Cooling circulation module and electronic device with same

Abstract

A cooling circulation module is used for solving the problem that an existing heat dissipation module is poor in heat dissipation effect. Comprising a heat absorption unit provided with a cavity; the fan heat dissipation module is connected with the heat absorption unit; and the liquid-cooled module is provided with a heat dissipation piece, the heat dissipation piece is provided with a flow channel, and the flow channel is communicated with the cavity of the heat absorption unit, so that working liquid circularly flows between the cavity and the flow channel. The utility model further relates to an electronic device with the cooling circulation module. Therefore, the effect of improving the heat dissipation efficiency in a limited space can be achieved.

Description

Technical Field

[0001] The utility model relates to a heat dissipation module, in particular to a cooling circulation module which can help an electronic device maintain an appropriate working temperature and an electronic device having the cooling circulation module. Background Art

[0002] Nowadays, electronic devices such as laptops not only have excellent performance, but also have been moving towards a trend of being lighter and thinner; however, electronic devices tend to generate a large amount of waste heat when in operation, which causes the temperature of the electronic devices to rise, increasing the thermal failure rate and loss rate of the electronic devices. Therefore, the heat generated by the heat source such as the chip in the electronic device is introduced into the cooling fan or the cooling fins, and the heat flow is discharged through the cooling fan or the cooling fins. However, the performance of today's chips continues to improve, and the heat generated by the operation of the chips is also relatively increased. It is difficult to form a good heat dissipation effect for the heat source with the current heat conduction method of the heat dissipation module. In addition, in order to correspond to the efficient operation of the chip, it is necessary to increase the volume of the cooling fan or the area of ​​the cooling fins to improve the fan heat efficiency, which will inevitably compress the installation space of the adjacent electronic components. Therefore, there is a need for improvement. Utility Model Content

[0003] In order to solve the above problems, the purpose of the utility model is to provide a cooling circulation module which can improve the heat dissipation effect.

[0004] Another object of the present invention is to provide a cooling circulation module which can improve the heat dissipation performance within a limited space.

[0005] Another object of the present invention is to provide an electronic device with better heat dissipation efficiency.

[0006] The directions or their approximate terms described throughout the present invention, such as "front", "rear", "left", "right", "upper (top)", "lower (bottom)", "inside", "outside", "side", etc., mainly refer to the directions of the accompanying drawings, and each direction or its approximate terms are only used to assist in the explanation and understanding of the various embodiments of the present invention, and are not used to limit the present invention.

[0007] The quantifiers “a” or “an” used in the elements and components described throughout the present invention are only for convenience of use and to provide a general meaning of the scope of the present invention; in the present invention, they should be interpreted as including one or at least one, and a single concept also includes multiple situations, unless it is obvious that it means otherwise.

[0008] The similar terms such as "combination", "assembly" or "assembly" mentioned throughout the present invention mainly include the connection that can be separated without damaging the components, or the connection that makes the components inseparable. Those skilled in the art can choose according to the materials of the components to be connected or the assembly requirements.

[0009] The utility model discloses a cooling circulation module, comprising: a heat absorbing unit having a chamber; a fan heat dissipation module connected to the heat absorbing unit; and a liquid cooling module having a heat dissipation element, the heat dissipation element having a flow channel, the flow channel being connected to the chamber of the heat absorbing unit so that a working liquid circulates between the chamber and the flow channel.

[0010] Therefore, the cooling cycle module of the utility model can dissipate heat by the fan heat dissipation module and the liquid cooling module after the heat absorption unit absorbs the heat energy of the heat source, thereby improving the heat dissipation efficiency. In addition, by dividing the heat dissipation work of the heat absorption unit between the fan heat dissipation module and the liquid cooling module, the volume of the fan heat dissipation module can be maintained without squeezing the installation space of adjacent components, and the heat dissipation effect can be further improved through the cooperative heat dissipation effect of the liquid cooling module, thereby improving the heat dissipation efficiency in a limited space.

[0011] The chamber has a heat conducting part, so that the heat conducting part can form a larger contact area with the working liquid to improve the efficiency of heat energy transfer.

[0012] The fan heat dissipation module has at least one fan and at least one fin assembly, and the at least one fin assembly is located opposite to at least one air outlet of the at least one fan. Thus, the at least one fan can make the air flow blow toward the at least one fin assembly, and has the effect of taking away the heat energy of the at least one fin assembly.

[0013] The at least one fin assembly is combined with the heat absorption unit, so that the at least one fin assembly can be used to introduce heat energy from the heat source.

[0014] The at least one fin assembly is connected to the heat absorption unit through at least one heat pipe, so that the heat energy can be transferred to the at least one fin assembly through the at least one heat pipe.

[0015] The at least one heat pipe has the fin assembly and the fan at one end, and the other end of the at least one heat pipe also has another fin assembly and another fan, and the heat absorption unit is located between the two ends of the at least one heat pipe. In this way, even if the heat absorption unit and the fin assemblies are located relatively far away from each other in response to the component configuration requirements inside the notebook computer, the heat energy can still be transferred through the at least one heat pipe and the heat energy can still be dissipated through the at least one fan.

[0016] The heat sink has a first plate and a second plate, the first plate and the second plate are relatively combined to form the flow channel, and the periphery of the first plate and the periphery of the second plate together form a step portion. In this way, the step portion can form a larger area, and when the step portion is filled with tin for soldering, glued for gluing, or laser welded, it can have better sealing and improve the bonding strength of the first plate and the second plate.

[0017] The first plate and the second plate each have at least one combination hole, and the at least one combination hole of the first plate and the at least one combination hole of the second plate have different apertures, so that the at least one combination hole of the first plate and the at least one combination hole of the second plate together form a step portion. In this way, the step portion can form a larger area, and the step portion can be filled with tin for soldering, glued for gluing, laser welding, or the first plate and the second plate are heat-pressed and then laser-welded by thermosetting glue mold, so that the combination hole has a better sealing effect.

[0018] The flow channel has a first end and a second end, the heat absorbing unit has a first connecting channel and a second connecting channel, the first end is connected to one end of the chamber through the first connecting channel, and the second end is connected to the other end of the chamber through the second connecting channel. In this way, the flow of the entire working liquid in the chamber can be driven to enter the flow channel of the heat sink for circulation.

[0019] The first end of the flow channel is connected to the first connecting channel by a connecting pipe, and the second end of the flow channel is connected to the second connecting channel by another connecting pipe. In this way, the worker can arrange the heat sink and the heat absorption unit at two relatively far places in the electronic device according to the space planning inside the electronic device.

[0020] The two connecting pipes are flexible structures, so that the two connecting pipes can be bent without affecting the effect of the working liquid flowing between the flow channel and the heat absorption unit.

[0021] The flow channel has a plurality of straight portions and a plurality of curved portions between the first end and the second end, so that the length of the flow channel can be extended and the flow channel can almost cover the entire interior of the heat sink.

[0022] At least one of the two adjacent straight portions forms an acute angle in the extending direction, so that part of the plurality of straight portions can function as inclined flow channels.

[0023] The liquid cooling module has a pump, which is located between the two ends of the flow channel to drive the working liquid to flow. In this way, the pump can provide the working liquid with a circulating flow power effect.

[0024] The liquid cooling module has a pump, and the pump is connected to the flow channel and the chamber through a plurality of connecting pipes. In this way, the worker can appropriately set the position of the pump according to the internal space planning of the electronic device, which can be conducive to the thinning of the heat sink. In addition, when the pump fails, it is also conducive to the repair or replacement of the pump.

[0025] The electronic device of the utility model has the above-mentioned cooling cycle module. Thus, after the heat energy of the heat source is absorbed by the heat absorption unit, the fan heat dissipation module and the liquid cooling module can jointly dissipate the heat, thereby achieving the effect of improving the heat dissipation efficiency.

[0026] The electronic device has a relatively folded main body and a screen back plate, the heat absorption unit and the fan heat dissipation module are located in the main body, and the liquid cooling module is located in the screen back plate. In this way, the heat energy transferred to the heat dissipation element can be dissipated to the outside through the screen back plate, and the continuous circulation of the working liquid can effectively remove the heat energy from the heat source, helping the electronic component to dissipate heat to maintain a suitable working temperature.

[0027] The total area of ​​the heat sink of the liquid cooling module is greater than or equal to 1 / 2 of the total area of ​​the screen back plate. Thus, the liquid cooling module has a better heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 : A three-dimensional diagram of the first embodiment of the utility model installed on a notebook computer;

[0029] Figure 2 : An exploded perspective view of the liquid-cooled module of the first embodiment of the utility model;

[0030] Figure 3 : Front view of the liquid cooling module assembly of the first embodiment of the utility model;

[0031] Figure 4 :along Figure 3 AA line profile of

[0032] Figure 5 : Front view of the liquid-cooled module assembly of the second embodiment of the utility model.

[0033] Description of Reference Numerals

[0034] 1: Heat absorption unit

[0035] 11: Heat transfer part

[0036] 12: First Link

[0037] 13: Second Link

[0038] 2: Fan cooling module

[0039] 2a: Fan

[0040] 2b: Fin assembly

[0041] 2c: Heat pipe

[0042] 21: Fan frame

[0043] 22: Fan wheel

[0044] 23: Wind Entrance

[0045] 24: Air outlet

[0046] 3: Liquid Cooling Module

[0047] 31: Heat sink

[0048] 31a: First Plate

[0049] 31b: Second board

[0050] 31c: Binding hole

[0051] 32: Step difference department

[0052] 33: Runner

[0053] 33a: First End

[0054] 33b: Second end

[0055] 34: Connecting pipe

[0056] 35: Pump

[0057] 35a: Liquid inlet

[0058] 35b: Liquid outlet

[0059] 36: Through hole

[0060] 37: Housing

[0061] H: Storage space

[0062] S: Chamber

[0063] L: Working liquid

[0064] M: Cooling cycle module

[0065] N: Laptop

[0066] N1: Host

[0067] N2: Screen back panel

[0068] R: Straight

[0069] T: bend. DETAILED DESCRIPTION

[0070] In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are specifically cited below and described in detail with reference to the accompanying drawings; in addition, those marked with the same symbols in different drawings are regarded as the same and their descriptions are omitted.

[0071] Please refer to Figure 1 , Figure 2 As shown, it is the first embodiment of the cooling circulation module M of the utility model, including a heat absorption unit 1, a fan heat dissipation module 2 and a liquid cooling module 3. The heat absorption unit 1 is used to transfer heat to the fan heat dissipation module 2 and the liquid cooling module 3.

[0072] The heat absorbing unit 1 can be used to contact a heat source, which can be an electronic component, so that the heat energy generated by the operation of the electronic component can be transferred to the heat absorbing unit 1. In this embodiment, the cooling cycle module M can be used to be set in a notebook computer N, which has a host body N1 and a screen back panel N2 that can be folded relative to each other. The electronic component can be, for example, a processor, a display chip or a memory located in the host body N1.

[0073] Continued reference Figure 1 , Figure 2 , Figure 3 As shown, the heat absorbing unit 1 can be made of copper, aluminum, titanium, stainless steel or other heat-conducting materials, and the appearance of the heat absorbing unit 1 can be generally in the shape of a thin plate, which can be light and thin so as to be installed in the laptop computer N. The heat absorbing unit 1 can directly abut against the heat source to absorb and guide the heat energy of the heat source, or the heat absorbing unit 1 can indirectly contact the heat source through a heat-conducting medium such as a heat-conducting sheet or a heat-conducting paste to further improve the thermal conductivity between the heat source and the heat absorbing unit 1. The heat absorbing unit 1 has a chamber S, and the chamber S can be used to flow a working liquid L. The chamber S can be located opposite to the heat source to transfer the heat energy of the heat source to the working liquid L in the chamber S. Preferably, the chamber S can have a heat-conducting portion 11, and the heat-conducting portion 11 can be in the form of fins, convex columns or convex particles, etc. The heat-conducting portion 11 can form a larger contact area with the working liquid L to improve the heat energy transfer efficiency.

[0074] After the heat energy of the heat source is absorbed by the heat absorption unit 1, it can be introduced into the fan heat dissipation module 2 to dissipate the heat energy through the fan heat dissipation module 2. The structural composition and form of the fan heat dissipation module 2 are not limited by the utility model, nor are they limited to the figures disclosed in this embodiment. The fan heat dissipation module 2 can have at least one fan 2a, and the at least one fan 2a can be a centrifugal fan. The at least one fan 2a has a fan frame 21 and a fan wheel 22, and the fan wheel 22 is rotatably located in the fan frame 21. The at least one fan 2a has an air inlet 23 and at least one air outlet 24, and the air inlet 23 can be used for airflow inflow, and the at least one air outlet 24 can be used for airflow outflow. Preferably, the at least one fan 2a has two air outlets 24, and the two air outlets 24 can have better heat dissipation efficiency.

[0075] The fan heat dissipation module 2 has at least one fin assembly 2b, which can be made of a metal material with high thermal conductivity. The at least one fin assembly 2b can be used to introduce heat energy from the heat source. The at least one fin assembly 2b is located opposite to the at least one air outlet 24. For example, the two air outlets 24 of the at least one fan 2a can each be located opposite to a fin assembly 2b. In this way, the at least one fan 2a can make the air flow blow toward the at least one fin assembly 2b, thereby taking away the heat energy of the at least one fin assembly 2b.

[0076] It is worth noting that the at least one fin assembly 2b can be directly combined with the heat absorption unit 1, preferably, the at least one fin assembly 2b can be located in the chamber S to directly receive the heat energy absorbed by the heat absorption unit 1. Alternatively, as shown in the present embodiment, the fan heat dissipation module 2 further has at least one heat pipe 2c, and the at least one heat pipe 2c is combined with the heat absorption unit 1, preferably, the at least one heat pipe 2c can be located in the chamber S. The at least one heat pipe 2c can be in the shape of a flat tube, that is, the cross-section of the at least one heat pipe 2c can be an oblate circle, thereby increasing the contact area between the at least one heat pipe 2c and the heat absorption unit 1, thereby improving the heat transfer efficiency. The at least one fin assembly 2b can contact the at least one heat pipe 2c, so that the heat energy of the heat absorption unit 1 can be transferred to the at least one fin assembly 2b through the at least one heat pipe 2c, and the heat energy is dissipated through the airflow of the at least one fan 2a.

[0077] It is also explained that the at least one heat pipe 2c can be filled with, for example, a phase change liquid and has a capillary structure, the phase change liquid can contact the capillary structure, the phase change liquid can penetrate into the capillary structure and flow by capillary action. The phase change liquid can be water, alcohol, a non-conductive liquid or other low-boiling point liquid, the phase change liquid can absorb heat from the liquid state and evaporate into a gaseous state, and then the gas-liquid phase change mechanism of the phase change liquid is used to achieve heat transfer, and the capillary structure can help the condensed phase change liquid to re-aggregate and reflux to re-absorb the heat energy of the heat absorption unit 1, thereby having good heat dissipation performance.

[0078] For example, one end of the at least one heat pipe 2c may have the fin assembly 2b and the fan 2a, and the other end of the at least one heat pipe 2c may be connected to the heat absorption unit 1. In this embodiment, one end of the at least one heat pipe 2c may have the fin assembly 2b and the fan 2a, and the other end of the at least one heat pipe 2c may also have another fin assembly 2b and another fan 2a, each fin assembly 2b is respectively located at the air outlet 24 of each fan 2a, and the heat absorption unit 1 is located between the two ends of the at least one heat pipe 2c. In this way, even if the heat absorption unit 1 and each fin assembly 2b are located relatively far away from each other due to the component configuration requirements inside the laptop computer N, heat energy can still be transferred through the at least one heat pipe 2c, and heat energy can be dissipated through the at least one fan 2a.

[0079] Please refer to Figure 2 , Figure 3 , Figure 4As shown, the liquid cooling module 3 has a heat sink 31, and the heat sink 31 can be made of, for example, copper, aluminum, titanium, stainless steel or other heat-conducting materials. In detail, the appearance of the heat sink 31 can be generally thin plate-shaped, and can be conveniently installed on, for example, the screen back panel N2 of the laptop N. In this embodiment, the heat sink 31 has a first plate 31a and a second plate 31b, and the first plate 31a and the second plate 31b can be relatively combined by hot pressing or welding. After the first plate 31a and the second plate 31b are relatively combined, the first plate 31a and the second plate 31b can preferably form a step difference portion 32 together. For example, the first plate 31a can be slightly smaller than the second plate 31b, or the second plate 31b can be slightly smaller than the first plate 31a, so that the periphery of the first plate 31a and the periphery of the second plate 31b are non-aligned to form the step difference portion 32. Furthermore, the first plate 31a and the second plate 31b may each have two relatively positioned coupling holes 31c, and the two coupling holes 31c may be used, for example, for screws to pass through, so as to fix the heat sink 31 in the laptop computer N. The coupling holes 31c of the first plate 31a and the coupling holes 31c of the second plate 31b may have different apertures, so that the two coupling holes 31c form the step portion 32. In this way, the step portion 32 may form a larger area, and the step portion 32 may be filled with tin for soldering, glued for gluing, laser welded, or the first plate 31a and the second plate 31b may be heat-pressed and then laser welded by thermosetting glue molds, so that better sealing can be achieved, and the bonding strength between the first plate 31a and the second plate 31b can be improved.

[0080] The heat sink 31 has a flow channel 33, which is connected to the chamber S of the heat absorption unit 1. The flow channel 33 can be used for the circulation of the working liquid L, so that the working liquid L can flow from the chamber S into the heat sink 31. In this way, when the working liquid L flows in the heat sink 31, the heat energy of the working liquid L can be transferred to the heat sink 31 to achieve the effect of cooling the working liquid L. The first plate 31a and the second plate 31b jointly form the flow channel 33. For example, the flow channel 33 can be recessed in the first plate 31a, or the flow channel 33 can be recessed in the second plate 31b, or the first plate 31a and the second plate 31b are respectively recessed to form a part of the flow channel 33.

[0081] The flow channel 33 has a first end 33a and a second end 33b, and the first end 33a and the second end 33b can be respectively connected to the chamber S of the heat absorption unit 1. Further, the heat absorption unit 1 can have a first connecting channel 12 and a second connecting channel 13, the first end 33a is connected to one end of the chamber S through the first connecting channel 12, and the second end 33b is connected to the other end of the chamber S through the second connecting channel 13. In this way, the working liquid L can flow from one end of the chamber S to the other end of the chamber S to drive the flow of the entire working liquid L in the chamber S, so as to enter the flow channel 33 of the heat sink 31 for circulation.

[0082] In this embodiment, the flow channel 33 can be connected to the chamber S of the heat absorption unit 1 through a plurality of connecting tubes 34. That is, the first end 33a can be connected to the first connecting channel 12 by one of the connecting tubes 34, and the second end 33b can be connected to the second connecting channel 13 by another connecting tube 34. Preferably, the plurality of connecting tubes 34 are flexible structures, such as heat-resistant plastic hoses or metal hoses. In this way, the heat absorption unit 1 can be set on the host body N1 of the notebook computer N, and the heat sink 31 can be set on the screen back panel N2, so that the two connecting tubes 34 are located at the relative folding position of the host body N1 and the screen back panel N2, and the two connecting tubes 34 can be folded with the notebook computer N to form a bend without affecting the flow of the working liquid L between the flow channel 33 and the heat absorption unit 1.

[0083] It is worth noting that the flow channel 33 can be extended in length by forming a plurality of straight portions R and a plurality of bends T at the portion between the first end 33a and the second end 33b, and the flow channel 33 can almost cover the entire interior of the heat sink 31; for example, in this embodiment, two adjacent straight portions R can be connected by a plurality of bends T to form a meandering flow channel 33, and preferably, some of the two adjacent straight portions R can form an acute angle in the extension direction, so that some of the plurality of straight portions R can form an inclined flow channel 33. In this way, when the laptop N is in use and the screen back panel N2 is in a substantially upright state (relative to the placement of the laptop N), the heat sink 31 disposed on the screen back panel N2 can make the working liquid L have better flow smoothness in the plurality of straight portions R through the influence of gravity.

[0084] Please continue to refer to Figure 2 , Figure 3As shown, the liquid-cooled module 3 has a pump 35, and the pump 35 is used to drive the circulation of the working liquid L. The person skilled in the art can adjust the flow direction of the working liquid L according to the needs, and the utility model is not limited. For example, the pump 35 can be used to drive the working liquid L to flow from the first end 33a of the flow channel 33 to the second end 33b, or the pump 35 can be used to drive the working liquid L to flow from the second end 33b of the flow channel 33 to the first end 33a. The utility model does not limit the form of the pump 35. The pump 35 is based on the principle of being able to drive the circulation of the working liquid L. In this embodiment, the pump 35 can adopt a shaft-inlet side-outlet centrifugal pump, and the pump 35 can be located between the first end 33a and the second end 33b of the flow channel 33. Further, the heat sink 31 may have a containing space H, the pump 35 is located in the containing space H, the first plate 31a or the second plate 31b may protrude to form the containing space H, or the first plate 31a or the second plate 31b may have a through hole 36, and a shell 37 is used to cover the through hole 36 in a liquid-tight manner to form the containing space H, and the utility model is not limited. In addition, the containing space H may be located on the path of the flow channel 33 so that the containing space H is connected to the flow channel 33, so that the pump 35 may be located on the path of the flow channel 33 to drive the working liquid L to circulate. Alternatively, in another embodiment, the pump 35 may be connected to the flow channel 33 through a pipeline to drive the working liquid L to circulate.

[0085] The pump 35 has a liquid inlet 35a, which is connected to the flow channel 33 and relatively adjacent to the second end 33b; the pump 35 has a liquid outlet 35b, which is connected to the flow channel 33 and relatively adjacent to the first end 33a. Therefore, the pump 35 can provide the power for the circulation of the working liquid L, suck the working liquid L from the second end 33b into the flow channel 33, and pump the working liquid L from the first end 33a of the channel 33 to the chamber S of the heat absorption unit 1. In addition, a non-conductive liquid can be selected as the working liquid L, so that the stator of the pump 35 does not need to be additionally provided with a waterproof structure. In this way, after the heat energy of the heat source is absorbed by the heat absorption unit 1, the heat energy can be transferred to the working liquid L in the chamber S, and the working liquid L in the chamber S is continuously driven by the pump 35 to flow into the heat sink 31, so that the working liquid L can release heat and cool down after contacting the relatively low temperature heat sink 31, and then flow back to the chamber S of the heat absorption unit 1. The heat energy transferred to the heat sink 31 can be dissipated to the outside through, for example, the screen back plate N2. Preferably, the total area of ​​the heat sink 31 can be greater than or equal to 1 / 2 of the total area of ​​the screen back plate N2, so that the heat sink 31 has a better heat dissipation efficiency. In this way, through the continuous circulation of the working liquid L, the heat energy of the heat source can be effectively removed, helping the electronic components to dissipate heat to maintain a suitable operating temperature.

[0086] Please refer to Figure 5 As shown, it is a second embodiment of the liquid cooling module 3 of the cooling circulation module M of the utility model. This embodiment is roughly the same as the first embodiment mentioned above. In this embodiment, the pump 35 is not arranged on the heat sink 31. Further, the pump 35 can be connected to the first end 33a and the first connecting channel 12 through the multiple connecting pipes 34, or the pump 35 can be connected to the second end 33b and the second connecting channel 13 through the multiple connecting pipes 34. In this way, the worker can appropriately set the position of the pump 35 according to the internal space planning of the electronic device, such as the notebook computer N, which can be beneficial to the thinning of the heat sink 31. In addition, when the pump 35 fails, it is also beneficial to repair or replace the pump 35.

[0087] In summary, the cooling circulation module of the utility model can dissipate heat by the fan heat dissipation module and the liquid cooling module together after the heat absorption unit absorbs the heat energy of the heat source, thereby achieving the effect of improving the heat dissipation efficiency. In addition, by dividing the heat dissipation work of the heat absorption unit to the fan heat dissipation module and the liquid cooling module, the volume of the fan heat dissipation module can be maintained without squeezing the installation space of adjacent components, and the heat dissipation effect can be further improved through the synergistic heat dissipation effect of the liquid cooling module, thereby achieving the effect of improving the heat dissipation efficiency in a limited space.

[0088] Although the present invention has been disclosed using the above preferred embodiments, they are not intended to limit the present invention. Any person skilled in the art can make various changes and modifications to the above embodiments without departing from the spirit and scope of the present invention, and the technical scope protected by the present invention is still within the scope of the present invention. Therefore, the protection scope of the present invention should include all changes within the meaning and equivalent scope of the claims attached above. In addition, when the above multiple embodiments can be combined, the present invention includes any combination of implementations.

Claims

1. A cooling cycle module, characterized in that: include: a heat absorbing unit having a chamber; A fan heat dissipation module connected to the heat absorption unit; and A liquid cooling module has a heat sink with a flow channel connected to a chamber of a heat absorbing unit so that a working liquid circulates between the chamber and the flow channel.

2. The cooling cycle module according to claim 1, characterized in that: The chamber has a heat conducting portion therein.

3. The cooling cycle module according to claim 1, characterized in that: The fan heat dissipation module has at least one fan and at least one fin assembly, and the at least one fin assembly is located opposite to at least one air outlet of the at least one fan.

4. The cooling cycle module according to claim 3, characterized in that: The at least one fin assembly is combined with the heat absorption unit.

5. The cooling cycle module according to claim 3, characterized in that: The at least one fin assembly is coupled to the heat absorption unit via at least one heat pipe.

6. The cooling cycle module according to claim 5, characterized in that: One end of the at least one heat pipe has the fin assembly and the fan, and the other end of the at least one heat pipe also has another fin assembly and another fan. The heat absorption unit is located between the two ends of the at least one heat pipe.

7. The cooling cycle module according to claim 1, characterized in that: The heat sink has a first plate and a second plate. The first plate and the second plate are relatively combined to form the flow channel. The periphery of the first plate and the periphery of the second plate jointly form a step portion.

8. The cooling cycle module according to claim 7, characterized in that: The first plate and the second plate each have at least one combining hole, and the at least one combining hole of the first plate and the at least one combining hole of the second plate have different hole diameters, so that the at least one combining hole of the first plate and the at least one combining hole of the second plate together form a step difference portion.

9. The cooling cycle module according to claim 1, characterized in that: The flow channel has a first end and a second end, the heat absorption unit has a first connecting channel and a second connecting channel, the first end is connected to one end of the chamber through the first connecting channel, and the second end is connected to the other end of the chamber through the second connecting channel.

10. The cooling cycle module according to claim 9, characterized in that: The first end of the flow channel is connected to the first connecting channel by a connecting pipe, and the second end of the flow channel is connected to the second connecting channel by another connecting pipe.

11. The cooling cycle module according to claim 10, characterized in that: The two connecting pipes are flexible structures.

12. The cooling cycle module according to claim 9, characterized in that: The flow channel has a plurality of straight portions and a plurality of curved portions at a position between the first end and the second end.

13. The cooling cycle module according to claim 12, characterized in that: At least one of the two adjacent straight portions forms an acute angle in the extending direction.

14. The cooling cycle module according to claim 1, characterized in that: The liquid cooling module has a pump, which is located between the two ends of the flow channel to drive the working liquid to flow.

15. The cooling cycle module according to claim 1, characterized in that: The liquid cooling module has a pump, and the pump is connected to the flow channel and the chamber through a plurality of connecting pipes.

16. An electronic device, characterized in that: A cooling cycle module according to any one of claims 1 to 15.

17. The electronic device according to claim 16, wherein: The electronic device comprises a main body and a screen back plate which are folded relatively to each other. The heat absorption unit and the fan heat dissipation module are located on the main body, and the liquid cooling module is located on the screen back plate.

18. The electronic device as claimed in claim 17, wherein: The total area of ​​the heat sink of the liquid cooling module is greater than or equal to 1 / 2 of the total area of ​​the screen back panel.

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