Special turning machine grinding wheel for sapphire edge machining

Abstract

The utility model relates to a special turning machine grinding wheel for sapphire edge machining, which is characterized in that annular grooves (13) are formed in the upper surface and the lower surface of a grinding wheel body (1) around a mounting hole (11), and a plurality of first grinding parts (14) and second grinding parts (15) are arranged on the edge of the grinding wheel body (1); sand plating layers (16) are arranged on the surfaces of the first grinding part (14) and the second grinding part (15); the first grinding part (14) comprises a first straight edge (141), a first fillet (142), a second straight edge (143) and a first bevel edge (144) which correspond to the first surface (2), the second chamfer (5) and the second surface (3); and the second grinding part (15) comprises a second bevel edge (151), a second fillet (152), a third straight edge (153) and a third bevel edge (154) which correspond to the fourth bevel edge (6), the third chamfer (7) and the fourth chamfer (8). According to the utility model, the machine adjustment difficulty can be reduced, and the production cost can be reduced.

Description

Technical Field

[0001] The utility model relates to a grinding wheel, in particular to a lathe grinding wheel specially used for processing sapphire edges. Background Art

[0002] The intersections of the stepped sapphire wafer surfaces are often designed with rounded corners. Therefore, when using a grinding wheel to process it, there are problems such as high difficulty in adjusting the machine, long processing time and low processing efficiency. In addition, sapphire is a material with a hardness second only to diamond in nature, so the wear of the grinding wheel is increased during processing, and the processing cost is high.

[0003] At present, the invention with patent number CN105598791A discloses a method for forming a 3D curved surface of sapphire, including first designing and preparing a sintered grinding wheel with a concave curved surface according to the target shape of the 3D curved surface of sapphire and the hardness of sapphire, and then using CNC in combination with the sintered grinding wheel to form the 3D curved surface of sapphire. Specifically, the rotation speed of the three-axis linkage high-speed spindle on the CNC is 20,000 to 30,000 r / min. The method provided by the present invention is used to form a 3D curved surface of sapphire, so that the surface of the sapphire product is not easy to leave knife marks, grinding wheel lines, steps and other poor appearances, and the surface quality of the formed product is high; and the processing is convenient, the processing efficiency is high, and the grinding wheel life is long. However, this application scheme can only process sapphires in a single rounded form, and is not suitable for the processing of stepped sapphire wafers. Summary of the invention

[0004] In view of the problems existing in the above-mentioned prior art, the utility model provides a special lathe grinding wheel for sapphire edge processing, which can reduce the difficulty of machine adjustment and reduce production costs.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a special lathe grinding wheel for sapphire edge processing, comprising a grinding wheel body, a mounting hole, a first chamfer, a first grinding portion, a first straight edge, a first rounded corner, a second straight edge, a first beveled edge, an annular groove, a second grinding portion, a second beveled edge, a second rounded corner, a third straight edge, a third beveled edge, a sand plating layer, a first surface, a second chamfer, a second surface, a fourth surface, a fourth beveled edge, a third chamfered edge and a fourth chamfer. A mounting hole is provided at the center of the disc-shaped grinding wheel body, and annular grooves are provided around the mounting hole on the upper and lower surfaces of the grinding wheel body. A plurality of first grinding portions and second grinding portions are arranged on the edge of the grinding wheel body; a sand plating layer is arranged on the surfaces of the first grinding portion and the second grinding portion; the first grinding portion comprises a first straight edge, a first rounded corner, a second straight edge and a first beveled edge corresponding to the first surface, the second chamfer and the second surface; the second grinding portion comprises a second beveled edge, a second rounded corner, a third straight edge and a third beveled edge corresponding to the fourth beveled edge, the third chamfer and the fourth chamfer.

[0006] In addition, the sapphire edge processing special lathe grinding wheel proposed in the above embodiment of the utility model may also have the following additional technical features:

[0007] As a further improvement of the present invention, the sand plating layer is a 00 mesh sand plating layer.

[0008] As a further improvement of the present utility model, the edge of the mounting hole is provided with a first chamfer.

[0009] As a further improvement of the present invention, the inclination angle of the first hypotenuse is 45°.

[0010] As a further improvement of the present invention, the first hypotenuse is parallel to the third hypotenuse.

[0011] As a further improvement of the present utility model, there are three first grinding parts and three second grinding parts.

[0012] Through the above scheme, the utility model has at least the following advantages: compared with conventional grinding wheels, by setting the first grinding part and the second grinding part, various parts of the stepped sapphire wafer can be effectively ground, thereby improving processing efficiency; in addition, the first grinding part and the second grinding part are both set in multiples, which can effectively increase the service life of the grinding wheel and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a top view of the lathe grinding wheel used for sapphire edge processing;

[0014] Figure 2 yes Figure 1 AA cross-section diagram;

[0015] Figure 3 yes Figure 2 A partial enlarged view of B;

[0016] Figure 4 is a side view of a stepped sapphire wafer;

[0017] Figure 5 This is a schematic diagram of the working state of the lathe grinding wheel specially used for sapphire edge processing;

[0018] In the figure: 1, grinding wheel body, 11, mounting hole, 12, first chamfer, 13, annular groove, 14, first grinding part, 141, first straight edge, 142, first fillet, 143, second straight edge, 144, first beveled edge, 15, second grinding part, 151, second beveled edge, 152, second fillet, 153, third straight edge, 154, third beveled edge, 16, sand plating layer, 2, first surface, 3, second surface, 4, fourth surface, 5, second chamfer, 6, fourth beveled edge, 7, third chamfer, 8, fourth chamfer. DETAILED DESCRIPTION

[0019] The special lathe grinding wheel for sapphire edge processing of the utility model is described below in conjunction with the accompanying drawings.

[0020] In the first embodiment of the present application, Figures 1 to 5 As shown, the sapphire edge processing lathe grinding wheel (hereinafter referred to as "this patent") comprises a grinding wheel body 1, a first grinding portion 14, a first straight edge 141, a first fillet 142, a second straight edge 143, a first bevel 144, a second grinding portion 15, a second bevel 151, a second fillet 152, a third straight edge 153, a third bevel 154 and a sand plating layer 16. A mounting hole 11 is provided at the center of the disc-shaped grinding wheel body 1, and an annular groove 13 is provided on the upper and lower surfaces of the grinding wheel body 1 around the mounting hole 11. The weight of the grinding wheel can be reduced by providing the annular groove 13. In order to reduce the amount of grinding, the use of materials and the production cost, a plurality of first grinding parts 14 and second grinding parts 15 are arranged on the edge of the grinding wheel body 1; a sand plating layer 16 is arranged on the surface of the first grinding part 14 and the second grinding part 15; the first grinding part 14 includes a first straight edge 141, a first rounded corner 142, a second straight edge 143 and a first beveled edge 144 corresponding to the first surface 2, the second chamfer 5 and the second surface 3; the second grinding part 15 includes a second beveled edge 151, a second rounded corner 152, a third straight edge 153 and a third beveled edge 154 corresponding to the fourth beveled edge 6, the third chamfer 7 and the fourth chamfer 8.

[0021] The invention number is CN105598791A, which is a method for forming a 3D curved surface of sapphire (hereinafter referred to as "the patent"). Although the method provided by the patent forms a 3D curved surface of sapphire, it is not easy to leave knife marks, grinding wheel lines, steps and other poor appearance on the surface of the sapphire product, and the surface quality of the formed product is high; and the processing is convenient, the processing efficiency is high, and the life of the grinding wheel is long, but the patent can only process sapphire with a single rounded corner, and is not suitable for the processing of stepped sapphire wafers. The first grinding wheel edge of the patent uses the first grinding wheel edge of ... The cutting portion 14, the first straight edge 141, the first rounded corner 142, the second straight edge 143, the first beveled edge 144, the second grinding portion 15, the second beveled edge 151, the second rounded corner 152, the third straight edge 153 and the third beveled edge 154 respectively correspond to processing the first surface 2, the second chamfer 5, the second surface 3, the fourth surface 4, the fourth beveled edge 6, the third chamfer 7 and the fourth chamfer 8, which can effectively reduce the processing time. At the same time, by setting a plurality of first grinding portions 14 and second grinding portions 15, the service life of the grinding wheel can be effectively improved and the cost can be reduced.

[0022] The structure of the second embodiment is basically the same as that of the first embodiment, except that Figure 3 As shown, the sand-plating layer 16 is a 600-mesh sand-plating layer.

[0023] In order to further optimize the working efficiency of the present application and facilitate installation, the edge of the mounting hole 11 is provided with a first chamfer 12. The inclination angle of the first bevel 144 is 45°. The first bevel 144 is parallel to the third bevel 154. There are three first grinding sections 14 and three second grinding sections 15. The first first grinding section 14 is first used to grind the stepped sapphire wafer, and when the first first grinding section 14 reaches its service life (after processing a specific number of times), the second first grinding section 14 is used; after the second first grinding section 14 reaches its service life, the third first grinding section 14 is used. Similarly, the use of multiple second grinding sections 15 is the same as that of the first grinding section 14. Through this arrangement, the service life of the grinding wheel can be significantly improved and the production cost can be reduced.

[0024] When in use, install the special lathe grinding wheel for sapphire edge processing in place and the grinding wheel can be put into use.

[0025] When the utility model is in use, the specific operations are as follows:

[0026] When in use, the first grinding part 14 is used to grind the first surface 2 and the second surface 3 of the stepped sapphire wafer. After the first surface 2 and the second surface 3 are processed to a specific size, the second grinding part 15 is used to grind the second surface 3 of the stepped sapphire wafer. The fourth surface 4 of the sapphire wafer is adjusted to a position corresponding to the second grinding part 15. Through the relative rotation of the sapphire wafer and the grinding wheel, the fourth bevel 6, the third chamfer 7 and the fourth chamfer 8 of the sapphire wafer can be quickly processed, thereby reducing the processing time and the production cost.

[0027] In summary, the special lathe grinding wheel for sapphire edge processing in the embodiment of the utility model can effectively grind the first surface 2, the second chamfer 5, the second surface 3, the fourth surface 4, the fourth bevel 6, the third chamfer 7 and the fourth chamfer 8 of the stepped sapphire wafer by setting the first grinding part 14 and the second grinding part 15, thereby improving the processing efficiency; in addition, the first grinding part 14 and the second grinding part 15 are both provided with a plurality of them, which can effectively increase the service life of the grinding wheel and reduce the cost.

[0028] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A lathe grinding wheel for sapphire edge processing, comprising a grinding wheel body (1) and a mounting hole (11), wherein the mounting hole (11) is provided at the center of the disc-shaped grinding wheel body (1), and the characteristics are as follows: The upper and lower surfaces of the grinding wheel body (1) are provided with annular grooves (13) around the mounting hole (11); a plurality of first grinding parts (14) and second grinding parts (15) are provided on the edge of the grinding wheel body (1); a sand plating layer (16) is provided on the surface of the first grinding part (14) and the second grinding part (15); the first grinding part (14) comprises a first straight edge (141), a first rounded corner (142), a second straight edge (143) and a first beveled edge (144) corresponding to the first surface (2), the second chamfer (5) and the second surface (3); the second grinding part (15) comprises a second beveled edge (151), a second rounded corner (152), a third straight edge (153) and a third beveled edge (154) corresponding to the fourth beveled edge (6), the third chamfer (7) and the fourth chamfer (8).

2. The special lathe grinding wheel for sapphire edge processing according to claim 1, characterized in that: The sand-plating layer (16) is a 600-mesh sand-plating layer.

3. The special lathe grinding wheel for sapphire edge processing according to claim 2, characterized in that: The edge of the mounting hole (11) is provided with a first chamfer (12).

4. The special lathe grinding wheel for sapphire edge processing according to claim 1, characterized in that: The first oblique edge (144) has an inclination angle of 45°.

5. The special lathe grinding wheel for sapphire edge processing according to claim 4, characterized in that: The first oblique side (144) is parallel to the third oblique side (154).

6. The special lathe grinding wheel for sapphire edge processing according to claim 4, characterized in that: There are three first grinding parts (14) and three second grinding parts (15).

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