Circuit board structure for optimizing high-speed differential signal quality

Abstract

The utility model discloses a circuit board structure for optimizing high-speed differential signal quality, which comprises a circuit board, n pairs of high-speed differential holes and 4m backflow ground holes, the high-speed differential holes and the backflow ground holes are arranged on the circuit board, the four backflow ground holes are uniformly arranged on the periphery of one pair of high-speed differential holes, and the number of the backflow ground holes is larger than that of the high-speed differential holes. GND copper sheets are laid outside the pair of high-speed differential holes, so that GND shielding cavities are formed around the high-speed differential holes, and power supply noise is isolated. According to the utility model, through the backflow ground hole layout and the special processing of the inner power supply layer, the stability and integrity of differential signal transmission are significantly improved, the backflow ground hole layout ensures that a complete circle is formed in the GND backflow direction, and signals can quickly find the nearest backflow path, thereby improving the backflow effect and reducing the cost. And two holes of a high-speed differential signal are subjected to complete ground wrapping treatment, so that an effective isolation barrier is formed, and the noise problem caused by a power supply can be effectively isolated.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, and more specifically to a circuit board structure for optimizing the quality of high-speed differential signals. Background Art

[0002] Printed Circuit Board (PCB), also known as printed circuit board, printed circuit board, or PCB for short, is one of the core components of electronic products. It carries electronic components and undertakes the important task of signal transmission. It is like a precision canvas carrying circuit patterns. It not only provides stable physical support for electronic components, but also is a key channel for signal transmission. In the application scenarios of high-speed circuits, as the design of integrated circuits becomes increasingly complex and the integration continues to increase, the signal transmission problem on PCB boards has become more and more prominent.

[0003] In the working process of high-speed circuit PCB boards, whether the signal can be accurately transmitted from the sending end to the receiving end is a key indicator for evaluating its performance. The reflux processing of high-speed signals is an important link that affects the integrity of the signal. If the reflux processing is improper, the reflux signal may be damaged, which in turn affects the integrity of the entire signal transmission.

[0004] In traditional PCB board design, in order to speed up the return speed of the signal, GND holes are usually added around the differential signal holes to increase the return path. There are many ways to add return ground holes, and there is a lack of unified standards and specifications. With the continuous increase in the differential signal rate, the traditional method of adding only one or two return ground holes has been difficult to meet the return requirements of high-speed differential signals, and the inner power plane will generate power noise interference between the two high-speed differential holes during the high-speed differential signal transmission process. This interference will not only affect the transmission quality of the differential signal, but may also cause signal distortion and even cause failure of the entire circuit system. Utility Model Content

[0005] In order to overcome the problem that the traditional method of adding one or two return ground holes can no longer meet the return requirements of high-speed differential signals, and the inner power plane will generate power noise interference between the two high-speed differential holes during the high-speed differential signal transmission process, the utility model provides a circuit board structure that optimizes the quality of high-speed differential signals.

[0006] The technical solution of the utility model is as follows:

[0007] A circuit board structure for optimizing the quality of high-speed differential signals, comprising a circuit board and high-speed differential holes and return ground holes arranged on the circuit board, wherein the high-speed differential holes are n pairs, the return ground holes are 4m, four return ground holes are evenly arranged around a pair of the high-speed differential holes, and a pair of the high-speed differential holes are paved with GND copper foil to form a GND shielding cavity around the high-speed differential holes to isolate power supply noise.

[0008] According to the above solution of the utility model, the distance between the two high-speed differential holes is 1.0 mm.

[0009] According to the above solution of the utility model, the spacing between adjacent return holes is 2.0 mm.

[0010] According to the above solution of the utility model, the spacing between the high-speed differential hole and the adjacent return ground hole on the X-axis is 0.5 mm, and the spacing between the high-speed differential hole and the adjacent return ground hole on the Y-axis is 1.0 mm.

[0011] According to the above-mentioned solution of the utility model, the distance between the high-speed differential hole and the inner edge of the GND copper sheet is 0.5 mm.

[0012] According to the above-mentioned solution of the utility model, a pair of the high-speed differential holes are connected by a high-speed differential line, and the GND copper sheet is formed with an opening at the high-speed differential line so that the high-speed differential line connects the two pairs of the high-speed differential holes.

[0013] According to the above-mentioned solution of the utility model, the distance between the high-speed differential line and the inner edge of the GND copper sheet is 0.5 mm.

[0014] According to the above-mentioned solution of the utility model, the distance between the outer edge of the GND copper sheet and the return ground hole is 0.5 mm.

[0015] The utility model according to the above scheme has the beneficial effect that the utility model provides a circuit board structure that optimizes the quality of high-speed differential signals. The stability and integrity of differential signal transmission are significantly improved through the layout of return ground holes and special treatment of the inner power layer. The layout of the return ground holes ensures that the return direction of GND forms a complete circle. No matter from which direction, the signal can quickly find the nearest return path, thereby greatly improving the return effect. Moreover, by completely enclosing the two holes of the high-speed differential signal, an effective isolation barrier is formed, which can effectively isolate the noise problem caused by the power supply, which not only improves the transmission quality of the differential signal, but also reduces the risk of signal distortion caused by power supply noise. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a structural schematic diagram of the top layer of the circuit board of the utility model;

[0017] Figure 2 It is a schematic structural diagram of the bottom layer of the circuit board of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the circuit board power supply layer of the utility model.

[0019] In the drawings, the reference numerals are as follows:

[0020] 1. Circuit board; 11. High-speed differential hole; 12. Return ground hole; 13. GND copper foil; 14. High-speed differential line; 15. Power copper foil. DETAILED DESCRIPTION

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0022] It should be noted that the terms "including" and "having" and any variations thereof in the specification and claims of the present utility model are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally includes steps or units that are not listed, or optionally includes other steps or units inherent to these processes, methods, products or devices. Terms such as "setting" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "bottom", etc. are based on the directions or positions shown in the drawings, which are only for the convenience of description and cannot be understood as limitations on the present technical solution.

[0023] It should be noted that the traditional method of adding only one or two return ground holes 12 is difficult to meet the return requirements of high-speed differential signals, and the inner power plane will generate power noise interference between the two high-speed differential holes 11 during the transmission of high-speed differential signals. This interference will not only affect the transmission quality of the differential signal, but may also cause signal distortion and even cause failure of the entire circuit system.

[0024] like Figure 1-Figure 3As shown, a circuit board 1 structure for optimizing the quality of high-speed differential signals significantly improves the stability and integrity of differential signal transmission through the layout of the return ground holes 12 and the special treatment of the inner power layer. It not only meets the high requirements of high-speed circuits for signal transmission, but also provides strong support for the performance improvement and reliability assurance of electronic products.

[0025] Specifically, a circuit board 1 structure for optimizing the quality of high-speed differential signals includes a circuit board 1 and high-speed differential holes 11 and return ground holes 12 arranged on the circuit board 1, wherein there are n pairs of high-speed differential holes 11 and 4m return ground holes 12 (where n and m are both natural numbers), and four return ground holes 12 are evenly arranged around a pair of high-speed differential holes 11, and a GND copper sheet 13 is laid outside the pair of high-speed differential holes 11 to form a GND shielding cavity around the high-speed differential holes 11 to isolate power supply noise.

[0026] Specifically, each pair of high-speed differential holes 11 is surrounded by a return ground hole 12, four in total. This layout ensures that the return direction of GND forms a complete circle. No matter from which direction, the signal can quickly find the nearest return path, thereby greatly improving the return effect. Compared with the traditional method of adding only one or two return ground holes 12, the design of four return holes is more efficient. Not only can the number of return paths be greatly increased, but also through uniform distribution, it ensures that each return ground hole 12 can play the greatest role, effectively reducing the loss of signals during transmission.

[0027] This circuit board 1 structure also has special processing on the inner power layer. By completely enclosing the two holes of the high-speed differential signal, an effective isolation barrier is formed, which can effectively isolate the noise problem caused by the power supply. It not only improves the transmission quality of the differential signal, but also reduces the risk of signal distortion caused by power supply noise.

[0028] In one embodiment, the spacing between the two high-speed differential holes 11 is 1.0 mm. The spacing of 1.0 mm not only ensures the stability of the differential signal during transmission, but also effectively controls the mutual interference between signals. In high-speed circuits, the transmission quality of differential signals is crucial to the performance of the entire circuit. The size of the differential hole spacing directly affects the transmission efficiency and integrity of the signal. If the spacing is too large, the signal may be subject to excessive external interference during transmission, resulting in a decrease in signal quality; if the spacing is too small, it may cause mutual interference between signals, which also affects the integrity of the signal.

[0029] In addition, the 1.0 mm pitch also facilitates the production and processing of the circuit board 1. During the production process, precise pitch control can ensure the manufacturing accuracy and consistency of the circuit board 1, thereby improving the yield and reliability of the product.

[0030] In one embodiment, during the transmission of high-speed differential signals, the return ground holes 12 play a vital role. They provide an effective return path for the signal to ensure that the signal can be transmitted stably and completely. The spacing between the return ground holes 12 directly affects the efficiency of the return path and the stability of signal transmission. The spacing between adjacent return ground holes 12 is 2.0 mm, which is based on an in-depth study of the signal return characteristics and the manufacturing capabilities of the circuit board 1. This spacing not only ensures the continuity of the return path, but also avoids the manufacturing difficulty and cost increase that may be caused by too dense return holes. The 2.0 mm spacing also allows the wiring space between the return holes to be fully utilized, providing sufficient layout space for other components of the circuit board 1, and improving the flexibility and aesthetics of the overall layout.

[0031] In terms of production and processing, the 2.0 mm spacing also meets the existing manufacturing accuracy requirements, and can ensure the position accuracy and consistency of the reflow holes, thereby improving the manufacturing quality and reliability of the circuit board 1.

[0032] In one embodiment, the spacing between the high-speed differential hole 11 and the adjacent return ground hole 12 on the X-axis is 0.5mm, and the spacing between the high-speed differential hole 11 and the adjacent return ground hole 12 on the Y-axis is 1.0mm, so that the return ground holes 12 can be evenly distributed around the high-speed differential hole 11, forming a stable return loop, effectively improving the return effect of the signal. The spacing of 0.5mm and 1.0mm both meet the existing manufacturing accuracy requirements, and can ensure the position accuracy and consistency of the return ground hole 12 and the high-speed differential hole 11, thereby improving the manufacturing quality and reliability of the circuit board 1.

[0033] In one embodiment, this embodiment takes the circuit board 1 as an example of a four-layer board. The high-speed differential line 14 needs to be routed from the top layer with the high-speed differential hole 11 to the fourth layer. The top layer high-speed differential line 14 + high-speed differential hole 11 + return ground holes 12 on the top, bottom, left and right sides make the differential signal return effect better and standardize the spacing between the return hole and the differential hole. L2 is the GND layer, and L3 is the power layer. The power layer is paved with power copper foil 15, and the high-speed differential hole 11 needs to be completely wrapped to isolate the power copper foil 15 and the high-speed differential hole 11, so as to isolate the power noise from affecting the quality of the differential signal.

[0034] The spacing between the high-speed differential hole 11 and the inner edge of the GND copper sheet 13 is 0.5 mm, which ensures that the differential signal can be stably shielded and protected by the GND copper sheet 13 during transmission, while avoiding signal interference or transmission loss that may be caused by too large or too small spacing.

[0035] A pair of high-speed differential holes 11 are connected by a high-speed differential line 14, and the GND copper sheet 13 is formed with an opening at the high-speed differential line 14 so that the high-speed differential line 14 connects the two pairs of high-speed differential holes 11, which not only ensures the continuity and stability of the high-speed differential line 14, but also enables the GND copper sheet 13 to continue to play a shielding role to prevent the differential signal from being interfered with by the outside world. The spacing between the high-speed differential line 14 and the inner edge of the GND copper sheet 13 is 0.5mm, which ensures that the high-speed differential line 14 will not be interfered by the GND copper sheet 13 when transmitting the differential signal, and ensures that the GND copper sheet 13 can effectively shield the influence of external noise on the differential signal.

[0036] The distance between the outer edge of the GND copper foil 13 and the return ground hole 12 is 0.5 mm, which ensures that the return ground hole 12 can effectively return the differential signal to the power layer, while avoiding signal leakage or interference problems that may be caused by improper spacing.

[0037] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to the utility model.

[0038] The above is an exemplary description of the utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the utility model patent is not limited to the above-mentioned method. As long as various improvements are made by adopting the method concept and technical solution of the utility model patent, or the concept and technical solution of the utility model patent are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. A circuit board structure for optimizing high-speed differential signal quality, characterized in that: It includes a circuit board and high-speed differential holes and return ground holes arranged on the circuit board, wherein the high-speed differential holes are n pairs, the return ground holes are 4m, four return ground holes are evenly arranged around a pair of the high-speed differential holes, and a pair of the high-speed differential holes are paved with GND copper foil to form a GND shielding cavity around the high-speed differential holes to isolate power supply noise.

2. The circuit board structure for optimizing high-speed differential signal quality according to claim 1, characterized in that: The distance between the two high-speed differential holes is 1.0 mm.

3. The circuit board structure for optimizing high-speed differential signal quality according to claim 2, characterized in that: The distance between adjacent return holes is 2.0 mm.

4. The circuit board structure for optimizing high-speed differential signal quality according to claim 3, characterized in that: The spacing between the high-speed differential hole and the adjacent return ground hole on the X-axis is 0.5 mm, and the spacing between the high-speed differential hole and the adjacent return ground hole on the Y-axis is 1.0 mm.

5. The circuit board structure for optimizing high-speed differential signal quality according to claim 1, characterized in that: The distance between the high-speed differential hole and the inner edge of the GND copper sheet is 0.5 mm.

6. The circuit board structure for optimizing high-speed differential signal quality according to claim 5, characterized in that: The two pairs of high-speed differential holes are connected by high-speed differential lines, and the GND copper sheet is formed with openings at the high-speed differential lines so that the high-speed differential lines connect the two pairs of high-speed differential holes.

7. The circuit board structure for optimizing high-speed differential signal quality according to claim 6, characterized in that: The distance between the high-speed differential line and the inner edge of the GND copper sheet is 0.5 mm.

8. The circuit board structure for optimizing high-speed differential signal quality according to claim 7, characterized in that: The distance between the outer edge of the GND copper sheet and the return ground hole is 0.5 mm.

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