Treatment system and treatment tool exhaust distribution plate

Abstract

Some embodiments of the present disclosure describe a processing system and a processing tool exhaust distribution plate. The processing system comprises a pedestal and an exhaust system. The pedestal is used for holding a substrate. The exhaust system may include a perforated plate with exhaust holes and an exhaust port. A perforated plate is positioned between the substrate and the exhaust port. Each of the vent holes includes a baffle.

Description

Technical Field

[0001] Some embodiments of the present disclosure relate to a processing system and a processing tool exhaust distribution plate. Background Art

[0002] During semiconductor manufacturing processes that require removal of solvent outgassing, deposited films may dry or cure unevenly. Uneven curing can adversely affect the critical dimension uniformity of semiconductor devices. As a result, smaller device sizes may be difficult to produce. Utility Model Content

[0003] In some embodiments of the present disclosure, a processing system includes a pedestal and an exhaust system. The pedestal is used to hold a substrate. The exhaust system includes a perforated plate with a plurality of exhaust holes and an exhaust port. The perforated plate can be positioned between the substrate on the pedestal and the exhaust port. Each of the exhaust holes includes a baffle.

[0004] In some embodiments of the present disclosure, a processing tool exhaust distribution plate includes a plurality of exhaust holes and a plurality of baffles. The exhaust holes are radially arranged on the processing tool exhaust distribution plate. The baffle is positioned in each of the exhaust holes.

[0005] In some embodiments of the present disclosure, a processing system includes a processing tool, an exhaust removal port, and an exhaust distribution plate. The exhaust removal port is adjacent to the processing tool. The exhaust distribution plate is inserted between the processing tool and the exhaust removal port. The exhaust distribution plate includes a plurality of exhaust holes, and the exhaust holes are radially arranged on the exhaust distribution plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Some aspects of the present disclosure are described in the accompanying Figure 1 It is best understood from the following detailed description when read together.

[0007] Figure 1 is a flow chart of a semiconductor process incorporating dynamic exhaust removal according to some embodiments;

[0008] Figure 2 is a top view of a perforated plate according to some embodiments;

[0009] FIG. 3A to FIG. 3C is a top view of a baffle according to some embodiments;

[0010] Figure 4 is a schematic diagram showing a perforated plate in a processing tool according to some embodiments;

[0011] FIG. 5A to FIG. 5F is an exhaust removal heat map according to some embodiments;

[0012] FIG. 6A to FIG. 6E is a surface profile of a cured material according to some embodiments;

[0013] Fig. 7A and Figure 7B is a top view of a perforated plate according to some embodiments;

[0014] Figure 8 is a flow chart of a method for operating a perforated plate according to some embodiments.

[0015]

Explanation of symbols

[0016] 100:Process flow

[0017] 105: Initiation operation

[0018] 110: Cooling operation

[0019] 115: coating operation

[0020] 120: Heating operation

[0021] 125: Cooling operation

[0022] 130: Irradiation Operation

[0023] 135: Heating operation

[0024] 140: Cooling operation

[0025] 145:Solvent flushing operation

[0026] 150: Heating operation

[0027] 155: Cooling operation

[0028] 200: Perforated plate

[0029] 210: Platform

[0030] 220: Hole

[0031] 230: Radial

[0032] 300: Baffle

[0033] 310: Blade

[0034] 400: Processing tools

[0035] 410:Substrate

[0036] 420:Port

[0037] 430: Chamber

[0038] 440: Ring baffle

[0039] 450: Control System

[0040] 510: Center seal

[0041] 610: Closed hole

[0042] 620: Partially open hole

[0043] 630: Open hole

[0044] 710: Closed

[0045] 720: Partially open

[0046] 730: Open

[0047] 800: Method

[0048] 810,820,830,840: Operation

[0049] Z1~Z4: Zone DETAILED DESCRIPTION

[0050] The following disclosure provides many different embodiments, or examples, for implementing the different features of the provided subject matter. Specific examples of components and configurations are described below to simplify some of the disclosed embodiments. Of course, these are merely examples and are not intended to be limiting. For example, in the following description, the formation of a first feature above or on a second feature may include an embodiment in which the first feature is formed in direct contact with the second feature, and may also include an embodiment in which an additional feature may be formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, some embodiments of the present disclosure may repeat reference numbers and / or letters in various examples. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or configurations discussed.

[0051] The terms used in the specification generally have their ordinary meaning in the art and in the specific context in which each term is used. The use of examples in the specification, including examples of any term discussed in some embodiments of the present disclosure, is illustrative only and does not limit the scope and meaning of some embodiments of the present disclosure or any illustrative term. Likewise, some embodiments of the present disclosure are not limited to the various embodiments given in the specification.

[0052] Additionally, for ease of description, spatially relative terms, such as "below," "beneath," "lower," "above," "upper," and the like, may be used in some embodiments of the present disclosure to describe the relationship of one element or feature to another element or feature illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used in some embodiments of the present disclosure may be similarly interpreted accordingly.

[0053] As used in some embodiments of the present disclosure, "approximately", "about", "roughly" or "substantially" shall generally refer to any approximation or range of a given value, wherein the value or range varies depending on the various technologies to which it is related, and its scope shall be interpreted in the broadest sense as understood by those familiar with the techniques to which some embodiments of the present disclosure are related so as to cover all such modifications and similar structures. In some embodiments of the present disclosure, "approximately", "about", "roughly" or "substantially" shall generally mean within 20%, preferably within 10%, and more preferably within 5% of a given value or range. In some embodiments of the present disclosure, the given quantities are approximate, thereby meaning that the terms "approximately", "about", "roughly" or "substantially" can be inferred if not explicitly stated, or mean other approximate values.

[0054] As used in some embodiments of the present disclosure, the meanings of “a”, “an” and “the” include the singular and the plural, unless the context clearly requires otherwise.

[0055] The term "and / or" when used in a list of two or more items means that any of the listed items may be used alone or in combination with any one or more of the listed items. For example, the expression "A and / or B" is intended to mean any one or both of A and B, that is, A alone, B alone, or A and B in combination. "A, B, and / or C" is intended to mean A alone, B alone, C alone, A and B in combination, A and C in combination, B and C in combination, or A, B, C in combination.

[0056] Some embodiments of the present disclosure are directed to dynamic exhaust removal systems for certain aspects of semiconductor manufacturing (e.g., nanofabrication). In some embodiments of the present disclosure, the exhaust removal system includes a pedestal for holding a substrate thereon and an exhaust removal system. The exhaust removal system (e.g., an exhaust system) may include a perforated plate with a plurality of exhaust holes and an exhaust port. The perforated plate may be positioned between the substrate and the exhaust port. In some embodiments of the present disclosure, each of the plurality of exhaust holes includes a baffle.

[0057] The perforated plate can have any shape and / or size, so that the perforated plate can be incorporated in any desired configuration. For example, the perforated plate can be configured as a circular shape, a square shape, an elliptical shape, a rectangular shape, a triangular shape, a pentagonal shape, a hexagonal shape, a heptagonal shape, an octagonal shape, a nonagonal shape, a decagonal shape, a dodecagonal shape, an icosagonal shape, a dodecahedral shape, or any suitable planar polygonal shape.

[0058] In some embodiments of the present disclosure, the perforated plate may have a size similar to a silicon (Si) wafer. For example, based on the diameter of the silicon wafer used in the process, the perforated plate may have a diameter of about 3 millimeters (millimeter, mm), about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 10 mm, about 15 mm, about 20 mm, about 25 mm, about 30 mm, about 35 mm, about 40 mm, about 45 mm, about 50 mm, about 60 mm, about 70 mm, about 80 mm, about 90 mm, about 100 mm, about 150 mm, about 200 mm, about 250 mm, about 300 mm, about 350 mm, about 400 mm, about 450 mm, or about 500 mm. In some embodiments of the present disclosure, the perforated plate may be larger than the silicon wafer. In some embodiments of the present disclosure, the perforated plate may be smaller than the silicon wafer.

[0059] In addition, the perforated plate can have any thickness suitable for the desired application. For example, the perforated plate can have a thickness of about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, or about 10 mm.

[0060] In some embodiments of the present disclosure, the holes are arranged in a radial configuration on the perforated plate. In some embodiments of the present disclosure, the holes can be arranged in a radial concentric configuration, a concentric configuration, a random configuration, a spiral configuration, a square configuration, a concentric elliptical configuration, or any suitable configuration on the perforated plate, depending on the desired exhaust removal.

[0061] In some embodiments of the present disclosure, each hole may include a baffle to control the diameter of the opening of each hole. For example, the baffle may be completely closed (for example, the hole is open to 0% of the diameter) or completely open (for example, open to 100% of the diameter of the hole). In some embodiments of the present disclosure, as shown below, the baffle may open from about 1% of the diameter of the hole to about 99% of the diameter of the hole. For example, the baffle may open to about 1%, about 2%, about 3%, about 4%, about 5%, about 10%, about 15%, about 20%, about 30%, about 40%, about 50%, about 60%, about 70%, about 80%, about 90%, or about 99% of the diameter of the hole.

[0062] In some embodiments of the present disclosure, a baffle may be positioned within each of the plurality of holes. For example, the baffle may be embedded within the perforated plate such that the baffle may extend from the sidewall of each of the plurality of holes toward the center of each hole to move into the closed configuration. In some embodiments of the present disclosure, the baffle may be positioned adjacent to each of the plurality of holes, for example, on the top of the perforated plate, and cover each of the plurality of holes when in the closed configuration. Similarly, the baffle may be positioned on the bottom of the perforated plate, covering each of the plurality of holes when in the closed configuration.

[0063] In some embodiments of the present disclosure, the baffle is an aperture baffle. The aperture baffle may include a plurality of blades to define the opening of each of the plurality of holes. For example, the aperture baffle may include 3 blades, 4 blades, 5 blades, 6 blades, 7 blades, 8 blades, 9 blades, 10 blades, 11 blades, 12 blades, 13 blades, 14 blades, 16 blades, 17 blades, 18 blades, 19 blades, 20 blades, or any suitable number of blades. In some embodiments of the present disclosure, the number of blades may define the shape of the opening (for example, 3 blades may form a triangular opening, 4 blades may form a square opening, etc., until the opening is substantially circular). In some embodiments of the present disclosure, the number of blades and the corresponding hole shape defined by the number of blades may result in different flow dynamic characteristics of the exhaust flow. For example, an aperture baffle with a greater number of blades (for example, 10 to 20 blades) may have an uninhibited exhaust flow through the hole. In other examples, where the aperture baffle has a smaller number of blades (e.g., 3-7 blades), the exhaust flow may experience inhibited flow if the blades block the possible openings. For example, a triangular opening may have a tortuous exhaust flow path, wherein a substantially circular opening may have a less tortuous and / or smoother exhaust flow path.

[0064] In some embodiments of the present disclosure, the baffle is a lateral baffle (e.g., a substantially straight-sided baffle spanning the hole to close the hole). In some embodiments of the present disclosure, the baffle is a sliding door type baffle (e.g., two substantially straight-sided lateral baffles that meet at the center of each hole to close the hole).

[0065] Figure 1 1 is a flow chart of an example process flow 100 according to some embodiments of the present disclosure. During a priming operation 105, a priming material such as hexamethyldisilazane (HDMS) is deposited onto a wafer (e.g., by spin casting). After the spin casting operation, the wafer undergoes a cooling operation 110 (e.g., by placing the wafer on a cooling plate). After the cooling operation 110, the primed wafer may be coated with a material such as a photoresist during a coating operation 115.

[0066] In some embodiments of the present disclosure, the material used in the coating operation is a polymer material deposited from a polymer solution dispensed in an organic solvent. During deposition (e.g., spin coating, dip coating, or the like), volatile organic compounds (VOCs) may evaporate and propagate throughout the deposition chamber, resulting in solvent outgassing. Additionally, in some embodiments of the present disclosure, solvent evaporation may be the beginning of a curing process, wherein the polymer film has a substantially uniform thickness across the entire area of ​​a wafer (e.g., a substrate) and is free of defects. In some embodiments of the present disclosure, removal of solvent outgassing may be used to control the drying and / or curing characteristics of the polymer film.

[0067] In some embodiments of the present disclosure, the dispensing and coating chamber may have an exhaust system fluidly coupled to the chamber. For example, the chamber may be a production-level photoresist coating tool, a laboratory fume hood, a glove box, or the like. In some embodiments of the present disclosure, the exhaust system port may be positioned above the dispenser nozzle and the coated wafer.

[0068] Reference now Figure 2 , the perforated plate 200 may be positioned adjacent to the exhaust system port such that the perforated plate 200 is between the exhaust system port and the wafer. In some embodiments of the present disclosure, the perforated plate 200 may be fluidly coupled to the exhaust system port. Figure 2 As shown in , the perforated plate 200 includes a platform 210 with a plurality of exhaust holes 220 extending radially from the center of the platform 210. In some embodiments of the present disclosure, the exhaust holes 220 may form concentric rings around the center of the platform 210, and the concentric rings are separated by a distance d. In some embodiments of the present disclosure, the distance d represents the distance from the center of the first hole 220 to the center of the second hole 220 along the radial line 230. The distance d may be about 3 mm, about 4 mm, about 5 mm, about 10 mm, about 15 mm, about 20 mm, about 30 mm, or any desired and / or possible suitable distance. For example, the placement of the aperture baffle can determine the proximity of the first hole 220 to the second hole 220. Also, Figure 2 As shown in , the exhaust holes 220 may have different diameters based on their placement along radial lines 230. For example, exhaust holes 220 located closer to the center of the platform 210 may have smaller diameters than exhaust holes 220 located closer to the edge of the platform 210.

[0069] In some embodiments of the present disclosure, the platform 210 may have a hole area ratio ranging from about 0.19 to about 0.22. In some embodiments, the hole area ratio is the ratio between the total area of ​​the platform 210 and the combined area of ​​the opening holes 220. For example, a 7.07 cm 2 The platform 210 (with an area of ​​1.43 cm2 The total open hole area) may have a hole area ratio of about 0.2. An example of the characteristics of the platform 210 and the hole 220 is shown in Table 1 below.

[0070] Table 1

[0071]

[0072] In some embodiments of the present disclosure, the hole 220 may have a diameter of about 500 μm to about 50 mm. For example, the hole 220 diameter may be about 500 μm, about 600 μm, about 700 μm, about 800 μm, about 900 μm, about 1 mm, about 2 mm, about 3 mm, about 4 mm, about 5 mm, about 6 mm, about 7 mm, about 8 mm, about 9 mm, about 10 mm, about 11 mm, about 12 mm, about 13 mm, about 14 mm, about 15 mm, about 16 mm, about 17 mm, about 18 mm, about 19 mm, about 20 mm, about 25 mm, about 30 mm, about 35 mm, about 40 mm, about 45 mm, or about 50 mm. In some embodiments of the present disclosure, the diameter of the hole may be about 0.1% to about 10% of the diameter of the perforated plate. For example, the diameter of the hole may be about 0.1%, about 0.2%, about 0.3%, about 0.4%, about 0.5%, about 0.6%, about 0.7%, about 0.8%, about 0.9%, about 1%, about 2%, about 3%, about 4%, about 5%, about 6%, about 7%, about 8%, about 9%, or about 10% of the diameter of the perforated plate.

[0073] In some embodiments of the present disclosure, the removal of solvent exhaust can be controlled by controlling the opening diameter of the exhaust hole 220. FIG. 3A to FIG. 3C Each of the exhaust holes 220 may include a baffle 300. In some embodiments of the present disclosure, the baffle 300 is an aperture baffle including a plurality of blades 310. When in the closed configuration, the blades 310 extend from the outer edge of the exhaust hole 220 to the center of the exhaust hole 220, such as Figure 3A as shown in . Figure 3B The partially open configuration is shown, providing an opening of about 1% to about 99% of the diameter of the vent 220. In some embodiments, Figure 3CAn aperture baffle is shown providing an opening of about 80% of the diameter of the exhaust hole. In some embodiments of the present disclosure, about 80% of the diameter of the exhaust hole 220 may be considered a fully open configuration, depending on the incorporation of the baffle 300. For example, when the baffle 300 is placed within the platform 210, the aperture blades 310 may not be fully retracted into the platform 210, and thus the baffle 300 may be in a fully open configuration, although the entire exhaust hole 220 may not be exposed. In some embodiments of the present disclosure, when the baffle 300 is positioned on the platform 210 and adjacent to the exhaust hole 220, the baffle 300 may be used to open to about 100% of the diameter of the exhaust hole 220.

[0074] In some embodiments of the present disclosure, controlling a self-material dispensing operation (e.g., Figure 1 The solvent removal of the priming operation 105, coating operation 115 and / or solvent rinsing operation 145 shown in Figure 1 can provide a substantially uniform and substantially consistent thin film. For example, spin coating and / or dip coating of a thin film material onto a substrate (e.g., a wafer) can be performed by dissolving the material into a solution, dispensing the material solution onto the substrate, and rotating the substrate to provide a thin film of the material. During the spinning operation, the solvent in the material solution can evaporate as process exhaust. In some embodiments of the present disclosure, the perforated plate 200 can be positioned adjacent to or above a spin coater.

[0075] Figure 4 The placement of a perforated plate 200 is shown according to some embodiments of the present disclosure. The perforated plate 200 can be positioned inside a processing tool 400, between the processing tool 400 and an exhaust port 420, or within the exhaust port 420. The processing tool 400 can receive a substrate 410 (e.g., a wafer) for processing (e.g., coating, curing, or the like). The processing tool 400 can include an exhaust port 420 for extracting solvents and other chemical exhaust from the processing tool 400. Figure 4 The directional arrows in pictorially depict example exhaust flows. In some embodiments of the present disclosure, the exhaust that occurs in the chamber 430 of the processing tool 400 may be fluidly controlled using the perforated plate 200. In some embodiments of the present disclosure, each of the exhaust holes 220 in the perforated plate 200 may be individually opened, closed, or partially opened using a control system 450 (e.g., a computing device, a controller device, or a processing device) to regulate exhaust gas flow from the chamber 430 to the exhaust port 420. An annular baffle 440 may be used to close the chamber 430. In some embodiments of the present disclosure, the control system 450 may be employed to control each baffle 300 associated with each hole 220 on the perforated plate 200.

[0076] In some embodiments of the present disclosure, solvent exhaust may be performed during a baking operation (e.g., Figure 1For example, a positive photoresist film may be used to coat a silicon wafer. The positive photoresist film is prepared for subsequent downstream processing, such as exposure ( Figure 1 Irradiation operation 130), hard baking ( Figure 1 heating operation 135 and cooling operation 140), and developing ( Figure 1 In some embodiments of the present disclosure, the coated silicon wafer is placed on a hot plate to cure the positive photoresist film, for example, to heat the remaining solvent and drive it out of the positive photoresist film by evaporation. The evaporated solvent becomes solvent exhaust, which can be controllably and safely removed from the environment using an exhaust system and perforated plate 200. In some embodiments of the present disclosure, an exhaust system port 420 can be positioned above the silicon wafer (for example, substrate 410), and perforated plate 200 can be positioned between the silicon wafer and the exhaust system port 420. Solvent exhaust (by Figure 4 4 (indicated by the directional arrows in FIG. 4 ) can be controllably and safely removed from chamber 430. Controllable solvent exhaust removal will be discussed in further detail below.

[0077] FIG. 5A to FIG. 5F is a collection of heat maps illustrating the effect of controlled exhaust flow on film properties according to some embodiments of the present disclosure. FIG. 5A to FIG. 5F , the top image shows the configuration of the perforated plate 200 during the experiment. FIG. 5A to FIG. 5F The bottom image in each of the is a critical dimension uniformity heat map. High points on the film (e.g., areas of thicker film) are represented by white (e.g., white represents films having a thickness greater than about 3.3 μm). Lower areas, e.g., areas of thinner film, are represented by black (e.g., films having a thickness of up to about 3.175 μm).

[0078] In some embodiments of the present disclosure, the amount of exhaust gas flowing through the center of the perforated plate 200 may affect the critical dimension uniformity of the deposited film. FIG. 5A to FIG. 5F As shown in , changing the amount of exhaust flowing through the center of the perforated plate 200 can have a significant effect on the uniformity of the film on the substrate. For example, Figure 5A The thermal map of φ shows the change in CD uniformity when all of the vent holes 220 are fully open (eg, the mask 300 exposes at least about 80% of each of the vent holes 220). FIG. 5A to FIG. 5F The heat map of FIG. 2 shows the critical dimension uniformity as the center seal diameter increases on the perforated plate 200. For example, Figure 5B The thermal map shows the critical dimension uniformity when a 30 mm diameter center seal 510 is used. Figure 5C The heat map shows the effect of a 60 mm diameter center seal 510. Figure 5D The heat map shows the effect of a 90mm diameter center seal 510. Figure 5E The heat map shows the effect of the 120mm diameter center seal 510, while Fig. 5F The heat map of 510 shows the effect of the 150 mm diameter center seal 510. Therefore, the remainder of the exhaust hole 220 remains in an open configuration.

[0079] In some embodiments of the present disclosure, when depositing a thin film on a 300 mm substrate (e.g., a 300 mm wafer), a center seal 510 having a diameter of 90 mm is produced, thereby providing a substantially uniform and substantially consistent thin film. Figure 5D As shown in FIG. , when the perforated plate 200 is operated with a 90 mm diameter center seal 510, the resulting film is substantially uniform and substantially free of defects (e.g., Figure 5D ). Thus, preventing exhaust flow from being removed from the central region of the substrate and enabling exhaust flow to be removed from regions closer to the periphery of the substrate can balance solvent exhaust removal from the film and provide a substantially uniform film on the substrate. In some embodiments of the present disclosure, a baffle 300 coupled to the central exhaust hole 220 can be used to create a central seal 510. In some embodiments of the present disclosure, a physical attachment (for example, a sticker) can be used to provide the central seal 510. In some embodiments of the present disclosure, the sticker can be aluminum, copper, silver, or gold, and have a thickness of about 0.03 mm to about 0.3 mm.

[0080] In some embodiments of the present disclosure, a soft bake is performed after spin coating to drive off residual solvent from the film and / or during coating ( Figure 1 , heating operation 120 and cooling operation 125) to at least partially cure the film. For example, some types of photoresist materials can be partially cured to allow exposure ( Figure 1 , irradiation operation 130, heating operation 135, and cooling operation 140) and development ( Figure 1 , solvent rinse operation 145), while maintaining adhesion in unexposed and undeveloped areas (for example, when using a positive resist). As a result, the film surface profile can be controlled by controlling the removal of exhaust from the soft bake process tool.

[0081] In some embodiments of the present disclosure, Figure 1As shown in heating operation 135, cooling operation 140, heating operation 150, and cooling operation 155, a hard bake may be performed to fully cure the thin polymer film to provide, for example, a hard mask, etch stop layer, dielectric layer, protective layer, or the like for subsequent etching operations (for example, wet etching and / or dry etching). Controlling the surface profile of the deposited film can provide a template for subsequent processing operations. For example, controlled solvent exhaust removal can provide a tailored film having a varying thickness suitable for providing a tailored etching profile. In some embodiments of the present disclosure, controlled exhaust removal can provide a cured film having a varying film thickness on a substrate. During a subsequent etching operation using a uniform etching recipe, areas masked with a thicker film mask will etch slower than areas masked with a thinner film mask.

[0082] Reference now FIG. 6A to FIG. 6E After a baking process to remove residual solvent and cure the film, the film surface profile corresponds to the open and closed patterns of the holes 220 in the perforated plate 200. In some embodiments of the present disclosure, FIG. 6A to FIG. 6E The inset of FIG. 1 shows the condition of each of the plurality of holes 220 during solvent baking. The inset shows a closed hole 610, a partially opened hole 620, and an open hole 630. The inset indicator corresponds to FIG. 6A to FIG. 6E The top image in each of the , shows the configuration of the perforated plate 200 during each experiment.

[0083] Fig. 6A The substantially uniform (some embodiments of the present disclosure include those in which all of the vent holes 220 in the plurality of vent holes are at least partially open) Fig. 6A The thin polymer film is spin cast onto substrate 410, and substrate 410 is baked. The thin polymer film is profiled, and the deposited film exhibits a substantially uniform film thickness across the diameter of substrate 410. In some embodiments of the present disclosure, when exhaust is uniformly removed from chamber 430, the deposited film may have a substantially uniform surface profile.

[0084] In some embodiments of the present disclosure, outgassing removal can be controlled to provide a tailored film surface profile. For example, when the central region of the perforated plate 200 is blocked, solvent outgassing removal is slowed above the center of the substrate, thereby providing a film with a thicker profile (e.g., a solvent-rich region) below the blocked outgassing holes 220. Likewise, where solvent outgassing removal is not inhibited (e.g., toward the periphery of the perforated plate 200 where the outgassing holes 220 are in an open configuration), solvent is drawn from the deposited film at a higher rate than at the center, thereby allowing the polymer to solidify faster while leaving a thinner film than where the outgassing holes 220 are blocked (e.g., a solvent-poor region). As Figure 6BAs shown in (for example, in the "center high" example), when the center hole 220 is closed and the outer holes 220 are open, the film can be provided with a center region that is thicker than the film on the rest of the substrate.

[0085] Furthermore, in some embodiments of the present disclosure, a deposited film having any desired annular surface profile can be provided. Figure 6C As shown in FIG. 1 , a film having a thinner central region and a thicker outer region can be provided in which the vent holes 220 closer to the center of the perforated plate 200 are in a fully open configuration and the vent holes 220 arranged around the fully open central portion are at least partially open (some embodiments of the present disclosure are shown in FIG. 1 ). Figure 6C Similarly, a film having a thick edge profile and a substantially uniform center profile can be provided, such as Fig.6D As depicted in (some embodiments of the present disclosure are also referred to as "edge high"), the outer holes 220 are closed and the center hole 220 is at least partially open. In addition, when the outer holes 220 are fully open and the center hole 220 is at least partially open, a thin edge profile and a substantially uniform center profile (some embodiments of the present disclosure are also referred to as "edge low") can be provided, such as Fig. 6E as shown in .

[0086] In some embodiments of the present disclosure, the perforated plate 200 may be deployed in any suitable chemical processing tool. For example, the perforated plate 200 may be deployed in a processing tool for developing exposed photoresist (e.g., Figure 1 The photoresist developer may be a solvent with harmful exhaust gases that need to be controllably removed. In some embodiments of the present disclosure, the use of a perforated plate 200 in a developer tool may provide controlled photoresist development. For example, a high exhaust flow may be provided by opening exhaust holes 220 above certain areas of the substrate and photoresist being developed. Faster exhaust pumping may accelerate solvent volatility and provide a partially developed photoresist layer, further providing a partially shielded area of ​​the substrate. In some embodiments of the present disclosure, the partially shielded area may be used to create a tailored etch profile in downstream processing.

[0087] In some embodiments of the present disclosure, each of the plurality of exhaust holes 220 arranged radially and concentrically on the perforated plate 200 can be configured to be individually controlled (e.g., open, closed, or partially open). In some embodiments of the present disclosure, the perforated plate 200 can be a processing tool exhaust distribution plate. As described above, distributing exhaust (e.g., solvent exhaust) from a film processing tool can provide a substantially uniform and substantially consistent film on the substrate 410. Optionally, distributing the exhaust can provide a tailored film, such as FIG. 6A to FIG. 6E As shown in Fig. 7A and Figure 7BAs shown in , each of the exhaust holes 220 may be open 730, partially open 720, and / or closed 710. In some embodiments of the present disclosure, Fig. 7A A non-radial pattern of open 730, partially open 720, and closed 710 exhaust holes 220 is shown. The individually controllable baffles 300 provide any desired exhaust removal pattern. For example, the perforated plate 200 can be used to provide different exhaust removal zones over the area of ​​the perforated plate 200. The exhaust removal zones can be controlled by inputting to ( Figure 4 The control system 450 may determine the predetermined recipe, as further described below. Fig. 7A As shown in , in some embodiments of the present disclosure, variable thickness films can be provided by programming the perforated plate 200 to be divided into four zones Z1, Z2, Z3, and Z4. In some embodiments of the present disclosure, the left zone Z1 can provide a thicker film, the second zone Z2 from the left can provide a thinner film, the third zone Z3 from the left can provide an intermediate thickness zone, and the right zone Z4 can provide a thicker right zone.

[0088] Figure 7B Optional exhaust removal patterns are shown. In some embodiments of the present disclosure, based on desired film properties (e.g., critical dimension uniformity and / or surface profile), the exhaust holes 220 may alternatively be closed 710, partially open 720, or open 730. In some embodiments of the present disclosure, the defined zones may provide a circular corrugation pattern in the cured film, with a thick center (zone Z4), a less thick first concentric region around the center (zone Z3), a thin concentric region adjacent to the less thick region (zone Z2), and a thick outer ring (zone Z1).

[0089] In some embodiments of the present disclosure, a method 800 for removing exhaust gas from a processing system is described. For example, the method 800 describes removing chemical exhaust gas from a chemical processing tool. For illustrative purposes, reference will be made to Figure 2 and Figure 4 The operations of method 800 are described. The operations of method 800 may be performed in different orders or not performed depending on the specific application. In addition, it should be understood that additional operations may be provided before, during, and after method 800, and some embodiments of the present disclosure may only briefly describe other operations.

[0090] At operation 810, an exhaust removal port of an exhaust removal system is positioned adjacent to a process tool. Figure 4, exhaust port 420 can be positioned above substrate 410. Processing tool 400 can be a closed system or an open system. In some examples, a closed system can have a chamber 430 (e.g., a reaction chamber, a vacuum chamber, an injection chamber, or the like) that can be further closed for processing (e.g., using an annular baffle 440). The chemical processing tool can be a wet chemical processing tool, a dry chemical processing tool, a laboratory bench, a glove box, and / or a fume hood.

[0091] In some embodiments of the present disclosure, the processing tool 400 is a chemical dispenser, a chemical curing system, a soft bake system, a hard bake system, a solvent rinse system, a chemical mechanical planarization (CMP) system, or any suitable chemical processing system.

[0092] refer to Figure 8 At operation 820, an exhaust gas distribution plate (for example, Figure 4 The exhaust distribution plate may be inserted between the processing tool 400 and the exhaust removal port. The exhaust distribution plate may be inserted into a slot positioned around and in front of the exhaust removal port. The slot may be inherent to the exhaust removal port or manufactured to receive the exhaust distribution plate. In some embodiments of the present disclosure, the exhaust distribution plate may have a separate base or frame to hold the exhaust distribution plate adjacent to the exhaust removal port. The separate base or frame may be separate from the exhaust removal port, the exhaust system, and / or the chemical processing tool.

[0093] refer to Figure 8 At operation 830, the process tool 400 and the exhaust distribution plate are closed to provide a controlled exhaust removal environment. Return to Reference Figure 4 , the processing tool 400 can be used to receive a substrate 410, wherein an exhaust removal port 420 is positioned above the substrate 410. An exhaust distribution plate (e.g., a perforated plate 200) can be positioned between the exhaust removal port 420 and the substrate 410. In some embodiments of the present disclosure, the chamber 430 can be closed to control the exhaust flow (by Figure 4 ). In some cases, an annular baffle 440 may be employed to enclose the processing tool 400 (eg, to enclose the chamber 430). Once enclosed, the exhaust gas may flow through the exhaust distribution plate (eg, the perforated plate 200) and into the exhaust removal port 420.

[0094] refer to Figure 8At operation 840, the diameter of each of the exhaust holes 220 in the plurality of exhaust holes radially disposed on the exhaust distribution plate is controlled. For example, the exhaust distribution plate can be communicatively coupled to a control system 450 (e.g., a programmable computer or a dedicated control device). The control system 450 can be used to control the baffle 300 setting for each of the individual exhaust holes 220. Thus, the exhaust distribution plate can be controlled to impart a desired film surface profile, provide a high degree of critical dimension uniformity, and / or tailor other film properties based on downstream applications.

[0095] In some embodiments of the present disclosure, a processing system includes a pedestal and an exhaust system. The pedestal is used to hold a substrate. The exhaust system may include a perforated plate with a plurality of exhaust holes and an exhaust port. The perforated plate may be positioned between the substrate on the pedestal and the exhaust port. Each of the exhaust holes includes a baffle. In some embodiments, the baffle includes an aperture baffle. In some embodiments, each of the exhaust holes is configured to be individually controlled. In some embodiments, in order to be individually controlled, each of the exhaust holes includes an open configuration, a partially open configuration, or a closed configuration. In some embodiments, the exhaust holes are allocated to a plurality of zones on the perforated plate. In some embodiments, the aforementioned zones are based on a plurality of closed exhaust holes, a plurality of partially open exhaust holes, and a plurality of predeterminable modes of a plurality of open exhaust holes. In some embodiments, the closed exhaust holes are opened 0%, the open exhaust holes are opened about 80%, and the partially open exhaust holes are opened between 0% and about 80%. In some embodiments, the processing system further includes a distributor positioned on the pedestal. In some embodiments, the exhaust system is used to remove exhaust from the distributor. In some embodiments, the processing system further includes a curing system for receiving the pedestal and the substrate. In some embodiments, the exhaust system is used to remove exhaust from the curing system. In some embodiments, the perforated plate includes a platform, and the exhaust holes extend radially from the center of the platform. In some embodiments, the exhaust holes form concentric rings around the center of the platform.

[0096] In some embodiments of the present disclosure, a processing tool exhaust distribution plate includes a plurality of exhaust holes radially arranged on the exhaust distribution plate. The exhaust distribution plate may include a plurality of baffles, and the baffles are positioned in each of the exhaust holes. In some embodiments, the processing tool exhaust distribution plate further includes a control system for controlling each of the baffles. In some embodiments, each of the baffles includes an aperture baffle. In some embodiments, the exhaust holes are radially arranged on the processing tool exhaust distribution plate.

[0097] In some embodiments of the present disclosure, a method for removing exhaust from a processing system includes the following steps. Positioning an exhaust removal port of an exhaust removal system adjacent to a chemical processing tool. Inserting an exhaust distribution plate between the chemical processing tool and the exhaust removal port. Enclosing the chemical processing tool and the exhaust distribution plate to provide a controlled exhaust removal environment. Controlling the diameter of each of a plurality of exhaust holes radially disposed on the exhaust distribution plate. In some embodiments, controlling the diameter of each of the exhaust holes includes controlling the opening of an aperture baffle used to close the exhaust holes. In some embodiments, controlling the opening of the aperture baffle includes opening the aperture baffle from 0% of the diameter of each of the open exhaust holes to at least about 80% of the diameter of each of the open exhaust holes. In some embodiments, the method for removing exhaust further includes adjusting the diameter of each of the exhaust holes. In some embodiments, the method for removing exhaust further includes inputting a closed hole, an open hole, and a partially open hole recipe into a control system.

[0098] In some embodiments of the present disclosure, a processing system includes a processing tool, an exhaust removal port, and an exhaust distribution plate. The exhaust removal port is adjacent to the processing tool. The exhaust distribution plate is inserted between the processing tool and the exhaust removal port. The exhaust distribution plate includes a plurality of exhaust holes, and the exhaust holes are radially arranged on the exhaust distribution plate. In some embodiments, the processing tool is a chemical dispenser, a chemical curing system, a soft bake system, a hard bake system, a solvent rinse system, or a chemical mechanical planarization system.

[0099] It should be understood that the implementation part, rather than the novel abstract part, is intended to be used to interpret the scope of the patent application. The novel abstract part may describe one or more but not all possible embodiments of the present disclosure conceived by the novel author, and therefore, is not intended to limit the scope of the patent application in any way.

[0100] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the aspects of the present disclosure. Those skilled in the art will appreciate that they can readily use the present disclosure as a basis for designing or modifying other processes and structures for implementing the same purposes and / or achieving the same advantages of the embodiments introduced in some embodiments of the present disclosure. Those skilled in the art will also recognize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and such equivalent constructions may be variously changed, substituted, and replaced in some embodiments of the present disclosure without departing from the spirit and scope of the present disclosure.

Claims

1. A processing system, characterized in that: Include: a base for holding a substrate; and An exhaust system includes a perforated plate with a plurality of exhaust holes and an exhaust port, wherein the perforated plate is positioned between the substrate and the exhaust port, and wherein each of the plurality of exhaust holes includes a baffle.

2. The processing system according to claim 1, characterized in that The baffle plate includes an aperture baffle plate.

3. The processing system according to claim 1, characterized in that The plurality of exhaust holes are distributed to a plurality of zones on the perforated plate.

4. The processing system according to claim 1, characterized in that Further included is a dispenser positioned on the base.

5. The processing system according to claim 1, characterized in that The perforated plate includes a platform, and the plurality of exhaust holes radially extend from the center of the platform.

6. The processing system according to claim 5, characterized in that The plurality of exhaust holes form a concentric ring around the center of the platform.

7. A processing tool exhaust distribution plate, characterized in that: Include: a plurality of exhaust holes radially disposed on the processing tool exhaust distribution plate; and A plurality of baffles are positioned within each of the plurality of exhaust holes.

8. The process tool exhaust distribution plate of claim 7, wherein: Each of the plurality of baffles comprises an aperture baffle.

9. A processing system, characterized in that: Include: a processing tool; an exhaust removal port adjacent the processing tool; and An exhaust distribution plate is inserted between the processing tool and the exhaust removal port, wherein the exhaust distribution plate includes a plurality of exhaust holes radially disposed on the exhaust distribution plate.

10. The processing system according to claim 9, characterized in that The processing tool is a chemical dispenser, a chemical curing system, a soft bake system, a hard bake system, a solvent rinse system or a chemical mechanical planarization system.

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