High-power concentration device for electroplating wastewater

Abstract

The utility model discloses an electroplating wastewater high-power concentration device which comprises an evaporation concentration tank and a condenser, a butt joint pipe is fixedly communicated between the evaporation concentration tank and the condenser, the outer wall of the condenser is fixedly communicated with an exhaust pipe, the outer wall of the evaporation concentration tank is fixedly communicated with two blow-off pipes, and the two blow-off pipes are communicated with each other. A water inlet pipe fixedly communicates with the outer wall of the evaporation concentration tank, a pump body fixedly communicates with one end of the water inlet pipe, valves are fixedly mounted on the outer walls of a butt joint pipe, an exhaust pipe, a blow-off pipe and the water inlet pipe, and a butt joint frame is fixedly connected to the outer wall of the evaporation concentration tank. The electric push rod, the water inlet pipe, the disc, the first steel wire brush, the round sleeve and the second steel wire brush are arranged, the second steel wire brush is used for cleaning the outer wall of the heat conduction pipe, and the first steel wire brush is used for cleaning the inner wall of the evaporation concentration tank, so that scale is cleaned, and the evaporation concentration tank body does not need to be disassembled.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating wastewater treatment equipment, in particular to a high-multiple concentration device for electroplating wastewater. Background Art

[0002] Electroplating wastewater refers to wastewater generated during the electroplating production process, mainly including plated parts cleaning water, waste plating solution, washing workshop water, etc. This wastewater contains harmful components such as heavy metal ions, cyanide, acids and alkalis. If it is directly discharged into the environment, it will cause serious pollution and harm to the soil, water and ecosystem.

[0003] After searching, the patent document with publication number: CN217398480U discloses a high-multiple concentration device for electroplating wastewater, which heats the electroplating wastewater in the chamber of the evaporation concentration tank through a heating device, stirs the electroplating wastewater through a stirring mechanism, and a vacuum tube is connected to the vacuum device. The vacuum device evacuates the chamber of the evaporation concentration tank to reduce the boiling point of the electroplating wastewater and increase the heating effect of the electroplating wastewater. The steam generated by the heating of the electroplating wastewater is transported to the chamber of the condensation tank through a first connecting pipe, and the condensation mechanism in the chamber of the condensation tank condenses the steam. The condensed water flows back to the chamber of the evaporation concentration tank through a second connecting pipe, and the electroplating wastewater is evaporated and concentrated multiple times.

[0004] Although the above device has solved some of the existing shortcomings, since scale is easily formed in the tank during the evaporation of water in the electroplating wastewater, there is no self-cleaning structure and the tank needs to be disassembled for cleaning. In addition, the thermal conductivity of scale is generally very poor. Compared with steel, the thermal conductivity coefficient differs by dozens to hundreds of times. Therefore, the formation of scale on the wall of the metal tank will seriously affect the heat transfer. Therefore, we propose a high-multiple concentration device for electroplating wastewater to solve the above problems. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a high-fold concentration device for electroplating wastewater.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] The electroplating wastewater high-power concentration device comprises an evaporation concentration tank and a condenser, wherein a docking pipe is fixedly connected between the evaporation concentration tank and the condenser, an exhaust pipe is fixedly connected to the outer wall of the condenser, two sewage pipes are fixedly connected to the outer wall of the evaporation concentration tank, a water inlet pipe is fixedly connected to the outer wall of the evaporation concentration tank, a pump body is fixedly connected to one end of the water inlet pipe, valves are fixedly installed on the outer walls of the docking pipe, the exhaust pipe, the sewage pipe and the water inlet pipe, a docking frame is fixedly connected to the outer wall of the evaporation concentration tank, a heating mechanism is arranged inside the evaporation concentration tank, and a cleaning mechanism is arranged inside the evaporation concentration tank.

[0008] Preferably, the heating mechanism includes a turntable with a hollow structure, a motor and an electric push rod are fixedly connected to the inside of the docking frame, a spur gear is fixedly sleeved on the outer wall of the motor output shaft, a ring gear is meshingly connected to the outer wall of the spur gear, a docking ring is fixedly connected to the outer wall of the ring gear, one end of the docking ring is fixedly connected to the outer wall of the turntable, a plurality of heat-conducting pipes are fixedly connected to the outer wall of the turntable, an electric heating rod is fixedly connected to the inside of the heat-conducting pipe, and the turntable is arranged to drive the plurality of heat-conducting pipes and the electric heating rod to rotate, so as to stir and heat the electroplating wastewater.

[0009] Preferably, the cleaning mechanism includes a disc, the output end of the electric push rod penetrates the outer wall of the turntable and is rotatably connected to the outer wall of the disc, the outer wall of the disc is provided with a plurality of sliding holes, the inner walls of the plurality of sliding holes are respectively slidably connected to the outer walls of a plurality of heat-conducting tubes, the outer wall of the disc is fixedly connected with a plurality of circular sleeves, the inner walls of the plurality of circular sleeves are evenly fixedly connected with a plurality of second steel wire brushes, the outer wall of the disc is evenly fixedly connected with a plurality of first steel wire brushes, and the inner wall of the evaporation concentration tank is cleaned by arranging the first steel wire brushes.

[0010] Preferably, an exhaust pipe is fixedly connected to the outer wall of the evaporation concentration tank, and a vacuum pump is fixedly connected to one end of the exhaust pipe. The operation of the vacuum pump reduces the gas pressure in the evaporation concentration tank 1, reduces the boiling point of water in the electroplating wastewater, and facilitates the rapid concentration of the electroplating wastewater.

[0011] Preferably, a circular hole is formed on the outer wall of the evaporation concentration tank, and the inner wall of the circular hole is rotatably connected to the outer wall of the docking ring.

[0012] Preferably, the outer wall of the first steel wire brush contacts the inner wall of the evaporation concentration tank, and the outer wall of the second steel wire brush contacts the outer wall of the heat conduction tube, and the outer wall of the heat conduction tube is cleaned by arranging the second steel wire brush.

[0013] Preferably, an electric slip ring is provided on the outer wall of the turntable, and a liquid inlet pipe is fixedly connected to the outer wall of the evaporation concentration tank. The electric slip ring is provided to assist the electric heating rod in being electrically connected to an external power supply through an existing cable.

[0014] Compared with the prior art, the advantages of the utility model are:

[0015] This scheme is provided with a motor, a spur gear, a ring gear, a docking ring, a turntable, a heat pipe and an electric heating rod. During the rotation of the multiple heat pipes, the electroplating wastewater is stirred to a certain extent, and the electric heating rod heats the electroplating wastewater to concentrate it.

[0016] By arranging an electric push rod, a water inlet pipe, a disc, a first steel wire brush, a round sleeve and a second steel wire brush, the second steel wire brush cleans the outer wall of the heat transfer tube, and the first steel wire brush cleans the inner wall of the evaporation concentration tank, thereby completing the cleaning of scale without disassembling the evaporation concentration tank body. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the description of the specific implementation methods will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the electroplating wastewater high-power concentration device proposed by the utility model;

[0019] Figure 2 This is a schematic cross-sectional structure diagram of the electroplating wastewater high-power concentration device proposed by the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the ring gear and spur gear of the electroplating wastewater high-multiple concentration device proposed by the utility model.

[0021] In the figure: 1. evaporation concentration tank; 2. condenser; 3. docking pipe; 4. exhaust pipe; 5. suction pipe; 6. sewage pipe; 7. valve; 8. docking frame; 9. motor; 10. spur gear; 11. ring gear; 12. docking ring; 13. turntable; 14. heat transfer pipe; 15. electric heating rod; 16. electric push rod; 17. water inlet pipe; 18. disc; 19. first steel wire brush; 20. round sleeve; 21. second steel wire brush. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] Depend on Figure 1-Figure 3As shown, it relates to a high-multiple concentration device for electroplating wastewater, including an evaporation concentration tank 1 and a condenser 2. The outer wall of the evaporation concentration tank 1 is fixedly connected with a liquid inlet pipe. The existing water pump transports the mixed liquid of scale cleaning agent and water into the evaporation concentration tank 1 through the liquid inlet pipe. The evaporation concentration tank 1 and the condenser 2 are fixedly connected with a docking pipe 3. The outer wall of the condenser 2 is fixedly connected with an exhaust pipe 4. Water vapor enters the condenser 2 through the docking pipe 3 for condensation and is finally discharged from the exhaust pipe 4.

[0024] The outer wall of the evaporation concentration tank 1 is fixedly connected with an exhaust pipe 5, one end of the exhaust pipe 5 is fixedly connected with a vacuum pump, the operation of the vacuum pump reduces the gas pressure in the evaporation concentration tank 1, and reduces the boiling point of water in the electroplating wastewater. The outer wall of the evaporation concentration tank 1 has two sewage pipes 6 fixedly connected, the outer wall of the evaporation concentration tank 1 is fixedly connected with a water inlet pipe 17, one end of the water inlet pipe 17 is fixedly connected with a pump body, the outer walls of the butt joint pipe 3, the exhaust pipe 4, the sewage pipe 6 and the water inlet pipe 17 are fixedly installed with valves 7, the butt joint pipe 3, the exhaust pipe 4, the sewage pipe 6 and the water inlet pipe 17 are opened and closed by the valve 7, and the outer wall of the evaporation concentration tank 1 is fixedly connected with a docking frame 8.

[0025] A heating mechanism is provided inside the evaporation concentration tank 1, and the heating mechanism includes a hollow turntable 13, and an electric slip ring is provided on the outer wall of the turntable 13. A motor 9 and an electric push rod 16 are fixedly connected inside the docking frame 8, and the docking frame 8 protects and supports the motor 9 and the electric push rod 16.

[0026] The outer wall of the output shaft of the motor 9 is fixedly sleeved with a spur gear 10, the outer wall of the spur gear 10 is meshedly connected with a ring gear 11, the outer wall of the ring gear 11 is fixedly connected with a docking ring 12, and the outer wall of the evaporation concentration tank 1 is provided with a circular hole, the inner wall of the circular hole is rotatably connected to the outer wall of the docking ring 12.

[0027] One end of the docking ring 12 is fixedly connected to the outer wall of the turntable 13, and a plurality of heat-conducting pipes 14 are fixedly connected to the outer wall of the turntable 13. The plurality of heat-conducting pipes 14 are arranged in a ring shape, and an electric heating rod 15 is fixedly connected inside the heat-conducting pipe 14. The electric heating rod 15 transfers heat to the heat-conducting pipe 14 to heat and concentrate the electroplating wastewater.

[0028] A cleaning mechanism is provided inside the evaporation concentration tank 1, and the cleaning mechanism includes a disc 18. The output end of the electric push rod 16 penetrates the outer wall of the turntable 13 and is rotatably connected to the outer wall of the disc 18. The outer wall of the disc 18 is provided with a plurality of sliding holes, and the inner walls of the plurality of sliding holes are respectively slidably connected to the outer walls of the plurality of heat conduction pipes 14.

[0029] The outer wall of the disc 18 is fixedly connected with a plurality of circular sleeves 20, the inner walls of the plurality of circular sleeves 20 are evenly fixedly connected with a plurality of second steel wire brushes 21, the outer wall of the disc 18 is evenly fixedly connected with a plurality of first steel wire brushes 19, the outer wall of the first steel wire brush 19 contacts the inner wall of the evaporation concentration tank 1, the outer wall of the second steel wire brush 21 contacts the outer wall of the heat conduction pipe 14, the first steel wire brush 19 and the second steel wire brush 21 are elastic and contact each other through elastic force, and in subsequent use, as the front end is worn shorter, the elastic force is used to compensate, and the brush can be replaced after it cannot be used.

[0030] Working principle: when in use, open the valve 7 on the water inlet pipe 17, and transport the electroplating wastewater to the evaporation concentration tank 1 through the pump body. After the transportation is completed, the valve 7 on the water inlet pipe 17 is closed, and the valve 7 on the exhaust pipe 5 is opened, and the other valves 7 are closed. The vacuum pump operates to reduce the gas pressure in the evaporation concentration tank 1 and reduce the boiling point of water in the electroplating wastewater. After reaching a certain pressure, the vacuum pump and the valve 7 on the exhaust pipe 5 are closed, and the motor 9 and the electric heating rod 15 are operated. The motor 9 drives the spur gear 10 and the ring gear 11 to rotate, and the rotation of the ring gear 11 drives the docking ring 12 to rotate, and the rotation of the docking ring 12 drives the turntable 13 to rotate, and the rotation of the turntable 13 drives the multiple heat-conducting pipes 14 and the disc 18 to rotate. The multiple heat-conducting pipes 14 stir the electroplating wastewater to a certain extent during the rotation process, and the electric heating rod 15 transfers heat to the heat-conducting pipes 14. The electroplating wastewater is heated and concentrated. When water vapor is generated, the valve 7 on the butt joint pipe 3 is opened, and the steam enters the condenser 2 for condensation to form water droplets. In the subsequent cleaning process, the valve 7 on one of the drain pipes 6 is opened, and the concentrated electroplating wastewater is discharged for treatment, while the impurities and scale remaining inside are transported to the evaporation concentration tank 1 through the liquid inlet pipe by the existing water pump. After the motor 9 drives the multiple heat conduction tubes 14 to rotate for a certain period of time, the electric push rod 16 drives the disc 18 to move to the left. The disc 18 moves to the left, driving the multiple circular sleeves 20 to move. The second steel wire brush 21 in the circular sleeve 20 cleans the outer wall of the heat conduction tube 14, and the first steel wire brush 19 on the disc 18 cleans the inner wall of the evaporation concentration tank 1, completing the cleaning of the scale, and finally discharged from another drain pipe 6.

[0031] The standard parts used in the utility model can all be purchased from the market, special-shaped parts can be customized according to the description in the specification and the drawings, the specific connection methods of each part all adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art, the machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here, and the components known to technical personnel in this field, their structures and principles can be known to these technical personnel through technical manuals or through conventional experimental methods.

[0032] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-power concentration device for electroplating wastewater, comprising an evaporation concentration tank (1) and a condenser (2), characterized in that: A butt joint pipe (3) is fixedly connected between the evaporation concentration tank (1) and the condenser (2); an exhaust pipe (4) is fixedly connected to the outer wall of the condenser (2); two sewage pipes (6) are fixedly connected to the outer wall of the evaporation concentration tank (1); a water inlet pipe (17) is fixedly connected to the outer wall of the evaporation concentration tank (1); a pump body is fixedly connected to one end of the water inlet pipe (17); valves (7) are fixedly installed on the outer walls of the butt joint pipe (3), the exhaust pipe (4), the sewage pipe (6) and the water inlet pipe (17); a butt joint frame (8) is fixedly connected to the outer wall of the evaporation concentration tank (1); a heating mechanism is provided inside the evaporation concentration tank (1); and a cleaning mechanism is provided inside the evaporation concentration tank (1).

2. The electroplating wastewater high concentration device according to claim 1, characterized in that: The heating mechanism comprises a rotating disk (13) with a hollow structure, a motor (9) and an electric push rod (16) are fixedly connected inside the docking frame (8), a spur gear (10) is fixedly sleeved on the outer wall of the output shaft of the motor (9), a ring gear (11) is meshedly connected to the outer wall of the spur gear (10), a docking ring (12) is fixedly connected to the outer wall of the ring gear (11), one end of the docking ring (12) is fixedly connected to the outer wall of the rotating disk (13), a plurality of heat-conducting pipes (14) are fixedly connected to the outer wall of the rotating disk (13), and an electric heating rod (15) is fixedly connected to the inside of the heat-conducting pipe (14).

3. The electroplating wastewater high concentration device according to claim 2, characterized in that: The cleaning mechanism comprises a disc (18), the output end of the electric push rod (16) penetrates the outer wall of the rotating disc (13) and is rotatably connected to the outer wall of the disc (18), the outer wall of the disc (18) is provided with a plurality of sliding holes, the inner walls of the plurality of sliding holes are respectively slidably connected to the outer walls of a plurality of heat-conducting pipes (14), the outer wall of the disc (18) is fixedly connected to a plurality of circular sleeves (20), the inner walls of the plurality of circular sleeves (20) are uniformly fixedly connected to a plurality of second steel wire brushes (21), and the outer wall of the disc (18) is uniformly fixedly connected to a plurality of first steel wire brushes (19).

4. The electroplating wastewater high concentration device according to claim 2, characterized in that: An exhaust pipe (5) is fixedly connected to the outer wall of the evaporation concentration tank (1), and a vacuum pump is fixedly connected to one end of the exhaust pipe (5).

5. The electroplating wastewater high concentration device according to claim 1, characterized in that: The outer wall of the evaporation concentration tank (1) is provided with a circular hole, and the inner wall of the circular hole is rotatably connected to the outer wall of the docking ring (12).

6. The electroplating wastewater high concentration device according to claim 3 is characterized in that: The outer wall of the first steel wire brush (19) contacts the inner wall of the evaporation concentration tank (1), and the outer wall of the second steel wire brush (21) contacts the outer wall of the heat conduction pipe (14).

7. The electroplating wastewater high concentration device according to claim 2, characterized in that: An electric slip ring is provided on the outer wall of the rotating disk (13), and a liquid inlet pipe is fixedly connected to the outer wall of the evaporation concentration tank (1).

Images