Cleaning device
By designing a cleaning device combined with a multi -stage treatment liquid and physical power, the problem of rough surface plate surface after the acid solution was cleaned, and the more effective substrate cleaning effect was achieved.
Patent Information
- Application Number
- CN202421048986.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-14
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-05-14
AI Technical Summary
After cleaning the substrate with an acid solution, the substrate surface is prone to roughening, and it is difficult for the prior art to effectively weaken or block the impact of the acid solution on the substrate surface.
A cleaning device was designed, including a conveyor, multiple nozzles and an air knife, to control the impact of the acidic solution on the substrate through a combination of multi-stage treatment liquid and physical force. Specific steps include preliminary cleaning using an acidic solution in the first treatment zone, followed by providing a second treatment liquid using an inclined nozzle in the second treatment zone, and providing physical force through an air knife in the third treatment zone to thin and block chemical reactions. .
Through the cleaning device, it can effectively reduce the chemical reaction of acid solution to the surface of the substrate, avoid roughness on the substrate surface, and improve the cleaning effect.
Smart Images
Figure CN222385438U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a cleaning device. Background Art
[0002] In the technology of cleaning substrates, the surface of the substrate is removed by a chemical solution or a solvent solution, for example, the surface of the substrate is cleaned by an acidic solution. However, the treatment effect of the acidic solution may cause the surface of the substrate to become rough. In view of this, how to reduce or block the effect of the acidic solution on the surface of the substrate after cleaning the surface of the substrate with the acidic solution has become one of the issues of concern in the industry. Utility Model Content
[0003] The utility model provides a cleaning device, comprising a conveying device, a plurality of first nozzles, a recovery unit, a second nozzle and an air knife. The conveying device is configured to carry a substrate and transfer the substrate from a first processing area to a second processing area and a third processing area. The first nozzle is arranged in the first processing area and above the conveying device to provide a first processing liquid to the substrate. The recovery unit is arranged in the first processing area and below the conveying device, and is configured to recover the first processing liquid. The second nozzle is arranged in the second processing area and above the conveying device, and is tilted to provide the substrate with a second processing liquid in a downstream direction. The air knife is arranged in the third processing area, above the conveying device, and downstream of the second nozzle, and is configured to provide a physical force to the second processing liquid covering the substrate.
[0004] In some embodiments, the cleaning device further comprises a third nozzle, which is disposed in the third processing zone and downstream of the air knife, and provides a cleaning liquid on the substrate.
[0005] In some embodiments, the cleaning device further includes a first storage device and a second storage device. The first storage device is configured to store the first treatment liquid, the first storage device is connected to the first nozzle and the recovery unit, and provides the first treatment liquid to the first nozzle, and contains the first treatment liquid recovered by the recovery unit. The second storage device is connected to the second nozzle, configured to store the second treatment liquid, and provide the second treatment liquid to the second nozzle.
[0006] In some embodiments, the cleaning device further includes a third storage device which is connected to the third nozzle and configured to store the cleaning liquid and provide the cleaning liquid to the third nozzle.
[0007] In some embodiments, the second nozzle provides the second processing liquid at a supply flow rate of 30 liters / minute to 40 liters / minute; and the third nozzle provides the cleaning liquid at a supply flow rate of 30 liters / minute to 40 liters / minute.
[0008] In some embodiments, the cleaning device further includes a first valve and a second valve. The first valve is disposed between the second storage device and the third storage device. The second valve is disposed between the second storage device and the third storage device. When the first valve is opened and the second valve is closed, the third nozzle provides the second processing liquid onto the substrate, and when the first valve is closed and the second valve is opened, the second nozzle provides the cleaning liquid onto the substrate.
[0009] In some embodiments, the distance between the outlet of the second nozzle and the outlet of the air knife is 100 mm to 200 mm.
[0010] In some embodiments, the distance between the outlet of the second nozzle and the outlet of the third nozzle is 250 mm to 350 mm.
[0011] In some embodiments, the cleaning device further includes an adjuster disposed on the third nozzle and configured to adjust an angle and a height of the third nozzle relative to the substrate.
[0012] In some embodiments, the angle is between positive and negative 0 degrees and 30 degrees relative to the normal direction of the substrate.
[0013] In some embodiments, the conveying speed of the conveyor is 3 m / min to 6 m / min. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] The following embodiments are read in conjunction with the accompanying drawings to clearly understand the features of the present invention. It should be noted that, in accordance with standard industry practice, various features are not drawn to scale. In fact, the sizes of various features may be arbitrarily enlarged or reduced for clear discussion.
[0015] Figure 1 is a schematic diagram of a cleaning device according to some embodiments of the utility model;
[0016] Figure 2 is a schematic diagram of the relative arrangement of the second nozzle, the air knife and the third nozzle according to some embodiments of the utility model;
[0017] Figure 3A and Figure 3B is a schematic diagram of a first valve and a second valve according to some embodiments of the present invention; and
[0018] Figure 4 It is a partial structural schematic diagram of an adjuster according to some embodiments of the utility model.
[0019] The reference numerals are described as follows:
[0020] 100: Cleaning device
[0021] 102: Substrate
[0022] 110: Transmission unit
[0023] 121: Recycling Department
[0024] 122: First nozzle
[0025] 123: First treatment liquid
[0026] 124: First storage device
[0027] 132: Second nozzle
[0028] 133: Second treatment liquid
[0029] 134: Second storage device
[0030] 135: Partition
[0031] 136, 146: valve
[0032] 137, 147, 139, 149: Check valve
[0033] 138: First Valve
[0034] 141: Air Knife
[0035] 142: The third nozzle
[0036] 143: Cleaning fluid
[0037] 144: Third storage device
[0038] 145: Regulator
[0039] 148: Second valve
[0040] 402: Bracket
[0041] 412: Rotating seat
[0042] 422: Fixed bracket
[0043] D1, D2, D3: distance
[0044] N: Normal direction
[0045] OP1, OP2, OP3: Export Department
[0046] PF: Physical Force
[0047] RP: Recovery Pipe
[0048] SP1, SP2, SP3: Supply piping
[0049] TD: Delivery Device
[0050] Z1: First treatment area
[0051] Z2: Second processing area
[0052] Z3: The third processing area
[0053] α, β, γ: angle DETAILED DESCRIPTION
[0054] The spirit of the present disclosure will be clearly illustrated below with drawings and detailed descriptions. After understanding the embodiments of the present disclosure, any person having ordinary knowledge in the technical field can make changes and modifications based on the techniques taught by the present disclosure without departing from the spirit and scope of the present disclosure.
[0055] The terms used in this disclosure are only used to describe specific embodiments and are not used to limit the disclosure. Singular forms such as "a", "this", "here", "this", and "the" as used in this disclosure also include plural forms. The terms "including", "comprising", "having", etc. used in this document are all open terms, that is, they mean including but not limited to.
[0056] See also Figure 1 , Figure 1 Schematic diagram of a cleaning device according to some embodiments of the present invention. The cleaning device 100 includes a conveying device TD, a plurality of first nozzles 122 , a recovery unit 121 , a second nozzle 132 , an air knife 141 and a third nozzle 142 .
[0057] The conveyor TD is disposed in the first processing zone Z1, the second processing zone Z2, and the third processing zone Z3. The conveyor TD is configured to carry the substrate 102 through a plurality of conveying units 110 arranged along the conveying direction of the substrate 102 (e.g., the arrow direction), and to convey the substrate 102 from the first processing zone Z1 to the second processing zone Z2 and the third processing zone Z3. In some embodiments, the conveying speed of the conveyor TD is 3 m / min to 6 m / min. In some embodiments, the conveying speed of the conveyor TD includes 4 m / min, 4.1 m / min, 4.3 m / min, 4.5 m / min, 4.6 m / min, 4.8 m / min, 5.5 m / min, or any value between any two of these values.
[0058] The first nozzle 122 is disposed in the first processing zone Z1 and is located above and below the conveying device TD to provide a first processing liquid 123 to the substrate 102. In some embodiments, the first processing liquid 123 includes an acidic solution, such as a hydrofluoric acid solution (HF aqIn some embodiments, the first nozzle 122 provides a supply flow rate of the first processing liquid 123 of 100 liters / minute to 150 liters / minute; of course, the flow rate is positively correlated with the size of the substrate 102, that is, the larger the size of the substrate 102, the larger the flow rate of the first processing liquid 123. In addition, in some embodiments, the first nozzle 122 is only disposed above the conveying device TD.
[0059] like Figure 1 As shown in the first processing zone Z1, the recovery unit 121 is disposed in the first processing zone Z1 and is located below the conveying device TD. The recovery unit 121 includes a recovery pipe RP and is configured to recover the first processing liquid 123. The cleaning device 100 further includes a first storage device 124. The first storage device 124 is configured to store the first processing liquid 123, and the first storage device 124 is connected to the first nozzle 122 and the recovery unit 121. The first storage device 124 provides the first processing liquid 123 to the first nozzle 122 through the supply pipe SP1, and through the recovery pipe RP of the recovery unit 121, the first storage device 124 will accommodate the first processing liquid 123 recovered by the recovery unit 121.
[0060] The second nozzle 132 is disposed in the second processing zone Z2 and above the conveying device TD, and is inclined at an angle α relative to the normal direction N of the substrate 102, and is configured to provide the second processing liquid 133 toward the downstream direction (e.g., the direction of conveying the substrate 102) to the substrate 102 through the supply pipe SP2. In some embodiments, the angle α is 20 degrees to 45 degrees. Figure 1 As shown in the second treatment zone Z2 of the cleaning device 100, the cleaning device 100 further includes a second storage device 134. The second storage device 134 is connected to the second nozzle 132 through the supply pipe SP2, and is configured to store the second treatment liquid 133 and provide the second treatment liquid 133 to the second nozzle 132. In addition, the second treatment liquid 133 provided by the second storage device 134 is a new and unused second treatment liquid 133. In some embodiments, the second treatment liquid 133 includes an acidic solution, such as a hydrofluoric acid solution (HF aq). In some embodiments, the supply flow rate of the second treatment liquid 133 provided by the second nozzle 132 is 30 liters / minute to 40 liters / minute. In some embodiments, the supply flow rate of the second treatment liquid 133 provided by the second nozzle 132 includes 31 liters / minute, 32 liters / minute, 35 liters / minute, 36 liters / minute, 37 liters / minute or any value between any two of these values. In some embodiments, the supply flow rate of the second treatment liquid 133 provided by the second nozzle 132 is positively correlated with the size of the substrate 102. In some embodiments, the second storage device 134 further includes a valve 136 disposed between the second nozzle 132 and the supply pipe SP2, and the valve 136 is configured to adjust the opening or closing, flow rate and / or pressure of the second treatment liquid 133. In some other embodiments, the second storage device 134 further includes a plurality of valves 136 disposed between the second nozzle 132 and the supply pipe SP2, and these valves 136 can be configured to control the opening and closing, flow rate or pressure of the second treatment liquid 133 respectively. In some embodiments, the second storage device 134 further includes a check valve 137 disposed between the supply pipe SP2 and the valve 136 , and the check valve 137 is configured to prevent the second processing liquid 133 from flowing back.
[0061] The air knife 141 is disposed in the third processing zone Z3, above the conveying device TD, and downstream of the second nozzle 132. In some embodiments, the cleaning device 100 further includes a partition 135 disposed between the second processing zone Z2 and the third processing zone Z3, and located above the conveying device TD, wherein the partition 135 is configured to separate the second nozzle 132 and the air knife 141. In addition, the bottom of the partition 135 is at a distance from the conveying device TD. In other words, when the conveying device TD conveys the substrate 102 between the second processing zone Z2 and the third processing zone Z3, the bottom of the partition 135 does not contact the upper surface of the substrate 102.
[0062] For further information, see Figure 2 , Figure 2 1 is a schematic diagram of the relative arrangement of the second nozzle, the air knife and the third nozzle according to some embodiments of the present invention. After the second nozzle 132 provides the second processing liquid 133 to the substrate 102, the conveying device TD conveys the substrate 102 covered with the second processing liquid 133 to the third processing zone Z3 (such as Figure 1As shown in the figure, the air knife 141 provides a physical force PF to the second processing liquid 133 covering the substrate 102, so as to reduce the thickness of the second processing liquid 133 coated on the substrate 102 by controlling the strength of the physical force PF, so as to slow down the chemical reaction of the second processing liquid 133 on the substrate 102; it can even block the second processing liquid 133 to expose the upper surface of the substrate 102, thereby terminating the chemical reaction of the second processing liquid 133 on the substrate 102. In addition, the gas flow rate of the air knife 141 ranges from 800 liters / minute to 1200 liters / minute or any value between any two of these values, wherein the gas flow rate of the air knife 141 is mainly adjusted according to the viscosity of the second processing liquid 133 or the process effect. In some embodiments, the physical force PF is a physical force PF generated by the ejection of a gas (such as air or an inert gas). In some embodiments, the air knife 141 provides a physical force PF in an upstream direction to the second processing liquid 133 covering the substrate 102 at an angle β. In some embodiments, the angle β is between 20 and 45 degrees.
[0063] like Figure 2 As shown, in some embodiments, the second nozzle 132 has an outlet portion OP1 for providing the second processing liquid 133, the air knife 141 has an outlet portion OP2 for providing the physical force PF, and the distance D1 between the outlet portion OP1 of the second nozzle 132 and the outlet portion OP2 of the air knife 141 is 100 mm to 200 mm. In some embodiments, the distance D1 between the outlet portion OP1 of the second nozzle 132 and the outlet portion OP2 of the air knife 141 includes 140 mm, 150 mm, 160 mm, 190 mm, or any value between any two of these values.
[0064] Please go back Figure 1, the third nozzle 142 is disposed in the third processing zone Z3 and is located downstream of the air knife 141, and provides a cleaning liquid 143 on the substrate 102. In some embodiments, the cleaning device 100 further includes a third storage device 144, and the third storage device 144 is connected to the third nozzle 142 through the supply pipe SP3, configured to store the cleaning liquid 143, and provide the cleaning liquid 143 to the third nozzle 142 through the supply pipe SP3. In some embodiments, the supply flow rate of the cleaning liquid 143 provided by the third nozzle 142 is 30 liters / minute to 40 liters / minute. In some embodiments, the supply flow rate of the cleaning liquid 143 provided by the third nozzle 142 includes 31 liters / minute, 32 liters / minute, 35 liters / minute, 36 liters / minute, 37 liters / minute, or any value between any two of these values. In some embodiments, the supply flow rate of the cleaning liquid 143 provided by the third nozzle 142 is positively correlated with the size of the substrate 102. In some embodiments, the third storage device 144 further includes a valve 146 disposed between the third nozzle 142 and the supply pipe SP3, and the valve 146 is configured to adjust the opening or closing, flow rate and / or pressure of the cleaning liquid 143. In some embodiments, the third storage device 144 further includes a check valve 147 disposed between the supply pipe SP3 and the valve 146, and the check valve 147 is configured to prevent the backflow of the cleaning liquid 143.
[0065] Next, see Figure 3A and Figure 3B , Figure 3A and Figure 3B 1 is a schematic diagram of a first valve and a second valve according to some embodiments of the present invention. The cleaning device 100 further includes a first valve 138 and a second valve 148. The first valve 138 is disposed between the second storage device 134 and the third storage device 144, and the second valve 148 is disposed between the second storage device 134 and the third storage device 144.
[0066] like Figure 3A As shown, when the valve 136 of the second storage device 134 is opened and the first valve 138 is opened, and the valve 146 of the third storage device 144 is closed and the second valve 148 is closed, the second processing liquid 133 will pass through the supply pipe SP2 through the first valve 138 and enter the supply pipe SP3, and the second processing liquid 133 will be provided to the substrate 102 by the third nozzle 142.
[0067] like Figure 3BAs shown in FIG. 1 , when the valve 146 and the second valve 148 of the third storage device 144 are opened, and the valve 136 and the first valve 138 of the second storage device 134 are closed, the cleaning liquid 143 passes through the supply pipe SP3, through the second valve 148, and enters the supply pipe SP2, and the cleaning liquid 143 is provided to the substrate 102 by the second nozzle 132. Figure 1 As shown, in some embodiments, the cleaning device 100 further includes a check valve 139 disposed between the first valve 138 and the check valve 137 of the second storage device 134, and the check valve 139 is configured to prevent the cleaning liquid 143 from the supply pipe SP3 from flowing into the supply pipe SP2. In some embodiments, the cleaning device 100 further includes a check valve 149 disposed between the second valve 148 and the check valve 147 of the third storage device 144, and the check valve 149 is configured to prevent the second processing liquid 133 from the supply pipe SP2 from flowing into the supply pipe SP3.
[0068] like Figure 1 As shown, in some embodiments, the cleaning device 100 further includes an adjuster 145. The adjuster 145 is disposed on the third nozzle 142 and is configured to adjust the rotation angle γ (such as Figure 2 ) and height, wherein the height range is between 5 mm and 25 mm or any value between any two of these values, mainly to be adjusted in accordance with the thickness of the substrate 102 or the process effect. For further explanation of the actuation mechanism of the adjuster 145, please refer to Figure 4 , Figure 4 1 is a partial structural schematic diagram of an adjuster according to some embodiments of the present invention. In some embodiments, when the length of the third nozzle 142 is shorter, the third nozzle 142 is cantilevered. In some embodiments, the third nozzle 142 is symmetrically mounted, such that the adjuster 145 includes a bracket 402, two rotating seats 412 (only one of which is shown in the figure) and two fixed frames 422 (only one of which is shown in the figure), wherein the third nozzle 142 is disposed on the bracket 402. The two ends of the bracket 402 are respectively pivotally connected to a rotating seat 412, and the two rotating seats 412 are respectively movably disposed on their corresponding fixed frames 422. In some embodiments, the two rotating seats 412 are respectively slidably disposed on their corresponding fixed frames 422. The rotating seat 412 can move vertically relative to the fixed frame 422, so the rotating seat 412 can adjust the height of the third nozzle 142 relative to the substrate 102. The support 402 can rotate relative to the rotating base 412, so the rotating base 412 can adjust the angle γ of the third nozzle 142 relative to the substrate 102 (eg Figure 2 In addition, Figure 2As shown, the rotation angle γ of the third nozzle 142 adjusted by the adjuster 145 is within a range of plus or minus 0 to 30 degrees (e.g., 0 to 30 degrees in the upstream direction, or 0 to 30 degrees in the downstream direction) based on the normal direction N of the substrate 102. In addition, in some embodiments, the third nozzle 142 has an outlet OP3 for providing the cleaning liquid 143, and since the third nozzle 142 can rotate relative to the normal direction N of the substrate 102, when the third nozzle 142 rotates to the maximum rotatable angle in the upstream direction (e.g., the angle γ is 30 degrees), the distance D2 between the outlet OP1 of the second nozzle 132 and the outlet OP3 of the third nozzle 142 is 250 mm; and when the third nozzle 142 rotates to the maximum rotatable angle in the downstream direction (e.g., the angle γ is 30 degrees), the distance D3 between the outlet OP1 of the second nozzle 132 and the outlet OP3 of the third nozzle 142 is 350 mm. In other words, the distance between the outlet OP1 of the second nozzle 132 and the outlet OP3 of the third nozzle 142 (e.g., the distance D2 to the distance D3) is 250 mm to 350 mm. In some embodiments, the distance between the outlet OP1 of the second nozzle 132 and the outlet OP3 of the third nozzle 142 includes 270 mm, 280 mm, 290 mm, 300 mm, 310 mm, 320 mm, or any value between any two of these values.
[0069] Although the present invention is disclosed in the above embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the following claims.
Claims
1. A cleaning device, characterized in that: include: a conveyor configured to carry a substrate and convey the substrate from a first processing area to a second processing area and a third processing area; A plurality of first nozzles are disposed in the first processing area and above the conveying device to provide a first processing liquid to the substrate; a recovery section, disposed in the first processing area and below the conveying device, configured to recover the first processing liquid; A second nozzle, disposed in the second processing area and above the conveying device, is tilted to provide a second processing liquid toward a downstream direction to the substrate; as well as An air knife is disposed in the third processing zone above the conveying device and downstream of the second nozzle, and is configured to provide a physical force to the second processing liquid covering the substrate.
2. The cleaning device according to claim 1, characterized in that: Further including: A third nozzle is disposed in the third processing zone and downstream of the air knife, and provides a cleaning liquid on the substrate.
3. The cleaning device according to claim 2, characterized in that: Further including: a first storage device configured to store the first processing liquid, the first storage device being connected to the first nozzles and the recovery part, and providing the first processing liquid to the first nozzles and containing the first processing liquid recovered by the recovery part; as well as A second storage device is connected to the second nozzle and is configured to store the second processing liquid and provide the second processing liquid to the second nozzle.
4. The cleaning device according to claim 3, characterized in that: Further including: A third storage device is connected to the third nozzle and is configured to store the cleaning liquid and provide the cleaning liquid to the third nozzle.
5. The cleaning device according to claim 4, characterized in that: The second nozzle provides the second treatment liquid with a supply flow rate of 30 liters / minute to 40 liters / minute; and The third nozzle provides the cleaning liquid with a supply flow rate of 30 liters / minute to 40 liters / minute.
6. The cleaning device according to claim 4, characterized in that: Further including: a first valve disposed between the second storage device and the third storage device; and a second valve disposed between the second storage device and the third storage device, When the first valve is opened and the second valve is closed, the third nozzle provides the second processing liquid onto the substrate, and When the first valve is closed and the second valve is opened, the second nozzle provides the cleaning liquid onto the substrate.
7. The cleaning device according to claim 1, characterized in that: The distance between an outlet of the second nozzle and an outlet of the air knife is 100 mm to 200 mm.
8. The cleaning device according to claim 2, characterized in that: A distance between an outlet of the second nozzle and an outlet of the third nozzle is 250 mm to 350 mm.
9. The cleaning device according to claim 2, characterized in that: Further including: An adjuster is disposed on the third nozzle and is configured to adjust an angle and a height of the third nozzle relative to the substrate.
10. The cleaning device according to claim 9, characterized in that: The angle is between positive and negative 0 degrees and 30 degrees based on the normal direction of the substrate.
11. The cleaning device according to claim 2, characterized in that: The conveying speed of the conveying device is 3 m / min to 6 m / min.