Internal storage liquid-cooling cold plate liquid-passing heat dissipation structure

Abstract

The utility model discloses a memory liquid-cooling cold plate liquid-passing heat dissipation structure, which relates to the technical field of server memory heat dissipation, and comprises a cold plate piece, the cold plate piece is provided with a flow channel part and a heat conduction part, the heat conduction part is attached to and covers the position of a flash memory chip of a memory bank, and two ends of the heat conduction part are respectively connected with the flow channel part; one side of the adapter block is communicated with the runner part, and the other side of the adapter block is provided with a water nozzle; and the two sides of the relay block communicate with the flow channel parts of the cold plates correspondingly. According to the memory liquid-cooling cold plate liquid-passing heat dissipation structure, the heat conduction part of the cold plate covers the main heating position of the memory bank, the heat conduction efficiency is improved, and the heat dissipation efficiency is effectively improved by adjusting the sectional area of the flow channel between the flow channel part and the heat conduction part. The cold plate is matched with the relay block to shorten the path of the cooling pipeline in the server, the occupied space of the heat dissipation assembly in the server is reduced while the structural strength is improved, the cold plate can be attached to multiple memory bank heating areas at the same time, the heat dissipation efficiency of the heat dissipation structure is improved, and the energy consumption of the server is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of server memory heat dissipation, in particular to a memory liquid cooling cold plate liquid heat dissipation structure. Background Art

[0002] As server performance improves, the frequency and performance supported by memory sticks are also getting higher and higher, which increases the heat of the server and requires improved heat dissipation efficiency. At present, the heat dissipation of existing memory sticks is usually carried out in the form of air cooling, relying on fans to blow in cold air to remove the heat in the memory stick. As the frequency, capacity and performance of memory sticks continue to increase, the power consumption of memory sticks increases. The existing air cooling method can no longer meet the needs of high-power memory sticks for heat dissipation, which has become one of the important reasons restricting the performance improvement of memory sticks.

[0003] CN201110390535.0 discloses a memory liquid cooling device, including a liquid inlet pipe, a connecting pipe, a liquid cooling block, a liquid outlet pipe, and a main board; the liquid inlet pipe, the liquid outlet pipe and the liquid cooling block are fixed on the main board, and the liquid inlet pipe and the liquid outlet pipe are respectively located at two ends of the liquid cooling block; a memory slot is also provided on the main board, and the memory slot is adjacent to the liquid cooling block; the liquid cooling block is composed of a metal block, metal springs installed on both sides of the metal block, and a liquid channel running through the metal block; the liquid inlet pipe, the liquid channel inside the metal block and the liquid outlet pipe are connected through a connecting pipe to form a cooling liquid circuit.

[0004] Existing server memory modules usually use heat sinks and internal cooling fans to remove heat. Using liquid cooling to dissipate heat for memory modules in servers requires overcoming the space utilization of the heat dissipation structure. Memory modules are often arranged very densely, which cannot provide enough space for heat dissipation, limiting the heat dissipation of the memory. Ensuring the liquid cooling efficiency of memory modules in a limited space has become the main direction of improvement. Utility Model Content

[0005] The utility model aims to at least solve the technical problem existing in the prior art that "the use of liquid cooling for heat dissipation of memory sticks in servers requires overcoming the spatial utilization of heat dissipation structures, and memory sticks are often arranged very densely, which cannot provide sufficient space for heat dissipation, limiting the heat dissipation of memory." To this end, the utility model proposes a liquid cooling cold plate heat dissipation structure for memory, which can efficiently dissipate heat for memory sticks through liquid cooling in a limited space, reduce server noise, improve heat dissipation efficiency and structural strength of memory sticks, and reduce server energy consumption.

[0006] According to some embodiments of the present invention, a memory liquid cooling cold plate liquid heat dissipation structure is applied to a memory bar; it includes:

[0007] A cold plate, wherein the cold plate is provided with a flow channel portion and a heat conducting portion, the heat conducting portion is attached to and covers the flash memory chip position of the memory bar, two ends of the heat conducting portion are respectively connected to the flow channel portion, and the cross-sectional area of ​​the heat conducting portion is larger than the cross-sectional area of ​​the flow channel portion;

[0008] An adapter block, one side of which is connected to the flow channel portion, and the other side of which is provided with a water nozzle, and the water nozzle is connected to the cooling pipe;

[0009] A relay block, both sides of which are respectively connected to the flow channel parts of the cold plate, and the cooling medium in the cold plate flows into another cold plate through the relay block.

[0010] According to some embodiments of the present invention, both sides of the heat-conducting portion are covered with heat-conducting gaskets, and the heat-conducting gaskets are respectively attached to the surface of the flash memory chip of the memory stick and the surface of the heat-conducting portion.

[0011] According to some embodiments of the present invention, the cold plate has a plate-like structure, and the thickness of the heat-conducting portion is ≤3.0 mm.

[0012] According to some embodiments of the present invention, the cold plate component comprises a cold plate upper cover and a cold plate lower cover, and the wall thickness of the cold plate upper cover and the cold plate lower cover is 0.4 mm to 0.6 mm.

[0013] According to some embodiments of the present invention, reinforcing ribs are provided between adjacent heat conducting parts of the cold plate, and the thickness of the reinforcing ribs is smaller than the thickness of the heat conducting part.

[0014] According to some embodiments of the present invention, the cross-sectional area of ​​the connecting channel between adjacent heat conducting parts is smaller than the cross-sectional area of ​​the heat conducting part.

[0015] According to some embodiments of the present invention, the cold plate is made of copper or stainless steel.

[0016] According to some embodiments of the present utility model, fixing holes are provided at the bottom of the adapter block and the relay block, and the fixing holes are used to fix the adapter block and the relay block on the mainboard.

[0017] According to some embodiments of the utility model, the openings of the adapter block and the relay block are respectively provided with blocking blocks for blocking.

[0018] According to some embodiments of the present invention, the cold plate, the adapter block and the relay block are connected by welding.

[0019] According to some embodiments of the present invention, the memory liquid-cooled cold plate liquid heat dissipation structure has at least the following beneficial effects: the heat-conducting portion of the cold plate covers the main heat-generating position of the memory bar, thereby improving the heat-conducting efficiency, and the cross-sectional area of ​​the flow channel between the flow channel portion and the heat-conducting portion is adjusted to effectively improve the heat dissipation efficiency. The cold plate cooperates with the relay block to shorten the path of the cooling pipeline in the server, thereby improving the structural strength and reducing the space occupied by the heat dissipation component inside. The cold plate can simultaneously fit multiple heat-generating areas of the memory bar, thereby improving the heat dissipation efficiency of the heat dissipation structure and reducing the energy consumption of the server.

[0020] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0022] Figure 1 This is a three-dimensional schematic diagram of a liquid-cooled cold plate heat dissipation structure according to an embodiment of the utility model;

[0023] Figure 2 This is a schematic diagram of the heat conduction part of the liquid cooling cold plate liquid heat dissipation structure of the embodiment of the utility model;

[0024] Figure 3 This is a first partial schematic diagram of the liquid cooling cold plate heat dissipation structure according to an embodiment of the utility model;

[0025] Figure 4 This is a second partial schematic diagram of the liquid cooling cold plate liquid heat dissipation structure in an embodiment of the utility model.

[0026] Reference numerals:

[0027] Cold plate 100, cold plate upper cover 101, cold plate lower cover 102, flow channel 110, heat conducting part 120, reinforcing rib 130, heat conducting pad 140,

[0028] Adapter block 210 , faucet 211 , relay block 220 , blocking block 310 , fixing hole 320 . DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0030] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, top, bottom, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0031] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0032] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0033] Reference below Figure 1-Figure 4 The liquid cooling structure of a memory liquid cooling cold plate according to an embodiment of the utility model is described.

[0034] like Figure 1-Figure 4 As shown, the memory liquid cooling cold plate liquid heat dissipation structure is mainly used on memory bars, especially DIMM memory bars of servers. The structure of existing servers is usually a blade structure, with multiple memory bars installed inside. The memory liquid cooling cold plate liquid heat dissipation structure of the utility model is used to efficiently dissipate the memory bars in the limited space inside the server, thereby reducing the operating energy consumption of the server cooling fan. It can reduce the working noise of the server and reduce the total energy consumption of the equipment.

[0035] The memory liquid-cooled cold plate liquid heat dissipation structure includes a cold plate 100, an adapter block 210 and a relay block 220. Specifically, the cold plate 100 is provided with a flow channel portion 110 and a heat conducting portion 120, and the heat conducting portion 120 is attached to and covers the flash memory chip position of the memory stick. Most of the heat in the memory stick is generated by the flash memory chip during operation. The heat transfer efficiency can be improved by covering the flash memory chip position with the heat conducting portion 120 in a targeted manner, so that the cooling medium in the heat conducting portion 120 can fully absorb the heat generated by the flash memory chip. DIMM memory sticks are usually single-sided board chips, and the two sides of a group of cold plates 100 can be attached to different memory sticks respectively, thereby saving internal space of the server.

[0036] Both ends of the heat conducting part 120 are connected to the flow channel part 110, and the cross-sectional area of ​​the heat conducting part 120 is larger than that of the flow channel part 110. When the cooling medium enters the heat conducting part 120 from the flow channel part 110, the cross-sectional area increases and the flow rate decreases, so that the contact time between the cooling medium and the heat conducting part 120 is longer, more heat is absorbed, and the heat dissipation efficiency is improved.

[0037] One side of the adapter block 210 is connected to the flow channel portion 110, and the other side is provided with a water nozzle 211, and the water nozzle 211 is connected to the cooling pipe. Specifically, the connection position of the adapter block 210 and the water nozzle 211 is adjusted accordingly according to the layout of the cooling pipe inside the server, so that the water nozzle 211 is directly connected to the cooling pipe, reducing the path of the cooling pipe and avoiding the bending connection of the cooling pipe, thereby improving the circulation efficiency of the cooling medium inside the cooling pipe.

[0038] The two sides of the relay block 220 are respectively connected to the flow channel part 110 of the cold plate 100, and the cooling medium in the cold plate 100 flows into the other cold plate 100 through the relay block 220. Specifically, when the memory of the server is arranged in a parallel structure, the memory bars in adjacent columns can share a cooling pipe, which reduces the laying of cooling pipes and reduces the internal space occupied by the server. The two sides of the relay block 220 are respectively connected to the flow channel parts 110 of the two cold plates 100, and the cooling medium in the cold plate 100 on one side enters the cold plate 100 on the other side through the relay block 220 and is finally discharged and refluxed from the water nozzle 211 of the adapter block 210. The relay block 220 also solves the problem of weak structural strength caused by the integrated structure cooling plate, so that the plate is divided into a multi-piece structure for connection, improves the structural strength of the heat dissipation structure, and saves the space occupied by the heat dissipation structure.

[0039] In some embodiments of the present invention, Figure 1 and Figure 4 As shown, both sides of the heat conducting part 120 are covered with heat conducting pads 140, and the heat conducting pads 140 are respectively attached to the surface of the flash memory chip of the memory stick and the surface of the heat conducting part 120. Specifically, the heat conducting pads 140 are used to fill the connection gap between the flash memory chip and the cold plate 100, and have a high thermal conductivity, which helps to transfer heat to the cold plate 100.

[0040] In some embodiments of the present invention, Figure 1-Figure 4 As shown, the cold plate 100 is a plate-shaped structure, and the thickness of the heat conducting portion 120 is ≤3.0 mm. Specifically, the thickness of the cold plate 100 is 3.0 mm, which cannot be too thick, because the slot spacing corresponding to the DIMM memory is fixed, and the compression amount of the heat conducting pad 140 needs to be reserved.

[0041] In some embodiments of the present invention, Figure 2 and Figure 3As shown, the cold plate 100 includes a cold plate upper cover 101 and a cold plate lower cover 102. The wall thickness of the cold plate upper cover 101 and the cold plate lower cover 102 is 0.4 mm to 0.6 mm. Specifically, the wall thickness of the cold plate upper cover 101 and the cold plate lower cover 102 is selected to be 0.50 mm, which is not too thin to avoid deformation of the plate due to too thin wall thickness and affect the structural strength.

[0042] In some embodiments of the present invention, Figure 1-Figure 4 As shown, a reinforcing rib 130 is provided between adjacent heat conducting parts 120 of the cold plate 100, and the thickness of the reinforcing rib 130 is less than the thickness of the heat conducting part 120. Specifically, the reinforcing rib 130 is integrally formed with the cold plate 100, which can improve the plate structural strength of the cold plate 100.

[0043] Furthermore, if Figure 2 and Figure 3 As shown, the cross-sectional area of ​​the connecting channel of adjacent heat conducting parts 120 is smaller than the cross-sectional area of ​​the heat conducting parts 120. Specifically, two heat conducting parts 120 are provided on the same cold plate 100, and the cross-sectional area of ​​the channel between the two heat conducting parts 120 is smaller than the cross-sectional area of ​​the channel of the heat conducting parts 120, which is conducive to the rapid flow of the cooling medium between the two heat conducting parts 120.

[0044] In some embodiments of the present invention, the cold plate 100 is made of copper or stainless steel. Specifically, the cold plate 100 is made of copper, which has a high thermal conductivity, or stainless steel, which has a higher hardness.

[0045] In some embodiments of the present invention, Figure 4 As shown, the bottom of the adapter block 210 and the relay block 220 is provided with a fixing hole 320, and the fixing hole 320 is used to fix the adapter block 210 and the relay block 220 on the mainboard. Specifically, when the cold plate 100 is installed at the memory bar, it is connected to the fixing hole 320 from the bottom of the mainboard by screws, so that the position of the adapter block 210 and the relay block 220 is fixed on the mainboard.

[0046] In some embodiments of the present invention, Figure 1-Figure 4 As shown, the openings of the adapter block 210 and the relay block 220 are respectively provided with blocking blocks 310 for blocking. Specifically, the blocking blocks 310 are welded with the openings to seal the internal channels of the adapter block 210 and the relay block 220, thereby improving the connection sealing performance of the heat dissipation structure pipeline.

[0047] In some embodiments of the present invention, the cold plate 100 , the adapter block 210 and the relay block 220 are connected by welding.

[0048] In some embodiments of the utility model, the cold plate 100 is attached to the flash memory chips of the memory stick one by one, and the internal reinforcement teeth (not shown in the drawings) are arranged inside the relay block 220 and the adapter block 210 for tensile strength. The heat on the memory chip particles is transferred to the cold plate 100 through the thermal pad 140, and the internal heat of the cold plate 100 is quickly taken away by the cooling medium, and the cycle is repeated to reduce the temperature of the memory flash chip particles.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0050] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A memory liquid cooling cold plate liquid heat dissipation structure, applied to memory bars; characterized in that: include: A cold plate (100), the cold plate (100) being provided with a flow channel portion (110) and a heat conducting portion (120), the heat conducting portion (120) being attached to and covering the flash memory chip position of the memory bar, two ends of the heat conducting portion (120) being respectively connected to the flow channel portion (110), and a cross-sectional area of ​​the heat conducting portion (120) being larger than a cross-sectional area of ​​the flow channel portion (110); An adapter block (210), one side of the adapter block (210) being in communication with the flow channel portion (110), and the other side of the adapter block being provided with a water nozzle (211), and the water nozzle (211) being in communication with a cooling pipeline; A relay block (220), both sides of which are respectively connected to the flow channel portion (110) of the cold plate component (100), and the cooling medium in the cold plate component (100) flows into another cold plate component (100) through the relay block (220).

2. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 1, characterized in that: Both sides of the heat-conducting portion (120) are covered with heat-conducting pads (140), and the heat-conducting pads (140) are respectively attached to the surface of the memory stick flash memory chip and the surface of the heat-conducting portion (120).

3. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 2, characterized in that: The cold plate (100) has a plate-like structure, and the thickness of the heat-conducting portion (120) is ≤3.0 mm.

4. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 3, characterized in that: The cold plate component (100) comprises a cold plate upper cover (101) and a cold plate lower cover (102), and the wall thickness of the cold plate upper cover (101) and the cold plate lower cover (102) is 0.4 mm to 0.6 mm.

5. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 2, characterized in that: A reinforcing rib (130) is provided between adjacent heat conducting parts (120) of the cold plate (100), and the thickness of the reinforcing rib (130) is smaller than the thickness of the heat conducting part (120).

6. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 5, characterized in that: The cross-sectional area of ​​the connecting channel of the adjacent heat conducting parts (120) is smaller than the cross-sectional area of ​​the heat conducting parts (120).

7. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 1, characterized in that: The cold plate (100) is made of copper or stainless steel.

8. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 1, characterized in that: The bottoms of the adapter block (210) and the relay block (220) are provided with fixing holes (320), and the fixing holes (320) are used to fix the adapter block (210) and the relay block (220) on a mainboard.

9. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 1, characterized in that: The openings of the transfer block (210) and the relay block (220) are respectively provided with blocking blocks (310) for blocking.

10. The memory liquid cooling cold plate liquid heat dissipation structure according to claim 1, characterized in that: The cold plate (100), the adapter block (210) and the relay block (220) are connected by welding.

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