Electronic equipment

Abstract

The embodiment of the utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment provided by the embodiment of the utility model comprises a shell, a heat dissipation mechanism and a heating element, wherein a containing cavity is formed in the shell, and the containing cavity is provided with an air outlet; the heat dissipation mechanism is arranged in the containing cavity and comprises a fan and a fan cover, an air cavity is formed in the fan cover, the fan is arranged in the air cavity, the air cavity is provided with an air outlet, and the air outlet corresponds to the air outlet; the heating element is located on the air outlet side of the fan and connected with the fan cover.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] In the electronic equipment in the related art, it is difficult to accurately control the direction of the heat dissipation airflow generated by the fan, and only a small amount of airflow will pass through the heating element to dissipate the heat of the heating element, resulting in low heat dissipation efficiency. Summary of the invention

[0003] The present application provides an electronic device, which includes a housing, a heat dissipation mechanism and a heating element. The housing is formed with a receiving cavity, and the receiving cavity has an air outlet; the heat dissipation mechanism is arranged in the receiving cavity, and includes a fan and a wind shield, the wind shield forms an air cavity, the fan is arranged in the wind cavity, the wind cavity has an air outlet, and the air outlet is arranged corresponding to the air outlet; the heating element is located on the air outlet side of the fan, and is connected to the wind shield.

[0004] In some implementations of the present application, the heating element is disposed in the wind cavity; or, the heating element is disposed outside the wind cavity and is thermally connected to the wind cover.

[0005] In some implementations of the present application, the heating element is disposed in an air cavity; the air cavity has a wire threading opening, a connecting wire is passed through the wire threading opening, and the heating element is electrically connected to components in the accommodating cavity through the connecting wire.

[0006] In some implementations of the present application, the electronic device further includes a heat-conducting structure, a first end of the heat-conducting structure is heat-conductingly connected to the heating element, and a second end of the heat-conducting structure extends to an air outlet.

[0007] In some implementations of the present application, the electronic device further includes a heat sink, which is disposed at the air outlet and is thermally connected to the second end of the heat-conducting structure.

[0008] In some implementations of the present application, the heating element is thermally connected to the air hood via a heat-conducting structure.

[0009] In some implementations of the present application, the heating element is arranged outside the wind hood, and the fan is a centrifugal fan; along the axial direction of the fan, the length of the wind hood matches the length of the fan; the heating element has a plate-like structure, and the thickness direction of the heating element is the axial direction of the fan; along the axial direction of the fan, the heat-conducting structure is located between the heating element and the wind hood.

[0010] In some implementations of the present application, the fan is a centrifugal fan; the heating element and the fan are arranged along a first radial direction of the fan; the inner wall of the air cavity includes a first wall portion, the first wall portion is opposite to the fan along a second radial direction of the fan, and the second radial direction is perpendicular to the first radial direction; the exhaust port is formed on the first wall portion, and along the first radial direction, two ends of the exhaust port are respectively arranged corresponding to the fan and the heating element.

[0011] In some implementations of the present application, the electronic device further includes a guide vane disposed in the wind cavity, one end of the guide vane being disposed between the fan and the heating element, and the other end extending toward a portion close to the air outlet corresponding to the heating element.

[0012] In some implementations of the present application, the guide plate is thermally connected to the wind shield. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structure of an electronic device in some embodiments of the present application;

[0014] Figure 2 This is one of the exploded views of the assembly structure of the heat dissipation mechanism and the heating element in some embodiments of the present application;

[0015] Figure 3 This is one of the structural schematic diagrams of the assembly of the heat dissipation mechanism and the heat dissipation element in some embodiments of the present application;

[0016] Figure 4 This is a second exploded view of the assembly structure of the heat dissipation mechanism and the heating element in some embodiments of the present application;

[0017] Figure 5 This is one of the schematic diagrams of the heat dissipation airflow direction in some embodiments of the present application;

[0018] Figure 6 This is the second structural schematic diagram of the assembly of the heat dissipation mechanism and the heat dissipation element in some embodiments of the present application.

[0019] Figure 7 The third exploded view of the assembly structure of the heat dissipation mechanism and the heating element in some embodiments of the present application;

[0020] Figure 8 It is a structural schematic diagram of the heat dissipation mechanism, the heating element and the heat dissipation component assembly structure in some embodiments of the present application;

[0021] Fig. 9 This is the second schematic diagram of the heat dissipation airflow direction in some embodiments of the present application.

[0022] Figure markings: 1-housing; 11-accommodating chamber; 111-air outlet; 2-heat dissipation mechanism; 21-fan; 22-wind cover; 221-bottom shell; 2211-weight reduction hole; 222-top cover; 2221-first air inlet hole; 3-wind cavity; 31-air outlet; 32-threading hole; 4-heating element; 51-heat conducting plate; 52-heat pipe; 53-heat spreader; 6-heat dissipation element; 7-guide plate; 8-spring screw; 9-main board; a-first radial direction; b-second radial direction; c-axial direction of the fan. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application are further elaborated in detail below in conjunction with the drawings and embodiments. The described embodiments should not be regarded as limiting the present application. All other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0024] In the following description, reference is made to "some embodiments", which describe a subset of all possible embodiments, but it is understood that "some embodiments" may be the same subset or different subsets of all possible embodiments. In the absence of conflict, the embodiments in this application and the technical features in the embodiments may be combined with each other.

[0025] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as representing a specific ordering of objects, nor can they be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0026] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0027] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0028] In the embodiments of the present application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which the present disclosure belongs. The terms used herein are only for the purpose of describing the present disclosure and are not intended to limit the present disclosure.

[0030] An embodiment of the present application provides an electronic device. The electronic device may refer to multiple types, for example, it may be a laptop computer, a tablet computer, a mobile phone, etc.

[0031] Please refer to Figure 1 , Figure 2 and Figure 3 The electronic device provided in the embodiment of the present application includes a housing 1, a heat dissipation mechanism 2 and a heating element 4. The housing 1 is formed with a housing cavity 11, and the housing cavity 11 has an air outlet 111; the heat dissipation mechanism 2 is arranged in the housing cavity 11, and includes a fan 21 and a wind cover 22, the wind cover 22 forms a wind cavity 3, the fan 21 is arranged in the wind cavity 3, the wind cavity 3 has an exhaust port 31, and the exhaust port 31 is arranged corresponding to the air outlet 111; the heating element 4 is located on the air outlet side of the fan 21, and is connected to the wind cover 22. In such a structural form, the exhaust port 31 is arranged corresponding to the air outlet 111, so that after the heat dissipation airflow generated by the fan 21 is discharged from the air cavity 3 through the exhaust port 31, the heat dissipation airflow can be directly discharged from the housing cavity 11 through the air outlet 111. The heating element 4 is located at the air outlet side of the fan 21 and is connected to the wind cover 22, that is, the heat dissipation airflow generated by the fan 21 will flow to the exhaust port 31 after passing through the heating element 4. In this way, most of the heat dissipation airflow can be discharged from the accommodating cavity 11 after passing through the heating element 4, and the heat dissipation efficiency is relatively high.

[0032] The heating element 4 in the embodiment of the present application may refer to multiple types, and illustratively, may be at least one of a central processing unit (CPU), a graphics processing unit (GPU), a disk, a memory stick, a network card, and a power supply, etc. In some embodiments of the present application, the number of the heating element 4 may be two, which may be a central processing unit and a graphics processing unit, respectively, and the central processing unit and the graphics processing unit may both be arranged on the mainboard 9.

[0033] In the embodiment of the present application, the accommodation cavity 11 may contain other components in addition to the heat dissipation mechanism 2 and the heating element 4. The other components may be located outside the air cavity 3. The other components have a lower heat generation than the heating element 4, and the other components may be spaced apart from the heat dissipation mechanism 2. The heat dissipation airflow generated by the fan 21 may be concentrated through the heating element 4, and less heat dissipation airflow or no heat dissipation airflow passes through other components, which is conducive to improving the heat dissipation efficiency.

[0034] It should be explained that, in the embodiment of the present application, the heating element 4 is located on the air outlet side of the fan 21, so that the heat dissipation airflow output by the fan 21 flows through the heating element 4 to the exhaust port 31. For example, in some embodiments of the present application, the fan 21 is an axial flow fan, and the air outlet side of the fan 21 is one side of the fan 21 along its own axial direction, and the air outlet side of the fan 21 is arranged along the axial direction c of the fan 21, so that the heat dissipation airflow output by the fan 21 to the heating element 4. In some embodiments of the present application, the fan 21 is a centrifugal fan, and the air outlet side of the fan 21 is one side of the fan 21 along its own radial direction, and the air outlet side of the fan 21 is arranged along the radial direction of the fan 21. Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the fan 21 may be a centrifugal fan, and along the axial direction c of the fan, the end wall of at least one end of the fan cover 22 may be provided with a first air inlet hole 2221 corresponding to the fan 21. In this way, the flow rate of the heat dissipation airflow generated by the fan 21 is increased. In some embodiments of the present application, the circumferential profile of the first air inlet hole 2221 may be circular, and may match the circumferential profile of the fan 21. In this way, the air intake volume is increased.

[0035] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the housing 1 is provided with a second air inlet hole corresponding to the first air inlet hole, which is beneficial to increase the flow rate of the heat dissipation airflow generated by the fan 21. For example, in some embodiments of the present application, the electronic device is a laptop computer, and the second air inlet hole is formed on the D surface of the laptop computer. On this basis, in some embodiments of the present application, a weight-reducing hole 2211 is formed on the side wall of the wind hood 22 and the side facing away from the D surface, and the weight-reducing hole 2211 is provided corresponding to the fan 21. In this way, the weight of the wind hood 22 can be reduced, and the heat dissipation airflow is not easy to flow out of the wind cavity 3 from the weight-reducing hole 2211, which is beneficial to improve the heat dissipation efficiency.

[0036] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the air shield 22 is fixedly connected to the housing 1. This helps to improve the reliability of the installation and can reinforce each other. In some embodiments of the present application, the side wall of the air shield 22 away from the D surface is supported by the keyboard of the laptop computer along the thickness direction. This helps to improve the strength and rigidity of the keyboard.

[0037] Please refer to Figure 1 , Figure 2 and Figure 3In some embodiments of the present application, the fan 21 is a centrifugal fan; along the axial direction c of the fan, the length of the wind cover 22 matches the length of the fan 21; the wind cover 22 includes a bottom shell 221 and a top cover 222 that are arranged opposite to each other along the axial direction of the fan 21, and the bottom shell 221 and the top cover 222 are detachably connected to form a wind cavity 3. In this way, the processing and manufacturing of the wind cover 22 is relatively convenient. In some embodiments of the present application, the exhaust port 31 can be formed by the bottom shell 221 and the top cover 222. It is convenient to process and manufacture the wind cover 22.

[0038] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the heating element 4 is disposed in the wind cavity 3. In this structural form, the heating element 4 is disposed in the wind cavity 3, and the heat dissipation airflow can directly contact the heating element 4, and the heat dissipation efficiency is high.

[0039] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the heating element 4 is arranged in the wind cavity 3; the wind cavity 3 has a threading port 32, and a connecting wire is passed through the threading port 32, and the heating element 4 is electrically connected to the components in the accommodating cavity 11 through the connecting wire. It should be explained that in the embodiment of the present application, the threading port 32 is different from the exhaust port 31. Through the connecting wire passed through the threading port 32, when the heating element 4 is arranged in the wind cavity 3, the heating element 4 can also transmit information and energy between the components, so that the electronic function can be realized, the structure is relatively simple, and the cost is low.

[0040] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the heating element 4 is arranged outside the wind cavity 3 and is thermally connected to the wind cover 22. With such a structural form, the heat of the heating element 4 can be transferred to the wind cover 22, and the heat dissipation wind flow can take away the heat on the wind cover 22, thereby dissipating the heat of the heating element 4. In this way, on the one hand, it has a better heat dissipation effect, and on the other hand, because the heating element 4 is arranged outside the wind cavity 3, the wind cavity 3 can be set smaller, which is conducive to reducing the manufacturing cost of the wind cover 22.

[0041] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the hood 22 is made of metal material, which is conducive to the good thermal conductivity of the metal material. The hood 22 is made of metal material, which is conducive to improving the thermal conductivity between the heating element 4 and the heat dissipation efficiency. In some embodiments of the present application, the hood 22 is formed by splicing multiple metal sheet metal parts. In this way, the sheet metal parts can be folded, making the processing and manufacturing of the hood 22 more convenient.

[0042] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the electronic device further includes a heat-conducting structure, the first end of which is heat-conductingly connected to the heating element 4, and the second end of which extends to the air outlet 111. In this way, the heat-conducting structure can transfer the heat of the heating element 4 to the air outlet 111, thereby increasing the heat dissipation area and improving the heat dissipation efficiency. Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, the heat-conducting structure may include a heat pipe 52. The heat pipe 52 has the same meaning as that generally understood by technicians in the technical field of the present application, and generally includes a tube shell and a liquid wick, etc. The liquid wick is arranged on the inner wall of the tube shell and can be made of a porous material. The liquid wick is filled with a working liquid. One end of the tube shell 52 is an evaporation end, which is connected to the heating element 4, and the other end is a condensation end. During the heating process of the evaporation end, the working liquid in the liquid wick evaporates and vaporizes to form steam. The steam flows toward the condensation end along the extension direction of the heat pipe under the pressure difference, and releases heat to condense to form liquid. The formed liquid can flow back to the evaporation end under the action of the capillary force of the liquid wick. In some embodiments of the present application, the heating element 4 is arranged in the wind cavity 3, and the heat-conducting structure includes a heat pipe 52, and the heat pipe 52 is arranged at a distance from the wind cover 22. In this way, it is convenient for the processing and manufacturing of electronic equipment.

[0043] Please refer to Figures 4 to 9 In some embodiments of the present application, the heat conducting structure may include a heat spreader 53. The heat spreader 53 has the same meaning as that generally understood by technicians in the technical field of the present application. The heat spreader 53 generally includes a shell and a liquid absorption structure. The liquid absorption structure is arranged on the inner wall of the shell and can be made of a porous material. The liquid absorption structure is filled with a coolant. The outer wall of the shell is connected to the heating element 4. The coolant evaporates and vaporizes after receiving the heat generated by the heating element 4 to form steam. The steam flows along the extension direction of the heat spreader 53 under the pressure difference. After flowing to the part with lower temperature, it releases heat and condenses to form liquid. The formed liquid can flow back under the action of the capillary force of the liquid absorption structure. In some embodiments of the present application, the heat conducting structure includes a heat spreader 53, and the side of the heat spreader 53 on one side in the thickness direction is attached to the air guide cover, or is an integrated structure. In this way, it is beneficial to increase the heat dissipation area, improve the heat dissipation efficiency, and is more convenient to process and manufacture. In some embodiments, the heat spreader 53 and the heat pipe 52 may have the same structural composition, but may have different shapes. The heat pipe 52 may be configured in a "tube shape" and the heat spreader 53 may be configured in a "plate shape".

[0044] Please refer to Figure 1 , Figure 2 and Figure 3In some embodiments of the present application, the heat conducting structure further includes a heat conducting plate 51, and the heat pipe 52 or the heat spreader 53 is thermally connected to the heating element 4 through the heat conducting plate 51. The heat conducting plate 51 can be a copper plate or a graphene plate, etc.

[0045] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the heat spreader 53 and the heating element 4 are fixed by a spring screw 8, and the axial direction of the spring screw 8 is the arrangement direction of the heat conducting structure and the heating element 4. In this way, the heat conducting structure and the heating element 4 have a greater contact force, which is conducive to improving the heat conduction effect.

[0046] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the electronic device further comprises a heat sink 6, which is disposed at the air outlet 111 and is thermally connected to the second end of the heat-conducting structure. In this way, the heat dissipation structure can further increase the heat dissipation area, which is beneficial to improving the heat dissipation efficiency. In some embodiments of the present application, the heat sink 6 can be a heat dissipation fin or a foam metal block, etc. The surface area of ​​the heat sink is relatively large, and it is disposed at the air outlet. The contact area with the heat dissipation airflow is also relatively large, which can better improve the heat dissipation efficiency. In some embodiments of the present application, the size of the heat sink can match the air outlet 111. In this way, the heat dissipation efficiency can be better improved.

[0047] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the heat sink 6 is thermally connected to the wind shield 22. This is conducive to further improving the heat dissipation efficiency. In some embodiments of the present application, the heat sink 6 is welded to the wind shield 22. This is conducive to improving the stability of the installation of the heat sink 6.

[0048] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the heat conducting structure includes a heat spreader 53, etc., and along the thickness direction of the heat spreader 53, opposite sides of the heat spreader 53 are both disposed on the heat sink 6. This is beneficial to increase the heat dissipation area.

[0049] Please refer to Figure 4 , Figure 5 and Figure 6In some embodiments of the present application, in some implementations of the present application, the heating element 4 is thermally connected to the wind hood 22 through a thermally conductive structure. With such a structural form, the thermally conductive structure can transfer heat to the air outlet 111 on the one hand to increase the heat dissipation area, and on the other hand, it is used for the thermally conductive connection between the heating element 4 and the wind hood 22, so that there is no need to set up other additional structures for thermally connecting the heating element 4 to the wind hood 22, which is conducive to improving the compactness of the structure and reducing costs. Moreover. Since the extension distance of the thermally conductive structure is relatively long, it is thermally connected to the wind hood 22 and can have a larger connection area, thereby greatly increasing the heat dissipation area and improving the heat dissipation efficiency.

[0050] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the heating element 4 is arranged outside the wind cover 22, and the fan 21 is a centrifugal fan; along the axial direction c of the fan, the length of the wind cover 22 matches the length of the fan 21; the heating element 4 is a plate-like structure, and the thickness direction of the heating element 4 is the axial direction c of the fan. Along the axial direction c of the fan, the heat-conducting structure is located between the heating element 4 and the wind cover 22. Such a structural form is conducive to reducing the space required for arranging the fan 21, the heating element 4 and the heat-conducting structure, and is conducive to improving the compactness of the structure. In some embodiments of the present application, the heat-conducting structure is a heat spreader 53, and the thickness of the heat spreader 53 is the same as the axial direction c of the fan. In this way, it is conducive to improving the compactness of the structure. In some embodiments of the present application, the heat-conducting structure is arranged on the side of the wind cover 22 away from the D surface, so that the heating element 4 is close to the keyboard, which is convenient for the connection between the heating element 4 and the keyboard.

[0051] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the fan 21 is a centrifugal fan; the heating element 4 and the fan 21 are arranged along the first radial direction a of the fan 21; the inner wall of the air cavity 3 includes a first wall portion, the first wall portion is opposite to the fan 21 along the second radial direction b of the fan 21, and the second radial direction b is perpendicular to the first radial direction a; the exhaust port 31 is formed on the first wall portion, and along the first radial direction a, the two ends of the exhaust port 31 are respectively arranged corresponding to the fan 21 and the heating element 4. In such a structural form, the heating element 4 and the fan 21 are arranged along the first radial direction a of the fan 21, and along the second radial direction b, the fan 21 and the heating element 4 are both corresponding to the exhaust port 31, and the extension distance of the exhaust port 31 is large, which is conducive to increasing the air volume, and is conducive to reducing the length of the electronic equipment in the second radial direction b, which is conducive to improving the compactness of the structure. It can be understood that during the rotation of the fan 21, a part of the heat dissipation airflow flows from the fan 21 to the exhaust port 31 and the part corresponding to the fan 21, and is discharged from the air cavity 3, and the other part of the heat dissipation airflow flows from the fan 21 to the heating element 4, and is discharged from the air cavity 3 through the exhaust port 31 and the part corresponding to the heating element 4.

[0052] It can be understood that the portion of the air outlet 31 corresponding to the fan 21 is the portion of the air outlet 31 directly opposite to the fan 21 along the second radial direction b. The portion of the air outlet 31 corresponding to the heating element 4 is arranged along the second radial direction b with the heating element 4. When the heating element 4 is located in the air cavity 3, the portion of the air outlet 31 corresponding to the heating element 4 is the portion of the air outlet 31 directly opposite to the heating element 4 along the second radial direction b.

[0053] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the electronic device is a laptop computer, the axial direction c of the fan is the thickness direction of the keyboard, and the first radial direction a is parallel to the length direction of the keyboard. With such a structural form, the electronic device may not be provided with air outlets 111 corresponding to the fan 21 on the end walls at the opposite ends of the first radial direction a, and the person is not easily affected by the heat dissipation airflow discharged from the air outlet 111 when using the keyboard. In some embodiments of the present application, the air outlet 111 is provided at the shaft between the keyboard and the display, which is conducive to reducing the impact of the heat dissipation airflow discharged from the air outlet 111 on the user.

[0054] Please refer to Figure 1 , Figure 2 and Figure 3 In some embodiments of the present application, along the axial direction c of the fan, at least one side of the heating element 4 is spaced from the wind cover 22 to form a ventilation gap. In this way, the ventilation gap allows the wind flow to fully pass through the heating element 4, which is beneficial to improving the heat dissipation effect. For example, in some embodiments of the present application, a ventilation gap is formed between the wind cover 22 on one side of the heating element 4 close to the D surface. In some embodiments of the present application, along the axial direction c of the fan, one side of the heating element 4 is spaced from the wind cover 22 to form a ventilation gap, and the other side is fixedly connected to the wind cover 22, such as by fasteners, which is beneficial to improving the installation stability of the heating element 4.

[0055] Please refer to Figure 7 , Figure 8 and Fig. 9 Of course, in some embodiments of the present application, the ventilation gap may not be set. For example, the heat-conducting structure and the heating element 4 are arranged relative to each other along the axial direction c of the fan, and the heat-conducting structure is supported between the heating element 4 and the wind cover 22 along the axial direction of the fan 21, and the side of the heating element 4 facing away from the heat-conducting structure is supported on the wind cover 22. For example, the heat-conducting structure is arranged on the side of the heating element 4 close to the D surface. Of course, in some embodiments of the present application, the ventilation gap may not be completely blocked by the heat-conducting structure. For example, the heat-conducting structure and the heating element 4 are arranged relative to each other along the axial direction c of the fan, and the end face of one end of the heat-conducting structure along the axial direction of the fan 21 is supported by the heating element 4, and a gap is formed between the end face of the other end and the wind guide cover 22.

[0056] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the number of fans 21 is at least two, the axial directions c of at least two fans are the same, and they are arranged along the first radial direction a, and along the first radial direction a, the heating element 4 is located between the two fans 21. In this way, at least two fans 21 jointly dissipate heat from the heating element 4, which is conducive to improving the heat dissipation efficiency.

[0057] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the electronic device further includes a guide plate 7, which is disposed in the air cavity 3, one end of which is disposed between the fan 21 and the heating element 4, and the other end of which extends toward the portion of the air outlet 111 corresponding to the heating element 4. With such a structural form, the heat dissipation airflow is guided by the guide plate 7 and flows from the fan 21 to the portion of the air outlet 111 corresponding to the heating element 4, which is conducive to increasing the flow of the heat dissipation airflow passing through the heating element 4, thereby facilitating improving the heat dissipation efficiency.

[0058] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the number of the guide blades 7 is multiple, and the multiple guide blades 7 are arranged in sequence along the first radial direction a. This is conducive to increasing the amount of heat dissipation airflow passing through the heating element 4 and / or the heat-conducting structure, and is conducive to improving the heat dissipation efficiency. In some embodiments of the present application, the heating element 4 and / or the heat-conducting structure is arranged between at least two guide blades 7 along the first radial direction a. This is conducive to further increasing the heat dissipation efficiency.

[0059] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the guide plate 7 can be arranged in the ventilation gap, so that the heat dissipation efficiency can be increased. Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the guide vane 7 may not be arranged in the ventilation gap.

[0060] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the guide plate 7 is thermally connected to the wind shield 22. With such a structural form, the heat of the heating element 4 can be transferred to the guide plate 7, and the heat dissipation airflow can take away the heat on the guide plate 7 during the process of passing through the guide plate 7, which is conducive to improving the heat dissipation efficiency.

[0061] Please refer to Figure 4 , Figure 5 and Figure 6 In some embodiments of the present application, the heating element 4 is arranged outside the air cavity 3 and is thermally connected to the outer wall of the wind cover 22. The end wall of the first end of the wind cover 22 in the axial direction c of the fan is thermally connected to the heating element 4, and the guide plate is arranged on the end wall of the first end of the wind cover 22. In this way, the heat transfer distance between the guide plate and the heating element 4 is short, which is conducive to improving the heat dissipation efficiency.

[0062] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the wind shield 22 can be an integrated structure with the heat conducting sheet, such as integrally formed or welded, etc. This facilitates processing and manufacturing, and is conducive to improving heat transfer efficiency.

[0063] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the heat conducting sheet can be connected to the heat spreader 53. The heat transfer efficiency of the heat conducting plate 51 is relatively high, and the heat conducting sheet is connected to the heat conducting plate 51 to improve the heat dissipation efficiency.

[0064] Please refer to Figure 7 , Figure 8 and Fig. 9 In some embodiments of the present application, the heat conducting sheet can be made of metal material, which is beneficial to improve the heat transfer efficiency and has higher strength.

[0065] The above are only implementation methods of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application.

Claims

1. An electronic device, characterized in that: include: The housing is formed with a receiving cavity, wherein the receiving cavity has an air outlet; A heat dissipation mechanism is arranged in the accommodating cavity and comprises a fan and a wind shield, wherein the wind shield forms a wind cavity, the fan is arranged in the wind cavity, the wind cavity has an exhaust port, and the exhaust port is arranged corresponding to the air outlet; The heating element is located at the air outlet side of the fan and is connected to the air cover.

2. The electronic device according to claim 1, characterized in that: The heating element is arranged in the wind cavity; or, the heating element is arranged outside the wind cavity and is thermally connected to the wind cover.

3. The electronic device according to claim 2, characterized in that: The heating element is arranged in the air cavity; the air cavity has a threading opening, a connecting wire is passed through the threading opening, and the heating element is electrically connected to the components in the accommodating cavity through the connecting wire.

4. The electronic device according to claim 1, characterized in that: It also includes a heat-conducting structure, a first end of which is thermally connected to the heating element, and a second end of which extends to the air outlet.

5. The electronic device according to claim 4, characterized in that: It also includes a heat sink, which is arranged at the air outlet and is thermally connected to the second end of the heat-conducting structure.

6. The electronic device according to claim 4, characterized in that: The heating element is thermally connected to the air cover via the heat conducting structure.

7. The electronic device according to claim 6, characterized in that: The heating element is arranged outside the wind cover, and the fan is a centrifugal fan; along the axial direction of the fan, the length of the wind cover matches the length of the fan; the heating element is a plate-like structure, the thickness direction of the heating element is the axial direction of the fan, and along the axial direction of the fan, the heat-conducting structure is located between the heating element and the wind cover.

8. The electronic device according to claim 1, characterized in that: The fan is a centrifugal fan; the heating element and the fan are arranged along a first radial direction of the fan; the inner wall of the air cavity includes a first wall portion, the first wall portion is opposite to the fan along a second radial direction of the fan, and the second radial direction is perpendicular to the first radial direction; the exhaust port is formed on the first wall portion, and along the first radial direction, two ends of the exhaust port are respectively arranged corresponding to the fan and the heating element.

9. The electronic device according to claim 8, characterized in that: It also includes a guide plate, which is arranged in the wind cavity, one end of which is arranged between the fan and the heating element, and the other end of which extends toward the direction of the part corresponding to the air outlet and the heating element.

10. The electronic device according to claim 9, characterized in that: The guide plate is thermally connected to the wind shield.

Images