Device for welding IGBT (Insulated Gate Bipolar Translator) chip of photovoltaic inverter

Abstract

The utility model discloses a device for welding an IGBT chip of a photovoltaic inverter, which comprises a placing plate, a circuit board placing groove is arranged at the top end of the placing plate, an IGBT chip fixing column is arranged in the circuit board placing groove, a nylon pressing strip is arranged at the top end of the IGBT chip fixing column, and the nylon pressing strip is connected with the IGBT chip fixing column through a hand screw bolt. The top end of the placing plate is provided with an IGBT chip pressing assembly. The beneficial effects are that the welding height error of the chip is greatly reduced through the arrangement of the IGBT chip fixing column, the heat dissipation surfaces of all IGBT chips are in the same plane, convenience is provided for subsequent installation of the heat dissipation sheet, the chip is kept stable in the welding process through the design of the IGBT chip pressing assembly and the IGBT chip fixing column, the welding quality is improved, and the production cost is reduced. The placing plate is provided with the circuit board placing groove which is the same as the inverter circuit board in shape and size, so that the circuit board can be completely embedded into a tool hole position, and the welding precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power electronics, in particular to a device for welding an IGBT chip of a photovoltaic inverter. Background Art

[0002] In the welding process of IGBT chips of photovoltaic inverters, traditional methods often make it difficult to ensure that the height of each chip is consistent after welding, which brings difficulties to the subsequent installation of heat sinks. Therefore, how to ensure that the height of IGBT chips is the same during welding has become an urgent problem to be solved.

[0003] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0004] In view of the problems in the related technology, the utility model proposes a device for welding an IGBT chip of a photovoltaic inverter to overcome the above technical problems existing in the existing related technology.

[0005] To this end, the specific technical solutions adopted by the utility model are as follows:

[0006] A device for welding an IGBT chip of a photovoltaic inverter comprises a placement plate, a circuit board placement groove is provided on the top of the placement plate, an IGBT chip fixing column is provided in the circuit board placement groove, a nylon pressure strip is provided on the top of the IGBT chip fixing column, the nylon pressure strip is connected to the IGBT chip fixing column by a hand-tightening bolt, and an IGBT chip clamping assembly is provided on the top of the placement plate.

[0007] Preferably, there is more than one IGBT chip fixing column.

[0008] Preferably, the IGBT chip clamping assembly includes a fixing seat which is located at the top of the placement plate and is arranged around the circuit board placement groove, a rotating rod is provided at the top of the fixing seat, one side of the rotating rod is connected to the fixing seat through a rotating shaft 1, a U-shaped frame is provided at the top of the fixing seat, the U-shaped frame is connected to the fixing seat through a rotating shaft 2, the U-shaped frame is connected to the rotating rod through a movable connecting frame, an adjustment plate is provided on one side of the top end of the rotating rod, and a pressure rod is provided on one side of the bottom end of the adjusting plate.

[0009] Preferably, a fixed push rod is provided at the top of the U-shaped frame, the top of the movable connecting frame is connected to the U-shaped frame via a rotating shaft three, and the bottom of the movable connecting frame is connected to the rotating rod via a rotating shaft four.

[0010] Preferably, a rubber pressure head is provided at the bottom end of the pressure rod.

[0011] Preferably, a bolt column passing through the adjusting plate is provided on one side of the top end of the rotating rod, a clamping nut is sleeved on the top end of the adjusting plate and located on the outer wall of the bolt column, a travel groove matching the bolt column is opened on the adjusting plate, and a guide rod passing through the travel groove is provided on the top end of the adjusting plate and located on one side of the bolt column.

[0012] The beneficial effects of the utility model are as follows: by setting the IGBT chip fixing column, the chip welding height error is greatly reduced, so that the heat dissipation surfaces of all IGBT chips are on the same plane, which provides convenience for the subsequent installation of the heat sink; at the same time, through the design of the IGBT chip clamping assembly and the IGBT chip fixing column, the chip remains stable during the welding process, and the welding quality is improved; the placement plate is provided with a circuit board placement groove with the same shape and size as the inverter circuit board, so that the circuit board can be completely embedded in the tooling hole, thereby improving the welding accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a schematic diagram of the overall structure of a device for welding a photovoltaic inverter IGBT chip according to an embodiment of the utility model;

[0015] Figure 2 It is a top view of a device for welding a photovoltaic inverter IGBT chip according to an embodiment of the utility model;

[0016] Figure 3 This is a schematic diagram of the structure of a fixing seat in a device for welding an IGBT chip of a photovoltaic inverter according to an embodiment of the utility model;

[0017] Figure 4 The present invention is a cross-sectional view of a U-shaped frame in a device for welding IGBT chips of a photovoltaic inverter according to an embodiment of the present invention.

[0018] In the figure:

[0019] 1. Placement plate; 2. Circuit board placement slot; 3. IGBT chip fixing column; 4. Fixing seat; 5. Rotating rod; 6. Rotating shaft one; 7. U-shaped frame; 8. Rotating shaft two; 9. Active connecting frame; 10. Adjustment plate; 11. Pressure rod; 12. Fixed push rod; 13. Rotating shaft three; 14. Rotating shaft four; 15. Rubber pressure head; 16. Bolt column; 17. Travel groove; 18. Guide rod; 19. Pressing nut; 20. Nylon pressure strip. DETAILED DESCRIPTION

[0020] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0021] According to an embodiment of the utility model, a device for welding an IGBT chip of a photovoltaic inverter is provided.

[0022] Embodiment 1;

[0023] like Figure 1-4 As shown, according to an embodiment of the utility model, a device for welding photovoltaic inverter IGBT chips includes a placement plate 1, a circuit board placement groove 2 is opened at the top of the placement plate 1, an IGBT chip fixing column 3 is arranged in the circuit board placement groove 2, a nylon pressure strip 20 is arranged at the top of the IGBT chip fixing column 3, the nylon pressure strip 20 is connected to the IGBT chip fixing column 3 by a hand-tightened bolt, and an IGBT chip clamping assembly is arranged at the top of the placement plate 1.

[0024] Embodiment 2:

[0025] like Figure 1-4As shown, it includes a placement plate 1, a circuit board placement groove 2 is provided at the top of the placement plate 1, an IGBT chip fixing column 3 is provided in the circuit board placement groove 2, a nylon pressure strip 20 is provided at the top of the IGBT chip fixing column 3, and the nylon pressure strip 20 is connected to the IGBT chip fixing column 3 through a hand-tightening bolt, and an IGBT chip clamping assembly is provided at the top of the placement plate 1. There is more than one IGBT chip fixing column 3. The IGBT chip clamping assembly includes a fixing seat 4 which is provided at the top of the placement plate 1 and is located around the circuit board placement groove 2, a rotating rod 5 is provided at the top of the fixing seat 4, one side of the rotating rod 5 is connected to the fixing seat 4 through a rotating shaft 1 6, a U-shaped frame 7 is provided at the top of the fixing seat 4, the U-shaped frame 7 is connected to the fixing seat 4 through a rotating shaft 2 8, and the U-shaped frame 7 is connected to the rotating rod 5 through a movable connecting frame 9, an adjustment plate 10 is provided on one side of the top of the rotating rod 5, and a pressure rod 11 is provided on one side of the bottom end of the adjustment plate 10. A fixed push rod 12 is provided at the top of the U-shaped frame 7, the top of the movable connecting frame 9 is connected to the U-shaped frame 7 through a rotating shaft 3 13, and the bottom of the movable connecting frame 9 is connected to the rotating rod 5 through a rotating shaft 4 14. A rubber pressure head 15 is provided at the bottom of the pressure rod 11. A bolt column 16 penetrating the adjustment plate 10 is provided at one side of the top of the rotating rod 5, a clamping nut 19 is sleeved on the top of the adjustment plate 10 and located on the outer wall of the bolt column 16, a travel groove 17 matching the bolt column 16 is opened on the adjustment plate 10, and a guide rod 18 penetrating the travel groove 17 is provided at the top of the adjustment plate 10 and located on one side of the bolt column 16.

[0026] In actual application, first ensure that all parts on the placement plate 1 are intact, especially key components such as the IGBT chip clamping assembly and the IGBT chip fixing column, and then embed the inverter circuit board into the circuit board placement groove 2 on the placement plate 1 to ensure that the circuit board fits tightly against the inner wall of the circuit board placement groove 2, and then insert the IGBT chip into the IGBT chip fixing column 3 on the placement plate 1. Each IGBT chip fixing column 3 corresponds to an IGBT chip. Then, you can choose to use a nylon pressure strip 20 with fixing holes in the same hole position, and insert it into the IGBT chip fixing column 3 to further fix the IGBT chip. When the IGBT chip is fixed, rotate the fixed push rod 12 to drive the U-shaped frame 7 to rotate. When the recessed part of the U-shaped frame 7 is directly below, during this process, the U-shaped frame 7 drives the rotating rod 5 to rotate to a horizontal state through the movable connecting frame 9, and the rotating rod 5 drives the pressure rod 11 and the rubber pressure head 15 through the adjustment plate 10 to cooperate to fix the IGBT The chip is clamped. When the position of the pressure rod 11 needs to be adjusted, the clamping nut 19 can be loosened and then the adjustment plate 10 can be moved to the appropriate position, and then the clamping nut 19 can be tightened. When the IGBT chip is clamped, the IGBT chip is welded. After welding is completed, the external welding equipment is turned off and the welding part is waited for to cool down. After cooling, the IGBT chip clamping assembly is released and the welded IGBT chip circuit board is removed. The chip welding height error is greatly reduced by setting the IGBT chip fixing column, so that the heat dissipation surface of all IGBT chips is on the same plane, which provides convenience for the subsequent installation of the heat sink. At the same time, the design of the IGBT chip clamping assembly and the IGBT chip fixing column makes the chip remain stable during the welding process, which improves the welding quality. The placement plate opens a circuit board placement groove with the same shape and size as the inverter circuit board, so that the circuit board can be fully embedded in the tooling hole, which improves the welding accuracy.

[0027] To sum up, with the help of the above-mentioned technical scheme of the utility model, the chip welding height error is greatly reduced by setting the IGBT chip fixing column, so that the heat dissipation surfaces of all IGBT chips are on the same plane, which provides convenience for the subsequent installation of heat sinks. At the same time, through the design of the IGBT chip clamping assembly and the IGBT chip fixing column, the chip remains stable during the welding process, and the welding quality is improved. The placement plate opens a circuit board placement groove with the same shape and size as the inverter circuit board, so that the circuit board can be completely embedded in the tooling hole, thereby improving the welding accuracy.

[0028] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for welding photovoltaic inverter IGBT chips, characterized in that: The invention comprises a placement plate (1), wherein a circuit board placement groove (2) is provided at the top of the placement plate (1), an IGBT chip fixing column (3) is provided in the circuit board placement groove (2), a nylon pressure strip (20) is provided at the top of the IGBT chip fixing column (3), the nylon pressure strip (20) is connected to the IGBT chip fixing column (3) by means of a hand-tightened bolt, and an IGBT chip clamping assembly is provided at the top of the placement plate (1).

2. A device for welding photovoltaic inverter IGBT chips according to claim 1, characterized in that: There is more than one IGBT chip fixing column (3).

3. The device for welding photovoltaic inverter IGBT chips according to claim 1, characterized in that: The IGBT chip clamping assembly comprises a fixing seat (4) which is arranged at the top of the placement plate (1) and is located around the circuit board placement groove (2); a rotating rod (5) is arranged at the top of the fixing seat (4); one side of the rotating rod (5) is connected to the fixing seat (4) via a rotating shaft (6); a U-shaped frame (7) is arranged at the top of the fixing seat (4); the U-shaped frame (7) is connected to the fixing seat (4) via a rotating shaft (8); the U-shaped frame (7) is connected to the fixing seat (4) via a movable connecting frame (9); an adjusting plate (10) is arranged at one side of the top of the rotating rod (5); and a pressing rod (11) is arranged at one side of the bottom of the adjusting plate (10).

4. The device for welding photovoltaic inverter IGBT chips according to claim 3, characterized in that: The top of the U-shaped frame (7) is provided with a fixed push rod (12), the top of the movable connecting frame (9) is connected to the U-shaped frame (7) via a rotating shaft three (13), and the bottom of the movable connecting frame (9) is connected to the rotating rod (5) via a rotating shaft four (14).

5. The device for welding photovoltaic inverter IGBT chips according to claim 3, characterized in that: A rubber pressure head (15) is provided at the bottom end of the pressure rod (11).

6. The device for welding photovoltaic inverter IGBT chips according to claim 3, characterized in that: A bolt column (16) penetrating the adjusting plate (10) is provided at one side of the top end of the rotating rod (5); a clamping nut (19) is sleeved at the top end of the adjusting plate (10) and located on the outer wall of the bolt column (16); a travel groove (17) matching the bolt column (16) is provided on the adjusting plate (10); and a guide rod (18) penetrating the travel groove (17) is provided at the top end of the adjusting plate (10) and located on one side of the bolt column (16).

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