Rectangular silicon wafer high-density packaging structure

Abstract

A rectangular silicon wafer high-density packaging structure comprises a supporting framework and a plurality of supporting pieces connected to the bottom of the supporting framework and used for supporting a rectangular silicon wafer, and is characterized in that the supporting pieces are provided with a plurality of first side clamping pieces and second side clamping pieces which are arranged in the length direction of the supporting pieces in a staggered mode; and any adjacent side clamping piece I and side clamping piece II and the supporting piece form a limiting structure for limiting the bottom of the rectangular silicon wafer. According to the high-density packaging structure for the rectangular silicon wafer, the part contacted with the bottom of the silicon wafer is more dispersed, the heat is not easy to gather, and the heat dissipation performance is higher.

Description

Technical Field

[0001] The utility model relates to a rectangular silicon slice high-density packaging structure, belonging to the technical field of solar cells. Background Art

[0002] With the surging demand for high-power solar photovoltaic modules in the solar photovoltaic power generation market, shingled solar photovoltaic modules have become the mainstream product of high-power modules. Shingled solar photovoltaic modules achieve "high energy density" by reducing the spacing between rectangular silicon wafers, but at the same time, they have higher requirements for heat dissipation performance.

[0003] The Chinese patent with authorization announcement number CN 211428131 U discloses a quartz boat for diffusion of shingled and half-piece large-size silicon wafers, including a quartz boat body, a support member, a reinforcement member and a locking member, wherein the support member is detachably connected to the quartz boat body, and the support member can be moved relative to the reinforcement member and locked by the locking member, the support member is arranged at the bottom of the quartz boat body, which is convenient for supporting the silicon wafer; the reinforcement member is detachably connected to the quartz boat body, and the reinforcement member can be moved relative to the quartz boat body and locked by the locking member, the reinforcement member is arranged parallel to the support member, which is convenient for positioning when inserting the silicon wafer; the support member and the reinforcement member are both provided with latch teeth, and the latch teeth on the support member correspond one-to-one with the latch teeth on the reinforcement member; and the latch teeth include a connecting portion and a supporting portion, and the connecting portion is connected to the supporting portion. Simply put, after the silicon wafer is inserted, the bottom of the silicon wafer contacts the support below and the support parts on both sides of the silicon wafer, that is, three-side contact.

[0004] However, the following problems still exist: the contacted parts at the bottom of the silicon wafer are located in the same vertical plane, the contact is too concentrated, heat is easily accumulated, the heat dissipation is poor, and the heat dissipation performance needs to be improved. Utility Model Content

[0005] In view of the deficiencies in the prior art, the present application provides a rectangular silicon wafer high-density packaging structure with higher heat dissipation performance.

[0006] A rectangular silicon wafer high-density packaging structure comprises a support frame, and a plurality of support members connected to the bottom of the support frame for supporting the rectangular silicon wafer. The feature is that the support members are provided with a plurality of side clamps 1 and 2 arranged along the length direction of the support members and arranged in an alternating manner, and any adjacent side clamps 1 and 2 and the support members form a limiting structure for limiting the bottom of the rectangular silicon wafer.

[0007] Preferably, the support member and the side clamp member 1 and the side clamp member 2 are staggered.

[0008] Preferably, the side clamping member 1 and the side clamping member 2 are located on both sides of the support member.

[0009] Preferably, the offset distance between the side clamp 1 and the support member is 0.5-1 mm, and the offset distance between the side clamp 2 and the support member is 0.5-1 mm.

[0010] Preferably, the side clamping member 1 is protrudingly provided with a side clamping portion 1 on the side close to the side clamping member 2, and the side clamping member 2 is protrudingly provided with a side clamping portion 2 on the side close to the side clamping member 1, and the side clamping portion 1 and the side clamping portion 2 are staggered in the height direction.

[0011] Preferably, an unobstructed heat dissipation space 1 is formed below the side clamping portion 1, and an unobstructed heat dissipation space 2 is formed below the side clamping portion 2.

[0012] Preferably, the support member comprises an arc-shaped support surface for supporting a rectangular silicon wafer.

[0013] Preferably, the bottom surface of the support member is recessed upward to form a heat dissipation groove.

[0014] Preferably, the supporting frame comprises end plate 1, end plate 2, lower connecting rod 1, lower connecting rod 2, upper connecting rod 1 and upper connecting rod 2 which are arranged between the end plate 1 and the end plate 2 and together constitute an accommodating space, and the two ends of the supporting member are respectively connected to the lower connecting rod 1 and the lower connecting rod 2; a plurality of reinforcing members are connected between the upper connecting rod 1 and the upper connecting rod 2, and the reinforcing members have the same structure as the supporting members and are symmetrically arranged between the supporting members.

[0015] In summary, the utility model has the following beneficial effects:

[0016] 1: The high-density packaging structure of the rectangular silicon wafer in the utility model makes the parts in contact with the bottom of the silicon wafer more dispersed, heat is not easy to accumulate, and the heat dissipation performance is higher.

[0017] 2: The high-density packaging structure of the rectangular silicon wafer in the utility model makes the contacted parts of the upper part of the silicon wafer more dispersed, heat is not easy to accumulate, and the heat dissipation performance is higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of a rectangular silicon wafer high-density packaging structure;

[0019] Figure 2 is a schematic structural diagram of the support member at a first viewing angle;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4is a schematic structural diagram of the support member at a second viewing angle;

[0022] Figure 5 for Figure 4 Enlarged view of point B in the middle;

[0023] Figure 6 A cross-sectional view of the support member. DETAILED DESCRIPTION

[0024] The present invention will be further described below through specific embodiments in conjunction with the accompanying drawings.

[0025] Embodiment: A rectangular silicon chip high-density packaging structure, such as Figure 1-5 As shown, it includes a support skeleton 1 and a plurality of support members 2 connected to the bottom of the support skeleton 1 for supporting rectangular silicon wafers. The support skeleton 1 can include an end plate 11, an end plate 12, a lower connecting rod 13, a lower connecting rod 14, an upper connecting rod 15, and an upper connecting rod 2 16 which are arranged between the end plate 11 and the end plate 2 and together form a accommodating space as in the prior art. The two ends of the support member 2 are respectively connected to the lower connecting rod 13 and the lower connecting rod 2 14 by welding or fastening.

[0026] The support member 2 is provided with a plurality of side clamps 1 3 and side clamps 2 4 which are arranged in an alternating manner along the length direction of the support member 2. Any adjacent side clamps 1 3 and side clamps 2 4 and the support member 2 form a restricting structure for restricting the bottom of the rectangular silicon wafer. Each rectangular silicon wafer is restricted multiple times by the restricting structures on the plurality of support members 2, and its lower part is stably restricted on the support member 2.

[0027] Since the side clamp 1 3 and the side clamp 2 4 are staggered, the contact area of ​​the side clamp 1 3 and the side clamp 2 4 at the bottom of the silicon wafer is more dispersed, and heat is not easy to accumulate. Compared with the prior art, the heat dissipation performance of the entire packaging structure to the bottom of the silicon wafer is improved.

[0028] In this embodiment, the support member 2 and the side clamp member 1 3 are also staggered, and the staggered distance is 0.5-1mm, which is more reasonable. In this way, the part of the bottom of the silicon wafer that is in contact with the support member 2 and the side clamp member 1 3 is also more dispersed, which can also reduce the phenomenon of heat accumulation and improve the heat dissipation performance of the entire packaging structure to the bottom of the silicon wafer. At the same time, the support member 2 and the side clamp member 2 4 are also staggered, and the staggered distance is 0.5-1mm. The part of the bottom of the silicon wafer that is in contact with the support member 2 and the side clamp member 2 4 is also more dispersed, which can also reduce the phenomenon of heat accumulation and improve the heat dissipation performance of the entire packaging structure to the bottom of the silicon wafer. The side clamp member 1 3 and the side clamp member 2 4 are located on both sides of the support member 2. Of course, in other embodiments, the side clamp member 1 3 and the side clamp member 2 4 can also be located on the same side of the support member 2.

[0029] In this embodiment, the side clamping member 1 3 is provided with a side clamping portion 1 31 protrudingly on the side of the side clamping member 2 4, and the side clamping member 2 4 is provided with a side clamping portion 2 41 protrudingly on the side of the side clamping member 1 3. The side clamping member 1 3 and the side clamping member 2 4 specifically restrict the silicon wafer through the side clamping portion 1 31, the side clamping portion 2 41 and other local parts to reduce the contact area with the silicon wafer. The side clamping portion 1 31 and the side clamping portion 2 41 are staggered in the height direction, so that the part of the silicon wafer bottom contacted by the side clamping member 1 3 and the side clamping member 2 4 is further dispersed, further reducing the phenomenon of heat accumulation, and further improving the heat dissipation performance of the entire packaging structure to the silicon wafer bottom.

[0030] An unobstructed heat dissipation space 31-1 is formed below the side clamp portion 1 31, and the space can directly exchange heat with the outside of the entire packaging structure to improve the heat dissipation performance. Similarly, an unobstructed heat dissipation space 41-1 is also formed below the side clamp portion 2 41.

[0031] like Figure 6 As shown, the support member 2 includes an arc-shaped support surface 21 for supporting a rectangular silicon wafer. The arc-shaped support surface 21 supports the silicon wafer, and the contact surface between the arc-shaped support surface 21 and the silicon wafer is smaller, so that heat is more easily dissipated. The bottom surface of the support member 2 is recessed upward to form a heat dissipation groove 22. As a contact component with the silicon wafer, the support member 2 also has a certain heat conduction function, and the presence of the heat dissipation groove 22 helps to further dissipate the heat.

[0032] like Figure 1 As shown, a plurality of reinforcing members 5 are connected between the upper connecting rod 15 and the upper connecting rod 2 16. The reinforcing members 5 have the same structure as the support member 2 and are symmetrically arranged with the support member 2. The reinforcing members 5 limit the upper part of the silicon wafer to make the silicon wafer more stable. At the same time, they have good heat dissipation performance like the support member 2.

[0033] The above embodiments are only for describing the preferred implementation of the utility model, and are not intended to limit the concept and scope of the utility model. Without departing from the design concept of the utility model, various modifications and improvements made by ordinary persons in the art to the technical solution of the utility model should fall within the protection scope of the utility model, and the technical contents of the utility model for protection have been fully recorded in the claims.

Claims

1. A rectangular silicon wafer high-density packaging structure, comprising a support frame (1), and a plurality of support members (2) connected to the bottom of the support frame (1) for supporting the rectangular silicon wafer, characterized in that: The support member (2) is provided with a plurality of side clamps one (3) and side clamps two (4) arranged along the length direction of the support member (2) and in a staggered arrangement, and any adjacent side clamps one (3) and side clamps two (4) and the support member (2) form a limiting structure for limiting the bottom of the rectangular silicon wafer.

2. The rectangular silicon wafer high-density packaging structure according to claim 1, characterized in that: The support member (2) and the side clamp member 1 (3) and the side clamp member 2 (4) are all staggered.

3. The rectangular silicon wafer high-density packaging structure according to claim 2, characterized in that: The side clamping member 1 (3) and the side clamping member 2 (4) are located on both sides of the support member (2).

4. The rectangular silicon wafer high-density packaging structure according to claim 3, characterized in that: The offset distance between the side clamping member 1 (3) and the support member (2) is 0.5-1 mm, and the offset distance between the side clamping member 2 (4) and the support member (2) is 0.5-1 mm.

5. The rectangular silicon wafer high-density packaging structure according to claim 1, characterized in that: The side clamping member 1 (3) is provided with a side clamping portion 1 (31) protrudingly on the side surface close to the side clamping member 2 (4), and the side clamping member 2 (4) is provided with a side clamping portion 2 (41) protrudingly on the side surface close to the side clamping member 1 (3), and the side clamping portion 1 (31) and the side clamping portion 2 (41) are staggered in the height direction.

6. The rectangular silicon wafer high-density packaging structure according to claim 5, characterized in that: An unobstructed heat dissipation space 1 (31-1) is formed below the first side clamping portion (31), and an unobstructed heat dissipation space 2 (41-1) is formed below the second side clamping portion (41).

7. The rectangular silicon wafer high-density packaging structure according to claim 1, characterized in that: The support member (2) comprises an arc-shaped support surface (21) for supporting a rectangular silicon wafer.

8. The rectangular silicon wafer high-density packaging structure according to claim 1, characterized in that: The bottom surface of the support member (2) is recessed upward to form a heat dissipation groove (22).

9. The rectangular silicon wafer high-density packaging structure according to claim 1, characterized in that: The support frame (1) comprises an end plate 1 (11), an end plate 2 (12), a lower connecting rod 1 (13), a lower connecting rod 2 (14), an upper connecting rod 1 (15), and an upper connecting rod 2 (16) which are arranged between the end plate 1 (11) and the end plate 2 (12) and together form a receiving space; the two ends of the support member (2) are respectively connected to the lower connecting rod 1 (13) and the lower connecting rod 2 (14); a plurality of reinforcing members (5) are connected between the upper connecting rod 1 (15) and the upper connecting rod 2 (16); the reinforcing members (5) have the same structure as the support member (2) and are symmetrically arranged with respect to the support member (2).

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