Electronic device and heat dissipation piece thereof

Abstract

The utility model provides an electronic device and a heat dissipation piece thereof. The electronic device comprises a circuit board, the heat dissipation piece and an electronic element. The heat dissipation piece is arranged on the circuit board and comprises a supporting section and an extending piece. The extension sheet is connected to the supporting section. The electronic component is arranged on the supporting section. And the extension sheet is not parallel to the supporting section.

Description

Technical Field

[0001] The invention relates to an electronic device and a heat dissipation element thereof. Background Art

[0002] Conventional electronic devices include at least one electronic component. The operation of the electronic component will inevitably generate heat. Therefore, how to dissipate the heat is one of the goals of technicians in this technical field. Utility Model Content

[0003] An embodiment of the present invention provides an electronic device. The electronic device includes a circuit board, a heat sink and an electronic component. The heat sink is disposed on the circuit board and includes a support section and a first extension piece. The first extension piece is connected to the support section. The electronic component is disposed in the support section. The first extension piece is not parallel to the support section.

[0004] Another embodiment of the present invention provides a heat sink. The heat sink includes a support section, a first extension piece, and a second extension piece. The first extension piece has a first end and a second end, and the first end of the first extension piece is connected to the support section. The second extension piece has a first end and a second end, and the first end of the second extension piece is connected to the second end of the first extension piece, wherein the extension direction of the first end of the first extension piece toward the second end of the first extension piece is different from the extension direction of the first end of the second extension piece toward the second end of the second extension piece.

[0005] Another embodiment of the present invention provides a heat sink. The heat sink includes a support section, a first extension piece and a second extension piece. The first extension piece is connected to the support section and has an upper surface. The second extension piece is connected to the first extension piece and has a lower surface. A gap is formed between the upper surface of the first extension piece and the lower surface of the second extension piece.

[0006] Another embodiment of the present invention provides an electronic device. The electronic device includes a housing, a circuit board, the aforementioned heat sink, and an electronic component. The housing has at least one opening. The circuit board is disposed in the housing. The heat sink is disposed on the circuit board, wherein the heat sink is disposed corresponding to the at least one opening. The electronic component is disposed corresponding to the heat sink and is electrically connected to the circuit board.

[0007] Another embodiment of the present invention provides an electronic device. The electronic device includes a housing, a circuit board, a heat sink and an electronic component. The housing has at least one opening. The circuit board is disposed in the housing. The heat sink is disposed on the circuit board and includes a support section and a first extension sheet. The support section protrudes from the circuit board.

[0008] The first extension piece is connected to the support section and extends toward one side of the support section. The electronic component is arranged on the support section.

[0009] An extension width of the first extension piece is greater than or equal to a width of the electronic component.

[0010] In order to better understand the above and other aspects of the present invention, embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1A A diagram showing an assembly of an electronic device according to an embodiment of the present invention;

[0012] Figure 1B Draw Figure 1A An exploded view of the electronic device;

[0013] Figure 2 Draw Figure 1B An exploded view of a heat sink, a first electronic component, and a second electronic component;

[0014] Figure 3 Draw Figure 2 A schematic diagram of a heat sink;

[0015] Figure 4 Draw Figure 1A A cross-sectional view of the electronic device along the 4-4' direction;

[0016] Figure 5 A schematic diagram of an electronic device according to another embodiment of the present invention is shown;

[0017] Figure 6 A schematic diagram showing a heat dissipation element according to another embodiment of the present invention is shown;

[0018] Figure 7 A schematic diagram showing a heat dissipation element according to another embodiment of the present invention is shown;

[0019] Fig. 8A A schematic diagram showing a heat dissipation element according to another embodiment of the present invention is shown;

[0020] Figure 8B A schematic diagram showing a heat dissipation element according to another embodiment of the present invention is shown;

[0021] Fig. 9 A schematic diagram showing a heat dissipation element according to another embodiment of the present invention is shown;

[0022] Fig.10 A schematic diagram showing a heat dissipation element according to another embodiment of the present invention is shown;

[0023] Fig.11 A schematic diagram of a heat dissipation element according to another embodiment of the present invention is shown.

[0024] Wherein, the reference numerals are:

[0025] 100,200: Electronic devices

[0026] 105: Upper shell

[0027] 105a,107a: Opening

[0028] 110: Circuit board

[0029] 107: Lower shell

[0030] 120,220,320,420,420',520,620,720: heat sink

[0031] 120s1: First side

[0032] 120s2: Second side

[0033] 121: Insertion part

[0034] 130,230: Fan

[0035] 131,231: Air outlet

[0036] 140: First electronic component

[0037] 140a,150a,V1 a:Through hole

[0038] 150: Second electronic component

[0039] 115: Electronic components

[0040] 160A: First fixing member

[0041] 160B: Second fixing member

[0042] 421,421':Guide

[0043] 421a: flow-guiding through hole

[0044] A1: First angle

[0045] A2: Second Angle

[0046] A': angle

[0047] A1', A2': Angle

[0048] L1: First height

[0049] L2: Second height

[0050] G1: Airflow

[0051] H1: First extension piece

[0052] H1a, H2a, H3a: First end

[0053] H1b, H2b, H3b: Second end

[0054] H1h,H2h,H3h:Through hole

[0055] H1u, H2u, H3u: upper surface

[0056] H2: Second extension piece

[0057] H2s, H3s: lower surface

[0058] H3: The third extension piece

[0059] P1: First side

[0060] P2: Second side

[0061] S1: First connection segment

[0062] S1a, S2a: first connection end

[0063] S1b, S2b: Second connection end

[0064] S2: Second connection segment

[0065] SP 1: First airflow space

[0066] SP2: Second airflow space

[0067] V1: Support section

[0068] V1s1: Side 1

[0069] V1s2: Side 2

[0070] W H1 :Extended Width

[0071] W 140 :width. DETAILED DESCRIPTION

[0072] Please refer to Figure 1A to Figure 4 , Figure 1A FIG. 1 is a diagram showing an assembly of an electronic device 100 according to an embodiment of the present invention. Figure 1B Draw Figure 1A An exploded view of the electronic device 100, Figure 2 Draw Figure 1B An exploded view of the heat sink 120, the first electronic component 140 and the second electronic component 150, Figure 3 Draw Figure 2 Schematic diagram of the heat sink 120, and Figure 4 Draw Figure 1AThe electronic device 100 is a cross-sectional view along the direction 4-4' (the housing is not shown). The electronic device 100 is, for example, a power supply unit (PSU), an energy storage unit, a computing unit or other types of electronic products. The electronic device 100 can be used in desktop computers, industrial computers, servers, charging equipment or consumer electronic products.

[0073] like Figure 1A and Figure 1B As shown, the electronic device 100 includes a housing, a circuit board 110, at least one electronic component 115, a heat sink 120, a fan 130, a first electronic component 140, a second electronic component 150, a first fixing member 160A and a second fixing member 160B. In one embodiment, the housing includes an upper shell 105 and a lower shell 107 that can be assembled, engaged or joined correspondingly, and the circuit board 110, the electronic component 115, the heat sink 120, the fan 130, the first electronic component 140, the second electronic component 150, the first fixing member 160A and the second fixing member 160B can be arranged on the lower shell 107 and surrounded by the upper shell 105 and the lower shell 107. The electronic component 115 is, for example, a capacitor. However, in another embodiment, the other electronic components 115 are, for example, connectors, slots, resistors, chips and / or inductors. In this embodiment, the fan 130 and the heat sink 120 overlap along the Z-axis direction, wherein the Z-axis direction is, for example, the height direction or the vertical direction of the electronic device 100.

[0074] like Figure 2 and Figure 3 As shown, the heat sink 120 is disposed on the circuit board 110. The heat sink 120 includes an insertion portion 121, a support segment V1, a first extension piece H1, a second extension piece H2, a third extension piece H3, a first connecting segment S1, and a second connecting segment S2. The first extension piece H1 is connected to the support segment V1. The first extension piece H1 and the support segment V1 are not parallel (that is, the extension of the first extension piece H1 and the extension of the support segment V1 will intersect). The first electronic component 140 is disposed in the support segment V1. In this way, the heat sink 120 can quickly convect the heat of the first electronic component 140 to the air.

[0075] like Figure 2 and Figure 3As shown, due to the appearance of the heat sink 120 of the new embodiment, it is particularly suitable for forming by stamping or bending. In one embodiment, the material of the heat sink 120 can be selected from aluminum specifications of JIS 6063, JIS 1100 or a combination thereof. Alternatively, the material of the heat sink 120 can be selected from recycled aluminum, such as post-industrial recycled aluminum (Pre-Consumer Recycled), industrial waste, scraps and / or defective products. Alternatively, the heat sink 120 can also be made of other materials, such as copper, iron, silver, gold or a combination thereof. The material of the heat sink 120 formed by stamping or bending is not limited to aluminum that meets the specifications, and can also be selected from the aforementioned recycled products. In terms of the manufacturing process, a sheet or a plate can be subjected to stamping, bending or a combination thereof to form the heat sink 120. In terms of structure, at least two of the insertion portion 121, the support section V1, the first extension piece H1, the second extension piece H2, the third extension piece H3, the first connection section S1 and the second connection section S2 can be an integrally formed structure. In addition, the heat sink 120 and the circuit board 110 can be electrically isolated. In other words, the heat sink 120 simply provides a heat dissipation effect and does not have a circuit function. In another embodiment, the heat sink 120 can be electrically connected to a ground potential (not shown), so that the heat sink 120 becomes a grounding element.

[0076] like Figure 2 and Figure 3 As shown, the insertion portion 121 of the heat sink 120 is connected to the bottom surface of the support segment V1 to be arranged (for example, inserted) in the circuit board 110. The insertion portion 121 can be welded to the circuit board 110 to fix the relative position between the heat sink 120 and the circuit board 110, as shown in FIG. Figure 1B As shown. Figure 4 As shown, after the heat sink 120 is disposed on the circuit board 110 , the support segment V1 protrudes from the circuit board 110 .

[0077] like Figure 2 and Figure 3 As shown, the first extension piece H1 is, for example, a transverse section extending toward one side of the support segment V1 (for example, the first side P1), and the first extension piece H1 is connected to the support segment V1. For example, the first extension piece H1 has a first end H1a and a second end H1b, wherein the first end H1a of the first extension piece H1 is connected to the end of the support segment V1. In addition, the first extension piece H1 is not parallel to the support segment V1, for example, there is an angle A' between the first extension piece H1 and the support segment V1, and the angle A' is, for example, an obtuse angle or a right angle, but it can also be an acute angle. In addition, the extension width W of the first extension piece H1 H1 Greater than or equal to the width W of the first electronic component 140 140 , which can increase the contact area between the first extension piece H1 and the first electronic component 140 and improve the heat dissipation efficiency.

[0078] like Figure 2 and Figure 3 As shown, the second extension piece H2 is, for example, a transverse section extending toward the other side of the support section V1 (such as the second side P2 opposite to the first side P1), and the second extension piece H2 is connected to the first extension piece H1 through the first connecting section S1. For example, the second extension piece H2 has a first end H2a and a second end H2b, and the first connecting section S1 has a first connecting end S1a and a second connecting end S1b, wherein the first end H2a of the second extension piece H2 is connected to the second end H1b of the first extension piece H1, the first connecting end S1a of the first connecting section S1 is connected to the second end H1b of the first extension piece H1, and the second connecting end S1b of the first connecting section S1 is connected to the first end H2a of the second extension piece H2. In this embodiment, the extension direction of the first end H1a of the first extension piece H1 to the second end H1b of the first extension piece H1 is different from the extension direction of the first end H2a of the second extension piece H2 to the second end H2b of the second extension piece H2.

[0079] like Figure 2 and Figure 3 As shown, the third extension piece H3 is, for example, a transverse section extending toward the first side P1 of the support section V1, and the third extension piece H3 is connected to the second extension piece H2 through the second connection section S2. For example, the third extension piece H3 has a first end H3a and a second end H3b, and the second connection section S2 has a first connection end S2a and a second connection end S2b, wherein the first end H3a of the third extension piece H3 is connected to the second end H2b of the second extension piece H2, the second end H3b of the third extension piece H3 is a free end (not directly connected to other extension pieces or connection sections), the first connection end S2a of the second connection section S2 is connected to the second end H2b of the second extension piece H2, and the second connection end S2b of the second connection section S2 is connected to the first end H3a of the third extension piece H3.

[0080] The term “connection” herein may be “direct connection” or “indirect connection”, where “direct connection” means, for example, two elements connected to each other have no intermediate element between them, and “indirect connection” means, for example, two elements connected to each other are connected via another element.

[0081] Two adjacent extension sheets respectively have an upper surface and a lower surface facing each other, wherein the upper surface and the lower surface can form an airflow space (or gap). Figure 2 and Figure 3As shown, the first extension piece H1 has an upper surface H1u. The second extension piece H2 is connected to the first extension piece H1 and has a lower surface H2s. A first airflow space SP1 (or gap) is formed between the upper surface H1u of the first extension piece H1 and the lower surface H2s of the second extension piece H2. For another example, the second extension piece H2 has an upper surface H2u, and the third extension piece H3 has a lower surface H3s, wherein a second airflow space SP2 (or gap) is formed between the upper surface H2u of the second extension piece H2 and the lower surface H3s of the third extension piece H3.

[0082] In addition, there is an airflow space (or gap) between two adjacent extension sheets, and the airflow space can be arranged corresponding to the opening of the shell. Figure 3 As shown, a first airflow space SP1 (or gap) is formed between the upper surface H1u of the first extension piece H1 and the lower surface H2s of the second extension piece H2, which may correspond to the opening 107a of the lower shell 107 (the opening 107a is shown in FIG. Figure 1B ), so that the airflow passing through the airflow space flows out of the lower housing 107 from the opening 107a along the shortest path. Figure 3 As shown, a second airflow space SP2 (or gap) is formed between the upper surface H2u of the second extension piece H2 and the lower surface H3s of the third extension piece H3, which may correspond to the opening 107a of the lower shell 107 (the opening 107a is shown in FIG. Figure 1B ), so that the airflow passing through the airflow space flows out of the lower housing 107 from the opening 107a along the shortest path. The opening 107a is, for example, a through hole.

[0083] At least one extension piece may have at least one through hole to provide a passage for airflow to pass through the extension piece. Figure 2 and Figure 3 As shown, the first extension piece H1 has at least one through hole H1h. The airflow can enter the space below the first extension piece H1 or enter the first airflow space SP1 through the through hole H1h. For another example. The second extension piece H2 has at least one through hole H2h, and the airflow can enter the space below the second extension piece H2 or enter the second airflow space SP2 through the through hole H2h. For another example, the third extension piece H3 has at least one through hole H3h. The airflow can enter the third extension piece H3 through the through hole H3h and enter the second airflow space SP2. In addition, the through hole H1h of the first extension piece H1 can be set to correspond to the opening of the shell. For example, the through hole H1h of the first extension piece H1 can correspond to the opening 105a of the upper shell 105 (the opening 105a is shown in Figure 1B ) configuration. Similarly, the through hole H2h of the second extension piece H2 can be arranged corresponding to the opening of the shell. For example, the through hole H2h of the second extension piece H2 can be arranged corresponding to the opening 105a of the upper shell 105. The opening 105a is, for example, a through hole.

[0084] In addition, the heat sink 120 further has a first side surface 120s1 and a second side surface 120s2 opposite to each other, wherein the first side surface 120s1 and the second side surface 120s2 can connect the upper surface and the lower surface of each extension piece. The airflow space between two adjacent extension pieces can extend from the first side surface 120s1 to the second side surface 120s2.

[0085] like Figure 2 and Figure 3 As shown, the connecting segment connecting two adjacent extension sheets may be a straight segment. For example, the first connecting segment S1 connecting the first extension sheet H1 and the second extension sheet H2 is, for example, a straight segment, and the second connecting segment S2 connecting the second extension sheet H2 and the third extension sheet H3 is, for example, a straight segment. In another embodiment, if the length of the connecting segment is short, the connecting segment connecting two adjacent extension sheets may be an arc segment. In other embodiments, the heat sink 120 may omit the connecting segment, in which case the two adjacent extension sheets may be directly connected so that the two adjacent extension sheets are like two sides of a triangle. In one embodiment, when the two adjacent extension sheets are connected non-parallel, the connecting segment connects the two adjacent extension sheets non-perpendicularly. When the two adjacent extension sheets are parallel, the connecting segment may connect the two adjacent extension sheets perpendicularly.

[0086] An airflow space is formed between two adjacent extension pieces and the connecting section. Figure 2 and Figure 3 As shown, a first airflow space SP1 is formed between the first extension piece H1, the second extension piece H2 and the first connecting segment S1, and a second airflow space SP2 is formed between the second extension piece H2, the third extension piece H3 and the second connecting segment S2.

[0087] like Figure 2 and Figure 3 As shown, there is an angle between two adjacent extension sheets. For example, a first angle A1 is formed between the first extension sheet H1 and the second extension sheet H2, and a second angle A2 is formed between the second extension sheet H2 and the third extension sheet H3. The first angle A1 and / or the second angle A2 are, for example, acute angles, which may be greater than or equal to 0 degrees and less than or equal to 90 degrees. In one embodiment, the first angle A1 and / or the second angle A2 are between 3 and 60 degrees. In this way, this angle helps the heat sink 120 to be easily demolded during the manufacturing process (for example, easy to demold from a bending mold or a stamping mold). In another embodiment, if demolding is not considered, the first angle A1 and / or the second angle A2 may be an obtuse angle or a right angle.

[0088] like Figure 2 and Figure 4As shown, the support segment V1 has a first surface V1s1 and a second surface V1s2 opposite to each other, and the first electronic component 140 and the second electronic component 150 are respectively arranged on the first surface V1s1 and the second surface V1s2. The first extension piece H1 is connected to the end of the support segment V1 and is located above or directly above the first electronic component 140. The through hole H1h of the first extension piece H1 can be located above the first electronic component 140. In this way, the airflow of the fan 130 can flow to the first electronic component 140 through the through hole H1h to cool the first electronic component 140. In another embodiment, the through hole H1h and the first electronic component 140 can overlap along the Z-axis direction, so that the airflow path between the through hole H1h and the first electronic component 140 is shorter or the shortest, so as to increase the cooling efficiency. In addition, the second extension piece H2 is located above or directly above the second electronic component 150. The through hole H2h of the second extension piece H2 is located above the second electronic component 150. Thus, the airflow of the fan 130 can flow to the second electronic component 150 through the through hole H2h to cool the second electronic component 150. In another embodiment, the through hole H2h and the second electronic component 150 can overlap along the Z axis to make the airflow path between the through hole H2h and the second electronic component 150 shorter or the shortest to increase cooling efficiency.

[0089] like Figure 2 and Figure 4 As shown, the third extension piece H3 is located above the second extension piece H2. In one embodiment, the through hole H3h of the third extension piece H3 and the through hole H2h of the second extension piece H2 can overlap along the direction Z, so that the airflow path between the through hole H3h of the third extension piece H3 and the through hole H2h of the second extension piece H2 is shorter or the shortest, so as to increase the cooling efficiency. In one embodiment, the through hole H1h of the first extension piece H1, the through hole H2h of the second extension piece H2, and the through hole H3h of the third extension piece H3 can overlap along the direction Z, so that the airflow path between the through hole H1h of the first extension piece H1, the through hole H2h of the second extension piece H2, and the through hole H3h of the third extension piece H3 is shorter or the shortest, and the airflow of the fan 130 can be along a straight path (small wind resistance) to increase the cooling efficiency. In addition, the through hole H3h of the third extension piece H3 can be set corresponding to the opening of the shell. For example, the through hole H3h of the third extension piece H3 can correspond to the opening 105a of the upper shell 105 (the opening 105a is shown in Figure 1B ) configuration.

[0090] like Figure 1B and Figure 4As shown, in this embodiment, the fan 130 can be arranged directly above the heat sink 120. The fan 130 overlaps with the support segment V1 or the first extension piece H1 of the heat sink 120 substantially along a direction (e.g., the Z-axis direction). The fan 130 has an air outlet 131, and the air outlet 131 overlaps with the upper surface (e.g., the upper surface H3u) of the topmost extension piece (e.g., the third extension piece H3) of the heat sink 120 along the Z-axis direction. In this way, the airflow G1 flowing out of the air outlet 131 of the fan 130 can flow (directly or indirectly) to the upper surface (e.g., the upper surface H3u) of the topmost extension piece (e.g., the third extension piece H3) of the heat sink 120. In one embodiment, the outer frame of the fan 130 may also have a protruding structure, corresponding to the protruding arrangement of the upper shell 105, so as to reduce the gap between the fan 130 and the inner surface of the upper shell 105, thereby optimizing the cooling airflow path and improving the overall heat dissipation effect.

[0091] The first electronic component 140 and / or the second electronic component 150 are, for example, heat sources in the electronic device 100. In one embodiment, the first electronic component 140 and / or the second electronic component 150 are, for example, semiconductor components, which may be rectifiers, metal-oxide-semiconductor field-effect transistors (MOSFET), integrated circuits (IC), magnetic components, capacitors, dual in-line packages (DIP) and other surface mount devices (SMD), etc.

[0092] like Figure 2 and Figure 4 As shown, the first fixing member 160A and the second fixing member 160B can fix the relative position of the heat sink 120 and the electronic component. For example, the support segment V1 has a through hole V1a, the first electronic component 140 has a through hole 140a, and the second electronic component 150 has a through hole 150a. The first fixing member 160A can pass through the through hole 150a, the through hole V1a, and the through hole 140a, and is combined with the second fixing member 160B to fix the relative position between the heat sink 120, the first electronic component 140, and the second electronic component 150. In one embodiment, the first fixing member 160A is, for example, a bolt, and the second fixing member 160B is, for example, a nut.

[0093] In addition to using the first fixing member 160A and / or the second fixing member 160B, some embodiments may also fix the electronic components to the heat sink 120 in other ways. For example, thermally conductive adhesive is disposed on both sides of the support segment V1 of the heat sink 120, and the first electronic component 140 and the second electronic component 150 may be attached to the heat sink 120 with the thermally conductive adhesive on their entire surfaces to achieve fixation and / or uniform heat dissipation.

[0094] like Figure 4 As shown, the heat sink 120 has a first height L1, and the electronic device 100 has a second height L2. The ratio of the first height L1 of the heat sink 120 to the second height L2 of the electronic device 100 is, for example, between 0.3 and 0.85, but may also be lower or higher. However, the present embodiment does not limit the ratio of the first height L1 to the second height L2, as long as the heat sink 120 does not interfere with other components of the electronic device 100. In one embodiment, the ratio of the first height L1 to the second height L2 may be between 0.4 and 0.6 to provide better airflow space and heat dissipation effect. In addition, the number of at least one extension piece of the heat sink 120 depends on the height of the support segment V1, and the height of the support segment depends on the height of the first electronic component 140 and the second electronic component 150, which is not limited by the present embodiment.

[0095] Please refer to Figure 5 , which is a schematic diagram of an electronic device 200 according to another embodiment of the present invention. The electronic device 200 is, for example, a power supply unit or other types of electronic products.

[0096] like Figure 5 As shown, the electronic device 200 includes the aforementioned housing, a circuit board 110, at least one third electronic component 115 (not shown), a heat sink 120, a fan 230, a first electronic component 140, a second electronic component 150 (not shown), a first fixing member 160A and a second fixing member 160B. The heat sink 120 is disposed on the circuit board 110. The heat sink 120 includes an insertion portion 121, a support segment V1, a first extension piece H1, a second extension piece H2, a third extension piece H3, a first connecting segment S1 and a second connecting segment S2. The first extension piece H1 is connected to the support segment V1. The first extension piece H1 and the support segment V1 are not parallel. The first electronic component 140 is disposed in the support segment V1. In this way, the heat sink 120 can quickly convect the heat of the first electronic component 140 to the air.

[0097] The electronic device 200 includes the same or similar technical features as the aforementioned electronic device 100, with at least one difference being that the configuration position of the fan 230 of the electronic device 200 is different from the configuration position of the fan 130 of the electronic device 100. In the present embodiment, the fan 230 overlaps with the heat sink 120 along the Y-axis, wherein the Y-axis is, for example, the horizontal direction of the electronic device 100.

[0098] like Figure 5 As shown, the fan 230 has an air outlet 231, and the air outlet 231 overlaps with the first side surface 120s1 of the heat sink 120 along the X-axis. In this way, the airflow G1 flowing out of the air outlet 231 of the fan 230 can flow (directly or indirectly) to the first side surface 120s1 of the heat sink 120 and into the airflow space between two adjacent extension pieces (for example, SP1 and SP2). In addition, similar to the aforementioned electronic device 100, the through hole H1h of the first extension piece H1 can correspond to the opening 105a of the upper shell 105 (the opening 105a is shown in FIG. Figure 1B ) configuration. Similarly, the through hole H2h of the second extension piece H2 can be configured to correspond to the opening of the shell. For example, the through hole H2h of the second extension piece H2 can be configured to correspond to the opening 105a of the upper shell 105. The through hole H3h of the third extension piece H3 can be configured to correspond to the opening of the shell. For example, the through hole H3h of the third extension piece H3 can correspond to the opening 105a of the upper shell 105 (the opening 105a is shown in FIG. Figure 1B ) configuration. The opening 105a is, for example, a through hole. In addition, the first airflow space SP1 (or gap) between the first extension piece H1 and the second extension piece H2 may correspond to the opening 107a of the lower shell 107 (the opening 107a is shown in FIG. Figure 1B ), so that the airflow passing through the airflow space flows out of the lower shell 107 from the opening 107a along the shortest path. Similarly, the second airflow space SP2 (or gap) between the second extension piece H2 and the third extension piece H3 may correspond to the opening 107a of the lower shell 107 (the opening 107a is shown in FIG. Figure 1B ), so that the airflow passing through the airflow space flows out of the lower housing 107 from the opening 107a along the shortest path. The opening 107a is, for example, a through hole.

[0099] Please refer to Figure 6 , which is a schematic diagram of a heat sink 220 according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 can be replaced by the heat sink 220 .

[0100] like Figure 6 As shown, the heat sink 220 has the same or similar technical features as the heat sink 120, with at least one difference being that the heat sink 220 has two extension pieces (i.e., the first extension piece H1 and the second extension piece H2), and one connecting section (i.e., the first connecting section S1), wherein the topmost extension piece has a free end. In addition, the material, manufacturing method and / or structure of the heat sink 220 are similar or the same as those of the heat sink 120, and will not be described in detail herein.

[0101] Please refer to Figure 7, which is a schematic diagram of a heat sink 320 according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 can be replaced by the heat sink 320 .

[0102] like Figure 7 As shown, the heat sink 320 includes a support segment and N extension pieces, the extension piece is, for example, a transverse segment extending toward one side of the support segment, wherein N is a positive integer equal to or greater than 1, for example, 2, 3, 4, 5, 10, 15, 20 or greater, or other odd or even numbers. The larger the value of N, the higher the heat dissipation effect, but the worse the manufacturability. In one embodiment, the value of N may be between 3 and 5, which can take into account both the heat dissipation effect and the manufacturability. In one embodiment, the N extension pieces are directly or connected in a circuitous shape. The first extension piece H1 is directly or indirectly connected to the second extension piece H2. In one embodiment, the first end of the first extension piece is connected to the support segment, and the second end of the first extension piece is connected to the first end of the second extension piece. When i2, the first end of the i+1 extension piece is directly or indirectly connected to the second end of the i extension piece, the second end of the i+1 extension piece is directly or indirectly connected to the first end of the i+2 extension piece, and the Nth extension piece (i.e., the last section or the topmost extension piece) has a free end. In other embodiments, the heat sink 320 further includes N-1 connecting segments, wherein the i-th connecting segment Si connects the i-th extension sheet and the i+1-th extension sheet, wherein i is a positive integer bundle between 1 and N. In addition, the i-th extension sheet and the i+1-th extension sheet are arranged in a non-parallel manner, for example, there is an angle between the i-th extension sheet and the i+1-th extension sheet, wherein the angle may be an obtuse angle, a right angle, or an acute angle. In addition, the material, manufacturing method, and / or structure of the heat sink 320 are similar to those of the heat sink 120, which are not described in detail herein. In the present embodiment, the width of the i+1-th extension sheet along the X-axis direction is greater than the width of the i-th extension sheet along the X-axis direction. However, in another embodiment, the width of the i+1-th extension sheet along the X-axis direction may be substantially equal to the width of the i-th extension sheet along the X-axis direction. In addition, the material and / or manufacturing method of the heat sink 320 are similar to or the same as those of the heat sink 120, which are not described in detail herein.

[0103] Please refer to Fig. 8A, which depicts a schematic diagram of a heat sink 420 according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 or 200 can be replaced by a heat sink 420. The heat sink 420 includes the same or similar technical features as the aforementioned heat sink 120, and at least one difference is that the heat sink 420 also includes at least one guide portion 421, and the guide portion 421 can be configured on any extension piece. The guide portion 421 configured on the first extension piece H1 can protrude toward the electronic component. In one embodiment, each guide portion 421 can be configured in (for example, inserted into) a corresponding through hole (for example, H1h, H2h or H3h). The guide portion 421 has a guide through hole 421a, through which more airflow can be guided to the support segment V1, the first electronic component 140 (not shown) and the second electronic component 150 (not shown). In addition, the guide portion 421 protrudes relative to the lower surface of the extension piece. For example, the guide portion 421 disposed in the through hole H1h of the first extension piece H1 protrudes relative to the lower surface H1s of the first extension piece H1, the guide portion 421 disposed in the through hole H2h of the second extension piece H2 protrudes relative to the lower surface H2s of the second extension piece H2, and the guide portion 421 disposed in the through hole H3h of the third extension piece H3 protrudes relative to the lower surface H3s of the third extension piece H3, so that the path of the airflow meets expectations, and more airflow is guided to the support section V1, the first electronic component 140 (not shown) and the second electronic component 150 (not shown). In addition, since the guide portion 421 protrudes relative to the lower surface of the extension piece, the contact area between the guide portion 421 (or the heat sink 420) and the airflow is increased, thereby enhancing the heat dissipation effect.

[0104] In addition, the material and / or manufacturing method of the heat sink 420 is similar or the same as that of the heat sink 120, which will not be described in detail. In addition, the heat sinks of other embodiments of the present invention may also include at least one guide portion 421, which is configured in the same manner as the heat sink 420, which will not be described in detail.

[0105] Please refer to Figure 8B, which shows a schematic diagram of a heat sink 420' according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 or 200 can be replaced by a heat sink 420'. The heat sink 420' includes the same or similar technical features as the aforementioned heat sink 420, and at least one difference is that the guide portion 421' of the heat sink 420' is an integrally formed structure. In a manufacturing process, at least one through hole (for example, H1h, H2h and H3h, etc.) and the guide portion 421' can be formed on a plate (not shown) by, for example, punching technology, wherein the guide portion 421' is formed by extruding the plate material when the through hole is formed; then, the bent shape of the heat sink 420' can be formed by, for example, bending or stamping. In addition, since the guide portion 421' protrudes relative to the lower surface of the extension sheet, the contact area between the guide portion 421' (or the heat sink 420') and the airflow is increased, thereby enhancing the heat dissipation effect.

[0106] Please refer to Fig. 9 , which shows a schematic diagram of a heat sink 520 according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 or 200 can be replaced by the heat sink 520. The heat sink 520 includes the same or similar technical features as the aforementioned heat sink 120, with at least one difference being that the heat sink 520 can omit the connecting section (for example, the first connecting section S1 and / or the second connecting section S2), and two adjacent extension pieces can be directly connected. For example, the first extension piece H1 and the second extension piece H2 can be directly connected, and the second extension piece H2 and the third extension piece H3 can be directly connected. In addition, the material and / or manufacturing method of the heat sink 520 are similar to or the same as those of the heat sink 120, and will not be repeated here. In other embodiments, the connection between the first extension piece H1 and the support segment V1 is not limited to Fig. 9 At the end of the support segment V1 shown in the figure, the connection between the second extension piece H2 and the first extension piece H1 is not limited to Fig. 9 The end of the first extending piece H1 shown in the figure only needs to make the first extending piece H1 or the second extending piece H2 be located above the electronic component.

[0107] Please refer to Fig.10 , which is a schematic diagram of a heat sink 620 according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 or 200 can be replaced by the heat sink 620. The heat sink 620 includes the same or similar technical features as the aforementioned heat sink 120, with at least one difference being that the angle between the connected extension piece and the connecting section of the heat sink 620 can be an obtuse angle.

[0108] For example, the first extension piece H1 of the heat sink 620 has an angle A1' with the first connection section S1, and the second extension piece H2 has an angle A2' with the first connection section S1, wherein the angle A1' and / or the angle A2' are, for example, obtuse angles; or, one of the angles A1' and A2' is an obtuse angle, and the other of the angles A1' and A2' can be an acute angle or a right angle. The angles between the second connection section S2 and the connected extension pieces (i.e., the second extension piece H2 and the third extension piece H3) have similar characteristics, which will not be described in detail here.

[0109] In addition, the material and / or manufacturing method of the heat dissipation element 620 are similar to or the same as those of the heat dissipation element 120 , and are not described in detail herein.

[0110] Please refer to Fig.11 , which shows a schematic diagram of a heat sink 720 according to another embodiment of the present invention. The heat sink 120 of the aforementioned electronic device 100 or 200 can be replaced by the heat sink 720. The heat sink 720 includes the same or similar technical features as the aforementioned heat sink 120, with at least one difference being that the number of extension pieces of the heat sink 720 can be single. For example, the heat sink 720 may include a connected support segment V1 and an extension piece, namely, a first extension piece H1. In addition, the material and / or manufacturing method of the heat sink 720 are similar to or the same as those of the heat sink 120, and will not be repeated here.

[0111] In summary, although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. A person skilled in the art of the present invention may make various modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of the patent application.

Claims

1. An electronic device, characterized in that: include: a circuit board; A heat sink is disposed on the circuit board and includes: a supporting section; and a first extension piece connected to the support section; and an electronic component, disposed on the support section; Wherein, the first extension piece is not parallel to the supporting section.

2. The electronic device according to claim 1, wherein: The first extension piece is connected to the end of the supporting section and is located directly above the electronic component.

3. The electronic device according to claim 1, wherein: The first extension piece has a through hole, and the through hole is located above the electronic component.

4. The electronic device according to any one of claims 1 to 3, characterized in that: Also includes: A guiding portion is disposed on the first extending piece and protrudes toward the electronic component.

5. The electronic device according to claim 1, wherein: The first extension piece has a first end and a second end, the first end is connected to the end of the support section, and the first extension piece extends toward a first side of the support section. The heat dissipation element further includes: A second extension piece has a first end, the first end of the second extension piece is connected to the second end of the first extension piece, and the second extension piece extends toward a second side of the support section, wherein the first side is opposite to the second side.

6. The electronic device as claimed in claim 1, wherein: The heat sink also includes: a second extension piece; and A connecting section connects the first extension piece and the second extension piece.

7. The electronic device according to any one of claims 1 to 3 and 5 to 6, characterized in that: Also includes: A fan overlaps with the supporting section or the first extending piece along a direction.

8. A heat sink, characterized in that: include: a supporting section; A first extension piece having a first end and a second end, wherein the first end of the first extension piece is connected to the support section; as well as A second extension piece has a first end and a second end, the first end of the second extension piece is connected to the second end of the first extension piece, wherein the extension direction of the first end of the first extension piece to the second end of the first extension piece is different from the extension direction of the first end of the second extension piece to the second end of the second extension piece.

9. The heat sink according to claim 8, wherein: Also includes: A first connecting section has a first connecting end and a second connecting end, wherein the first connecting end is connected to the second end of the first extending piece, and the second connecting end is connected to the first end of the second extending piece.

10. The heat sink according to claim 8, wherein: The first extending piece and the second extending piece are arranged opposite to each other.

11. The heat sink according to claim 8, wherein: The heat sink also includes: A third extending piece is connected to the second end of the second extending piece, and the third extending piece is arranged opposite to the second extending piece.

12. The heat sink according to any one of claims 8 to 11, characterized in that: At least one of the first extending piece and the second extending piece has at least one through hole.

13. The heat sink according to claim 12, wherein: Also includes: At least one guiding portion is respectively disposed corresponding to at least one through hole and protrudes toward the supporting section.

14. A heat sink, characterized in that: include: a supporting section; a first extension piece connected to the support section and having an upper surface; and a second extension piece connected to the first extension piece and having a lower surface; Wherein, a gap is formed between the upper surface of the first extending piece and the lower surface of the second extending piece.

15. The heat sink according to claim 14, wherein: Also includes: a connecting section, connecting the first extension piece and the second extension piece; Wherein, the gap is formed between the first extending piece, the second extending piece and the connecting section.

16. An electronic device, characterized in that: include: A housing having at least one opening; a circuit board, disposed in the housing; The heat sink as claimed in any one of claims 8 to 15, disposed on the circuit board, wherein the heat sink is arranged corresponding to the at least one opening; and An electronic component is arranged corresponding to the heat sink and is electrically connected to the circuit board.

17. An electronic device, characterized in that: include: A housing having at least one opening; a circuit board, disposed in the housing; A heat sink is disposed on the circuit board and includes: a supporting section protruding from the circuit board; and a first extension piece connected to the support section and extending toward one side of the support section; and an electronic component, disposed on the support section; Wherein, the extension width of the first extension piece is greater than or equal to the width of the electronic component.

18. The electronic device as claimed in claim 17, wherein: The first extension piece has a through hole, which is arranged corresponding to the at least one opening.

19. The electronic device according to claim 17, wherein: The heat sink also includes: a second extension piece connected to the first extension piece, and the second extension piece extends from the first extension piece toward the other side of the support section; There is a gap between the first extension piece and the second extension piece, which is arranged corresponding to the at least one opening.

20. The electronic device according to any one of claims 17 to 19, characterized in that: The heat sink has a first height, the housing has a second height, and a ratio of the first height to the second height is between 0.3 and 0.85.

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