste, which is conducive to reducing the production cost of the circuit board.

[0011] In a possible implementation, along the depth direction of the circuit board slot, the orthographic projection of the outer pin is located within the orthographic projection of the bottom.

[0012] Along the width direction of the housing, the outer pins will not exceed the edge of the bottom at any position. When the CEM connector is connected to the circuit board, the outer pins are located in the gap between the CEM connector and the circuit board as a whole, so that the outer pins are not easily scratched, squeezed or electrically connected with the components arranged around the CEM connector on the circuit board, which is conducive to ensuring that the CEM connector and the circuit board can maintain normal working conditions after being connected.

[0013] In a possible implementation manner, along the width direction of the circuit board slot, the root of the pin is arranged close to the edge of the bottom.

[0014] One connection process between the CEM connector and the circuit board may be to align the pin toe of the CEM connector with the conductive contact of the circuit board, and then solder the pin toe to the conductive contact using a soldering process. The arrangement of the pin toe relatively close to the bottom edge facilitates the operator to observe the alignment state and soldering state of the pin toe and the conductive contact, and facilitates the operation to separate the pin toe from the conductive contact and remove the CEM connector in the event of damage to the CEM connector.

[0015] In a possible implementation manner, one row of conductive pins is symmetrically arranged with respect to another row of conductive pins.

[0016] The structural design of one row of conductive pins is the same as the structural design of another row of conductive pins, thereby effectively reducing the difficulty of processing the conductive pins themselves, and also effectively reducing the difficulty of assembling the conductive pins and the housing to form a CEM connector.

[0017] In a possible implementation manner, there is a gap between the pin toe and the bottom.

[0018] One connection process between the CEM connector and the circuit board may be to solder the pin toe to the conductive contact using a soldering process. During the soldering process, the solder will cover the pin toe of the outer pin. In the case where a gap is provided between the pin toe and the bottom, a space for avoiding solder can be formed between the pin toe and the bottom, so that during the soldering process, the solder is not easy to contact the shell and burn the shell.

[0019] A second aspect of an embodiment of the present application provides a circuit board assembly, which includes a CEM connector and a circuit board.

[0020] The CEM connector includes a housing and two rows of conductive pins. The housing includes a top, a bottom, and a circuit board slot. The circuit board slot has an insertion interface located at the top. Along the width direction of the circuit board slot, one row of conductive pins is arranged at intervals from another row of conductive pins. The conductive pins include inner pins and outer pins. The inner pins are arranged facing the circuit board slot. The outer pins pass through the bottom. The outer pins include a pin root and a pin toe. The pin toe is connected to the end of the pin root away from the bottom. Along the width direction of the circuit board slot, the pin toes of one row of conductive pins extend toward the pin toes of another row of conductive pins.

[0021] The circuit board includes connected conductive contacts and metal leads. Along the width direction of the circuit board slot, one row of conductive contacts is arranged at intervals from another row of conductive contacts. A metal lead is arranged between the two rows of conductive contacts. The outer pins are located between the bottom and the circuit board. The correspondingly arranged two rows of pin toes are respectively connected to the two rows of conductive contacts.

[0022] In a possible implementation, the conductive contact extends beyond the bottom of the housing along the width direction of the circuit board slot.

[0023] When observing the outside of the circuit board assembly, the extension of the conductive contact can be observed. One connection process between the CEM connector and the circuit board can be to solder the pin toe to the conductive contact using a soldering process. The arrangement of the conductive contact extending beyond the bottom makes it easier for an operator to observe the alignment state of the pin toe and the conductive contact and the soldering state.

[0024] In a possible implementation, the pin toe is welded to the conductive contact, thereby ensuring a high mechanical connection strength between the pin toe and the conductive contact, and also helping to reduce the difficulty of connecting the pin toe and the conductive contact.

[0025] A third aspect of an embodiment of the present application provides a computing device, which includes a circuit board assembly.

[0026] The circuit board assembly includes a CEM connector and a circuit board. The CEM connector includes a housing and two rows of conductive pins. The housing includes a top, a bottom and a circuit board slot. The circuit board slot has an insertion interface located at the top. Along the width direction of the circuit board slot, one row of conductive pins is arranged at intervals with another row of conductive pins. The conductive pins include inner pins and outer pins. The inner pins are arranged facing the circuit board slot. The outer pins pass through the bottom. The outer pins include a pin root and a pin toe. The pin toe is connected to the end of the pin root away from the bottom. Along the width direction of the circuit board slot, the pin toes of one row of conductive pins extend toward the pin toes of another row of conductive pins. The circuit board includes connected conductive contacts and metal leads. Along the width direction of the circuit board slot, one row of conductive contacts is arranged at intervals with another row of conductive contacts. A metal lead is arranged between the two rows of conductive contacts. The outer pins are located between the bottom and the circuit board. The two rows of pin toes arranged correspondingly are respectively connected to the two rows of conductive contacts.

[0027] In a possible implementation, the computing device further includes an external circuit board. The external circuit board includes a plug-in terminal and a gold finger disposed on the plug-in terminal. The plug-in terminal is plugged into a circuit board slot. The corresponding inner pin is electrically connected to the gold finger. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram of a partial structure of a computing device provided in an embodiment of the present application;

[0029] Figure 2 A schematic diagram of a partial structure of a computing device provided in an embodiment of the present application;

[0030] Figure 3 A schematic diagram of a partial structure of a CEM connector provided in an embodiment of the present application;

[0031] Figure 4 A schematic diagram of a partial structure of a CEM connector provided in an embodiment of the present application;

[0032] Figure 5 A schematic diagram of a partial cross-sectional structure of a CEM connector provided in an embodiment of the present application;

[0033] Figure 6 A schematic diagram of a partial exploded structure of a circuit board assembly provided in an embodiment of the present application;

[0034] Figure 7 A schematic diagram of a partial structure of a circuit board assembly provided in an embodiment of the present application;

[0035] Figure 8 A schematic diagram of a partial structure of a circuit board assembly provided in an embodiment of the present application;

[0036] Fig. 9 A schematic diagram of a partial structure of an external circuit board provided in an embodiment of the present application;

[0037] Fig.10 A schematic diagram of a partial cross-sectional structure of the electrical connection between an external circuit board and a circuit board assembly provided in an embodiment of the present application.

[0038] Reference numerals:

[0039] 10. CEM connector;

[0040] 20. Shell;

[0041] 21. Top;

[0042] 22. Bottom;

[0043] 23. Circuit board slot;

[0044] 30. Conductive pins;

[0045] 31. Inner pins;

[0046] 32, external pin; 321, pin root; 322, pin toe;

[0047] 100. Computing equipment;

[0048] 110, box body;

[0049] 120, external circuit board; 121, plug-in terminal; 122, gold finger;

[0050] 200. Circuit board assembly;

[0051] 210, circuit board; 211, conductive contact; 212, metal lead;

[0052] X, width direction;

[0053] Y, length direction;

[0054] Z, depth direction. DETAILED DESCRIPTION

[0055] The embodiment of the present application provides a computing device, which may be a switch, a rack server, a blade server, a tower server, a whole cabinet server, or other devices with computing functions, and the embodiment of the present application does not specifically limit the form of the computing device.

[0056] Figure 1 A partial structure of the computing device 100 is schematically shown. Figure 2 The partial structure of the computing device 100 is schematically shown. Figure 1 and Figure 2 As shown, the computing device 100 provided in the embodiment of the present application may include a case 110 and a power supply device. The case 110 includes a storage space. The power supply device may be arranged in the storage space of the case 110. The case 110 may include a connected shell and a top cover. The shell and the top cover are detachably connected. Specifically, the shell may include a bottom plate and a side plate.

[0057] The computing device 100 of the embodiment of the present application may further include a circuit board assembly 200. The circuit board assembly 200 may include a circuit board 210. The circuit board 210 may be a printed circuit board (PCB). Exemplarily, the circuit board 210 may be, but is not limited to, a mainboard. A variety of components are arranged on the circuit board 210. The components on the circuit board 210 may include, but are not limited to, a chip or a memory. The circuit board 210 may be arranged in the housing 110. The power supply device may be used to supply power to the components on the circuit board 210.

[0058] The computing device 100 of the embodiment of the present application may further include an electrical connector. The electrical connector may be used as an external interface. The electrical connector is disposed on the circuit board 210. The electrical connector may be disposed on the edge of the circuit board 210 or in the inner area of ​​the circuit board 210. Signal transmission may be achieved between the circuit board 210 and the electrical connector. The electrical connector of the embodiment of the present application may be a CEM (card electromechanical) connector 10.

[0059] The computing device 100 of the embodiment of the present application may further include an external circuit board 120. The external circuit board 120 may be connected or separated with the corresponding CEM connector 10 in a plug-in manner. After the external circuit board 120 is docked with the corresponding CEM connector 10, signal transmission may be achieved between the external circuit board 120 and the corresponding CEM connector 10.

[0060] The external circuit board 120 may be a printed circuit board. Exemplarily, the external circuit board 120 may be, but is not limited to, an expansion card, an adapter board, or a sub-board. A variety of components are arranged on the external circuit board 120. The components on the external circuit board 120 may include, but are not limited to, capacitors, resistors, or memory. The power supply device may be used to supply power to the components on the external circuit board 120.

[0061] In the related art, the CEM connector includes a housing and two rows of external pins. The external pins of the CEM connector are used to connect to the conductive contacts on the circuit board. For a CEM connector, two rows of conductive contacts need to be set on the circuit board. Each conductive contact needs to be set with a corresponding metal lead. The metal lead is led out from the outside of the conductive contact. The ends of the correspondingly set external pins and the conductive contacts are connected to each other. In one scenario, the CEM connector needs to be set close to the edge of the circuit board. However, since the metal lead is located on the outside of the conductive contact, when the CEM connector needs to be set at the edge of the circuit board, the wiring space between the conductive contact and the edge of the circuit board is small, resulting in increased difficulty in setting the metal lead in the space between the conductive contact and the edge of the board. One solution to the above problem is that the conductive contact does not use the metal lead to transmit the signal, but uses the POFV (plate over filled via) process to form a metal via at the conductive contact to achieve the layer change and lead out the metal routing. However, the POFV process refers to the resin plug hole electroplating filling process. The POFV process is relatively complex and has high processing costs. In another scenario, the CEM connector needs to be set in the in-board area of ​​the circuit board, that is, the position of the CEM connector is relatively far away from the edge of the circuit board. However, the ends of the outer pins of the CEM connector are folded outward, so that there is a large gap between the ends of one row of outer pins and the ends of another row of outer pins. Since the two rows of conductive contacts on the circuit board need to be arranged corresponding to the two rows of outer pins, there is a large gap between the two rows of conductive contacts on the circuit board, so that the board area occupied by the two rows of conductive contacts is large. At the same time, the metal leads need to be led out from the outside of the conductive contacts, so that the metal leads will also occupy the board surface. The utilization rate of the circuit board surface is relatively low, resulting in waste of board surface and increasing the production cost of the circuit board.

[0062] The CEM connector 10 of the embodiment of the present application includes two rows of conductive pins. The ends of the conductive pins located outside the housing are folded inward, so that there is a relatively small distance between the ends of one row of conductive pins and the ends of the other row of outer pins. Since the two rows of conductive contacts on the circuit board need to be arranged corresponding to the two rows of outer pins, there is a relatively small distance between the two rows of conductive contacts on the circuit board, so that the board area occupied by the two rows of conductive contacts is small. At the same time, the metal lead can be led out from the inside of the conductive contact, so that the metal lead can utilize the board surface between the two rows of conductive contacts, and will not occupy the board surface outside the conductive contact.

[0063] Figure 3 and Figure 4 Partial structures of the CEM connector 10 are schematically shown respectively. Figure 5 The partial cross-sectional structure of the CEM connector 10 is schematically shown. Figures 3 to 5 As shown, the CEM connector 10 of the embodiment of the present application includes a housing 20. The housing 20 is a structural member with a predetermined length, width and height. The housing 20 may be an insulating structural member. The housing 20 may include a top 21, a bottom 22 and a circuit board slot 23. Along the height direction of the housing 20, the top 21 and the bottom 22 of the housing 20 are arranged opposite to each other. When the CEM connector 10 is arranged on the circuit board 210, the bottom 22 of the housing 20 faces the circuit board 210, and the top 21 of the housing 20 faces away from the circuit board 210. The circuit board slot 23 has a plug interface located at the top 21. The circuit board slot 23 is a docking space for docking with an external circuit board 120. The plug interface of the circuit board slot 23 is used for inserting the external circuit board 120. The depth direction Z of the circuit board slot 23 is the same as the height direction of the housing 20. The width direction X of the circuit board slot 23 is the same as the width direction of the housing 20. The length direction Y of the circuit board slot 23 is the same as the length direction of the housing 20.

[0064] The CEM connector 10 of the embodiment of the present application further includes conductive pins 30. Two rows of conductive pins 30 are arranged on the housing 20. One row of conductive pins 30 is arranged alternately with another row of conductive pins 30 along the width direction X of the circuit board slot 23. One row of conductive pins 30 and another row of conductive pins 30 are in a non-electrically connected state with each other.

[0065] The conductive pin 30 includes an inner pin 31 and an outer pin 32. The inner pin 31 and the outer pin 32 are connected to each other. The inner pin 31 is located inside the housing 20. The inner pin 31 is arranged facing the circuit board slot 23. The inner pin 31 can be observed when observed from the plug interface of the circuit board slot 23. The housing 20 can form a protection for the inner pin 31 to effectively isolate the inner pin 31, reduce the possibility of accidental electrical connection between the inner pin 31 and other conductive structural parts, or reduce the possibility of deformation of the inner pin 31 due to accidental impact or extrusion of the inner pin 31 by other structural parts. The outer pin 32 of the conductive pin 30 can pass through the bottom 22 of the housing 20. The outer pin 32 is located outside the housing 20, so that the outer pin 32 can be observed when observed from the bottom of the CEM connector 10.

[0066] In some embodiments, the material of the housing 20 may be plastic or plastic. The material of the conductive pins 30 may be copper or copper alloy.

[0067] In the present application examples, see Figure 4 and Figure 5 As shown, the outer pin 32 includes a pin root 321 and a pin toe 322. The pin root 321 is arranged near the bottom 22 of the housing 20. The pin toe 322 is connected to the end of the pin root 321 away from the bottom 22. Along the width direction X of the circuit board slot 23, the pin toes 322 of one row of conductive pins 30 and the pin toes 322 of another row of conductive pins 30 extend toward each other, that is, the two rows of pin toes 322 extend toward each other, so that along the width direction X of the circuit board slot 23, the spacing between the pin toes 322 of one row of conductive pins 30 and the pin toes 322 of another row of conductive pins 30 is relatively small.

[0068] Along the width direction X of the circuit board slot 23, the pin toe 322 extends toward the central area of ​​the bottom 22. The extension direction of the pin root 321 is different from the extension direction of the pin toe 322. The pin toe 322 is folded toward the central area of ​​the bottom 22 relative to the pin root 321, that is, the pin toe 322 is folded inward relative to the pin root 321. Exemplarily, the pin root 321 can extend along the width direction and the height direction of the housing 20 at the same time, so that the pin root 321 is inclined relative to the bottom 22 of the housing 20. The pin toe 322 can extend along the width direction of the housing 20.

[0069] In the embodiment of the present application, Figure 6 A partial exploded structure of the circuit board assembly 200 is schematically shown. Figure 7 The partial structure of the circuit board assembly 200 is schematically shown. Figure 2 , Figure 6 and Figure 7As shown, the CEM connector 10 and the circuit board 210 can be assembled to form a circuit board assembly 200. The circuit board 210 includes connected conductive contacts 211 and metal leads 212. Along the width direction X of the circuit board slot 23, one row of conductive contacts 211 is spaced apart from another row of conductive contacts 211, and the metal leads 212 are arranged between the two rows of conductive contacts 211. The metal leads 212 are located on the inner side of the conductive contacts 211, so that the metal leads 212 can reuse the board surface between the two rows of conductive contacts 211. The external pins 32 are located between the bottom 22 of the housing 20 and the circuit board 210. The corresponding pin toes 322 are connected to the conductive contacts 211. Specifically, one pin toe 322 is electrically connected to a correspondingly arranged conductive contact 211. In some examples, the pin toe 322 can be welded to the conductive contact 211 , thereby ensuring a high mechanical connection strength between the pin toe 322 and the conductive contact 211 and reducing the difficulty of connecting the pin toe 322 and the conductive contact 211 .

[0070] In the circuit board assembly 200 of the embodiment of the present application, the pin toe 322 of the CEM connector 10 is folded inward, and the metal lead 212 on the circuit board 210 is arranged between two rows of conductive contacts 211, so that the signal can be transmitted through the metal lead 212, the conductive contact 211, the pin toe 322 and the pin root 321, that is, the metal lead 212, the conductive contact 211, the pin toe 322 and the pin root 321 are on the signal transmission path, thereby effectively reducing the size of the conductive contact 211 and the pin toe 322 that are not on the signal transmission path.

[0071] The larger the size of the conductive contact 211 and the pin toe 322 that are not on the signal transmission path, the more serious the adverse effect on the signal integrity (SI) during the signal transmission process. For example, if the pin toe 322 of the CEM connector 10 is folded inward, and the metal lead 212 is led out from the outside of the conductive contact 211, the signal is mainly transmitted through the metal lead 212, a small part of the conductive contact 211, a small part of the pin toe 322 and the pin root 321, so that most of the conductive contacts 211 and most of the pin toe 322 are not on the signal transmission path. At this time, the size of the conductive contact 211 and the pin toe 322 that are not on the signal transmission path is relatively large, which has a relatively large impact on the signal integrity. Therefore, the pin toe 322 of the CEM connector 10 of the embodiment of the present application is turned inward, and the metal lead 212 on the circuit board 210 is set between two rows of conductive contacts 211, which can effectively reduce the adverse effect on the signal integrity during the signal transmission between the CEM connector 10 and the circuit board 210.

[0072] The CEM connector 10 of the embodiment of the present application includes a housing 20 and conductive pins 30. Two rows of conductive pins 30 are arranged on the bottom 22 of the CEM connector 10. The outer pins 32 of the conductive pins 30 are folded inward. Along the width direction of the housing 20, the pin roots 321 of the outer pins 32 are inclined toward the central area of ​​the bottom 22, and the pin toes 322 extend toward the central area of ​​the bottom 22 along the width direction of the housing 20. Along the width direction X of the circuit board slot 23, the pin toes 322 of one row of conductive pins 30 extend toward the pin toes 322 of another row of conductive pins 30. Two rows of conductive contacts 211 and corresponding metal leads 212 are correspondingly arranged on the circuit board 210 adapted to the CEM connector 10. Along the width direction of the housing 20, the spacing between the two rows of pin toes 322 is relatively small, so that the spacing between the two rows of conductive contacts 211 correspondingly arranged on the circuit board 210 is relatively small. At the same time, the metal lead 212 on the circuit board 210 can be set between the two rows of conductive contacts 211, that is, the metal lead 212 is led out from the inner side of the conductive contact 211, so that the metal lead 212 can use the board surface between the two rows of conductive contacts 211 without occupying the board surface outside the conductive contact 211.

[0073] When the CEM connector 10 is connected to the edge of the circuit board 210, the long side of the CEM connector 10 is close to the edge of the circuit board 210. Two rows of conductive contacts 211 are correspondingly arranged in the area close to the edge of the circuit board 210. The metal lead 212 is located below the bottom 22 of the housing 20. Since the metal lead 212 can be arranged between the two rows of conductive contacts 211, when the space between the conductive contact 211 and the edge of the board is small, the conductive contact 211 can still transmit signals through the metal lead 212, thereby effectively solving the problem of the difficulty of arranging the metal lead 212 in the space between the conductive contact 211 and the edge of the board, reducing the difficulty of arranging the CEM connector 10 on the edge of the circuit board 210, and at the same time, there is no need to use the POFV process to change the layer to lead out the metal routing, reducing the difficulty of processing and manufacturing, and saving processing costs.

[0074] In addition, along the width direction of the housing 20, the spacing between the two rows of pin toes 322 is relatively small, so that the spacing between the two corresponding rows of conductive contacts 211 on the circuit board 210 is relatively small, so that the board area occupied by the two rows of conductive contacts 211 is smaller, and at the same time, the metal routing does not occupy the board area outside the conductive contacts 211, so that the board area utilization rate of the circuit board 210 is relatively high, effectively avoiding board area waste, which is beneficial to reducing the production cost of the circuit board 210.

[0075] In some possible implementations, see Figure 7As shown, along the depth direction Z of the circuit board slot 23, the orthographic projection of the outer pin 32 of the conductive pin 30 is located within the orthographic projection of the bottom 22 of the housing 20. Along the width direction of the housing 20, the outer pin 32 does not exceed the edge of the bottom 22 at any position. When the CEM connector 10 is connected to the circuit board 210, the outer pin 32 is entirely located in the gap between the CEM connector 10 and the circuit board 210, so that the outer pin 32 is not easily scratched, squeezed or electrically connected with the components arranged around the CEM connector 10 on the circuit board 210, which is conducive to ensuring that after the CEM connector 10 and the circuit board 210 are connected, the CEM connector 10 and the circuit board 210 can both maintain a normal working state.

[0076] In some possible implementations, see Figure 7 As shown, along the width direction X of the circuit board slot 23, the pin root 321 of the external pin 32 is arranged close to the edge of the bottom 22 of the housing 20, so that the pin toe 322 connected to the pin root 321 is also relatively close to the edge of the bottom 22. There is a relatively large distance between the pin toe 322 and the center of the bottom 22. One connection process between the CEM connector 10 and the circuit board 210 may be to align the pin toe 322 of the CEM connector 10 and place it on the conductive contact 211 of the circuit board 210, and then use a welding process to weld the pin toe 322 and the conductive contact 211. The arrangement of the pin toe 322 relatively close to the edge of the bottom 22 makes it easy for the operator to observe the alignment state and welding state of the pin toe 322 and the conductive contact 211, and in the event that the CEM connector 10 is damaged, it is easy to operate to separate the pin toe 322 from the conductive contact 211 and remove the CEM connector 10.

[0077] In some possible implementations, see Figure 7 As shown, in the circuit board assembly 200 formed by assembling the CEM connector 10 and the circuit board 210, the conductive contact 211 extends beyond the housing 20 along the width direction X of the circuit board slot 23. The portion of the conductive contact 211 extending beyond the housing 20 along the width direction X of the circuit board slot 23 forms an extension away from the metal lead 212. The extension of the conductive contact 211 is located outside the bottom 22. When the circuit board assembly 200 is observed from the outside, the extension of the conductive contact 211 can be observed. One connection process between the CEM connector 10 and the circuit board 210 can be to weld the pin toe 322 to the conductive contact 211 using a welding process. The arrangement of the conductive contact 211 extending beyond the bottom 22 makes it easier for the operator to observe the alignment state and welding state of the pin toe 322 and the conductive contact 211.

[0078] In some examples, along the width direction X of the circuit board slot 23 , the conductive contact 211 may extend beyond the bottom 22 by a value ranging from 0.5 mm to 1 mm.

[0079] In some examples, Figure 8 The partial structure of the circuit board assembly 200 is schematically shown. Figure 8 As shown, the conductive contact 211 may be a pad. Along the thickness direction of the conductive contact 211, the orthographic projection area of ​​the pin toe 322 on the conductive contact 211 is smaller than the area of ​​the conductive contact 211. Exemplarily, the conductive contact 211 may be a rectangular pad. The length direction of the conductive contact 211 is the same as the width direction of the housing 20. The width direction of the conductive contact 211 is the same as the length direction of the housing 20. The pin toe 322 may be a rectangular structure. The length direction of the pin toe 322 is the same as the width direction of the housing 20. The width direction of the pin toe 322 is the same as the length direction of the housing 20. The length of the pin toe 322 may be smaller than the length of the conductive contact 211. Alternatively, the width of the pin toe 322 may be smaller than the width of the conductive contact 211. Alternatively, the length of the pin toe 322 may be smaller than the length of the conductive contact 211, and the width of the pin toe 322 may be smaller than the width of the conductive contact 211.

[0080] In some examples, the width of the metal lead 212 is smaller than the width of the conductive contact 211. The metal lead 212 and the conductive contact 211 can be an integrally formed structure. In some examples, the material of the conductive pin 30 can include copper or a copper alloy. The material of the metal lead 212 and the conductive contact 211 can each include copper or a copper alloy.

[0081] In some achievable embodiments, one row of conductive pins 30 is symmetrically arranged with another row of conductive pins 30. The structural design of one row of conductive pins 30 is the same as the structural design of another row of conductive pins 30, thereby effectively reducing the difficulty of processing the conductive pins 30 themselves, and also effectively reducing the difficulty of assembling the conductive pins 30 and the housing 20 to form the CEM connector 10. Accordingly, the two rows of conductive contacts 211 arranged on the circuit board 210 can be symmetrically arranged.

[0082] In some achievable embodiments, there is a gap between the pin toe 322 of the outer pin 32 and the bottom 22 of the housing 20. One connection process between the CEM connector 10 and the circuit board 210 may be to weld the pin toe 322 to the conductive contact 211 using a welding process. During the welding process, the solder will cover the pin toe 322 of the outer pin 32. In the case where there is a gap between the pin toe 322 and the bottom 22, a space for avoiding solder can be formed between the pin toe 322 and the bottom 22, so that during the welding process, the solder is not easy to contact the housing 20 and burn the housing 20.

[0083] In some achievable ways, Fig. 9 The partial structure of the external circuit board 120 is schematically shown. Fig.10 The schematic diagram shows a partial cross-sectional structure of the electrical connection between the external circuit board 120 and the circuit board assembly 200. Fig. 9 and Fig.10 As shown, the external circuit board 120 includes a plug-in end 121 and a gold finger 122 disposed on the plug-in end 121. The external circuit board 120 can be connected or separated with the CEM connector 10 in a plug-in manner. Along the thickness direction of the external circuit board 120, the gold fingers 122 are respectively disposed on both sides of the plug-in end 121. The plug-in end 121 of the external circuit board 120 can be plugged into the circuit board slot 23 of the CEM connector 10. The inner pin 31 of the corresponding conductive pin 30 is electrically connected to the gold finger 122 of the plug-in end 121, so that signal interaction can be achieved between the external circuit board 120, the CEM connector 10 and the circuit board 210.

[0084] In some examples, there is a spacing between the inner pins 31 arranged on both sides of the circuit board slot 23. After the plug-in end of the external circuit board 120 is inserted into the circuit board slot 23, the plug-in end will push the inner pins 31 on both sides to move outward to expand the spacing between the inner pins 31 on both sides, so that the plug-in end can smoothly pass through between the inner pins 31 on both sides. The inner pins 31 accumulate elastic potential energy. When the plug-in end of the external circuit board 120 is plugged into the predetermined position, the inner pins 31 arranged on both sides are pressed against the gold fingers 122 on both sides of the plug-in end under the action of their own elastic restoring force, so as to ensure that the inner pins 31 and the gold fingers 122 maintain a good and stable connection state.

[0085] In some examples, along the width direction of the housing 20 , both rows of pin toes 322 extend toward the external circuit board 120 . Along the width direction of the housing 20 , the spacing between the two rows of pin toes 322 may be greater than the thickness of the external circuit board 120 .

[0086] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0087] The embodiments of the present application do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0088] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, systems, products or devices.

[0089] The term "plurality" in this article refers to two or more than two. The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship; in a formula, the character " / " indicates that the previous and next associated objects are in a "division" relationship.

[0090] It is understood that the various numerical numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application. It is understood that in the embodiments of the present application, the size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A CEM connector, characterized in that: include: The housing comprises a top, a bottom and a circuit board slot, wherein the circuit board slot has an insertion interface located at the top; Two rows of conductive pins, one row of conductive pins is spaced apart from the other row of conductive pins along the width direction of the circuit board slot, the conductive pins include inner pins and outer pins, the inner pins are arranged facing the circuit board slot, the outer pins pass through the bottom, the outer pins include pin roots and pin toes, the pin toes are connected to the ends of the pin roots away from the bottom, and along the width direction of the circuit board slot, the pin toes of one row of conductive pins and the pin toes of the other row of conductive pins extend toward each other.

2. The CEM connector according to claim 1, characterized in that: Along the depth direction of the circuit board slot, the orthographic projection of the outer pin is located within the orthographic projection of the bottom.

3. The CEM connector according to claim 1, characterized in that: Along the width direction of the circuit board slot, the pin root is arranged close to the edge of the bottom.

4. The CEM connector according to any one of claims 1 to 3, characterized in that: The conductive pins in one row are symmetrically arranged with respect to the conductive pins in another row.

5. The CEM connector according to any one of claims 1 to 3, characterized in that: A gap is formed between the pin toe and the bottom.

6. A circuit board assembly, characterized in that: include: The CEM connector according to any one of claims 1 to 5; The circuit board includes connected conductive contacts and metal leads. Along the width direction of the circuit board slot, one row of the conductive contacts is spaced apart from another row of the conductive contacts, and the metal leads are arranged between the two rows of the conductive contacts. The external pins are located between the bottom and the circuit board, and the two corresponding rows of pin toes are respectively connected to the two rows of the conductive contacts.

7. The circuit board assembly according to claim 6, characterized in that: The conductive contacts extend beyond the bottom of the housing along a width direction of the circuit board slot.

8. The circuit board assembly according to claim 6, characterized in that: The pin toe is welded to the conductive contact.

9. A computing device, characterized in that Comprising a circuit board assembly as claimed in any one of claims 6 to 8.

10. The computing device according to claim 9, characterized in that The computing device further comprises an external circuit board, which comprises a plug-in terminal and a gold finger arranged on the plug-in terminal. The plug-in terminal is plugged into the circuit board slot, and the corresponding inner pin is electrically connected to the gold finger.

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