Electric heating common-substrate optical engine packaging structure

Abstract

The utility model provides an electric-heating common-substrate optical engine packaging structure. The electric-heating common-substrate optical engine packaging structure comprises a substrate, an electric chip, a heat conduction structure, an optical chip and a heat conduction sheet, a heat-conducting fin is arranged on the top surface of the substrate, an electric chip is arranged on one side of the bottom surface of the substrate, and an optical chip is arranged on the other side of the bottom surface of the substrate; a heat conduction structure is arranged between the heat conduction sheet and the optical chip and is used for transmitting heat of the optical chip to the heat conduction sheet. The electric chip, the optical chip and the heat-conducting sheet are all assembled on the same substrate, so that the packaging thickness can be reduced, and the advantages of high compactness and high mechanical reliability are achieved. Moreover, the optical chip and the electric chip are electrically interconnected directly through the substrate, so that the optical chip and the electric chip have the advantages of short transmission distance and high bandwidth, and even if a lead bonding mode is adopted for connection, a shorter bonding wire length and a higher transmission bandwidth can be obtained due to a lower chip height difference.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular, to an optical engine package structure of an electric heating common substrate. Background Art

[0002] With the rapid development of technologies such as 5G Internet, artificial intelligence, and high-performance computing, the demand for data transmission is increasing. Due to the low loss, anti-electromagnetic interference, and large bandwidth of lasers, laser-based optical communication technology has become the preferred solution for large-bandwidth interconnection between data centers and chips. As one of the necessary devices for optical interconnection, the function of the optical module is to realize the conversion of photoelectric signals and complete the reception and transmission of optical signals. With the continuous advancement of technology, the demand for bandwidth has increased dramatically, and the packaging form of optical modules has also been continuously improved, with smaller and smaller volumes, larger and larger bandwidths, and continuous improvement in anti-electromagnetic interference, heat resistance, moisture resistance, cost, stability, and reliability. In optical interconnection communication systems such as in-vehicle and airborne systems, indicators such as mechanical reliability, temperature reliability, and compactness of optical engine modules have become increasingly important.

[0003] The packaging architecture of the existing technical solution uses a discrete thermoelectric cooler TEC to control the temperature of the optical chip. During the packaging process, the optical chip needs to be mounted on the TEC, and the TEC and the electrical chip need to be mounted on another PCB board. The assembly of TEC needs to consider the performance index requirements of electrical, thermal, mechanical and other aspects, which usually cannot be taken into account at the same time, resulting in shortcomings such as complex packaging structure, low mechanical reliability, and low temperature control efficiency. In the existing packaging architecture, the connection between TEC and the circuit board is a semi-suspended splicing, which has low mechanical reliability. In addition, the electrical chip is placed on the lower surface of the circuit board, and the optical chip is placed on the lower surface of the TEC, resulting in a large height difference between the electrical chip and the optical chip, a long length of the bonding wire connecting the electrical chip and the optical chip, and large high-frequency transmission losses. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a light engine packaging structure with an electric and thermal common substrate, so as to solve the problems of low mechanical reliability and large height difference between the electric chip and the optical chip in the existing light engine packaging structure.

[0005] An optical engine packaging structure of an electric heating common substrate provided by the embodiment of the present application includes: a substrate, an electric chip, a thermally conductive structure, an optical chip and a thermally conductive sheet;

[0006] A heat conductor is provided on the top surface of the substrate, an electric chip is provided on one side of the bottom surface of the substrate, and an optical chip is provided on the other side of the bottom surface of the substrate;

[0007] A thermally conductive structure is provided between the thermally conductive sheet and the optical chip, which is used to transfer the heat of the optical chip to the thermally conductive sheet.

[0008] Among them, the optical chip is an electronic device made of semiconductor materials for optical communication, which can convert electrical signals into optical signals or convert optical signals into electrical signals. The chip structure inside the optical chip is usually composed of an optical transmitter and an optical receiver. The optical transmitter excites the light source through the electrical signal to generate an optical signal and send it out, while the optical receiver is responsible for receiving the optical signal. Optical chips include but are not limited to integrated optical waveguide chips such as silicon, silicon nitride, thin-film lithium niobate, silicon dioxide, III-V, and germanium silicon; optical chips can be monolithic integrated chips or heterogeneous integrated chips.

[0009] The substrate, also known as a PCB board or circuit board, is the main part of a printed circuit board. It is a flat board made of insulating material, usually glass fiber reinforced epoxy resin (FR-4) or polyimide (PI) and other materials. There are one or more layers of metal conductive tracks on the PCB substrate, which are usually formed by processes such as chemical etching or metal deposition. These conductive tracks are used to connect and support electronic components to build circuits. In addition to the conductive tracks, there are structures such as drill holes and pads on the PCB substrate for mounting and connecting electronic components. The materials of the substrate include but are not limited to ceramic materials such as silicon nitride, alumina, aluminum nitride, and glass materials.

[0010] The electric chip may be an active electric chip such as a driver (Driver), a transimpedance amplifier (TIA), or other signal processing chips.

[0011] Thermal conducting sheet is a highly thermally conductive material, including but not limited to ceramic materials such as aluminum nitride, aluminum oxide, silicon nitride, etc.

[0012] In the above technical solution, the electric chip, optical chip and heat conducting sheet are all assembled on the same substrate, which can reduce the package thickness and has the advantages of high compactness and strong mechanical reliability. In addition, the optical chip and the electric chip are directly electrically interconnected through the substrate, which has the advantages of short transmission distance and high bandwidth. Even if wire bonding is used for connection, a shorter bonding wire length and higher transmission bandwidth can be obtained due to the lower chip height difference.

[0013] In some alternative embodiments, the heat conducting sheet and the optical chip are disposed on the same side of the substrate; the thermally conductive structure includes a first thermally conductive column and a second thermally conductive column;

[0014] The first thermal conductivity column and the second thermal conductivity column both penetrate the top surface and the bottom surface of the substrate. The lower end of the first thermal conductivity column is connected to the optical chip, and the lower end of the second thermal conductivity column is connected to the electric chip.

[0015] In the above technical solution, the substrate also contains a large number of metal through-hole thermal conductivity columns for rapidly transmitting heat to the other side of the substrate and increasing the thermal conductivity of the substrate in the vertical substrate surface direction.

[0016] In some optional embodiments, the heat-conducting structure further includes cooling particles; the upper ends of the first heat-conducting column and the second heat-conducting column are in the same plane as the top surface of the substrate, and the lower ends of the first heat-conducting column and the second heat-conducting column are in the same plane as the bottom surface of the substrate;

[0017] Refrigeration particles are arranged between the top surface of the substrate and the heat conducting sheet, and the refrigeration particles are used to transport heat from the top surface of the substrate to the heat conducting sheet when powered on.

[0018] Among them, the material of the refrigeration particles is thermoelectric materials, such as Bi2Te3, Mg3(Sb,Bi)2, SnTe, GeTe, etc.

[0019] In the above technical solution, the cooling particles are arranged on the top surface of the substrate to provide a short heat transfer path. In this embodiment, the cooling particles are also arranged on one side of the optical chip, so that the heat of the optical chip can quickly pass through the substrate to the cooling area. When the cooling particles are powered, the heat can be quickly transported from the upper surface of the substrate to the thermal conductive sheet.

[0020] Specifically, refrigeration particles usually refer to a tiny particle used in refrigeration technology, whose properties enable it to play a key role in the refrigeration process. Refrigeration particles can be made of different materials, including semiconductor materials. Taking semiconductor refrigeration particles as an example, they achieve refrigeration through the thermal effect caused by electric current and heat. When electric current passes through the semiconductor material, electrons and holes move in the material and generate heat, and the heat is transferred to the surrounding air through convection and radiation, thereby achieving a refrigeration effect.

[0021] In some alternative embodiments, both the first and second thermal conductivity columns are perpendicular to the top surface of the substrate.

[0022] In some alternative embodiments, the refrigeration particles are mounted on the top surface of the substrate by a surface mount process.

[0023] In the above technical scheme, the surface mount process, namely Surface Mount Technology (SMT), directly solders electronic components on the surface of the printed circuit board (PCB). The core principle of SMT is to accurately connect the pins of electronic components with the pads on the PCB and fix them on the surface of the PCB through welding technology. In this process, the electronic components are accurately placed at the predetermined positions on the PCB, usually completed by an automatic placement machine, and its high efficiency and accuracy greatly improve the production efficiency. Subsequently, the components are tightly connected to the pads by hot-melt welding materials to form a stable and reliable circuit connection. The process flow of SMT includes pad preparation, printing solder paste, component placement, welding and testing. Pad preparation is to provide a suitable welding position for electronic components, while printing solder paste is to form a layer of material suitable for welding on the pads. In the component placement link, the automatic placement machine plays a vital role, which can quickly and accurately place components on the pads. The welding link adopts methods such as hot air melting welding or reflow soldering to ensure a firm connection between components and pads. Finally, the accuracy of placement and the quality of welding are ensured by visual inspection, X-ray inspection and automatic optical inspection.

[0024] In some alternative embodiments, the electric chip and / or optical chip are mounted on the bottom surface of the substrate by a flip- soldering process.

[0025] In the above technical solution, the flip-chip process is a microelectronic packaging technology in which the IC chip is directly interconnected with the package shell or wiring substrate face down. This technology overcomes the problem of the center distance limit of the wire bonding pad and provides more convenience for electronic designers in the design of the power and ground distribution of the chip. The flip-chip process reduces the RC delay by shortening the interconnection length, thereby providing a more complete signal for high-frequency and high-power devices. In addition, it has excellent thermal performance, allowing the installation of a heat sink on the back of the chip. At the same time, it has been widely used due to its high reliability (due to the effect of the under-chip filler, the anti-fatigue life of the package is enhanced) and easy rework. The process of the flip-chip process includes the steps of wafer pad redistribution, wafer thinning, bump making, wafer cutting, flip-chip bonding, underfilling, encapsulation, solder ball matching, reflow soldering, surface marking, separation, final inspection and test packaging.

[0026] In some optional embodiments, a circuit wiring is provided in the substrate, and the circuit wiring is used to connect the resistor and capacitor components on the surface of the substrate, as well as the optical chip and the electrical chip. The material of the circuit wiring is a high-conductivity metal material, such as gold, silver, copper, aluminum, etc. The number of layers of the substrate wiring can be a single layer or multiple layers.

[0027] In some alternative embodiments, bonding wires are further included; bonding wires are used to connect optical chips and electrical chips.

[0028] In some alternative embodiments, it is also included: a heat dissipation shell; the heat dissipation shell is a highly thermally conductive material, including but not limited to, ceramics, metals and the like.

[0029] The heat dissipation housing comprises a filling part and a shell plate part;

[0030] The shell plate portion is arranged above the heat conducting sheet;

[0031] The filling part is provided on the top surface of the substrate; the filling part fills the space area between the shell plate part and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 An optical engine packaging structure of an electric heating common substrate provided for the first embodiment of the present application;

[0034] Figure 2 An optical engine packaging structure of an electric heating common substrate provided for the second embodiment of the present application.

[0035] Icons: 1-substrate, 2-circuit wiring, 3-first thermal column, 4-refrigeration particles, 5-electric chip, 6-optical chip, 7-heat conductor sheet, 8-heat dissipation shell. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0037] Please refer to Figure 1 , Figure 1 A schematic diagram of an optical engine packaging structure of an electric heating common substrate 1 provided for the embodiment of the present application, the optical engine packaging structure includes: a substrate 1 , an electric chip 5 , a thermally conductive structure, an optical chip 6 and a thermally conductive sheet 7 .

[0038] A heat conducting sheet 7 is arranged on the top surface of the substrate 1, an electrical chip 5 is arranged on one side of the bottom surface of the substrate 1, and an optical chip 6 is arranged on the other side of the bottom surface of the substrate 1; a heat conducting structure is arranged between the heat conducting sheet 7 and the optical chip 6, and the heat conducting structure is used to transfer the heat of the optical chip 6 to the heat conducting sheet 7.

[0039] Among them, the optical chip 6 is an electronic device made of semiconductor materials for optical communication, which can convert electrical signals into optical signals or convert optical signals into electrical signals. The chip structure inside the optical chip 6 is usually composed of an optical transmitter and an optical receiver. The optical transmitter excites the light source through the electrical signal to generate an optical signal and sends it out, while the optical receiver is responsible for receiving the optical signal. The optical chip 6 includes but is not limited to integrated optical waveguide chips such as silicon, silicon nitride, thin-film lithium niobate, silicon dioxide, III-V, and germanium silicon; the optical chip 6 can be a monolithic integrated chip or a heterogeneous integrated chip.

[0040] The substrate 1, also called a PCB board or circuit board, is the main part of the printed circuit board. It is a flat board made of insulating material, usually glass fiber reinforced epoxy resin (FR-4) or polyimide (PI) and other materials. There are one or more layers of metal conductive tracks on the PCB substrate 1, which are usually formed by processes such as chemical etching or metal deposition. These conductive tracks are used to connect and support electronic components to build circuits. In addition to the conductive tracks, there are structures such as drill holes and pads on the PCB substrate 1 for mounting and connecting electronic components. The materials of the substrate 1 include but are not limited to ceramic materials such as silicon nitride, aluminum oxide, aluminum nitride, and glass materials.

[0041] The electric chip 5 may be an active electric chip such as a driver (Driver), a transimpedance amplifier (TIA), or other signal processing chips.

[0042] The heat conducting sheet 7 is a highly thermally conductive material, including but not limited to ceramic materials such as aluminum nitride, aluminum oxide, silicon nitride, etc.

[0043] In the embodiment of the present application, the electric chip 5, the optical chip 6 and the heat conducting sheet 7 are all assembled on the same substrate 1, which can reduce the package thickness and has the advantages of high compactness and strong mechanical reliability. In addition, the optical chip 6 and the electric chip 5 are directly electrically interconnected through the substrate 1, which has the advantages of short transmission distance and high bandwidth. Even if wire bonding is used for connection, a shorter bonding wire length and a higher transmission bandwidth can be obtained due to the lower chip height difference.

[0044] In some optional embodiments, the heat conducting sheet 7 and the optical chip 6 are arranged on the same side of the substrate 1; the heat conducting structure includes a first heat conducting column 3 and a second heat conducting column. The first heat conducting column 3 and the second heat conducting column both penetrate the top and bottom surfaces of the substrate 1, the lower end of the first heat conducting column 3 is connected to the optical chip 6, and the lower end of the second heat conducting column is connected to the electrical chip 5.

[0045] In the embodiment of the present application, the substrate 1 also contains a large number of metal through-hole thermal conductivity columns for rapidly transmitting heat to the other side of the substrate 1 and increasing the thermal conductivity of the substrate 1 in the direction of the vertical substrate 1 surface.

[0046] In some optional embodiments, the heat-conducting structure also includes cooling particles 4; the upper ends of the first heat-conducting column 3 and the second heat-conducting column are in the same plane with the top surface of the substrate 1, and the lower ends of the first heat-conducting column 3 and the second heat-conducting column are in the same plane with the bottom surface of the substrate 1; the cooling particles 4 are arranged between the top surface of the substrate 1 and the heat-conducting sheet 7, and the cooling particles 4 are used to transport heat from the top surface of the substrate 1 to the heat-conducting sheet 7 when power is turned on.

[0047] Among them, the material of the refrigeration particles 4 is a thermoelectric material, such as Bi2Te3, Mg3(Sb,Bi)2, SnTe, GeTe, etc.

[0048] In the embodiment of the present application, the cooling particles 4 are arranged on the top surface of the substrate 1 to provide a short heat transfer path. In the present embodiment, the cooling particles are also arranged on the side of the optical chip, so that the heat of the optical chip 6 can quickly pass through the substrate 1 to the cooling area. When the cooling particles 4 are powered, the heat can be quickly transported from the upper surface of the substrate 1 to the heat conducting sheet 7.

[0049] Specifically, the refrigeration particle 4 generally refers to a tiny particle used in refrigeration technology, whose characteristics enable it to play a key role in the refrigeration process. The refrigeration particle 4 can be made of different materials, including semiconductor materials. Taking semiconductor refrigeration sheet particles as an example, they achieve refrigeration through the thermal effect caused by electric current and heat. When electric current passes through the semiconductor material, electrons and holes move in the material and generate heat, and the heat is transferred to the surrounding air through convection and radiation, thereby achieving a refrigeration effect.

[0050] In some alternative embodiments, both the first thermally conductive column 3 and the second thermally conductive column are perpendicular to the top surface of the substrate 1 .

[0051] In some optional embodiments, the refrigeration particles 4 are mounted on the top surface of the substrate 1 by a surface mounting process. In the embodiment of the present application, the surface mounting process, namely Surface Mount Technology (SMT), directly solders the electronic components on the surface of the printed circuit board (PCB). The core principle of SMT is to accurately connect the pins of the electronic components to the pads on the PCB and fix them on the surface of the PCB by welding technology. In this process, the electronic components are accurately placed at the predetermined positions on the PCB, usually completed by an automatic placement machine, and its high efficiency and accuracy greatly improve the production efficiency. Subsequently, the components are tightly connected to the pads by hot-melt welding materials to form a stable and reliable circuit connection. The process flow of SMT includes the steps of pad preparation, printing solder paste, component placement, welding and testing. Pad preparation is to provide a suitable welding position for the electronic components, and printing solder paste is to form a layer of material suitable for welding on the pads. In the component placement link, the automatic placement machine plays a vital role, which can quickly and accurately place the components on the pads. The welding link adopts methods such as hot air melting welding or reflow soldering to ensure a firm connection between the components and the pads. Finally, through visual inspection, X-ray inspection and automatic optical inspection, the accuracy of mounting and welding quality are ensured.

[0052] In some optional embodiments, the electric chip 5 and / or the optical chip 6 are mounted on the bottom surface of the substrate 1 by a flip-chip process. In the embodiment of the present application, the flip-chip process is a microelectronic packaging technology, in which the IC chip is directly interconnected with the package shell or the wiring substrate 1 facing downward. This technology overcomes the problem of the center distance limit of the lead bonding pad, and provides more convenience for electronic designers in the design of the power supply and ground distribution of the chip. The flip-chip process reduces the RC delay by shortening the interconnection length, thereby providing a more complete signal for high-frequency and high-power devices. In addition, it also has excellent thermal performance, allowing a heat sink to be installed on the back of the chip, and is widely used due to its high reliability (due to the effect of the chip under the filler to enhance the anti-fatigue life of the package) and the characteristics of easy rework. The process of the flip-chip process includes the steps of wafer pad redistribution, wafer thinning, bump making, wafer cutting, flip-chip bonding, lower filling, encapsulation, solder ball matching, reflow soldering, surface marking, separation, final inspection and test packaging.

[0053] In some optional embodiments, a circuit wiring 2 is provided in the substrate 1, and the circuit wiring 2 is used to connect the resistor and capacitor components on the surface of the substrate 1, as well as the optical chip 6 and the electrical chip 5. The material of the circuit wiring 2 is a high-conductivity metal material, such as gold, silver, copper, aluminum, etc. The number of layers of the wiring of the substrate 1 can be a single layer or a multi-layer.

[0054] In some optional embodiments, it further includes: a heat dissipation shell 8; the heat dissipation shell 8 is a high thermal conductivity material, including but not limited to ceramics, metals and other materials. The heat dissipation shell 8 includes a filling part and a shell plate part; the shell plate part is arranged above the heat conducting sheet 7; the filling part is arranged on the top surface of the substrate 1; the filling part fills the space area between the shell plate part and the substrate 1.

[0055] Specifically, in a specific embodiment, the substrate 1 can be an AlN ceramic substrate 1, the optical chip 6 is a silicon optical chip, the electric chip 5 is a driver and TIA driver chip, the cooling particles 4 are thermoelectric material Bi2Te3, the heat conducting sheet 7 is an AlN ceramic sheet, and the heat dissipation housing 8 is pure copper. The electric chip 5 and the optical chip 6 are mounted on the lower surface of the substrate 1 by flip-chip bonding, and the interconnection between the substrate 1 and the electric chip 5 and the optical chip 6 is achieved through solder balls and circuit wiring 2.

[0056] Please refer to Figure 2 , Figure 2 A schematic diagram of an optical engine packaging structure of an electric and thermal common substrate 1 provided in the second embodiment of the present application is different from the first embodiment in that: the optical engine packaging structure also includes bonding wires; the bonding wires are used to connect the optical chip 6 and the electrical chip 5.

[0057] Specifically, in a specific embodiment, the substrate 1 is a glass substrate 1, the optical chip 6 is an indium phosphide chip, the electric chip 5 is a driver and TIA driver chip, the cooling particles 4 are thermoelectric material Bi2Te3, the heat conducting sheet 7 is an Al2O3 ceramic sheet, and the heat dissipation housing 8 is an aluminum alloy. The electric chip 5 and the optical chip 6 are attached to the lower surface of the substrate 1 in a positive manner, and the substrate 1 is connected to the electric chip 5 and the optical chip 6 through bonding wires and circuit wiring 2.

[0058] In summary, the light engine packaging structure of one or more embodiments of the present application uses a multi-layer substrate 1 as a packaging carrier, and the substrate 1 has a multi-layer circuit wiring 2, which can connect the resistor and capacitor components, the optical chip 6 and the electric chip 5 on the surface of the substrate 1. The substrate 1 also contains a large number of metal through-hole thermal conductive columns, which are used to quickly transfer heat to the other side of the substrate 1, and increase the thermal conductivity of the substrate 1 in the direction perpendicular to the surface of the substrate 1. The electric chip 5 and the optical chip 6 are mounted on the lower surface of the substrate 1, and the pads of the mounted chips are face-to-face with the pads of the substrate 1, and the flip-chip process is adopted and connected with solder balls. The surface mounting process is adopted on the front of the substrate 1, and the cooling particles 4 are mounted in the area directly above the optical chip 6 to provide a short heat transfer path, so that the heat of the optical chip 6 can quickly pass through the substrate 1 and reach the cooling area. When the cooling particles 4 are energized, the heat can be quickly transported from the upper surface of the substrate 1 to the heat dissipation housing 8. In addition, the heat of the electric chip 5 is directly exported to the heat dissipation housing 8 through the substrate 1. Therefore, this packaging structure, firstly, allows the electrical chip 5, the optical chip 6 and the cooler to be assembled on the same substrate 1, which has the advantages of high compactness and strong mechanical reliability; secondly, the optical chip 6 and the electrical chip 5 are directly electrically interconnected through the substrate 1, which has the advantages of short transmission distance and high bandwidth. Even if wire bonding is used for connection, the advantages of shorter bonding wire length and higher transmission bandwidth can be obtained due to the lower chip height difference.

[0059] In the embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The device embodiments described above are merely schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some communication interfaces, and the indirect coupling or communication connection of the devices or units can be electrical, mechanical or other forms.

[0060] In addition, the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0061] Furthermore, the functional modules in the various embodiments of the present application may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0062] In this document, relational terms such as first and second, etc. are used merely to distinguish one entity or operation from another entity or operation, but do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0063] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An optical engine packaging structure with electric and thermal common substrate, characterized in that: include: Substrates, electrical chips, thermal conductive structures, optical chips and thermal conductive sheets; The heat conducting sheet is arranged on the top surface of the substrate, the electric chip is arranged on one side of the bottom surface of the substrate, and the optical chip is arranged on the other side of the bottom surface of the substrate; The heat-conducting structure is arranged between the heat-conducting sheet and the optical chip, and the heat-conducting structure is used to transfer the heat of the optical chip to the heat-conducting sheet.

2. The light engine packaging structure according to claim 1, characterized in that: The heat conducting sheet and the optical chip are arranged on the same side of the substrate; the heat conducting structure comprises a first heat conducting column and a second heat conducting column; The first heat-conducting column and the second heat-conducting column both penetrate the top surface and the bottom surface of the substrate, the lower end of the first heat-conducting column is connected to the optical chip, and the lower end of the second heat-conducting column is connected to the electrical chip.

3. The light engine packaging structure according to claim 2, wherein: The heat-conducting structure further includes cooling particles; the upper ends of the first heat-conducting column and the second heat-conducting column are in the same plane as the top surface of the substrate, and the lower ends of the first heat-conducting column and the second heat-conducting column are in the same plane as the bottom surface of the substrate; The cooling particles are arranged between the top surface of the substrate and the heat conducting sheet, and the cooling particles are used to transport heat from the top surface of the substrate to the heat conducting sheet when power is turned on.

4. The light engine packaging structure according to claim 2, wherein: The first heat-conducting column and the second heat-conducting column are both perpendicular to the top surface of the substrate.

5. The light engine packaging structure according to claim 3, wherein: The cooling particles are mounted on the top surface of the substrate through a surface mounting process.

6. The light engine packaging structure according to claim 3, wherein: The electric chip and / or optical chip is mounted on the bottom surface of the substrate by a flip-chip bonding process.

7. The light engine packaging structure according to claim 1, wherein: Circuit wiring is arranged in the substrate, and the circuit wiring is used to connect the resistor and capacitor components on the surface of the substrate, as well as the optical chip and the electric chip.

8. The light engine packaging structure according to claim 7, wherein: It also includes bonding wires; the bonding wires are used to connect the optical chip and the electrical chip.

9. The light engine packaging structure according to claim 1, wherein: Also includes: Heat dissipation housing; The heat dissipation housing comprises a filling portion and a shell plate portion; The shell plate portion is arranged above the heat conducting sheet; The filling portion is arranged on the top surface of the substrate; the filling portion fills the space area between the shell plate portion and the substrate.

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