Silicon wafer conveying mechanism

Abstract

The utility model belongs to the technical field of silicon wafer conveying, and particularly relates to a silicon wafer conveying mechanism, which comprises a plurality of first conveying assemblies, a plurality of second conveying assemblies, a plurality of second conveying assemblies, a plurality of first conveying assemblies and a plurality of second conveying assemblies, the horizontal moving pair is erected above the first conveying assemblies and the second conveying assemblies, a plurality of adsorption assemblies are arranged at the moving end of the horizontal moving pair, and the number of the first conveying assemblies, the number of the second conveying assemblies and the number of the adsorption assemblies are the same; a plurality of adsorption assemblies are arranged at the moving end of the horizontal moving pair, so that silicon wafers on the second conveying assembly can be adsorbed and then translated to the first conveying assembly; the second conveying assemblies are arranged on the two sides of the first conveying assembly respectively, the silicon wafers in the equipment can be received through the second conveying assemblies, and the silicon wafers are output by the first conveying assembly close to the second conveying assemblies.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer conveying, and specifically relates to a silicon wafer conveying mechanism. Background Art

[0002] The silicon wafers need to be transported by conveyor belts to various devices. If the front process produces wafers too quickly, it will cause the silicon wafers to pile up, affecting production efficiency.

[0003] Therefore, how to avoid silicon wafer accumulation is a technical problem that needs to be solved urgently in this field. Utility Model Content

[0004] The utility model aims to provide a silicon wafer conveying mechanism.

[0005] In order to solve the above technical problems, the utility model provides a silicon wafer conveying mechanism, including: a plurality of first conveying components, on both sides of which are arranged a plurality of second conveying components; a horizontal moving pair mounted above the first conveying components and the second conveying components, and a plurality of adsorption components are arranged at the moving end of the horizontal moving pair on the horizontal moving pair, wherein the number of the first conveying components, the second conveying components and the adsorption components are the same.

[0006] Preferably, the horizontal moving pair is provided in a pair, and the number of the adsorption components and the second transfer components on each horizontal moving pair is the same.

[0007] Preferably, the adsorption assembly includes an adsorption support plate, an adsorption bracket and an adsorption bottom plate; the adsorption support plate is arranged at the moving end of the horizontal moving pair, the adsorption bracket is arranged on the side wall of the adsorption support plate, and the adsorption bottom plate is slidably arranged at the bottom of the adsorption bracket.

[0008] Preferably, a lifting cylinder is provided on the side wall of the adsorption bracket, and the adsorption bottom plate is provided on the piston rod of the lifting cylinder.

[0009] Preferably, the adsorption bracket is "L"-shaped, and the piston rod of the lifting cylinder always passes through the horizontal end of the adsorption bracket.

[0010] Preferably, the horizontal moving pair comprises a "C"-shaped support frame, a side wall of the support frame is provided with an electric actuator, and the adsorption assembly is arranged on the moving end of the electric actuator.

[0011] Preferably, the first conveying assembly includes a plurality of first conveying brackets, a first conveying beam is mounted on the top of the first conveying bracket, first conveying rollers are rotatably provided at both ends of the first conveying beam, and conveying belts are supported respectively at both ends of the first conveying rollers.

[0012] Preferably, a first active bracket is arranged between the conveying brackets, a first active roller is arranged on the first active bracket, and the first active roller supports the conveying belt; a driving motor is arranged between the conveying brackets, and the output shaft of the driving motor is connected to the first active roller through a synchronous belt.

[0013] Preferably, the second conveying assembly includes a plurality of second conveying brackets, a second conveying beam is mounted on the top of the second conveying bracket, second conveying rollers are rotatably provided at both ends of the second conveying beam, conveying belts are supported at both ends of the second conveying rollers, and a material receiving support plate is obliquely provided on the top of the second conveying bracket located at the rear end, a material receiving roller is rotatably provided at the end of the material receiving support plate, and the material receiving roller supports the conveying belt on the second conveying roller.

[0014] Preferably, a material receiving box is provided at the rear end of the material receiving support plate, and a guide rod is provided on the side wall of the material receiving support plate.

[0015] The beneficial effects of the utility model are:

[0016] By arranging a plurality of adsorption components at the moving end of the horizontal moving pair, the silicon wafers on the second conveying component can be adsorbed and then translated to the first conveying component; further, second conveying components are respectively arranged on both sides of the first conveying component, and the silicon wafers in the equipment can be received by the second conveying components, and the first conveying component close to them is responsible for outputting them. Furthermore, the number of adsorption components and first conveying components is the same as the number of second conveying components, so that the adsorption components can adsorb the silicon wafers on all the second conveying components at one time and can be placed on the first conveying component at the same time.

[0017] Other features and advantages of the present invention will be set forth in the following description, and in part will become apparent from the description, or may be understood by implementing the present invention.

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a top view of a preferred embodiment of the silicon wafer conveying mechanism of the utility model;

[0021] Figure 2 It is a three-dimensional diagram of a preferred embodiment of the silicon wafer conveying mechanism of the utility model;

[0022] Figure 3 yes Figure 2 The enlarged view of point A in the middle;

[0023] Figure 4 yes Figure 2 The enlarged view of point B in the middle;

[0024] Figure 5 It is a structural schematic diagram of the first transmission component of the utility model.

[0025] In the figure:

[0026] 1. A first transmission component;

[0027] 11. first transmission bracket; 12. first transmission beam; 13. first transmission roller; 14. transmission belt; 15. first active bracket; 16. first active roller; 17. driving motor;

[0028] 2. A second transmission component;

[0029] 21. Second conveying bracket; 22. Second conveying beam; 23. Second conveying roller; 24. Material receiving support plate; 25. Material receiving roller; 26. Material receiving box; 27. Guide rod;

[0030] 3. Horizontal moving pair;

[0031] 31. Support frame; 32. Electric actuator;

[0032] 4. Adsorption components;

[0033] 41. Adsorption support plate; 42. Adsorption bracket; 43. Adsorption bottom plate; 44. Lifting cylinder. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the embodiments of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] like Figures 1 to 4As shown, at least one embodiment provides a silicon wafer conveying mechanism, comprising: a plurality of first conveying components 1, with a plurality of second conveying components 2 arranged on both sides thereof; a horizontal moving pair 3 erected above the first conveying components 1 and the second conveying components 2, and a plurality of adsorption components 4 are arranged on the moving end of the horizontal moving pair 3 on the horizontal moving pair 3, wherein the number of the first conveying components 1, the second conveying components 2 and the adsorption components 4 are the same; in short, by arranging a plurality of adsorption components 4 at the moving end of the horizontal moving pair 3, the silicon wafers on the second conveying components 2 can be adsorbed and then translated to the first conveying component 1; further, the second conveying components 2 are respectively arranged on both sides of the first conveying component 1, and the silicon wafers in the equipment can be received by the second conveying components 2, and the first conveying component 1 close thereto is responsible for outputting them, and further, the number of adsorption components 4 and the first conveying component 1 is the same as the number of the second conveying components 2, so that the adsorption components 4 can adsorb all the silicon wafers on the second conveying components 2 at one time, and can be placed on the first conveying component 1 at the same time.

[0036] In some embodiments, the horizontal moving pair 3 is mirror-set in pair, and the number of the adsorption components 4 on each of the horizontal moving pairs 3 is the same as the number of the second conveying components 2; in short, by mirror-setting the horizontal moving pair 3, it can be responsible for the second conveying components 2 on both sides respectively, further improving the conveying efficiency and avoiding the accumulation of silicon wafers.

[0037] In some embodiments, the adsorption assembly 4 includes an adsorption support plate 41, an adsorption bracket 42 and an adsorption bottom plate 43; the adsorption support plate 41 is arranged at the moving end of the horizontal moving pair 3, the adsorption bracket 42 is arranged on the side wall of the adsorption support plate 41, and the adsorption bottom plate 43 is slidably arranged at the bottom of the adsorption bracket 42; in short, the adsorption bottom plate 43 is connected to the air source, and the silicon wafer is adsorbed by negative pressure, and the adsorption bottom plate 43 is slidably arranged on the adsorption bracket 42, and can be lifted after the adsorption of the silicon wafer is completed, and moved to the first conveying assembly 1.

[0038] In some embodiments, a lifting cylinder 44 is provided on the side wall of the adsorption bracket 42 , and the adsorption bottom plate 43 is provided on the piston rod of the lifting cylinder 44 ; in short, the sliding setting of the adsorption bottom plate 43 can be completed by the lifting cylinder 44 .

[0039] In some embodiments, the adsorption bracket 42 is "L"-shaped, and the piston rod of the lifting cylinder 44 always passes through the horizontal end of the adsorption bracket 42; in short, the piston rod of the lifting cylinder 44 is inserted into the horizontal end of the adsorption bracket 42, which can avoid the displacement of the piston rod of the lifting cylinder 44 and improve the life of the lifting cylinder 44.

[0040] In some embodiments, the horizontal moving pair 3 includes a "C"-shaped support frame 31, the side wall of the support frame 31 is provided with an electric actuator 32, and the adsorption assembly 4 is arranged on the moving end of the electric actuator 32; in short, the horizontal movement of the adsorption support plate 41 can be completed by the electric actuator 32.

[0041] In some embodiments, the first conveying component 1 includes a plurality of first conveying brackets 11, a first conveying beam 12 is set on the top of the first conveying bracket 11, first conveying rollers 13 are rotatably set at both ends of the first conveying beam 12, and conveying belts 14 are supported at both ends of the first conveying roller 13; in short, a pair of conveying brackets can set up the first conveying beam 12, and a pair of first conveying rollers 13 are rotatably set on the first conveying beam 12 to support the conveying belt 14, and the conveying belt 14 can be driven to complete the transportation of silicon wafers.

[0042] In some embodiments, a first active bracket 15 is arranged between the conveying brackets, a first active roller 16 is arranged on the first active bracket 15, and the first active roller 16 supports the conveying belt 14; a driving motor 17 is arranged between the conveying brackets, and the output shaft of the driving motor 17 is connected to the first active roller 16 through a synchronous belt; in short, the first active roller 16 can be set up through the first active bracket 15, and the first active roller 16 is suitable for supporting the conveying belt 14, and the driving motor 17 drives the first active roller 16 to drive the conveying belt 14.

[0043] In some embodiments, the second conveying component 2 includes a plurality of second conveying brackets 21, a second conveying beam 22 is set on the top of the second conveying bracket 21, second conveying rollers 23 are rotatably set at both ends of the second conveying beam 22, and conveying belts 14 are supported at both ends of the second conveying rollers 23, and a material receiving support plate 24 is tilted on the top of the second conveying bracket 21 at the rear end, and a material receiving roller 25 is rotatably set at the end of the material receiving support plate 24, and the material receiving roller 25 supports the conveying belt 14 on the second conveying roller 23; in short, the second conveying component 2 is similar in structure to the first conveying component 1, and the second conveying beam 22 is set by a pair of second conveying brackets 21, and second conveying rollers 23 are rotatably set at both ends of the second conveying beam 22 to support the conveying belt 14, and a driving motor 17 and an active roller are also provided in the second conveying component 2 to complete the driving of the conveying belt 14.

[0044] In some embodiments, a material receiving box 26 is provided at the rear end of the material receiving support plate 24, and a guide rod 27 is provided on the side wall of the material receiving support plate 24; in short, silicon wafers are taken out through the material receiving box 26, and silicon wafers that are not taken away in time can be temporarily stored through the guide rod 27.

[0045] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0047] Based on the above ideal embodiments of the utility model, the relevant staff can make various changes and modifications without deviating from the technical concept of the utility model through the above description. The technical scope of the utility model is not limited to the content of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A silicon wafer conveying mechanism, characterized in that: include: A plurality of first conveying components (1), with a plurality of second conveying components (2) arranged on both sides thereof; A horizontal moving pair (3) is mounted above the first conveying assembly (1) and the second conveying assembly (2), wherein a plurality of adsorption assemblies (4) are arranged at the moving end of the horizontal moving pair (3), wherein The number of the first conveying components (1), the second conveying components (2) and the adsorption components (4) is the same.

2. The silicon wafer conveying mechanism according to claim 1, characterized in that: A pair of the horizontal moving pairs (3) are arranged in a mirror image, and the number of the adsorption components (4) and the second conveying components (2) on each of the horizontal moving pairs (3) is the same.

3. The silicon wafer conveying mechanism according to claim 1, characterized in that: The adsorption assembly (4) comprises an adsorption support plate (41), an adsorption bracket (42) and an adsorption bottom plate (43); The adsorption support plate (41) is arranged at the moving end of the horizontal moving pair (3), the adsorption bracket (42) is arranged on the side wall of the adsorption support plate (41), and the adsorption bottom plate (43) is slidably arranged at the bottom of the adsorption bracket (42).

4. The silicon wafer conveying mechanism according to claim 3, characterized in that: A lifting cylinder (44) is provided on the side wall of the adsorption bracket (42), and the adsorption bottom plate (43) is provided on the piston rod of the lifting cylinder (44).

5. The silicon wafer conveying mechanism according to claim 4, characterized in that: The adsorption bracket (42) is in an "L" shape, and the piston rod of the lifting cylinder (44) always passes through the horizontal end of the adsorption bracket (42).

6. The silicon wafer conveying mechanism according to claim 1, characterized in that: The horizontal moving pair (3) comprises a "C"-shaped support frame (31), a side wall of the support frame (31) is provided with an electric actuator (32), and the adsorption component (4) is arranged on the moving end of the electric actuator (32).

7. The silicon wafer conveying mechanism according to claim 1, characterized in that: The first conveying assembly (1) comprises a plurality of first conveying brackets (11), a first conveying beam (12) being mounted on the top of the first conveying bracket (11), first conveying rollers (13) being rotatably arranged at both ends of the first conveying beam (12), and conveying belts (14) being supported respectively at both ends of the first conveying rollers (13).

8. The silicon wafer conveying mechanism according to claim 7, characterized in that: A first active support (15) is arranged between the conveying supports, a first active roller (16) is arranged on the first active support (15), and the first active roller (16) supports the conveying belt (14); A driving motor (17) is arranged between the conveying brackets, and an output shaft of the driving motor (17) is connected to the first active roller (16) via a synchronous belt.

9. The silicon wafer conveying mechanism according to claim 1, characterized in that: The second conveying assembly (2) comprises a plurality of second conveying brackets (21), a second conveying beam (22) being mounted on the top of the second conveying bracket (21), second conveying rollers (23) being rotatably arranged at both ends of the second conveying beam (22), and conveying belts (14) being supported at both ends of the second conveying rollers (23); and A material receiving support plate (24) is obliquely arranged on the top of the second conveying bracket (21) at the rear end, and a material receiving roller (25) is rotatably arranged at the end of the material receiving support plate (24), and the material receiving roller (25) supports the conveying belt (14) on the second conveying roller (23).

10. The silicon wafer conveying mechanism according to claim 9, characterized in that: A material receiving box (26) is provided at the rear end of the material receiving support plate (24), and a guide rod (27) is provided on the side wall of the material receiving support plate (24).

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