Heat dissipation module with dip angle groove fins and electronic device with heat dissipation module

Abstract

The utility model provides a heat dissipation module with inclination angle groove fins and an electronic device with the heat dissipation module. The heat dissipation module with the inclination angle groove fins comprises a heat dissipation base, a plurality of heat conduction elements and a plurality of heat dissipation fins. A plurality of grooves inclined at a preset angle are formed in the surfaces of the two sides of each heat dissipation fin, and the grooves are arranged in a staggered mode and extend in the length direction of the heat dissipation fins, so that the three-dimensional eddy current effect is formed, and heat resistance is reduced; an air inlet side of each heat dissipation fin is provided with an inverted inclined plane so as to eliminate heat dissipation dead angles. The heat dissipation module with the dip angle groove fins can effectively improve heat dissipation efficiency, and is suitable for heat dissipation of various electronic devices.

Description

Technical Field

[0001] The utility model relates to a heat dissipation module and an electronic device having the same, and in particular to a heat dissipation module with inclined groove fins applied to the electronic device. The heat dissipation module improves heat dissipation performance by designing an inclined groove structure on the heat dissipation fins. Background Art

[0002] With the advancement of electronic technology, the computing speed of electronic components is constantly increasing, and the corresponding heat generated is also greatly increased. In order to ensure that electronic components can operate stably for a long time, it is usually necessary to set a heat dissipation module in the electronic device to promptly guide the heat generated by the electronic components and dissipate it to the external environment.

[0003] Traditional heat dissipation modules usually include a heat dissipation base and heat dissipation fins disposed on the base. The heat dissipation fins are often flat or columnar, and parallel heat dissipation channels are formed between the fins to increase the contact area with the air. However, the heat dissipation efficiency of this structure is low and it is difficult to meet the heat dissipation requirements of modern electronic devices.

[0004] In order to further improve the heat dissipation efficiency, some improved heat sink fin structures have emerged. For example, needle-shaped or columnar protrusions are set on the surface of the heat sink fin to disrupt the airflow and enhance heat transfer. However, these structures are difficult to manufacture, costly, and have limited improvement in heat dissipation effect.

[0005] Therefore, it is necessary to provide a new heat sink fin structure that can significantly improve the heat dissipation efficiency of the heat dissipation module while taking into account the manufacturing cost, so as to meet the growing heat dissipation needs of electronic components. Utility Model Content

[0006] The main purpose of the utility model is to provide a heat dissipation module with inclined groove fins to solve the problem of insufficient heat dissipation efficiency in the prior art. The heat dissipation module with inclined groove fins is provided with grooves inclined at a predetermined angle on the heat dissipation fins, and an inverted slope is provided on the air inlet side to eliminate the heat dissipation dead angle, thereby greatly improving the heat dissipation efficiency compared with traditional flat fins, and is suitable for the heat dissipation needs of various electronic devices.

[0007] To achieve the above-mentioned purpose, the present invention provides an embodiment of a heat dissipation module with inclined groove fins, which comprises:

[0008] a heat dissipation base;

[0009] A plurality of heat-conducting elements, one end of each heat-conducting element being connected to the heat-dissipating base; and

[0010] A plurality of heat dissipation fins, wherein the heat dissipation fins are connected to the other end of the heat conducting element;

[0011] Wherein, a plurality of grooves are arranged on both side surfaces of each heat dissipation fin, and the grooves are arranged at a predetermined inclination angle.

[0012] In one embodiment of the heat dissipation module with inclined groove fins of the utility model, the grooves on the two side surfaces of the heat dissipation fins are set at a predetermined inclination angle in the range of 20 degrees to 40 degrees; preferably, the predetermined inclination angle is 30 degrees, which is the optimal inclination angle obtained by comprehensive consideration of factors such as heat dissipation effect and manufacturing cost.

[0013] In one embodiment of the heat dissipation module with angled groove fins of the utility model, the plurality of grooves on the heat dissipation fins are arranged in a staggered manner on both sides of each heat dissipation fin. Through the design of the staggered arrangement of the grooves, the airflow can form a "Z"-shaped flow path between the heat dissipation fins, increasing the contact area and time between the airflow and the heat dissipation fins, thereby enhancing the heat exchange effect.

[0014] In one embodiment of the heat dissipation module with angled groove fins of the utility model, the plurality of grooves on the heat dissipation fins are extended along the length direction of the heat dissipation fins to induce the airflow to generate a rotating flow along the groove direction, thereby forming a three-dimensional vortex effect between the heat dissipation fins to reduce the thermal resistance of the heat dissipation fins. This is because the grooves are extended along the length direction of the heat dissipation fins, which can guide the airflow to form a stable rotating flow between the heat dissipation fins, further enhancing the heat dissipation effect.

[0015] In one embodiment of the heat dissipation module with angled groove fins of the utility model, an inverted slope is provided on an air inlet side of each heat dissipation fin, and the inverted slope forms a preset angle with the main body of the heat dissipation fin; wherein the preset angle ranges from 45 degrees to 85 degrees, and preferably, the preset angle is 60 degrees. The setting of the inverted slope can effectively eliminate the heat dissipation dead angle at the connection between the heat dissipation fin and the heat conducting element.

[0016] Furthermore, the utility model also provides an electronic device, which includes a housing and a mainboard arranged in the housing, and a plurality of electronic components are arranged on the mainboard; the electronic device also includes a heat dissipation module with inclined groove fins as in any of the embodiments described above, and the heat dissipation module with inclined groove fins is arranged on the mainboard.

[0017] In one embodiment, the electronic device is any one selected from the group consisting of a server, a switch, a router, a gateway, an industrial computer, a desktop computer, an all-in-one computer, a smart TV, an in-vehicle entertainment device, a gaming console, and a game console. As the functions of modern electronic devices become increasingly powerful, the heat dissipation requirements also increase accordingly. The heat dissipation module with angled groove fins of the present invention can provide an efficient heat dissipation solution for the above common high-power electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1A It is a three-dimensional schematic diagram of an embodiment of the heat dissipation module with an inverted slope of the utility model;

[0019] Figure 1B It is a three-dimensional schematic diagram from another perspective of an embodiment of the heat dissipation module with an inverted slope of the utility model;

[0020] Figure 1C It is an exploded schematic diagram of an embodiment of the heat dissipation module with an inverted slope of the utility model;

[0021] Figure 2 It is a three-dimensional schematic diagram of a heat dissipation fin with an inverted slope and an inclined groove in the heat dissipation module of the utility model;

[0022] Figure 3A is a partially enlarged schematic diagram of a heat dissipation module with angled groove fins of the present invention, showing the detailed structure of the inverted slope and the groove; and

[0023] Figure 3B The figure is a schematic diagram of the groove structure of the heat dissipation fin of the utility model and the inlet side inclined surface and the airflow direction.

[0024]

Explanation of symbols

[0025] 10: Heat dissipation base

[0026] 20: Thermal Conductive Components

[0027] 30: Cooling fins

[0028] 32: Groove

[0029] 34: Inverted bevel

[0030] α: Predetermined tilt angle

[0031] β: preset angle

[0032] W: Wind side DETAILED DESCRIPTION

[0033] In order to more clearly describe the heat dissipation module with angled groove fins proposed by the present invention, the preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings. In addition, the same reference numerals (component symbols) in the accompanying drawings may be used to represent similar components.

[0034] Please refer to Figures 1A to 1C The present embodiment provides a heat dissipation module with an inverted slope, which includes a heat dissipation base 10, a plurality of heat-conducting elements 20, and a plurality of heat dissipation fins 30. One end of the heat-conducting element 20 is connected to the heat dissipation base 10, and the other end is connected to the heat dissipation fin 30, so as to quickly conduct the absorbed heat to the heat dissipation fin 30. The heat dissipation fin 30 is provided with an inverted slope 34 on the air inlet side, and the inverted slope 34 forms a preset angle β with the main body of the heat dissipation fin 30, preferably, the preset angle β is 45 degrees to 85 degrees, and more preferably 60 degrees.

[0035] Please refer to Figure 2 and Figure 3A In another embodiment, a plurality of grooves 32 are provided on both side surfaces of the heat dissipation fin 30, and the grooves 32 are arranged at a predetermined tilt angle α. Preferably, the grooves 32 are staggered on both sides of the heat dissipation fin 30 and extend along the length direction of the heat dissipation fin 30. Through the tilt and staggered design of the grooves 32, a three-dimensional rotating airflow can be formed between the fins, thereby enhancing the heat dissipation effect and reducing the heat dissipation resistance. In addition, the predetermined tilt angle α is preferably 20 to 40 degrees, and more preferably 30 degrees.

[0036] Further, by Figure 3A and Figure 3B It can be seen that the airflow passing through the inverted slope 34 on the air inlet side W of the heat sink fin 30 can avoid the formation of heat sink dead angles and reduce the ineffective heat sink area. The inclined grooves 32 can guide the airflow to form a rotating flow along the direction of the grooves 32 between the heat sink fins 30, and the staggered arrangement of the grooves 32 can make the airflow form a Z-shaped three-dimensional flow path, increasing the contact area and time between the airflow and the heat sink fin 30, thereby enhancing the heat exchange effect and heat dissipation efficiency.

[0037] In summary, in one embodiment, the present invention provides a heat dissipation module with inclined groove fins, which includes:

[0038] a heat dissipation base 10;

[0039] A plurality of heat-conducting elements 20, one end of each heat-conducting element 20 being connected to the heat dissipation base 10; and

[0040] A plurality of heat dissipation fins 30, wherein the heat dissipation fins 30 are connected to the other end of the heat conducting element 20;

[0041] Wherein, a plurality of grooves 32 are provided on both side surfaces of each heat dissipation fin 30, and the grooves 32 are arranged at a predetermined inclination angle α;

[0042] The predetermined inclination angle α is in the range of 20 to 40 degrees, preferably 30 degrees;

[0043] The plurality of grooves 32 are staggered on both side surfaces of each heat sink fin 30, and the plurality of grooves 32 are extended along the length direction of the heat sink fin 30 to induce the airflow to generate a rotating flow along the direction of the grooves 32, thereby forming a three-dimensional vortex effect between the heat sink fins 30 to reduce the thermal resistance of the heat sink fin 30;

[0044] Wherein, an air inlet side W of each heat dissipation fin 30 is provided with an inverted slope 34, and the inverted slope 34 forms a preset angle β with the main body of the heat dissipation fin 30;

[0045] The preset angle β ranges from 45 degrees to 85 degrees, preferably 60 degrees.

[0046] Furthermore, in one embodiment, the utility model also provides an electronic device, which includes a housing, a motherboard disposed in the housing, and a plurality of electronic components disposed on the motherboard, wherein the electronic device further includes a heat dissipation module with angled groove fins as described above, the heat dissipation module is disposed on the motherboard for dissipating heat from the electronic components. In addition, the electronic device can be a server, a switch, a router, a gateway, an industrial computer, a desktop computer, an all-in-one computer, a smart TV, an in-vehicle entertainment device, a gaming console or a game console, etc.

[0047] In summary, the heat dissipation module with inclined groove fins provided by the utility model can effectively improve the heat dissipation efficiency by providing inclined grooves and inverted slopes on the air inlet side on the heat dissipation fins, and is suitable for the heat dissipation needs of various electronic devices.

[0048] The above description has completely and clearly described a heat dissipation module with angled groove fins and an electronic device having the same of the present invention. It must be emphasized that the above detailed description is a specific description of a feasible embodiment of the present invention, but the embodiment is not used to limit the patent scope of the present invention. Any equivalent implementation or change that does not deviate from the technical spirit of the present invention should be included in the patent scope of this case.

Claims

1. A heat dissipation module with inclined groove fins, characterized in that: It includes: a heat dissipation base; A plurality of heat-conducting elements, one end of each heat-conducting element being connected to the heat-dissipating base; as well as A plurality of heat dissipation fins, wherein the heat dissipation fins are connected to the other end of the heat conducting element; Wherein, a plurality of grooves are arranged on both side surfaces of each heat dissipation fin, and the grooves are arranged at a predetermined inclination angle.

2. The heat dissipation module with inclined groove fins according to claim 1, characterized in that: The predetermined inclination angle ranges from 20 degrees to 40 degrees.

3. The heat dissipation module with inclined groove fins according to claim 1, characterized in that: The predetermined inclination angle is 30 degrees.

4. The heat dissipation module with inclined groove fins according to claim 1, characterized in that: A plurality of the grooves are arranged alternately on both side surfaces of each of the heat dissipation fins.

5. The heat dissipation module with inclined groove fins according to claim 1, characterized in that: The plurality of grooves are extended along the length direction of the heat sink fins to induce the airflow to generate a rotating flow along the groove direction, thereby forming a three-dimensional eddy effect between the heat sink fins to reduce the thermal resistance of the heat sink fins.

6. The heat dissipation module with inclined groove fins according to claim 1, characterized in that: An air inlet side of each of the heat dissipation fins is provided with an inverted slope, and the inverted slope forms a preset angle with the main body of the heat dissipation fin.

7. The heat dissipation module with inclined groove fins according to claim 6, characterized in that: The preset angle ranges from 45 degrees to 85 degrees.

8. The heat dissipation module with inclined groove fins according to claim 6, characterized in that: The preset angle is 60 degrees.

9. An electronic device comprising a housing and a mainboard disposed in the housing, wherein the mainboard is provided with a plurality of electronic components, wherein: The electronic device further comprises a heat dissipation module with inclined groove fins according to any one of claims 1 to 8, and the heat dissipation module with inclined groove fins is disposed on the mainboard.

10. The electronic device according to claim 9, wherein: The electronic device is any one selected from the group consisting of a server, a switch, a router, a gateway, an industrial computer, a desktop computer, an all-in-one computer, a smart TV, an in-vehicle entertainment device, a gaming console, and a game console.

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