Heating pump and vehicle thermal management system

Abstract

The utility model provides a heating pump and a vehicle heat management system. The heating pump comprises a circuit board assembly and a heating assembly electrically connected with the circuit board assembly, the heating pump is provided with a flow channel, the flow channel is communicated with a water inlet and a water outlet of the heating pump, the heating pump further comprises a heat dissipation cavity, and the circuit board assembly is arranged in the heat dissipation cavity. The heat dissipation cavity is isolated from the flow channel through a heat dissipation wall, the flow channel comprises a first flow section and a second flow section, the first flow section is located on the upstream of the second flow section, the heating assembly is located in the second flow section, and the heat dissipation wall forms a part of the wall of the first flow section. Through the structural design, effective and continuous heat dissipation of the circuit board assembly is achieved by means of fluid in the heating pump, the problem that the use reliability of the circuit board assembly is affected due to the fact that the circuit board assembly cannot dissipate heat in time is solved, the heat can be used for heating the fluid, energy is saved, and the heating efficiency of the heating pump is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, and in particular to a heating pump and a vehicle thermal management system. Background Art

[0002] During vehicle use, especially in cold environments, the battery temperature needs to be increased to ensure its performance. Heat pumps are usually used to achieve thermal management of the vehicle.

[0003] However, the circuit board components in the heating pump generate heat during use. If the heat is not dissipated in time, the temperature of the circuit board will continue to rise. The electronic components may even fail due to excessive temperature, and the reliability of the circuit board will also be reduced, thus affecting the performance and service life of the circuit board components. Utility Model Content

[0004] In order to solve the above technical problems, the utility model proposes a heating pump and a vehicle thermal management system to solve the problem that the circuit board components in the heating pump cannot effectively dissipate heat and thus affect its reliability of use.

[0005] In order to achieve one of the purposes of the utility model mentioned above, an embodiment of the utility model provides a heating pump, including a circuit board assembly and a heating assembly electrically connected to the circuit board assembly, the heating pump having a flow channel, the flow channel connecting the water inlet and the outlet of the heating pump, the heating pump also including a heat dissipation cavity, the circuit board assembly is arranged in the heat dissipation cavity, the heat dissipation cavity is isolated from the flow channel by a heat dissipation wall, the flow channel includes a first flow segment and a second flow segment, the first flow segment is located upstream of the second flow segment, the heating assembly is located in the second flow segment, and the heat dissipation wall constitutes a part of the wall of the first flow segment.

[0006] As a further improvement of an embodiment of the utility model, the circuit board assembly includes a circuit board and a power element, and the power element is arranged on a side of the circuit board facing the first flow section.

[0007] As a further improvement of an embodiment of the utility model, the power element is an IGBT.

[0008] As a further improvement of one embodiment of the utility model, the heating pump also includes a shell, a cover body and a pump body, the pump body is located in the shell, the cover body is arranged at one end of the shell, the water inlet is formed on the cover body, the first flow section is located between the pump body and the cover body, the second flow section is located between the pump body and the shell, and the heat dissipation cavity is located at one end of the pump body close to the first flow section.

[0009] As a further improvement of one embodiment of the utility model, the pump body includes an isolation sleeve, the isolation sleeve includes a cylindrical wall and a bottom wall, the heating component is tubular and is sleeved on the outer periphery of the cylindrical wall, the bottom wall connects the cylindrical wall and the heating component, a first cavity is formed between the heating component, the cylindrical wall and the bottom wall, the heat dissipation cavity is formed in the first cavity, and the heat dissipation wall is integrally formed on the bottom wall.

[0010] As a further improvement of an embodiment of the utility model, one end of the heating component away from the bottom wall is sealed and connected to the pump body, and the heating component is sealed and connected to the bottom wall.

[0011] As a further improvement of one embodiment of the utility model, the heating pump also includes a shell, a cover body and a pump body, the pump body is located in the shell, the cover body is arranged at one end of the shell, the water inlet is formed on the cover body, the heat dissipation cavity is located on the side of the cover body away from the pump body, and the heat dissipation wall is integrally formed on the cover body.

[0012] As a further improvement of an embodiment of the utility model, the heating pump also includes a cover plate, which is arranged on a side of the cover body away from the pump body, the heat dissipation cavity is formed between the cover plate and the cover body, and the circuit board assembly is connected to the cover plate.

[0013] As a further improvement of one embodiment of the utility model, the heating component is tubular and is sleeved on the outer circumference of the pump body, the end of the heating component close to the cover body is connected to the cover body, the second flow section includes a first sub-flow channel formed between the pump body and the heating component and a second sub-flow channel formed between the heating component and the shell, the first sub-flow channel connects the first flow section and the second sub-flow channel.

[0014] In order to achieve one of the above purposes of the utility model, an embodiment of the utility model further provides a vehicle thermal management system, including the heat pump as described above.

[0015] Compared with the prior art, the utility model has the following beneficial effects: in the heating pump and vehicle thermal management system of the utility model, the fluid entering the flow channel first exchanges heat with the circuit board assembly in the heat dissipation cavity through the heat dissipation wall, thereby realizing the heat dissipation of the circuit board assembly, and the temperature of the fluid is increased, and then the fluid enters the second flow section and passes through the heating assembly, thereby realizing the heating of the fluid, and finally discharged from the heating pump; through structural design, the present application realizes effective and continuous heat dissipation of the circuit board assembly with the help of the fluid in the heating pump, solves the problem that the circuit board assembly cannot dissipate heat in time and affects its reliability of use, and the heat can be used to heat the fluid, saving energy and improving the heating efficiency of the heating pump. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings provided herein are used to further illustrate the understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 It is a cross-sectional schematic diagram of the heating pump of Example 1 of the present utility model;

[0018] Figure 2 for Figure 1 A cross-sectional view from another angle;

[0019] Figure 3 This is a schematic diagram of the structure of the circuit board assembly of Example 1 of the present utility model;

[0020] Figure 4 It is a cross-sectional schematic diagram of a heating pump according to Example 2 of the present utility model;

[0021] Figure 5 It is a cross-sectional schematic diagram of a heating pump according to Embodiment 3 of the present utility model;

[0022] Figure 6 for Figure 5 A cross-sectional view from another angle;

[0023] The direction indicated by the arrow is the flow direction of the fluid in the heating pump.

[0024] 100. Heating pump; 1. Shell; 2. Cover; 21. Boss; 3. Pump body; 31. Isolation sleeve; 311. Cylindrical wall; 312. Bottom wall; 313. First tubular wall; 314. Second tubular wall; 32. First cavity; 33. Second cavity; 34. Stator assembly; 35. Rotor assembly; 4. Circuit board assembly; 41. Circuit board; 42. Power element; 5. Heating assembly; 6. Flow channel; 61. Water inlet; 62. Drain; 63. First flow section; 64. Second flow section; 641. First sub-flow channel; 642. Second sub-flow channel; 7. Heat dissipation cavity; 71. Heat dissipation wall; 8. Impeller; 9. Cover. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of this application clearer, the technical solution of this application will be clearly and completely described in combination with the specific embodiments of this application and the corresponding drawings. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0026] In various drawings of the present invention, for the convenience of illustration, some dimensions of structures or parts are enlarged relative to other structures or parts, and therefore, are only used to illustrate the basic structure of the subject matter of the present invention.

[0027] It should be understood that, unless otherwise expressly specified and limited, in the description of the present invention, the terms "inside", "outside", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0028] Example 1

[0029] The utility model proposes a vehicle thermal management system, comprising a heating pump 100, through which thermal management of the vehicle can be achieved.

[0030] See also Figures 1 to 3 The heating pump 100 includes a shell 1, a cover body 2, a pump body 3, a circuit board assembly 4 and a heating assembly 5. The pump body 3 is located in the shell 1, the cover body 2 is arranged at one end of the shell 1, the heating assembly 5 is electrically connected to the circuit board assembly 4, and the heating assembly 5 is used to heat the fluid in the flow channel 6.

[0031] The heating pump 100 has a flow channel 6, which connects the water inlet 61 and the drain 62 of the heating pump 100. The fluid enters the flow channel 6 from the water inlet 61 and finally exits the heating pump 100 from the drain 62. Of course, the water inlet 61 here is only used to describe the inlet of the fluid, and the fluid here can be water or other fluids that can be used for heating; the drain 62 is also used to describe the outlet of the fluid from the heating pump 100.

[0032] The heat pump 100 also includes a heat dissipation cavity 7, in which the circuit board assembly 4 is disposed, and the heat dissipation cavity 7 is isolated from the flow channel 6 by a heat dissipation wall 71, thereby preventing the fluid from entering the heat dissipation cavity 7 and causing a short circuit or damage to the circuit board assembly 4. The flow channel 6 includes a first flow segment 63 and a second flow segment 64, and the first flow segment 63 is located upstream of the second flow segment 64, that is, the fluid first flows through the first flow segment 63 and then flows through the second flow segment 64. The heating assembly 5 is located in the second flow segment 64, and the heat dissipation wall 71 constitutes a part of the wall of the first flow segment 63.

[0033] In this way, the fluid entering the flow channel 6 first exchanges heat with the circuit board assembly 4 in the heat dissipation cavity 7 through the heat dissipation wall 71, thereby achieving heat dissipation of the circuit board assembly 4, and the temperature of the fluid is increased. Thereafter, the fluid enters the second flow section 64 and passes through the heating assembly 5, thereby achieving heating of the fluid, and finally is discharged from the heating pump 100. The present application, through structural design, achieves effective and continuous heat dissipation of the circuit board assembly 4 with the help of the fluid in the heating pump 100, solves the problem that the circuit board assembly 4 cannot dissipate heat in time and affects its reliability of use, and the heat can be used to heat the fluid, saving energy and improving the heating efficiency of the heating pump 100.

[0034] Combination Figures 1 to 3 Furthermore, the circuit board assembly 4 includes a circuit board 41 and a power element 42. The power element 42 is arranged on a side of the circuit board 41 facing the first flow section 63, so that sufficient heat dissipation of the power element 42 can be ensured.

[0035] In the present application, the power element 42 is an insulated gate bipolar transistor, also known as an Insulate-Gate Bipolar Transistor, or IGBT for short, which combines the advantages of a power transistor (Giant Transistor—GTR) and a power field effect transistor (Power MOSFET) and has good characteristics.

[0036] In this embodiment, the water inlet 61 is formed on the cover 2, the first flow segment 63 is located between the pump body 3 and the cover 2, the second flow segment 64 is located between the pump body 3 and the housing 1, and the heat dissipation cavity 7 is located at one end of the pump body 3 close to the first flow segment 63. In this way, the first flow segment 63 is located close to the water inlet 61, and the fluid has just entered the heating pump 100 and is still in an unheated state. At this time, the heat dissipation for the circuit board assembly 4 can be better, and the heat dissipation cavity 7 is arranged in the pump body 3, which can reasonably utilize the space of the pump body 3 and is also conducive to the wiring connection between the heating assembly 5 and the circuit board assembly 4.

[0037] In this embodiment, the drain port 62 is formed on the housing 1 .

[0038] See also Figure 1 to Figure 2Further, the pump body 3 includes an isolation sleeve 31, the isolation sleeve 31 includes a cylindrical wall 311 and a bottom wall 312, the heating component 5 is tubular and is sleeved on the outer periphery of the cylindrical wall 311, the bottom wall 312 connects the cylindrical wall 311 and the heating component 5, a first cavity 32 is formed between the heating component 5, the cylindrical wall 311 and the bottom wall 312, and a second cavity 33 is formed in the cylindrical wall 311, that is, the cylindrical wall 311 divides the space in the pump body 3 into a first cavity 32 and a second cavity 33, the heat dissipation cavity 7 is formed in the first cavity 32, and the heat dissipation wall 71 is integrally formed in the bottom wall 312, that is, the circuit board assembly 4 exchanges heat with the fluid in the first flow section 63 through the bottom wall 312, thereby realizing the heat dissipation of the circuit board assembly 4. Here, the heat dissipation cavity 7 constitutes a part of the first cavity 32, that is, the circuit board assembly 4 is located in the first cavity 32. Specifically, the heat dissipation cavity 7 is the part of the first cavity 32 close to the bottom wall 312, that is, the circuit board assembly 4 is arranged in the first cavity 32 close to the bottom wall 312. In this way, the space provided in the pump body 3 can be utilized without adding additional space to arrange the circuit board assembly 4.

[0039] Preferably, the circuit board assembly 4 is connected to the bottom wall 312. More preferably, the power element 42 is close to the bottom wall 312, so that the heat dissipation efficiency of the power element 42 can be greatly improved.

[0040] In addition, the pump body 3 further includes a stator assembly 34 and a rotor assembly 35 . The stator assembly 34 is accommodated in the first cavity 32 , and the rotor assembly 35 is accommodated in the second cavity 33 .

[0041] One end of the heating assembly 5 away from the bottom wall 312 is sealed and connected to the pump body 3, and one end of the heating assembly 5 close to the bottom wall 312 is sealed and connected to the bottom wall 312. In this way, the first cavity 32 can be sealed with the help of the heating assembly 5, thereby preventing the fluid from entering the first cavity 32 and causing a short circuit or damage to the circuit board assembly 4 and the stator.

[0042] In addition, the heating pump 100 further includes an impeller 8 disposed at the water inlet 61 . The impeller 8 is located between the pump body 3 and the cover body 2 , and the impeller 8 is rotatably connected to the rotor assembly 35 . The impeller 8 can guide the fluid to reduce flow resistance.

[0043] Example 2

[0044] The difference between this embodiment and the first embodiment is that the heat dissipation cavity 7 is disposed at a different position, the heating assembly 5 is disposed at a different position, and the structure of the isolation sleeve 31 is different.

[0045] See also Figure 4 In this embodiment, the heat dissipation cavity 7 is located on the side of the cover body 2 away from the pump body 3, and the heat dissipation wall 71 is integrally formed with the cover body 2, so that the fluid that has not been heated in the first flow section 63 can be used to dissipate heat for the circuit board assembly 4, and the heating efficiency of the heating pump 100 can be improved.

[0046] Furthermore, the heating pump 100 also includes a cover plate 9, which is arranged on the side of the cover body 2 away from the pump body 3. A heat dissipation cavity 7 is formed between the cover plate 9 and the cover body 2. The circuit board assembly 4 is connected to the cover plate 9, which facilitates the installation and replacement of the circuit board assembly 4. The cooperation between the cover plate 9 and the cover body 2 can encapsulate the circuit board assembly 4 to prevent the circuit board assembly 4 from being exposed to the external environment and causing short circuit or damage.

[0047] Preferably, the circuit board assembly 4 is connected to the cover body 2. More preferably, the power element 42 is arranged close to the cover body 2, so that the heat dissipation efficiency of the power element 42 can be greatly improved.

[0048] Furthermore, in the present embodiment, the heating component 5 is tubular and sleeved on the outer periphery of the pump body 3, the end of the heating component 5 close to the cover body 2 is connected to the cover body 2, and the second flow section 64 includes a first sub-flow channel 641 formed between the pump body 3 and the heating component 5 and a second sub-flow channel 642 formed between the heating component 5 and the shell 1, and the first sub-flow channel 641 connects the first flow section 63 and the second sub-flow channel 642. In other words, there is a gap between the end of the heating component 5 away from the cover body 2 and the pump body 3, and the fluid can flow from the first sub-flow channel 641 through the gap into the second sub-flow channel 642. Such a configuration not only facilitates the circuit connection and wiring arrangement between the heating component 5 and the circuit board component 4, but also increases the contact area between the fluid and the heating component 5, thereby improving the heating efficiency of the heating pump 100.

[0049] In this embodiment, the drain port 62 is formed on the cover body 2 , so as to increase the area of ​​the fluid flowing through the heating assembly 5 , thereby improving the heating efficiency of the heat pump 100 .

[0050] In this embodiment, the isolation sleeve 31 includes a first tubular wall 313, a second tubular wall 314 and a bottom wall 312. The first tubular wall 313 and the second tubular wall 314 are coaxially arranged, the first tubular wall 313 is located at the outer periphery of the second tubular wall 314, and the bottom wall 312 connects the first tubular wall 313 and the second tubular wall 314 and is close to the cover body 2. The first tubular wall 313, the second tubular wall 314 and the bottom wall 312 together enclose a first cavity, a second cavity is formed in the second tubular wall 314, the stator assembly 34 is accommodated in the first cavity, and the rotor assembly 35 is accommodated in the second cavity.

[0051] Except for the above differences, the other structures of this embodiment and embodiment 1 are the same and will not be described again.

[0052] Example 3

[0053] The difference between this embodiment and the first embodiment is only that the structure of the isolation sleeve 31 is different, the structure of the flow channel 6 is different, and the connection method of the heating component 5 is different.

[0054] See also Figure 5 to Figure 6 In this embodiment, the isolation sleeve 31 includes a first tubular wall 313, a second tubular wall 314 and a bottom wall 312. The first tubular wall 313 and the second tubular wall 314 are coaxially arranged. The first tubular wall 313 is located at the outer periphery of the second tubular wall 314. The bottom wall 312 connects the first tubular wall 313 and the second tubular wall 314 and is close to the cover body 2. The first tubular wall 313, the second tubular wall 314 and the bottom wall 312 together enclose a first cavity, and a second cavity is formed in the second tubular wall 314. The stator assembly 34 is accommodated in the first cavity, and the rotor assembly 35 is accommodated in the second cavity.

[0055] The heat dissipation cavity 7 is formed in the first cavity, and the heat dissipation wall 71 is integrally formed on the bottom wall 312, that is, the circuit board assembly 4 exchanges heat with the fluid in the first flow section 63 through the bottom wall 312, thereby achieving heat dissipation of the circuit board assembly 4. Here, the heat dissipation cavity 7 constitutes a part of the first cavity, that is, the circuit board assembly 4 is located in the first cavity, specifically, the heat dissipation cavity 7 is the part of the first cavity close to the bottom wall 312, that is, the circuit board assembly 4 is arranged in the first cavity close to the bottom wall 312.

[0056] Furthermore, in this embodiment, the heating assembly 5 is tubular and sleeved on the outer circumference of the isolation sleeve 31, specifically, the heating assembly 5 is sleeved on the outer circumference of the first tubular wall 313. A plurality of bosses 21 are also provided on the side of the cover body 2 facing the second flow section 64, and the plurality of bosses 21 are arranged at intervals along the circumference of the heating assembly 5, and fluid holes for fluid to pass through are formed between adjacent bosses 21, and one end of the heating assembly 5 close to the cover body 2 is connected to the plurality of bosses 21; and a gap is formed between the end of the heating assembly 5 away from the cover body 2 and the pump body 3.

[0057] The second flow section 64 includes a first sub-flow channel 641 formed between the isolation sleeve 31 and the heating component 5 and a second sub-flow channel 642 formed between the heating component 5 and the housing 1. The first sub-flow channel 641 connects the first flow section 63 with the drain port 62, and the second sub-flow channel 642 also connects the first flow section 63 with the drain port 62. In other words, after the fluid passes through the first flow section 63, it can be divided into two paths, one of which flows out from the first sub-flow channel 641 through the gap between the heating component 5 and the pump body 3 to the drain port 62, and the other flows into the second sub-flow channel 642 through the liquid holes between the plurality of bosses 21, and then flows to the drain port 62, so that the contact area between the fluid and the heating component 5 can be increased, thereby improving the heating efficiency of the heating pump 100.

[0058] Except for the above differences, the other structures of this embodiment and embodiment 1 are the same and will not be described again.

[0059] In summary, the heating pump 100 and the vehicle thermal management system having the same proposed in the present invention, the fluid entering the flow channel 6 first exchanges heat with the circuit board assembly 4 in the heat dissipation cavity 7 through the heat dissipation wall 71, thereby achieving heat dissipation of the circuit board assembly 4, and the temperature of the fluid is increased, and then the fluid enters the second flow section 64 and passes through the heating assembly 5, thereby achieving heating of the fluid, and finally discharged from the heating pump 100; the present application, through structural design, uses the fluid in the heating pump 100 to achieve effective and continuous heat dissipation of the circuit board assembly 4, solves the problem that the circuit board assembly 4 cannot dissipate heat in time and affects its reliability of use, and the heat can be used to heat the fluid, saving energy and improving the heating efficiency of the heating pump 100.

[0060] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0061] The above is only a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several modifications and improvements without departing from the inventive concept of the present invention, and these modifications and improvements all fall within the protection scope of the present invention.

Claims

1. A heating pump, comprising a circuit board assembly and a heating assembly electrically connected to the circuit board assembly, wherein the heating pump has a flow channel, the flow channel connecting a water inlet and a water outlet of the heating pump, and characterized in that: The heating pump also includes a heat dissipation cavity, the circuit board assembly is arranged in the heat dissipation cavity, the heat dissipation cavity is isolated from the flow channel by a heat dissipation wall, the flow channel includes a first flow segment and a second flow segment, the first flow segment is located upstream of the second flow segment, the heating assembly is located in the second flow segment, and the heat dissipation wall constitutes a part of the wall of the first flow segment.

2. The heating pump according to claim 1, characterized in that: The circuit board assembly includes a circuit board and a power element, and the power element is arranged on a side of the circuit board facing the first flow section.

3. The heating pump according to claim 2, characterized in that: The power element is an IGBT.

4. The heating pump according to any one of claims 1 to 3, characterized in that: It also includes a shell, a cover body and a pump body, the pump body is located in the shell, the cover body is arranged at one end of the shell, the water inlet is formed on the cover body, the first flow section is located between the pump body and the cover body, the second flow section is located between the pump body and the shell, and the heat dissipation cavity is located at one end of the pump body close to the first flow section.

5. The heating pump according to claim 4, characterized in that: The pump body includes an isolation sleeve, which includes a cylindrical wall and a bottom wall. The heating component is tubular and is sleeved on the outer circumference of the cylindrical wall. The bottom wall connects the cylindrical wall and the heating component. A first cavity is formed between the heating component, the cylindrical wall and the bottom wall. The heat dissipation cavity is formed in the first cavity, and the heat dissipation wall is integrally formed on the bottom wall.

6. The heating pump according to claim 5, characterized in that: One end of the heating component away from the bottom wall is sealed and connected to the pump body, and the heating component is sealed and connected to the bottom wall.

7. The heating pump according to any one of claims 1 to 3, characterized in that: It also includes a shell, a cover body and a pump body, the pump body is located in the shell, the cover body is arranged at one end of the shell, the water inlet is formed on the cover body, the heat dissipation cavity is located on the side of the cover body away from the pump body, and the heat dissipation wall is integrally formed on the cover body.

8. The heating pump according to claim 7, characterized in that: It also includes a cover plate, which is arranged on a side of the cover body away from the pump body, the heat dissipation cavity is formed between the cover plate and the cover body, and the circuit board assembly is connected to the cover plate.

9. The heating pump according to claim 8, characterized in that: The heating component is tubular and is sleeved on the outer circumference of the pump body. The end of the heating component close to the cover body is connected to the cover body. The second flow section includes a first sub-flow channel formed between the pump body and the heating component and a second sub-flow channel formed between the heating component and the shell. The first sub-flow channel connects the first flow section and the second sub-flow channel.

10. A vehicle thermal management system, characterized in that: A heating pump comprising the heating pump according to any one of claims 1 to 9.

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