Heat dissipation device

Abstract

According to the first aspect of the utility model, the utility model provides a heat dissipation device (100), which comprises a block body (110) and a closed flow cavity (130) at least partially formed in the block body (110). The flow chamber (130) performs heat pipe circulation when provided with a phase change heat transfer fluid and heat from the heat source (200). The flow chamber (130) at least partially has a rotationally non-symmetric cross-sectional shape. The apparatus also includes at least one heat dissipation portion (120) extending from the block (110).

Description

Technical Field

[0001] The present disclosure relates to cooling of heat sources, in particular electronic or optical devices, especially high power electronic or optical devices. Background Art

[0002] Cooling of electronic devices, such as microprocessors, LEDs, IGBT modules, etc., is traditionally based on physically and thermally connecting a heat transfer element to the device. A typical such heat transfer element includes a heat sink, which provides a large heat dissipation area for dissipating heat from the device to the environment. In addition, forced flow liquid cooling heat transfer elements are also known, such as heat sinks.

[0003] It is also known to provide a heat sink with an inner cavity so that a heat pipe can be arranged within the heat sink to promote effective heat distribution across the heat sink. For example, CN103307579B discloses such a solution in which an LED device is connected to the bottom of a vertical heat sink having radially extending fins and a hollow cylindrical core that acts as a heat pipe to direct heat to the heat sink. Although effective, the heat sink of CN103307579B is considered to be relatively rigid in design and application because the heat sink must be positioned in a specific manner relative to the heat source, i.e., in series with the heat source longitudinally. Such limitations, for example, may prevent flush mounting with a containment structure.

[0004] However, there remains a need for further development of heat sinks for cooling electrical components that not only provide efficient heat transfer but also allow for flexibility in design, or at least provide the public with useful alternatives. Utility Model Content

[0005] The utility model is defined by the features of the independent claim, and some specific embodiments are defined in the dependent claims.

[0006] According to a first aspect of the present disclosure, a heat sink is provided, comprising: a block; a plurality of closed flow cavities, which are at least partially formed in the block, configured to perform heat pipe circulation when a phase-change heat transfer fluid and heat from a heat source are provided, and at least partially have a non-rotationally symmetrical cross-sectional shape, wherein the flow cavities are separated by an intermediate wall of the block located between the flow cavities; at least one heat dissipation portion extending from the block; the heat sink comprises a closing element, which is connected to the block to close the flow cavity; and a mounting area located on the closing element or on the block or on the closing element and the block for accommodating the heat source. The mounting area is configured to accommodate a plurality of such heat sources aligned with the corresponding plurality of flow cavities. The plurality of flow cavities have different widths for allocating different heat dissipation resources to different heat sources.

[0007] One or more embodiments may include one or more of the following features:

[0008] - the flow chamber at least partially has a substantially quadrilateral cross-sectional shape;

[0009] - the flow chamber includes a proximal portion that is closest to the mounting point for the heat source;

[0010] - the proximal portion has a non-rotationally symmetrical cross-sectional shape;

[0011] - The heat dissipation portion includes a base and a plurality of fins extending from the base;

[0012] - The base extends from the block;

[0013] - the flow chamber includes a distal portion connected to a proximal portion;

[0014] - the distal portion is provided to a base;

[0015] - the distal portion is configured to spread heat from the proximal portion along the base;

[0016] - The distal part consists of a network of interconnected subcavities, which are connected to the proximal part;

[0017] - A non-rotationally symmetric cross-sectional shape has an extension in one dimension that is one or more orders of magnitude greater than the extension in the other dimensions orthogonal thereto;

[0018] - the non-rotationally symmetric portion of the flow chamber has a length in one Cartesian dimension, a width in a second Cartesian dimension, and a depth in a third Cartesian dimension;

[0019] - the non-rotationally symmetric part of the flow chamber includes the evaporation region;

[0020] - the non-rotationally symmetrical portion of the flow chamber comprises a condensation region which is distinct or separate from the evaporation region;

[0021] - the non-rotationally symmetrical part of the flow chamber is configured to carry out a heat pipe circulation between the evaporation area and the condensation area;

[0022] - the block is configured to accommodate a heat source directly or indirectly at the evaporation zone;

[0023] - The heat dissipation part forms a condensation area;

[0024] - the heat sink comprises a closing element connected to the block for closing the flow chamber;

[0025] - the closing element comprises a mounting area for receiving a heat source;

[0026] - the block includes a mounting area for receiving a heat source;

[0027] - both the closing element and the block comprise a shared mounting area for receiving a heat source;

[0028] - the mounting area of ​​the closing element is aligned with the evaporation area of ​​the flow chamber;

[0029] - the heat sink comprises a plurality of such flow chambers separated by intermediate walls of the block located between said flow chambers;

[0030] - the mounting area is configured to receive a corresponding plurality of heat sources;

[0031] - Multiple heat sources aligned with multiple flow chambers;

[0032] - the first and second flow chambers have different widths for allocating different heat dissipation resources to different heat sources;

[0033] - the flow chamber or one or more non-rotationally symmetrical portions of the flow chambers include an isthmus for dividing the flow chamber into a number of branches;

[0034] - the heat dissipation portion comprises a plurality of fins, which are connected (e.g. welded) or formed (e.g. extruded) on the block or the closing element, or connected to both the block and the closing element;

[0035] - The heat sink is separated from the mounting area;

[0036] - The mounting area is located on the side of the block opposite to the heat sink area.

[0037] With the help of this novel design, considerable benefits are obtained. The novel design of the flow cavity in the heat sink provides new possibilities for designing the cooling of the heat source, expanding the design freedom without affecting the heat transfer performance of traditional heat dissipation solutions. The solution uses the very effective concept of heat pipe circulation for transferring heat from the heat source to the heat sink for heat dissipation. In addition, the non-tubular flow cavity extending from the heat source to the heat sink enables new degrees of freedom. For example, the heat sink can be located relatively far away from the heat source and / or on a different side of the block from the heat source. Heat can also be transferred through components that do not require additional cooling. For example, power electronic components that require additional cooling and control components that do not require additional cooling can be installed on the same carrier block, where the heat of the power electronic components is transferred through the control components for heat dissipation by the heat sink. Therefore, the present solution allows design freedom and allows several different devices to be installed on one host even if not all devices require additional cooling. In addition, the novel shape of the flow cavity helps to spread the heat over a relatively large heat dissipation area. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In the following, some embodiments of the present invention will be described in more detail with reference to the accompanying drawings, in which:

[0039] Figure 1 A bottom perspective view of a heat sink according to at least some embodiments of the present invention is shown;

[0040] Figure 2 Shows Figure 1 an exploded view of the heat sink shown;

[0041] Figure 3 A bottom perspective view of a heat sink having two heat sink portions according to at least some embodiments of the present invention is shown;

[0042] Figure 4 Shows Figure 3 an exploded view of the heat sink shown;

[0043] Figure 5 A bottom perspective view of a heat sink having two flow chambers according to at least some embodiments of the present invention is shown;

[0044] Figure 6 Shows Figure 5 an exploded view of the heat sink shown;

[0045] Figure 7 A bottom perspective view of a heat sink having a heat sink portion spaced apart from a heat source is shown according to at least some embodiments of the present invention;

[0046] Figure 8 Shows Figure 7 an exploded view of the heat sink shown;

[0047] Fig. 9 A top perspective view of a heat sink device according to at least some embodiments of the present invention is shown, the device having two flow chambers, a heat sink portion spaced apart from two heat sources, and additional components mounted on a closure element;

[0048] Fig.10 Shows Fig. 9 an exploded view of the heat sink shown;

[0049] Fig.11 Shows Fig. 9 a bottom perspective view of the heat sink shown;

[0050] Fig.12 Shows Fig.11 an exploded view of the heat sink shown;

[0051] Fig.13A bottom perspective view of a heat sink according to at least some embodiments of the present invention is shown, wherein a portion of the flow channel is integrated into the base of the heat sink;

[0052] Fig.14 Shows Fig.13 a top perspective view, partially cut away, of the heat sink shown; and

[0053] Fig.15 Shows Fig.13 A top perspective view, partially cut away, of an improved embodiment of a heat sink is shown. DETAILED DESCRIPTION

[0054] Figure 1 and Figure 2 A simple embodiment of the utility model is shown. The exemplary heat sink 100 is used to dissipate the heat generated by the heat source 200, and utilizes the heat pipe effect inside the heat sink 100 to transfer the heat to the heat sink 120 and diffuse the heat on the heat sink 120. The heat sink 100 has three basic components: a block 110, a heat sink 120, and a closed element 140. Therefore, the heat sink 100 is basically an improved heat sink. The heat source 200 can be a power electronic device, a processor, an artificial lighting device, or any conventional component that generates a large amount of heat.

[0055] The block 110 may have a generally box form with a flow cavity 130 formed therein. The illustrated embodiment shows a generally quadrilateral flow cavity 130, however the shape of the flow cavity may vary. For example, the flow cavity 130 may be a curved shape, or a shape having fewer than or more than four sides. Additionally or alternatively, the depth of the flow cavity may vary along the flow cavity, and between different flow cavity designs. Additionally or alternatively, the corners of the flow cavity 130 may be rounded, chamfered, or otherwise modified. The block 110 may be cast or extruded from a thermally conductive material such as steel, aluminum, a metal alloy, etc. In Figure 1 and Figure 2 In the example of the block 110, the block 110 presents an elongated and relatively flat quadrilateral. The flow cavity 130 can be formed into a groove 112 in the block 110, for example, by milling, casting or cold forging or any combination of these means. The groove 112 has a relatively flat surface that deviates from the base material of the block 110. The block 110 has a peripheral edge 111 surrounding the groove 112 and connected to it by a transition portion 113, which is a wall surrounding the groove 112.

[0056] The flow chamber 130 according to the embodiments described herein has a completely or partially non-rotationally symmetric cross-sectional shape.

[0057] The flow chamber 130 is formed in the form of a volume that is bounded at one end by a groove 112, at two sides by transition portions 113, and at the other end by a closure element 140. The closure element 140 may take the form of a simple lid attached to the block 110. More specifically, the closure element 140 is attached to the peripheral edge 111 of the block 110, thereby closing the flow chamber 130. The closure element 140 may match the dimensions of the block 110. The closure element 140 may be a component of the device or an integral component of the host device, such as a wall of a power conversion device (such as an AC drive or inverter, a power distribution station, a telecommunications server, or a cellular network base station). When the closure element 140 is in place, the flow chamber 130 has a width W in one Cartesian dimension, a length L in a second Cartesian dimension, and a depth D in a third Cartesian dimension. The closure element 140 may have a groove to increase the depth of the flow chamber 130 (not shown in the figure). It should be noted that, compared with the conventional heat transfer scheme between the heat source 200 and the heat dissipation portion 120, the flow cavity 130 presents a non-rotationally symmetrical cross-sectional shape. In this article, the cross-sectional shape is observed on the length L, width W, depth D of the flow cavity 130 or any combination of these dimensions. The flow cavity 130 is quite shallow. In fact, the length L and the width W can be at least twice the depth D, preferably five times or more than the depth D, and more preferably ten times or more than the depth D. When a phase change heat transfer fluid and heat from the heat source 200 are provided, the flow cavity 130 performs a heat pipe cycle. The heat transfer fluid can be provided to the flow cavity 130 through the port 115 on the block 110, which can be sealed, for example, by filling with a simple plug.

[0058] In the present disclosure, a heat pipe cycle generally refers to a physical phenomenon in which a heat transfer medium contacts a hot solid interface, heating the medium into vapor, whereupon the vapor passes through a conduit to a relatively cool solid interface, whereupon the medium condenses into a liquid. After returning to a liquid state, the medium returns to the hot solid interface for the next cycle. The phase change either absorbs or releases latent heat in the medium, resulting in efficient heat transfer. The liquid can return to the hot solid interface by several different modes, such as gravity or capillary action. In this article, the term "heat pipe cycle" refers to a mode independent of the return, and therefore includes gravity and capillary action.

[0059] The heat pipe cycle is carried out in the flow chamber 130, wherein the evaporation phase occurs at the end of the flow chamber 130 which is initially heated by the heat source 200. For the purpose of illustration, Figure 2 An approximate division is shown between an evaporation region 131, in which the heat transfer fluid is evaporated during the heat pipe cycle, and a condensation region 132, in which the heat transfer fluid returns to liquid form after transferring heat to the heat sink 120. Likewise, Figure 2A schematic representation of a mounting area 141 on the closure element 140 for receiving a heat source 200 is shown. The heat source 200 may be any electrical or optical component that generates heat that needs to be effectively cooled, such as a microprocessor, LED, or IGBT module. When the closure element 140 is connected to the block 110, the mounting area 141 and the evaporation area 131 are aligned. The closure element 140 may be connected to the block 110 by welding, laser welding, friction stir welding, brazing, or any other possible connection method known in the art. A particularly suitable method for connecting the closure element 140 to the block 110 is condensation. The closure element 140 may be connected to the block 110 by any combination of the above means. Accordingly, the heat sink 120 and the condensation area 132 are also aligned. An additional layer of sealing material, adhesive, O-ring, etc. may be provided between the base structural element and the closure element. To promote effective heat pipe circulation, the heat sink is preferably mounted in a generally vertical orientation, with the condensation area 132 located above the evaporation area 131.

[0060] In practice, the heat from the heat source 200 forms a hot spot in the flow chamber 130, which is defined as the evaporation region 131. In contrast, the heat dissipation capacity of the heat dissipation portion 120 creates a relatively cool region, which is defined as the condensation region 132, where there is a dew point for the heat transfer fluid. In other words, the heat dissipation portion 120 forms the condensation region 132. These regions 131, 132 are distinguished from each other according to the behavior of the heat transfer fluid affected by the relative temperature difference between the regions 131, 132. The position and shape of the regions 131, 132 can be changed during operation. As will be understood later, the regions 131, 132 can also be spaced apart from each other so as to transfer heat between the heat source 200 and the heat dissipation portion 120. In fact, the mounting region 141 can be spaced apart from the heat dissipation region 120 to achieve lateral heat transfer. The mounting region 141 and the heat dissipation region 120 and the evaporation region 131 and the condensation region 132 can be located at opposite ends of the block 110.

[0061] exist Figure 1 and Figure 2 In the example of , the heat dissipation portion 120 is disposed on the side of the block 110 opposite to the heat source 200. The heat dissipation portion 120 can be a separate component connected to the block 110, the heat dissipation portion 120 can be produced as an integral feature in the same additive manufacturing stage as the block 110, or as shown, the fins 121 of the heat dissipation portion 120 can be connected to the block 110. Suitable connection methods include welding, shrink fitting, laser welding, stir friction welding, brazing, press fitting, scraping, and any combination of the above means. The heat dissipation portion 120 can extend over the entire width and length of the block 110, or, as shown in other illustrated embodiments, the heat dissipation portion 120 can be offset from the evaporation region 131.

[0062] Figure 3 and Figure 4 Shows Figure 1 and Figure 2 A variation of the embodiment shown, in which the closing element 140 also has a heat dissipation portion 120 for enhanced heat dissipation. The heat dissipation portion 120 on the closing element 140 can be produced by mounting (e.g. welding) a single fin 121 on the closing element, or by producing the fin 121 in the same additive manufacturing step as the other parts of the closing element 140. Excess fins (if any) can be removed, for example, by milling, to form a mounting area for the heat source 200 on the closing element 140. The embodiment of multiple heat sources can include more than two heat sources, which can be arranged in different ways on the closing element, for example, at opposite ends of the length of the closing element 140.

[0063] Figure 5 and Figure 6 Shows Figure 1 and Figure 2 Another variation of the illustrated embodiment is that a wider heat sink 100 is made to accommodate several heat sources 200. According to the illustrated embodiment, the heat sink 100 can accommodate two heat sources, namely a first heat source 200a and a second heat source 200b, which are mounted adjacent to each other on the closure element 140. Although the flow chamber 130 can also be similarly widened, Figure 5 and Figure 6 The embodiment has a further improvement, in which the flow chamber 130 is divided into several flow chambers to correspond to several heat sources 200. According to the illustrated embodiment, the block 110 includes two flow chambers, namely a first flow chamber 130a and a second flow chamber 130b. The two flow chambers 130a and 130b are separated by an intermediate wall 114. The intermediate wall 144 can be formed by the base material of the block 110 and extend between the opposite ends of the block along its length or width. The flow chambers 130a and 130b can be different from each other. Figure 5 and Figure 6 As shown, the first flow cavity 130a can be wider than the second flow cavity 130b. More specifically, the condensation area of ​​the first flow cavity 130a can be wider than the condensation area of ​​the second flow cavity 130b. The difference in width can be achieved by the meandering intermediate wall 114. By varying the width of the flow cavity, different proportions of the total heat dissipation capacity of the heat sink 100 can be allocated to different heat sources 200a, 200b being cooled. Of course, the block 110 can define more than two flow cavities.

[0064] Additionally or alternatively, Figure 5 and Figure 6 The embodiment shown can be combined with Figure 3 and Figure 4The embodiments shown are combined.

[0065] Figure 7 and Figure 8 Shows Figure 1 and Figure 2 Another variation of the embodiment is shown, in which the heat sink portion 120 extends over only a portion of the length of the block 110, and the heat sink portion 120 is provided to the block 110 via a base 122. Figure 7 and Figure 8 In the embodiment of the present invention, the heat sink 120 includes a base 122 from which the fins 121 extend. Therefore, the heat sink 120 can be produced as a separate component from the block 110. For example, the heat sink 120 can be extruded, cast, die-cast, forged, or produced by other additive manufacturing methods. In order to receive the heat sink 120, the block 110 has an opening 116, which is formed by an edge 117 produced by passing through the depth of the block 110. In the illustrated embodiment, the opening 116 is formed at the end opposite to the mounting area for the heat source 200. The heat sink 120 can be connected to the block 110 by an interference fit, welding, or adhesive (not shown). The opening 116 may not extend over the length of the block 110, whereby the opening 116 can transition into the groove 112, which fills a portion of the length of the block 110. Depending on the installation depth of the heat sink 120, the depth of the flow cavity 130 can vary between the groove 112 and the opening 116. A further variation in the depth of the flow chamber 130 can be provided by a recess for the closing element 140 .

[0066] Figure 1 and 2 The embodiment may alternatively be implemented using only Figure 7 and 8 Any variation in the embodiment of the present invention, that is, only a shorter heat dissipation portion 120 is used, or only the connection structure between the heat dissipation portion 120 and the base 110 is used for improvement. As an alternative or in addition, Figure 7 and 8 The embodiments can be used with Figure 3 and 4 and / or Figure 5 and 6 The embodiment is combined with the embodiment of the present invention, that is, including two heat dissipation parts 120, and / or several heat sources 200a, 200b, and / or several flow chambers 130a, 130b.

[0067] Figures 9 to 12 Another embodiment is shown, which includes Figure 1 and 2 , 3 and 4, 5 and 6, and 7 and 8. Unlike the previously described embodiment in which the heat source 200 is indirectly mounted on the block 110 through the closing element 140, according to Figures 9 to 12 In the embodiment shown, the heat source or heat sources 200a, 200b are mounted directly on the block 110. Fig.10 As shown, the heat sources 200a, 200b are mounted at one end of the block 110, in the mounting area 119. The heat sources 200a, 200b can be mounted to the block 110 by using adhesive or through-device paste, clamps, or other external suspension devices, welding, brazing, etc. Preferably, a thermally conductive paste is applied under the heat source. The mounting area 119 can be selected arbitrarily, but in the example shown, the heat sources 200a, 200b are mounted at one end of the block 110 to reserve enough space for the heat sink 120 and the optional additional component 300. The heat sources 200a, 200b, the heat sink 120 and the additional component 300 are all arranged on the same side of the block 110, while the flow cavity or flow cavities 130a, 130b are closed by the closing elements 140a, 140b arranged on the other side. The heat sink 120 can be provided to the block 110 by separately connecting the fins 121 to the block 110, for example, by welding. Or, with Figures 1 to 6 Similar to the embodiment shown, the heat sink portion 120 can be produced as an integral part of the block 110 in the same additive manufacturing step as the other parts of the block 110, or as Figure 7 and Figure 8 As shown in the embodiment of FIG. 1 , the heat dissipation portion 120 may be connected as a separate component.

[0068] As mentioned above, the additional components 300 are optional. The additional components 300 may include, for example, the circuitry required to control the heat source 200. Figures 9 to 12 An exemplary structure is shown, in which electrical components 303 may be surface mounted, for example, on a circuit board 301, which in turn is mounted on a block 110 via spacer legs 302. The spacer legs 302 are preferably configured to lift the circuit board 301 off the block 110, and / or are made of a poorly conductive material. A practical example of such an application is a power supply comprising two power electronic components as heat sources 200a, 200b that require additional cooling, and a control component as an additional component 300 that may not require additional cooling, wherein all components 200a, 200b, 303 may be mounted on the same carrier block 100, and the heat of the power electronic components 200a, 200b is transferred through the control component 303 to be dissipated by the heat dissipation portion 120.

[0069] Fig.11 and Fig.12The side opposite to the mounting side of the heat sink 100 is shown. Similar to the previous embodiment, the flow cavity 130 is formed as a recess 112 in the block 110. The illustrated embodiment is designed to cool two devices that generate different amounts of heat, wherein the first heat source 200a is expected to generate much less heat than the second heat source 200b. Therefore, the first flow cavity 130a is designed to be smaller, and in particular narrower, than the second flow cavity 130b in order to allocate more heat dissipation capacity to the second heat source 200b. Figure 5 and Figure 6 The same as the example, Figures 9 to 12 The shape of the flow chambers 130a, 130b of the illustrated embodiment may be serpentine so as to enable the heat source 200a, 200b to be mounted in the center of the mounting area 119 while allowing the heat dissipation portion 120 to utilize the full width of the block 110. In fact, the evaporation region 131a, 131b may be offset from the condensation region 132a, 132b along the length and width of the flow chamber. The relatively wide flow chambers 130a, 130b may be further divided into sub-branches, wherein intermediate structures are disposed within the flow chambers 130a, 130b. The individual flow chambers 130a, 130b may be divided into sub-branches with isthmuses 118, which may be made of the base material of the block 110, similar to the intermediate wall 114 that divides the flow chamber into two parts. In the illustrated example, the first relatively narrow flow chamber 130a is divided into two sub-branches by one isthmus 118, and the second relatively wide flow chamber 130b is divided into four sub-branches by three isthmuses 118. Isthmus 118 may be advantageous in providing a counterpart for welding or otherwise connecting closure element 140 to block 110. In addition, isthmus 118 will make the structure more rigid, which is advantageous for preventing unwanted acoustic emissions caused by thermal cycling occurring within the flow chamber. Additionally or alternatively, division into sub-branches may be used to modify or optimize the flow dynamics within the flow chamber.

[0070] The flow chambers 130a, 130b are closed by closure elements 140a, 140b, which in the illustrated embodiment take the form of a simple plate whose shape is consistent with the geometry of the flow chambers 130a, 130b. To enable flush mounting, there is a small insert on the bottom surface of the block 110 to receive the closure elements 140a, 140b. The closure elements 140a, 140b of this or other embodiments may have more functionality. For example, the closure elements may include additional heat dissipation portions, or inlets and / or outlets for external sources of heat transfer media.

[0071] like Fig. 9 and Fig.10As shown, the block 110 is relatively wide so as to accommodate several heat sources 200a, 200b. This embodiment can be further widened to accommodate more than two heat sources, or narrowed to accept only one heat source (not shown). It should also be understood that the heat sink can include one heat source per flow cavity, several heat sources per flow cavity, or several flow cavities per heat source. Alternatively, the shape of the block 110 can be changed by placing the heat sources and additional components in parallel near the heat sink portion 120 (not shown). In addition or alternatively, the additional component 300 can be mounted on one or more enclosed elements (not shown).

[0072] The embodiments described above have been discussed with reference to specific configurations, which are shown as stand-alone devices. However, the principles described may alternatively be applied and integrated into larger entities. For example, the heat source may be a power electronic module or component used in the electrical system of an industrial host device, such as an AC drive, an electric vehicle charging station, or an LED lamp. Such power electronic modules and components include IGBT modules, high power LED modules, high power RF components, or any other heat generating components known in the art. The enclosing element or block may be an integral part of the host device, such as a portion of the outer frame of a housing or cabinet. Figure 7 and Figure 8 As an example, the block 110 can be a part of the housing wall, which provides the heat source 200 on the inside through the closing element 140 and provides the heat dissipation portion 120 on the outside through the base 122 and the opening 116. It can be understood that the heat dissipation portion 120 can be placed relatively far away from the heat source 200, which is possible due to the novel design of the flow chamber 130. In addition, the heat dissipation portion 120 can be located on the side of the block 110 opposite to the heat source 200, thereby increasing the design flexibility of the heat dissipation device 100.

[0073] Figures 1 to 12 The illustrated embodiment shows a generally planar block 110, wherein the heat sink portion 120 extends from the block 110 in a generally orthogonal direction. Thus, the flow cavity 130 formed in the block 110 is used to transport and diffuse the heat of the heat source 200 to the heat sink portion 120 in a two-dimensional manner. However, a variation of the heat sink concept is also foreseeable, wherein the heat sink portion 120 is provided to the block 110 via a base 122, which extends in a generally orthogonal direction relative to the block 110. This variation of the heat sink of the utility model is Fig.13 and Fig.14 Displayed in.

[0074] The heat sink 100 according to this modified embodiment has a block 110. The heat sink 120 has a base 122 extending orthogonally or at least in a non-parallel direction relative to the block 110 and has fins 121 extending conventionally from the base 122. The block 110 and the base 120 enclose a flow cavity 130 having two parts, thereby three-dimensionally transporting and spreading heat on the block 110 and the base 120 extending in a non-parallel manner to each other. Fig.14 As shown in the partially cut-away view of , a portion 133 of the flow channel 130 is provided to the block 110 and is the portion closest to the heat source 200, having a substantially flat and non-rotationally symmetrical cross-sectional shape. In this article, this portion of the flow channel 130 is referred to as the proximal portion 133. Fig.13 and 14 The proximal portion 133 of the flow channel 130 of the heat sink 100 may have a Figure 2 and 4 The straight line single path design shown, such as Figure 6 The separated and varied shapes shown, such as Fig.12 The split, varied and branched designs shown, or any foreseeable combination or variation thereof. Fig.13 and Fig.14 In the example shown, the heat source 200 has two components 200a, 200b, which are connected to the block 110 through different respective closure elements 140a, 140b, so that the heat sources 200a, 200b are in conductive contact with the proximal portion 133 of the flow chamber.

[0075] The second portion of the flow cavity 130 is provided to the base 122 of the heat dissipation portion 120 and is referred to as the distal portion 134 to reflect the distal relationship to the heat source 200 compared to the proximal portion 133. The purpose of the distal portion 134 of the flow cavity 130 is to receive heat from the proximal portion 133 and transport the heat to the fins 121. Heat transfer can be achieved according to the heat pipe principle explained above. In order to effectively spread on the base 122, the distal portion 133 can be formed by Fig.14 The embodiment of the present invention can be composed of a network of interconnected sub-cavities as shown, or composed of flat, non-rotationally symmetrical sub-cavities similar to the proximal portion 133 (not shown in the figure). However, since the non-rotationally symmetrical sub-cavities require the assembly of the heat sink from two milled halves, it is preferred to use a network of interconnected sub-cavities for ease of manufacture. The network of interconnected sub-cavities is characterized by a plurality of trunks 135 extending from the proximal portion 133 in a transverse direction relative to it. In the illustrated embodiment, the distal portion 134 has seven such trunks 135. The trunks 135 transfer and spread heat on the base 122, keeping it away from the block 110.

[0076] The distal portion 134 also has a number of branches 136 extending in a parallel direction relative to the fins 121. This direction may actually be the extrusion direction of the heat dissipating portion 120, whereby the branches 136 may be produced during extrusion, or subsequently by machining. Fig.14 The branches 136 in the block 122 are drilled after the extrusion of the heat sink portion 120. Therefore, the branches 136 are blind holes and do not extend through the base 122. The heat sink portion 120 can be produced in the same additive manufacturing step as the block 110, or it can be produced separately and then connected by adhesives, interlocking shapes, welding or other foreseeable connection methods. The branches 136, which can be arranged in a parallel manner to each other, can be connected to one or more trunks 135, which are also arranged in a parallel manner to each other. For example, the distal portion 134 can have: a single branch 136 (shown in the middle) with a single trunk 135 connecting it to the proximal portion 133; a group of two branches (as shown in the right figure) with three trunks connecting them to the proximal portion 133; and a group of three branches (as shown in the left figure) with three trunks connecting them to the proximal portion 133. Some branches 136 can receive heat transfer fluid from several trunks 135. Therefore, a given branch 136 can intersect with one or more trunks 135. The trunk 135 can be drilled through the proximal portion 133, connecting the branches 136 to the proximal portion 133, and optionally connected to each other. Thus, a sub-cavity network can be achieved. The sub-cavity network of the distal portion 134 of the flow cavity 130 can be closed with plugs 137 arranged at both ends of the branches 136.

[0077] Fig.15 Shown according to Fig.13 and 14 A variant in which the branch 136 of the distal portion 134 of the flow chamber 130 is not a blind hole, but extends through the base 122 of the heat sink 120. Such a configuration can be produced by providing a suitable extrusion tool for the branch 136 during the additive manufacturing step of the heat sink 120. Of course, such a branch 136 can also be drilled. Accordingly, both ends of the branch 136 can be closed with a plug 137. As shown in the figure, Fig.15 The embodiment has a modified number of trunks 135 and branches 135. Fig.15 The embodiment of FIG. 1 shows a further modification in that the heat source 200 is connected to the closing element 140 via an additional mounting plate.

[0078] Further variations of the three-dimensional embodiment are foreseeable. For example, the heat sink 100 may include several heat sinks connected in parallel, in series, or in both parallel and series. Figures 13 to 15 The units shown can provide effective cooling solutions for a range of heat sources. For example, Fig.13 and Fig.14 or Fig.15 The three units shown are used to cool the overheating components of the AC drive, and the three units are arranged in parallel to receive the three IGBT components of the three phases of the inverter. The three units can be assembled from three different devices, or produced as an integral part in the same additive manufacturing stage (for example, by extrusion). The proximal parts of the flow chambers of these units can be fluidly connected to each other to share the cooling resources of the heat sink at the heat source. Any such embodiment can be used Figures 9 to 12 This is supplemented by the floating circuit board setup shown in .

[0079] Heat dissipation may be enhanced by providing forced airflow through the heat dissipation portion, such as with a fan.

[0080] The effect of the heat pipe circulation can be improved by providing a porous or fibrous material in the flow chamber to optimize the distribution of the heat transfer fluid. In other words, the flow chamber can include a capillary structure. The inner surface of the flow chamber can be additionally or additionally provided with a ceramic coating, such as a thermal spray coating, to more effectively evaporate and / or condense the heat transfer fluid.

[0081] Although Figures 14 to 15 The double-sided heat sink shown is preferred, however the fins 121 may alternatively be provided on only one side of the base 122 .

[0082] Although the illustrated embodiments involve an overall planar design, the heat sink may alternatively be designed to be more three-dimensional, with the body including more than two faces for the heat source. According to a foreseeable embodiment, the body may have a generally polyhedral shape. An example is a body with a triangular cross-section, wherein the body may extend along an elongated axis and have three faces for receiving a heat source and / or a heat sink portion. Of course, more than three faces may also be foreseen. Other examples include the shapes of a hexahedron, a cube, an octahedron, and a rhombic octahedron.

[0083] Furthermore, the heat dissipation device may include heat sources disposed on both sides of the block. Figure 7 The embodiment shown is taken as an example. Heat sources can be provided on both sides of the block 110, that is, Figure 7 As shown, it is disposed on the side opposite to the heat dissipation portion 120, but it may also be disposed on the side of the heat dissipation portion 120. An additional heat source (not shown) may be connected to the block 110 directly or indirectly.

[0084] The heat source shown in the illustrated embodiment is adapted to be housed within the enclosed element. The heat source may alternatively extend through the enclosed element, superimposed on the block. Thus, both the enclosed element and the block may include a shared mounting area for receiving the heat source.

[0085] It should be understood that the disclosed embodiments of the present invention are not limited to the specific structures, process steps or materials disclosed herein, but can be extended to equivalents recognized by ordinary technicians in the relevant field. It should also be understood that the terms used herein are only used to describe specific embodiments without limitation.

[0086] Throughout this specification, referring to an embodiment means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present utility model. Therefore, the phrases "in one embodiment" appearing in different places in this specification do not necessarily all refer to the same embodiment.

[0087] As used herein, for convenience, multiple items, structural elements, constituent elements and / or materials may be presented in a common list. However, these lists should be understood as each member in the list being individually identified as an independent and unique member. Therefore, unless otherwise stated, any single member in such a list should not be understood as a de facto equivalent of any other member in the same list solely based on appearing in the same group. In addition, when referring to various embodiments and examples of the utility model, alternatives to its various components are also mentioned at the same time. It should be understood that such embodiments, examples and alternatives should not be understood as de facto equivalents to each other, but should be regarded as independent and autonomous expressions of the utility model.

[0088] In addition, the described features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Many specific details, such as examples of length, width, shape, etc., are provided in this specification to provide a comprehensive understanding of the embodiments of the utility model. However, those skilled in the relevant art will recognize that the utility model can be implemented without one or more of these specific details, or implemented with other methods, components, materials, etc. In other cases, well-known structures, materials or operations are not shown or described in detail to avoid covering up other aspects of the utility model.

[0089] Although the above examples illustrate the principle of the present invention in one or more specific applications, it is obvious to those skilled in the art that a large number of modifications can be made to the form, usage and details of implementing the present invention without paying creative labor and without departing from the principle and concept of the present invention. Therefore, the present invention is defined by the claims listed below.

[0090] The verbs "comprise" and "include" are used in this document as open limitations, which neither exclude nor require the existence of unrecited features. Unless explicitly stated otherwise, the features recited in the claims may be freely combined with each other. It is further to be understood that the singular forms "a" or "an" as used herein do not exclude a plurality.

[0091] Reference numerals list

[0092]

Claims

1. A heat dissipation device (100), comprising: - Block (110); - A plurality of closed flow chambers (130a, 130b) which: being at least partially formed in the block (110); configured to perform a heat pipe cycle when a phase change heat transfer fluid and heat from a heat source (200) are provided; having at least partially a rotationally non-symmetrical cross-sectional shape, The flow chambers (130a, 130b) are separated by an intermediate wall of the block (110) located between the flow chambers (130a, 130b). - at least one heat dissipation portion (120) extending from the block (110), - the heat sink (100) comprises a closing element (140) connected to the block (110) to close the flow chamber (130), and - a mounting area (141) on the closing element (140) or on the block (110) or on the closing element (140) and the block (110) for accommodating the heat source (200), Features: The mounting area (119, 141) is configured to accommodate a plurality of such heat sources (200a, 200b) aligned with the corresponding plurality of flow chambers (130a, 130b), The multiple flow chambers (130a, 130b) have different widths (W) and are used to allocate different heat dissipation resources to different heat sources (200a, 200b).

2. The heat dissipation device (100) according to claim 1, characterized in that: The flow chamber (130) at least partially has a substantially quadrilateral cross-sectional shape.

3. The heat dissipation device (100) according to claim 1 or 2, characterized in that: The flow chamber (130) includes a proximal portion (133) that is closest to a mounting point for the heat source (200), wherein the proximal portion (133) has a non-rotationally symmetric cross-sectional shape.

4. The heat dissipation device (100) according to claim 3, characterized in that: - the heat dissipation portion (120) comprises a base (122) and a plurality of fins (121) extending from the base (122), - the base (122) extends from the block (110), - the flow chamber (130) comprises a distal portion (134) connected to the proximal portion (133), and - The distal portion (134) is provided to the base (122) and is configured to spread heat from the proximal portion (133) along the base (122).

5. The heat dissipation device (100) according to claim 4, characterized in that: The distal portion (134) comprises a network of interconnected sub-cavities, which is connected to the proximal portion (133).

6. The heat dissipation device (100) according to claim 1, characterized in that: A non-rotationally symmetric cross-sectional shape has an extension in one dimension that is one or more orders of magnitude greater than the extension in another dimension orthogonal thereto.

7. The heat dissipation device (100) according to claim 1, characterized in that: The non-rotationally symmetric part of the flow chamber (130) has: - length in the first Cartesian dimension (L); - the width in the second Cartesian dimension (W); and - depth in the third Cartesian dimension (D), Wherein, the length (L) and the width (W) are at least twice the depth (D).

8. The heat dissipation device (100) according to claim 7, characterized in that: The length (L) and width (W) are both five times or more than the depth (D).

9. The heat dissipation device (100) according to claim 8, characterized in that: The length (L) and width (W) are both ten times or more than the depth (D).

10. The heat dissipation device (100) according to claim 1, characterized in that: The non-rotationally symmetric part of the flow chamber (130): - including the evaporation area (131); - comprising a condensation region (132) that is distinct or separated from the evaporation region (131); and - It is configured to perform heat pipe circulation between the evaporation area (131) and the condensation area (132).

11. The heat dissipation device (100) according to claim 10, characterized in that: The block (110) is configured to directly or indirectly accommodate the heat source (200) at the evaporation region (131).

12. The heat dissipation device (100) according to claim 10 or 11, characterized in that: The heat dissipation portion (120) forms the condensation region (132) by providing a dew point for the heat transfer fluid.

13. The heat dissipation device (100) according to claim 1, characterized in that: The non-rotationally symmetric portion of the flow chamber (130) or one or more flow chambers (130a, 130b) comprises an isthmus (118) for dividing the flow chamber (130) into a plurality of branches.

14. The heat dissipation device (100) according to claim 1, characterized in that: The heat dissipation portion (120) comprises a plurality of fins, which are connected to the block (110) or the closing element (140), or are connected to both the block (110) and the closing element (140).

15. The heat dissipation device (100) according to claim 1, characterized in that: The heat dissipation portion (120) is spaced apart from the mounting area (119, 141).

16. The heat dissipation device (100) according to claim 1, characterized in that: The mounting area (119, 141) is located on a side of the block (110) opposite to the heat dissipation area (120).

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