Heat dissipation module and electronic equipment

Abstract

The utility model discloses a heat dissipation module and electronic equipment, the heat dissipation module comprises a first heat dissipation plate, the first heat dissipation plate is provided with a containing groove in the thickness direction, and a phase-changeable heat dissipation medium is arranged in the containing groove. A groove opening of the containing groove is covered with a breathable structural part, and the breathable structural part can exchange gaseous heat dissipation media with the external environment and can prevent non-gaseous heat dissipation media from passing through. After the heat dissipation module discharges the gaseous heat dissipation medium to the external environment, the heat dissipation module can absorb the gaseous heat dissipation medium from the external environment based on the breathable structural member.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices for electronic equipment, and more specifically, to a heat dissipation module and an electronic equipment. Background Art

[0002] In order to meet people's increasing usage needs, the functions of electronic devices are becoming more and more powerful. As the functions of electronic devices become more and more powerful, the heat generated by electronic devices is also increasing, which brings higher requirements for the heat dissipation performance of electronic devices.

[0003] Heat dissipation performance is a key factor affecting the performance of electronic devices, so many electronic devices use heat dissipation modules to improve heat dissipation performance. In the prior art, heat dissipation modules generally dissipate heat based on a simple heat conduction method, and the heat dissipation effect is poor. Utility Model Content

[0004] In view of this, the present application provides a heat dissipation module and an electronic device, and the scheme is as follows:

[0005] On one hand, the present application provides a heat dissipation module, including:

[0006] A first heat sink is provided with a receiving groove in the thickness direction of the first heat sink, and the receiving groove is filled with a heat sink medium with phase changeability;

[0007] The air-permeable structural member is arranged to cover the notch of the accommodating groove, and can exchange gaseous heat dissipation medium with the external environment, and can block the passage of non-gaseous heat dissipation medium;

[0008] Among them, after the heat dissipation module discharges the gaseous heat dissipation medium to the external environment, it can absorb the gaseous heat dissipation medium from the external environment through the breathable structural member.

[0009] Preferably, in the above heat dissipation module, it also includes:

[0010] A cover plate is arranged on the side of the air-permeable structure facing away from the first heat sink and is sealed at the notch. A plurality of heat sink groups are arranged at intervals on the side of the cover plate facing away from the air-permeable structure to discharge the heat conducted by the first heat sink out of the heat dissipation module.

[0011] The cover plate is provided with air holes in the gaps between adjacent heat sink groups, so that the air-permeable structural member can exchange gaseous water vapor with the external environment.

[0012] Preferably, in the above heat dissipation module, the heat dissipation module includes at least one of the following:

[0013] The sizes of the gaps are all equal, or the sizes of at least two gaps are unequal;

[0014] The number of heat sinks in each heat sink group is the same, or the number of heat sinks in at least two heat sink groups is different;

[0015] The structures of the heat sink groups are the same, or the structures of at least two heat sink groups are different.

[0016] Preferably, in the above heat dissipation module, the first heat dissipation plate is further provided with a protruding structure on the inner side of the bottom wall of the receiving groove, and the outer surface of the protruding structure has at least one pointed structure;

[0017] and / or,

[0018] The first heat dissipation plate is further provided with a first isolation layer on the outer side of the bottom wall of the containing groove.

[0019] Preferably, in the above heat dissipation module, the heights of the protruding structures are not completely equal and / or the intervals between the protruding structures are not completely equal.

[0020] Preferably, in the above heat dissipation module, the air-permeable structural member is a selectively permeable film, which can block the penetration of liquid heat dissipation medium and can penetrate water vapor.

[0021] On the other hand, the present application also provides an electronic device, including:

[0022] a heat source assembly having opposing first and second sides;

[0023] In any of the above heat dissipation modules, a side of the first heat dissipation plate facing away from the air-permeable structural component is in thermal contact with the first side of the heat source assembly.

[0024] Preferably, the above electronic device further includes:

[0025] The second heat dissipation plate is in contact with the second side of the heat source assembly.

[0026] Preferably, in the above electronic device, the first heat sink is in thermal contact with the first side of the heat source assembly based on the first isolation layer;

[0027] The second heat dissipation plate is in thermal contact with the second side of the heat source assembly based on the second isolation layer.

[0028] Preferably, in the above electronic device, the first isolation layer and the second isolation layer are both flexible thermally conductive films.

[0029] It can be seen from the above description that the technical solution of the present application provides a heat dissipation module and an electronic device, wherein the heat dissipation module includes a first heat dissipation plate, and the first heat dissipation plate is provided with a receiving groove in the thickness direction, and a heat dissipation medium with a phase change is provided in the receiving groove. The notch of the receiving groove is covered with a breathable structural member, and the breathable structural member can exchange gaseous heat dissipation medium with the external environment and can block the passage of non-gaseous heat dissipation medium. After the heat dissipation module discharges the gaseous heat dissipation medium to the external environment, it can also absorb the gaseous heat dissipation medium from the external environment based on the breathable structural member. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0031] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0032] Figure 1 A cross-sectional view of a heat dissipation module provided in an embodiment of the present application;

[0033] Figure 2 for Figure 1 A cross-sectional view of the first heat dissipation plate in the heat dissipation module shown;

[0034] Figure 3 A cross-sectional view of another heat dissipation module provided in an embodiment of the present application;

[0035] Figure 4 for Figure 3 A cross-sectional view of the first heat dissipation plate in the heat dissipation module shown;

[0036] Figure 5 A top view of a heat dissipation module provided in an embodiment of the present application;

[0037] Figure 6 for Figure 5 A cross-sectional view of the heat dissipation module shown in the A-A' direction;

[0038] Figure 7 A cross-sectional view of a first heat dissipation plate provided in an embodiment of the present application;

[0039] Figure 8 A cross-sectional view of another heat dissipation module provided in an embodiment of the present application;

[0040] Fig. 9 A cross-sectional view of an electronic device provided in an embodiment of the present application;

[0041] Fig.10 A cross-sectional view of another electronic device provided in an embodiment of the present application;

[0042] Fig.11A cross-sectional view of another electronic device provided in an embodiment of the present application;

[0043] Fig.12 A three-dimensional view of an electronic device provided in an embodiment of the present application;

[0044] Fig.13 for Fig.12 Exploded view of the electronic device shown. DETAILED DESCRIPTION

[0045] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0046] Taking the PC as an example, as the performance of various boards and motherboard power supply components inside the PC increases, the internal components of the PC face the challenge of high temperature and difficult heat dissipation. How to effectively dissipate heat from the internal heat source components of the PC in a limited space and ensure a good noise experience is an urgent problem to be solved. The internal heat source components of the PC include the above-mentioned boards.

[0047] It should be noted that in the embodiments of the present application, the electronic device can be any electronic device with heat-generating electronic components, such as mobile phones, laptop computers, tablet computers, wearable devices and other electronic devices.

[0048] At present, metal heat sinks with higher thermal conductivity are generally used to achieve higher heat dissipation performance. In order to further improve the heat dissipation performance, the area of ​​the heat sink is increased, and active heat dissipation devices (such as fans) are added.

[0049] Although increasing the size of the radiator and adding active cooling devices can improve the heat dissipation performance, it will greatly increase the installation space of the heat dissipation module. In addition, active cooling components will also bring additional noise sources.

[0050] In view of this, an embodiment of the present application provides a heat dissipation module and an electronic device. The heat dissipation module can place a phase-changeable heat dissipation medium by setting a receiving groove in the first heat dissipation plate, and the notch of the receiving groove is covered by a breathable structural member. While allowing the heat dissipation module to exchange gaseous heat dissipation medium with the external environment, it can also avoid leakage of non-gaseous heat dissipation medium in the receiving groove.

[0051] Compared with the heat dissipation method based solely on heat conduction of the radiator, the heat dissipation module provided in the embodiment of the present application can not only dissipate the heat in the heat source component of the electronic device to the external environment through the first heat dissipation plate based on heat conduction, but the heat generated by the operation of the electronic device can also heat the phase-changeable heat dissipation medium in the receiving groove from non-gaseous state to gaseous state, and dissipate the gaseous heat dissipation medium to the external environment through the breathable structural member, thereby further improving the heat dissipation efficiency.

[0052] Moreover, the heat dissipation module utilizes the performance of phase-changeable heat dissipation media to improve heat dissipation efficiency without increasing the size of the heat dissipation module. Under the same heat dissipation performance, there is no need to increase the volume of the heat dissipation module compared to conventional radiators, and the volume of the heat dissipation module can even be reduced to a certain extent.

[0053] In addition, by selecting an appropriate heat dissipation medium, the air-permeable structure can pass through the gaseous heat dissipation medium and block the selective permeability of the non-gaseous heat dissipation medium. For example, the air-permeable structure can be a film that can pass through gas and block the selective permeability of liquid. When the concentration of the liquid heat dissipation medium in the receiving tank is too high, it can also reversely absorb the gaseous heat dissipation medium in the external environment, while improving the heat dissipation efficiency based on the phase-changeable heat dissipation medium, so as to maintain the dynamic balance of the phase-changeable heat dissipation medium in the receiving tank.

[0054] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0055] refer to Figure 1 and Figure 2 As shown, Figure 1 A cross-sectional view of a heat dissipation module provided in an embodiment of the present application, Figure 2 for Figure 1 A cross-sectional view of a first heat dissipation plate in the heat dissipation module shown, wherein the heat dissipation module shown comprises:

[0056] A first heat sink 11, with a receiving groove 12 formed in the thickness direction of the first heat sink 11, and the receiving groove 12 is filled with a heat sink medium 13 with phase changeability;

[0057] A breathable structural member 14, the breathable structural member 14 is covered on the notch of the receiving groove 12, the breathable structural member 14 can exchange gaseous heat dissipation medium with the external environment, and can prevent the liquid heat dissipation medium in the receiving groove 12 from flowing out;

[0058] After discharging the gaseous heat dissipation medium to the external environment, the heat dissipation module can absorb the gaseous heat dissipation medium from the external environment through the breathable structural member 14 .

[0059] It should be noted that in the embodiments of the present application, the cross-sectional views are all cross-sectional views along the thickness direction of the first heat dissipation plate 11 .

[0060] Based on the above description, it can be seen that the heat dissipation module provided in the embodiment of the present application includes a first heat dissipation plate 11. The first heat dissipation plate 11 has a thickness direction ( Figure 1 and Figure 2 A receiving groove 12 is provided in the vertical direction of the receiving groove 12, and a phase-changeable heat dissipation medium 13 is provided in the receiving groove 12. The notch of the receiving groove 12 is covered with a breathable structural member 14, which can exchange gaseous heat dissipation medium with the external environment and can prevent the liquid heat dissipation medium in the receiving groove 12 from flowing out. Therefore, after the heat dissipation module discharges the gaseous heat dissipation medium to the external environment, it can also absorb the gaseous heat dissipation medium from the external environment based on the breathable structural member 14.

[0061] The first heat sink 11 is an integrally formed first high thermal conductivity structural member. For example, the first heat sink 11 can be a first metal structural member or a first ceramic structural member. Both the first metal structural member and the first ceramic structural member have a high thermal conductivity coefficient. When used as the first heat sink 11, the heat conduction rate can be increased, thereby improving the heat dissipation efficiency.

[0062] In one implementation of the embodiment of the present application, it can be as follows Figure 1 and Figure 2 As shown, the spacing between the two opposite sides of the receiving groove 12 is uniform and constant in the thickness direction of the first heat dissipation plate 11. In this way, the notch of the receiving groove 12 is the same as the area of ​​the bottom wall. Specifically, in the thickness section view of the first heat dissipation plate 11, the section width of the receiving groove 12 is constant along the thickness direction of the first heat dissipation plate 11.

[0063] use Figure 1 and Figure 2 The first heat sink 11 of the structure shown has a regular shape of the receiving groove 12, which facilitates the processing and preparation of the first heat sink.

[0064] refer to Figure 3 and Figure 4 As shown, Figure 3 A cross-sectional view of another heat dissipation module provided in an embodiment of the present application, Figure 4 for Figure 3 The cross-sectional view of the first heat dissipation plate in the heat dissipation module shown in FIG. Figure 1 and Figure 2 The difference between the illustrated methods is that the notch area of ​​the receiving groove 12 is smaller than the bottom wall area of ​​the receiving groove 12. Specifically, in the thickness section view of the first heat dissipation plate 11, along the thickness direction of the first heat dissipation plate 11, the section width close to the notch position is smaller, and the section width of the receiving groove below the notch remains unchanged, thereby forming a narrowed receiving groove 12.

[0065] use Figure 3 and Figure 4The first heat dissipation plate 11 of the structure shown is convenient for carrying other structural members above the notch, such as the air-permeable structural member 14 and the cover plate 15 in the subsequent embodiments.

[0066] In the embodiment of the present application, the heat dissipation medium capable of phase change in the containing tank 12 is a liquid medium capable of evaporation. The heat dissipation medium includes water and / or other medium capable of gas-liquid phase change. Other medium capable of gas-liquid phase change may include at least one of alcohol, fluorinated liquid, higher aliphatic hydrocarbons, fatty acids and lipids. Higher aliphatic hydrocarbons include at least one of n-hexadecane, n-octadecane and paraffin.

[0067] The phase-changeable heat dissipation medium in the receiving tank 12 can be liquid or solid at room temperature. It is easy to know that the breathable structural member 14 can block the liquid heat dissipation medium from flowing out, and can also block the solid heat dissipation medium from passing through. In the application embodiment, the normal temperature can be room temperature, such as 20°C to 30°C.

[0068] Optionally, in the embodiment of the present application, the heat dissipation medium 13 capable of phase change in the containing tank 12 may be a liquid solution at room temperature, the liquid solution comprising a solvent and a solute, at least the solvent being capable of phase change between liquid and gas. The solvent may include at least one of water, alcohol, and other evaporable organic solvents.

[0069] In order to realize that the phase-changeable heat dissipation medium 13 in the receiving groove 12 can not only improve the heat dissipation efficiency by emitting gaseous heat dissipation medium to the external environment when dissipating heat for the electronic device, but also can reversely absorb water vapor in the external environment and convert it into liquid heat dissipation medium when there is no heat dissipation demand (such as when the electronic device is not working or the electronic device is working at low power consumption),

[0070] In the embodiment of the present application, an aqueous solution of a preset solute is preferably used. The preset solute includes an inorganic salt, and the aqueous solution of the inorganic salt can evaporate water based on the heat of the electronic device to improve the heat dissipation efficiency. It can also reversely absorb water vapor in the external environment based on the high-concentration inorganic salt solution in the receiving tank 12 when there is no heat dissipation demand, so that the water vapor can pass through the breathable structural member 14, condense into liquid water in the receiving tank 12 and dissolve into the inorganic salt solution, so as to maintain the dynamic balance of the liquid heat dissipation medium in the receiving tank 12.

[0071] In other embodiments, the phase-changeable heat dissipation medium 13 in the receiving groove 12 may also include a solid medium adsorbed with moisture, and the solid medium may be a desiccant. In the initial state, the solid medium is saturated with moisture. During the heat dissipation process, the moisture adsorbed in the solid medium evaporates due to heat and is dissipated into the external environment through the breathable structural member 14. When there is no need for heat dissipation, water vapor in the external environment can be reversely absorbed based on the property of the solid medium to adsorb moisture. This method uses a solid medium adsorbed with moisture to maintain a dynamic balance of internal moisture by utilizing the water absorption property of the solid medium, evaporate moisture during heat dissipation, and can spontaneously reversely absorb water vapor in the external environment when no heat dissipation is required.

[0072] refer to Figure 5 and Figure 6 As shown, Figure 5 A top view of a heat dissipation module provided in an embodiment of the present application, Figure 6 for Figure 5 The cross-sectional view of the heat dissipation module in the direction of A-A' is shown, based on any of the above embodiments. Figure 5 and Figure 6 The illustrated method also includes: a cover plate 15, which is covered on the side of the breathable structural member 14 facing away from the first heat sink 11 and sealed in the notch; a plurality of heat sink groups 16 are arranged at intervals on the side of the cover plate 15 facing away from the breathable structural member 14, and the heat sink groups 16 are used to discharge the heat conducted by the first heat sink 11 out of the heat dissipation module; the cover plate 15 is provided with air holes 17 in the gaps 18 between adjacent heat sink groups 16, so that the breathable structural member 14 can exchange gaseous water vapor with the external environment.

[0073] Optionally, the cover plate 15 can be fixed to the first heat dissipation plate 11 around the notch of the receiving groove 12 by screws, and the air-permeable structure 14 can also be fixed between the cover plate 15 and the first heat dissipation plate 11 .

[0074] exist Figure 5 and Figure 6 In the manner shown, not only can the heat dissipation efficiency be improved by utilizing the phase-changeable heat dissipation medium 13, but heat can also be dissipated through the heat conduction effect of the cover plate 15. The heat in the first heat dissipation plate 11 can be conducted to the cover plate 15, and the heat is dissipated to the external environment, thereby further improving the heat dissipation efficiency. Moreover, the cover plate 15 is provided with air holes 17 in the gaps 18 between adjacent heat sink groups 16, so that the air-permeable structural member 14 can exchange gaseous water vapor with the external environment. Based on the air holes 17, during the heat dissipation process, the water vapor evaporated inside the receiving tank 12 can be dissipated to the external environment through the air-permeable structural member 14. When there is no heat dissipation demand, the phase-changeable heat dissipation medium 13 in the receiving tank 12 can also absorb water vapor from the external environment.

[0075] The cover plate 15 may be an integrally formed second high thermal conductivity structural member, such as a second metal structural member or a second ceramic structural member, both of which have a high thermal conductivity coefficient, and when used as the cover plate 15, the heat conduction rate can be increased, thereby improving the heat dissipation efficiency.

[0076] Based on any of the above implementations, Figure 5 As shown, the sizes of the gaps 18 are set to be equal. The sizes of the two gaps 18 are equal, including the two gaps 18 being Figure 5 The horizontal width is the same as in Figure 5 The longitudinal lengths of the two gaps 18 are also the same. The sizes of the gaps 18 in the cover plate 15 are set to be equal, so as to facilitate the processing of the cover plate 15 and reduce the processing cost of the heat dissipation module. In other embodiments, the shape of the cover plate 15 can be set based on the needs. Based on the shape of the cover plate 15, the sizes of at least two gaps 18 are set to be unequal, so that the heat dissipation module can adapt to different layout spaces. The unequal sizes of the two gaps 18 include the two gaps 18 in Figure 5 The lateral widths in are not the same, and / or Figure 5 The vertical lengths are not the same.

[0077] Based on any of the above implementations, Figure 5 As shown, there are multiple heat sink groups 16, and each heat sink group 16 has multiple heat sinks 161. In each heat sink group 16, the heat sinks 161 can be arranged at equal intervals to facilitate the processing of the cover plate 15 and reduce the processing cost of the heat sink module. In other embodiments, the heat sinks 161 in at least two heat sink groups 16 can also be arranged with different intervals so that the heat sink module can adapt to different layout spaces.

[0078] Based on any of the above implementations, Figure 5 As shown, the number of heat sinks 161 in the heat sink group 16 can be set to be the same. The number of heat sinks 161 in each heat sink group 16 is set to be the same, which facilitates the processing of the cover plate 15 and reduces the processing cost of the heat sink module. In other embodiments, the number of heat sinks 161 in at least two heat sink groups 16 can be different, so that the heat sink module can adapt to different layout spaces.

[0079] Based on any of the above implementations, Figure 5As shown, the structures of the heat sink groups 16 are the same, so as to facilitate the processing of the cover plate 15 and reduce the processing cost of the heat dissipation module. The same structure of the two heat sink groups 16 includes: the heat sink group 16 has the same number of heat sinks 161, and the spacing and size of the heat sinks 161 are the same. In other embodiments, at least two heat sink groups 16 can also be set with different structures. The different structures of the two heat sink groups 16 include at least one of the following: the heat sink group 16 has a different number of heat sinks 161, the spacing of the heat sinks 161 is different, and the size of the heat sinks 161 is different.

[0080] refer to Figure 7 As shown, Figure 7 A cross-sectional view of a first heat sink provided in an embodiment of the present application, based on any of the above implementations, Figure 7 The first heat dissipation plate 11 is shown as being further provided with a protruding structure 19 on the inner side of the bottom wall of the receiving groove 12 , and the outer surface of the protruding structure 19 has at least one pointed end structure 191 .

[0081] When the heat dissipation module adopts Figure 7 In the first heat sink 11 shown, the phase-changeable heat sink medium 13 in the receiving groove 12 is liquid at room temperature. Based on the protruding structure 19 with the tip structure 191, the bubbles generated by the liquid heat sink medium during the heat dissipation process can be punctured to accelerate the dissipation speed of the gaseous heat sink medium and improve the heat dissipation efficiency.

[0082] Optionally, a plurality of array-arranged protrusion structures 19 are provided at the bottom of the receiving groove 12, and a plurality of tip structures 191 are provided on the surface of each protrusion structure 19 so as to quickly puncture bubbles generated during the heating process. In order to facilitate the processing of the first heat sink 11, each protrusion structure 19 is arranged to be identical.

[0083] When a protruding structure 19 is provided on the inner side of the bottom wall of the receiving groove 12, based on any of the above-mentioned embodiments, the heights of the protruding structures 19 may be set to be unequal to accommodate receiving grooves 12 of different shapes and structures. In other embodiments, the protruding structures 19 in the receiving groove 12 may be set to have the same height to facilitate the processing and preparation of the first heat dissipation plate 11 and reduce the manufacturing cost.

[0084] When a protruding structure 19 is provided on the inner side of the bottom wall of the receiving groove 12, based on any of the above embodiments, the spacing between the protruding structures 19 may be set to be unequal to adapt to receiving grooves 12 of different shapes and structures. In other embodiments, the protruding structures 19 in the receiving groove 12 may be set to have the same spacing to facilitate the processing and preparation of the first heat dissipation plate 11 and reduce the manufacturing cost.

[0085] refer to Figure 8 As shown, Figure 8 A cross-sectional view of another heat dissipation module provided in an embodiment of the present application, based on any of the above embodiments, the first heat dissipation plate 11 is further provided with a first isolation layer 20 on the outer side of the bottom wall of the receiving groove 12. The first isolation layer 20 at least achieves good thermal contact between the side of the first heat dissipation plate 11 facing away from the breathable structural member 14 and the heat source component in the electronic device.

[0086] Optionally, the first isolation layer 20 is a flexible heat-conductive film, so that the first heat sink 11 forms good thermal contact with a heat source component in the electronic device.

[0087] The first isolation layer 20 may be an insulating flexible thermally conductive film, so as to achieve insulating thermal contact between the first heat sink 11 and the heat source component to avoid short circuit problems.

[0088] Based on any of the above embodiments, the breathable structural member 14 is set as a selective permeable film, which can block the liquid heat dissipation medium from passing through and can pass water vapor. Based on the selective permeable film, the heat dissipation medium can be heated by utilizing the heat required to be dissipated during the heat dissipation process, and the water in the heat dissipation medium can evaporate into water vapor. On the basis of the conventional heat conduction heat dissipation method, the phase change heat dissipation of water is increased. When heat dissipation is not required, the water vapor in the external environment can also be reversely absorbed based on the water absorption characteristics of the phase-changeable heat dissipation medium 13 in the receiving tank 12, so that the water vapor is converted into liquid water and melted into the phase-changeable heat dissipation medium 13 in the receiving tank 12, so as to maintain the dynamic balance of the phase-changeable heat dissipation medium 13 in the receiving tank 12.

[0089] Optionally, the selective permeable membrane may be a PTFE (polytetrafluoroethylene) filter membrane or other membranes that can pass gas and block liquid. The present application embodiment does not limit the material of the selective permeable membrane. PTFE and other polymer filters have good hydrophobicity, can pass water vapor and block liquid water, and have good chemical corrosion resistance and high temperature resistance. They can pass water vapor based on surface micropores and block liquid water.

[0090] Optionally, the first heat dissipation plate 11 is a first metal structural member, so that the inner surface of the receiving tank 12 can be anodized to increase the corrosion resistance and hydrophilicity of the inner surface of the receiving tank 12 .

[0091] In the embodiment of the present application, the manufacturing process of the heat dissipation module includes: first, preparing a first heat dissipation plate. When the first heat dissipation plate 11 is a first metal structural member, the first heat dissipation plate 11 of the desired shape can be prepared based on an aluminum metal plate. The first heat dissipation plate 11 formed in one piece can be directly prepared based on injection molding or CNC (numerical control machine tool), or a circle of metal side walls can be welded on the periphery of one side surface of a flat metal to form a first heat dissipation plate 11 of the desired structure. Secondly, after the first heat dissipation plate 11 is prepared, an aqueous solution of LiBr with an initial concentration of 30% is prepared at room temperature. After the aqueous solution of LiBr is injected into the containing tank 12, the hydrophobic PTFE filter membrane and the cover plate 15 are fixed above the notch in sequence, and fixed by screws to complete the manufacturing process of the heat dissipation module.

[0092] Based on the above embodiment, another embodiment of the present application further provides an electronic device, which can be Fig. 9 shown.

[0093] refer to Fig. 9 As shown, Fig. 9 A cross-sectional view of an electronic device provided in an embodiment of the present application, the electronic device shown includes: a heat source component 21, the heat source component 21 has a first side 211 and a second side 212 relative to each other; a heat dissipation module provided in any one of the implementation methods of the above embodiments, wherein the side of the first heat dissipation plate 11 in the heat dissipation module facing away from the breathable structural component 14 is in thermal contact with the first side 211 of the heat source component 21.

[0094] In the electronic device provided in the embodiment of the present application, the heat dissipation module provided in the above embodiment can not only conduct the heat generated by the heat source component 21 from the first side 211 to the first heat sink 11 based on heat conduction, and dissipate the heat to the external environment based on the first heat sink 11, but also utilize the phase change of the phase-changeable heat dissipation medium 13 in the receiving groove 12 to dissipate heat, and has a high heat dissipation efficiency.

[0095] refer to Fig.10 As shown, Fig.10 This is a cross-sectional view of another electronic device provided in an embodiment of the present application. Based on the implementation of the above electronic device, Fig.10 The electronic device shown further includes: a second heat sink 22, the second heat sink 22 is in contact with the second side 212 of the heat source assembly 21. Fig.10 In the illustrated embodiment, the heat generated by the heat source assembly 21 can not only be conducted to the first heat sink 11 on the first side 211 , but also be conducted to the second heat sink 22 on the second side 212 , thereby increasing the heat dissipation path and further improving the heat dissipation efficiency.

[0096] refer to Fig.11 As shown, Fig.11A cross-sectional view of another electronic device provided in an embodiment of the present application, Fig.10 Based on the shown manner, the first heat dissipation plate 11 is in thermal contact with the first side 211 of the heat source component 21 based on the first isolation layer 20 ; the second heat dissipation plate 22 is in thermal contact with the second side 212 of the heat source component 21 based on the second isolation layer 23 .

[0097] exist Fig.11 In the shown manner, the heat source component 21 is in thermal contact with the first heat sink 11 based on the first isolation layer 20 on the first side 211, and is in thermal contact with the second heat sink 22 based on the second isolation layer 23 on the second side 212, which can improve the thermal contact effect so that the heat can be quickly conducted to the heat sink on the corresponding side, thereby ensuring the heat dissipation efficiency.

[0098] Optionally, the first isolation layer 20 and the second isolation layer 23 are both flexible thermally conductive films. On the one hand, the flexible thermally conductive film can achieve good thermal contact between the heat source component 21 and each heat sink. On the other hand, the flexible thermally conductive film can better cover the surface of the heat source component 21 to prevent water vapor from invading and affecting the performance of electronic components on the heat source component 21.

[0099] The heat source component 21 may be a mainboard of an electronic device. The circuit mainboard has a plurality of electronic components on the first side 211 . The electronic components include at least one of a board, a memory, a chip, and a power supply device on the circuit board mainboard.

[0100] It should be noted that in the implementation of the present application, when the heat dissipation medium in the receiving groove includes liquid water, the water vapor in the heat dissipation process can be quickly dissipated into the external environment based on the heat dissipation holes on the electronic device. Relative to the volume of the external environment space, the effect of these water vapors on the humidity of the environment in which the electronic device is located can be ignored, and the water vapor effect on the electronic device can be ignored.

[0101] refer to Fig.12 and Fig.13 As shown, Fig.12 A three-dimensional view of an electronic device provided in an embodiment of the present application, Fig.13 for Fig.12 The exploded diagram of the electronic device shown is based on any of the above embodiments. Fig.12 and Fig.13 In the illustrated method, the heat source component 21 is illustrated as a circuit mainboard in an electronic device. Based on the heat dissipation module, electronic components such as SSD (solid state hard disk) on the circuit mainboard can be efficiently cooled. The technical solution of the embodiment of the present application has a high heat dissipation capacity and can improve the performance of the internal board of the device.

[0102] Optionally, the second heat sink 22 may be a heat-conducting plastic injection molded part. The second heat sink 22 has a groove, and the heat source assembly 21 with the heat dissipation module fixed thereto is placed in the groove.

[0103] Corresponding to the second heat sink 22, the side wall of the groove and the cover plate 15 have an adaptive buckle structure, and the second heat sink 22 and the cover plate 15 can be fixed based on the adaptive buckle structure to improve mechanical stability. The buckle structure arranged on the second heat sink 22 can be a wedge-shaped hook arranged on the inner wall of the groove.

[0104] When the heat dissipation module provided in the embodiment of the present application dissipates heat for a board or a circuit mainboard of an electronic device, the use of a phase-changeable heat dissipation medium can effectively enhance the heat dissipation effect of the heat dissipation module without the need for active heat dissipation devices with noise.

[0105] Optionally, the phase-changeable heat dissipation medium 13 in the receiving tank 12 can be an aqueous solution of an inorganic salt, such as an aqueous solution of LiBr or an aqueous solution of NaCl. Preferably, an inorganic salt with good hygroscopicity is used. In this way, during the heat dissipation process, the heat generated by the operation of the heat source component 21 can be used to evaporate water, and the water can be dissipated to the external environment through the breathable structural member 14 to improve the heat dissipation performance. The inorganic salt in the aqueous solution will crystallize as the water evaporates. When there is no need to dissipate heat, due to the increase in the concentration of the aqueous solution, it has a higher hygroscopicity. The water vapor in the external environment will be absorbed by the high-solubility aqueous solution and converted into liquid water and melted into the solution, thereby reducing the solution concentration, and the solution concentration can be restored to the initial lower concentration state, or at least reduce the difference with the initial concentration. Therefore, the technical solution of the present application can be used to make the state of the aqueous solution continuously cycle between evaporation and absorption, which can greatly improve the heat dissipation efficiency compared to the simple heat conduction heat dissipation method.

[0106] The heat dissipation module does not need to be equipped with a separate active heat dissipation device. The inherent fan of the electronic device can be used to assist in the heat dissipation of the heat dissipation module, so as to improve gas fluidity and increase heat dissipation during the heat dissipation process.

[0107] In the specification of this application, each embodiment is described in a progressive, parallel, or progressive and parallel manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. The implementation methods provided in the embodiments of this application can be combined with each other if there is no contradiction.

[0108] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.

[0109] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0110] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0111] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation module, characterized in that: include: A first heat sink, wherein a receiving groove is provided in a thickness direction of the first heat sink, and the receiving groove is filled with a heat sink medium capable of phase change; A breathable structural member, covering the notch of the accommodating groove, capable of exchanging gaseous heat dissipation medium with the external environment and capable of blocking the passage of non-gaseous heat dissipation medium; Wherein, after discharging the gaseous heat dissipation medium to the external environment, the heat dissipation module can absorb the gaseous heat dissipation medium from the external environment through the breathable structural member.

2. The heat dissipation module according to claim 1, characterized in that: Also includes: A cover plate, which is arranged on the side of the air-permeable structure facing away from the first heat sink and is sealed at the notch, and a plurality of heat sink groups are arranged at intervals on the side of the cover plate facing away from the air-permeable structure, so as to discharge the heat conducted by the first heat sink out of the heat dissipation module; The cover plate is provided with air holes in the gaps between adjacent heat sink groups, so that the air-permeable structural member can exchange gaseous water vapor with the external environment.

3. The heat dissipation module according to claim 2, characterized in that: The heat dissipation module includes at least one of the following: The sizes of the gaps are all equal, or the sizes of at least two of the gaps are unequal; The number of heat sinks in the heat sink groups is the same, or the number of heat sinks in at least two of the heat sink groups is different; The structures of the heat sink groups are the same, or the structures of at least two heat sink groups are different.

4. The heat dissipation module according to claim 1, characterized in that: The first heat dissipation plate is further provided with a protrusion structure on the inner side of the bottom wall of the receiving groove, and the outer surface of the protrusion structure has at least one pointed structure; and / or, The first heat dissipation plate is further provided with a first isolation layer on the outer side of the bottom wall of the accommodating groove.

5. The heat dissipation module according to claim 4, characterized in that: The heights of the protruding structures are not completely equal and / or the intervals between the protruding structures are not completely equal.

6. The heat dissipation module according to any one of claims 1 to 5, characterized in that: The breathable structural member is a selectively permeable film, which can block the penetration of liquid heat dissipation medium and can penetrate water vapor.

7. An electronic device, characterized in that: include: a heat source assembly having opposing first and second sides; According to the heat dissipation module as described in any one of claims 1 to 6, a side of the first heat dissipation plate facing away from the breathable structural member is in thermal contact with a first side of the heat source assembly.

8. The electronic device according to claim 7, characterized in that: Also includes: A second heat dissipation plate is in contact with a second side of the heat source assembly.

9. The electronic device according to claim 8, characterized in that: The first heat sink is in thermal contact with the first side of the heat source assembly based on a first isolation layer; The second heat dissipation plate is in thermal contact with the second side of the heat source assembly based on a second isolation layer.

10. The electronic device according to claim 9, characterized in that: The first isolation layer and the second isolation layer are both flexible heat-conductive films.

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