Depth camera

Abstract

The utility model provides a depth camera. The depth camera comprises a photoelectric support, a laser emission module, a first imaging module, a heat dissipation piece, a mainboard support and a mainboard. The photoelectric bracket is provided with a plurality of mounting holes, and the rear side of the photoelectric bracket is provided with an accommodating groove; the laser emitting module and the first imaging module are mounted in different mounting holes, and the rear end of the laser emitting module extends into the accommodating groove; the heat dissipation piece is mounted in the accommodating groove and is in contact with the rear end of the laser emission module; the mainboard bracket is mounted on the rear side of the photoelectric bracket; and the main board is mounted on the main board bracket and is electrically connected with the laser emission module and the first imaging module. According to the depth camera, the heat dissipation piece is arranged to dissipate heat of the laser emission module, so that the thermal stability of the laser emission module during working is ensured.

Description

Technical Field

[0001] The present application belongs to the field of 3D sensing technology, and more specifically, to a depth camera. Background Art

[0002] With the rapid development of science and technology, depth cameras are widely used in sports and fitness, smart phones, security equipment, and intelligent robots. Structured light depth cameras mainly include laser emission modules and imaging modules. The laser emission module emits structured light to the target object, and the imaging module is responsible for collecting the structured light reflected by the target object to generate a structured light image. The depth image of the target is obtained by processing the structured light image, and vision-related applications can be realized based on the depth image.

[0003] However, during the operation of the depth camera, the light source chip in the laser emission module will generate high heat. Under long-term working conditions, the temperature in the laser emission module will rise rapidly. Excessive temperature will affect the stability and life of the light source chip, and may even cause laser instability, such as temperature drift, which will cause deviations in the data collected by the imaging module and affect the accuracy of the depth camera. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a depth camera and a depth camera to solve the technical problem of excessive temperature during the operation of the laser emission module in the prior art.

[0005] To achieve the above purpose, the technical solution adopted by the present application is: to provide a depth camera, including an optoelectronic bracket, a laser emission module, a first imaging module, a heat sink, a mainboard bracket and a mainboard. The optoelectronic bracket is provided with a plurality of mounting holes, and a receiving groove is provided on the rear side of the optoelectronic bracket; the laser emission module and the first imaging module are installed in different mounting holes, and the rear end of the laser emission module extends into the receiving groove; the heat sink is installed in the receiving groove and contacts with the rear end of the laser emission module; the mainboard bracket is installed on the rear side of the optoelectronic bracket; the mainboard is installed on the mainboard bracket and is electrically connected to the laser emission module and the first imaging module.

[0006] In some embodiments, the depth camera can be communicatively connected with a host computer, a processing chip is provided on the main board, the processing chip is electrically connected to the laser emission module and the first imaging module, and the processing chip is used to: control the laser emission module and the first imaging module, and receive the structured light image captured by the first imaging module, calculate the depth image based on the structured light image and / or output the structured light image to the host computer.

[0007] In some embodiments, the heat sink includes a heat conducting plate and a plurality of heat dissipation fins. The heat conducting plate is installed in the receiving groove and contacts the rear end of the laser emission module. Each heat dissipation fin is connected to the rear end of the heat conducting plate. In some embodiments, the heat conducting plate includes a first sub-board body and a second sub-board body extending laterally and connected. The first sub-board body and / or the second sub-board body are fixed to the photoelectric bracket. A plurality of heat dissipation fins are connected to the rear end of the first sub-board body and / or the second sub-board body. The front end of the first sub-board body contacts the rear end of the laser emission module, and the front end of the second sub-board body contacts the photoelectric bracket. In some embodiments, the main board includes a first interface, and the depth camera also includes an adapter circuit board. The adapter circuit board and the main board are installed on the same side of the main board bracket. The adapter circuit board includes a first connector and a second interface. The first connector is plugged into the first interface to electrically connect the adapter circuit board to the main board.

[0008] In some embodiments, the depth camera further includes a front shell and a rear shell, the front shell and the rear shell enclose an installation cavity, the photoelectric bracket and the mainboard bracket are installed in the installation cavity, and the mainboard bracket is fixed to the front shell or the rear shell.

[0009] In some embodiments, the depth camera further includes a housing seal, which is disposed between the front shell and the rear shell to seal the gap between the front shell and the rear shell. In some embodiments, the housing seal is a sealing rubber ring, the mainboard bracket includes a connecting boss, the connecting boss is used to connect the depth camera to other devices, and the front shell or the rear shell is provided with a avoidance opening corresponding to the connecting boss; the sealing rubber ring includes a first sub-ring and a second sub-ring connected to the first sub-ring, the first sub-ring is disposed between the front shell and the rear shell to seal the gap between the front shell and the rear shell, and the second sub-ring is sleeved on the connecting boss to seal the gap between the connecting boss and the avoidance opening.

[0010] In some embodiments, the depth camera also includes an interface sealing ring, a first exposure hole is provided on the front shell or the rear shell, the first exposure hole is used to expose the second interface of the depth camera, and the interface sealing ring is sleeved on the second interface to seal the gap between the first exposure hole and the second interface; and / or, the depth camera also includes a multi-machine synchronization interface plug, a multi-machine synchronization interface is provided on the main board, a second exposure hole is provided on the front shell or the rear shell, the second exposure hole is used to expose the multi-machine synchronization interface, the multi-machine synchronization interface plug is pluggable to the second exposure hole, and when the multi-machine synchronization interface plug is plugged into the second exposure hole, the second exposure hole is sealed.

[0011] In some embodiments, the depth camera further includes a buffer seal disposed between the optoelectronic bracket and the front shell to seal the gap between the optoelectronic bracket and the front shell; and / or, a plurality of heat dissipation teeth distributed at intervals are further disposed on the rear side of the rear shell.

[0012] The beneficial effects of a depth camera provided by the present application are:

[0013] A accommodating groove is also provided on the rear side of the photoelectric bracket. The heat sink is arranged in the accommodating groove and in contact with the rear end of the laser emitting module, so that the heat generated by the laser emitting module during operation can be effectively conducted to the heat sink, thereby reducing the temperature of the laser emitting module and ensuring that the laser emitting module will not drift due to excessive temperature, thereby ensuring the accuracy and stability of the depth camera. At the same time, the influence of the heat sink on the thickness of the depth camera is reduced, and the structure of the depth camera is more compact, which is conducive to the miniaturization of the depth camera. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 A schematic diagram of the connection between the depth camera and the host computer provided in this application;

[0016] Figure 2 A schematic diagram of a three-dimensional structure of a depth camera provided in this application;

[0017] Figure 3 for Figure 2 The provided schematic diagram of the split structure of the depth camera;

[0018] Figure 4 for Figure 2 A schematic diagram of the cross-sectional structure of the provided depth camera;

[0019] Figure 5 A schematic diagram of the three-dimensional structure of the heat sink of the depth camera provided in this application;

[0020] Figure 6 Another schematic diagram of the three-dimensional structure of the depth camera provided in this application;

[0021] Figure 7 for Figure 6 The provided schematic diagram of the split structure of the depth camera;

[0022] Figure 8 for Figure 6 A schematic diagram of the cross-sectional structure of the provided depth camera.

[0023] Among them, the reference numerals in the figure are:

[0024] 1. Front shell; 21. Photoelectric bracket; 22. Laser emission module; 23. First imaging module; 24. Heat sink; 241. Heat conducting plate; 2411. First sub-board; 2412. Second sub-board; 242. Heat dissipation fins; 25. Mainboard bracket; 251. Connecting boss; 26. Mainboard; 261. First interface; 262. Multi-machine synchronization interface; 27. Second imaging module; 28. Proximity sensor; 29. ​​Head circuit board; 210. First pressing member; 211. Adapter circuit board; 2111. Second interface; 2112. First connector; 212. Second pressing member; 3. Back shell; 31. Heat dissipation teeth; 4. Shell seal; 41. First sub-circle; 42. Second sub-circle; 5. Glass lens; 6. Buffer seal; 7. Interface seal ring; 8. Multi-machine synchronization interface plug; 9. Avoidance. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0027] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] like Figure 1As shown, the present application provides a depth camera, which can be connected to a host computer (laptop, desktop computer, mobile phone, tablet, computing box, etc.) by wired or wireless communication, and the depth camera outputs a depth image and / or a structured light image to the host computer. When the depth camera outputs a structured light image to the host computer, the host computer can calculate the depth based on the structured light image; when the depth camera outputs a depth image and a structured light image to the host computer, the host computer can calculate the depth based on the structured light image, and can optimize the depth image output by the depth camera. The host computer can also perform vision-related applications based on the image data transmitted by the depth camera, such as three-dimensional reconstruction, posture recognition, joint point recognition, motion analysis, etc., which are not listed here one by one.

[0030] like Figures 2 to 4 As shown, the depth camera includes an optoelectronic bracket 21, a laser emission module 22, a first imaging module 23, a heat sink 24, a mainboard bracket 25 and a mainboard 26. The optoelectronic bracket 21 is provided with a plurality of mounting holes, and a receiving groove is provided on the rear side of the optoelectronic bracket 21; the laser emission module 22 and the first imaging module 23 are installed in different mounting holes, and the rear end of the laser emission module 22 extends into the receiving groove. The laser emission module 22 is used to emit structured light to the target, and the first imaging module 23 is used to collect the structured light reflected back by the target to generate a structured light image; the heat sink 24 is installed in the receiving groove and contacts with the rear end of the laser emission module 22; the mainboard bracket 25 is installed on the rear side of the optoelectronic bracket 21; the mainboard 26 is installed on the mainboard bracket 25, and is electrically connected to the laser emission module 22 and the first imaging module.

[0031] The specific working principle of the depth camera: the mainboard 26 controls the laser emission module 22 to emit a structured light beam (such as speckle structured light, stripe structured light, etc.) to the target, and synchronously controls the first imaging module 23 to collect the structured light reflected by the target to generate a structured light image and output it to the mainboard 26. The mainboard 26 can calculate the depth image based on the structured light image, and the mainboard 26 can output the depth image to the host computer. The mainboard 26 can also directly output the structured light image to the host computer without calculating the depth image, and the host computer calculates the depth image. The depth camera can be a monocular structured light or binocular structured light depth camera.

[0032] The depth camera provided by the present application has a receiving groove on the rear side of the photoelectric bracket, and the heat sink is arranged in the receiving groove and in contact with the rear end of the laser emission module, so that the heat generated by the laser emission module during operation can be effectively conducted to the heat sink, and the heat sink can be promptly conducted to the photoelectric bracket and quickly dissipated, thereby reducing the temperature of the laser emission module during operation, ensuring that the laser emission module will not have excessive temperature, thereby ensuring the accuracy and thermal stability of the depth camera, and at the same time, the heat sink will not increase the thickness of the depth camera, and the structure of the depth camera is more compact, which is conducive to the miniaturization of the depth camera.

[0033] The laser emission module 22 may include a lens barrel, a base, a laser light source arranged on the base, and an emitting optical element. The lens barrel can be fixed in a mounting hole on a photoelectric bracket, the base can be fixed at the bottom or inside of the lens barrel, the emitting optical element is arranged on the lens barrel and is located in the emission path of the laser, and the laser light source is used to generate a laser beam, and specifically may be a vertical cavity surface laser emitter (Vertical Cavity Surface Emitting Laser, VCSEL), an edge laser emitter (Edge Emitting Laser, EEL) and other laser light sources. The emitting optical element may include a collimating lens and a diffraction optical element, or include a mask, etc., which is used to modulate the laser beam generated by the laser light source.

[0034] The first imaging module 23 can be an infrared imaging module or an infrared color dual imaging module, and the first imaging module 23 can collect the structured light beam reflected back by the target. The number of first imaging modules 23 can be one or two. When the number of first imaging modules 23 is one, the first imaging module 23 and the laser emission module 22 constitute a monocular structured light depth camera; when the number of first imaging modules 23 is two, the two first imaging modules 23 and the laser emission module 22 constitute a binocular structured light depth camera.

[0035] The mainboard 26 can be electrically connected to the laser emission module 22 and the first imaging module 23 through a flexible circuit board (FPC), so as to control the laser emission module 22 and the first imaging module 23 and receive the structured light image captured by the first imaging module 23. A processing chip (not shown) can be provided on the mainboard 26, and the processing chip is electrically connected to the laser emission module 22 and the first imaging module 23, and is used to output a control signal to the laser emission module 22 and the first imaging module 23, so as to synchronously control the laser emission module 22 and the first imaging module 23. The processing chip is also used to receive the structured light image captured by the first imaging module 23, and calculate the depth image and / or transmit the structured light image to the host computer.

[0036] The photoelectric bracket 21 mainly plays a role of limiting and supporting, and can ensure that the relative position between the laser emission module 22 and the first imaging module 23 does not change, thereby ensuring the accuracy of the depth camera. The photoelectric bracket 21 can be made of metal materials with good thermal conductivity such as copper, iron, and aluminum, so that the photoelectric bracket 21 has good rigidity and can withstand various forces generated during operation without being easily deformed. At the same time, it also has good thermal conductivity and can efficiently conduct and dissipate heat to ensure the thermal stability of each device.

[0037] The heat sink 24 has good heat dissipation performance. The heat sink 24 is fixedly installed in the receiving groove and contacts the rear end of the laser emission module 22. It should be noted that the contact includes but is not limited to direct contact between the heat sink 24 and the laser emission module 22, and indirect contact between the heat sink 24 and the laser emission module 22, such as coating silicone grease and attaching a thermal conductive sheet. The heat sink 24 can contact the photoelectric bracket 21 to transfer heat to the photoelectric bracket 21 in a timely manner. The heat sink 24 is made of metal materials with good thermal conductivity such as copper, iron, and aluminum, so that the heat sink 24 has good heat dissipation performance. At the same time, the heat sink 24 is not easy to deform and will not cause the position of the laser emission module 22 to change. After the heat sink 24 is installed in the receiving groove, it does not protrude from the photoelectric bracket 21 to avoid increasing the thickness of the depth camera.

[0038] like Figure 5 As shown, in one embodiment of the present application, the heat sink 24 includes a heat conductive plate 241 and a plurality of heat dissipating fins 242. The heat conductive plate 241 is installed in the receiving groove and contacts the rear end of the laser emission module 22. Each heat dissipating fin 242 is connected to the rear end of the heat conductive plate 241. The heat dissipating fin 242 has a larger heat dissipation area, which increases the area of ​​the heat sink 24. The heat dissipating fin 242 can significantly improve the heat dissipation performance of the heat sink 24.

[0039] In one embodiment of the present application, the heat conducting plate 241 extends in the lateral direction so that the heat conducting plate 241 has a large heat dissipation area, and at the same time, there is a large contact area between the heat conducting plate 241 and the photoelectric support 21, so as to quickly transfer the heat on the laser emission module 22 to the photoelectric support 21. The heat conducting plate 241 includes a first sub-plate body 2411 and a second sub-plate body 2412 connected to each other, and the first sub-plate body 2411 and the second sub-plate body 2412 are both extended in the lateral direction, and the first sub-plate body 2411 is fixed to the photoelectric support 21, or the second sub-plate body 2412 is fixed to the photoelectric support 21, or the first sub-plate body 2411 and the second sub-plate body 2412 are both fixed to the photoelectric support 21. A plurality of heat dissipation fins 242 are connected to the rear end of the first sub-plate body 2411, and can also be connected to the rear end of the second sub-plate body 2412, or the rear ends of the first sub-plate body 2411 and the second sub-plate body 2412 are both connected with heat dissipation fins 242. The front end of the first sub-board 2411 contacts the rear end of the laser emission module 22 , and the front end of the second sub-board 2412 contacts the photoelectric bracket 21 , thereby receiving the heat of the laser emission module 22 and achieving better heat transfer with the photoelectric bracket 21 .

[0040] The mainboard 26 can be used to realize functions such as data processing, data transmission, and control. The mainboard 26 is mounted on the mainboard bracket 25, specifically on the side of the mainboard bracket 25 away from the photoelectric bracket 21. In addition to the processing chip, other components such as memory and various circuits can be arranged on the mainboard 26.

[0041] like Figures 2 to 4 As shown, in one embodiment of the present application, the depth camera includes a second imaging module 27, which is a color imaging component, and the second imaging module 27 is mounted on the photoelectric bracket 21, specifically in a mounting hole on the photoelectric bracket 21, and is electrically connected to the main board 26. The second imaging module 27 is used to capture color images in order to obtain actual texture information of the target.

[0042] like Figures 2 to 4 As shown, in one embodiment of the present application, the depth camera further includes a proximity sensor 28, which is connected to the photoelectric bracket 21, specifically installed in a mounting hole on the photoelectric bracket 21, and is electrically connected to the mainboard 26 to transmit signals to the mainboard 26 and receive control signals from the mainboard 26. The proximity sensor 28 is used to detect the distance between the target and the depth camera, so as to facilitate laser protection and achieve better detection accuracy.

[0043] like Figures 2 to 4 As shown, in one embodiment of the present application, the depth camera also includes a head circuit board 29. The head circuit board 29 is arranged between the photoelectric bracket 21 and the mainboard bracket 25, and is electrically connected to the laser emission module 22, the first imaging module 23 and the mainboard 26, that is, the laser emission module 22 and the first imaging module 23 are electrically connected to the mainboard 26 through the head circuit board 29. The head circuit board 29 and the mainboard 26 can be connected through a flexible printed circuit board. The head circuit board 29 can be provided with components such as memory, resistors, capacitors and corresponding circuits. The head circuit board 29 can be used to achieve drive current management, etc., which has different functions from the mainboard 26. The color imaging component and the proximity sensor 28 can be electrically connected to the mainboard 26 through the head circuit board 29.

[0044] like Figures 2 to 4 As shown, in one embodiment of the present application, the depth camera includes a first pressing member 210, and the first pressing member 210 presses against the electrical connection between the main board 26 and the head circuit board 29, so that the first pressing member 210 presses against the FPC connection part between the main board 26 and the head circuit board 29, ensuring the connection stability between the FPC and the main board 26, and preventing the connection from loosening or falling off due to vibration or external impact.

[0045] like Figure 3 As shown, in one embodiment of the present application, the mainboard 26 includes at least one first interface 261, and the first interface 261 can specifically be a Type-C interface, etc. The mainboard 26 can output image data to the host computer, receive instructions and firmware issued by the host computer, etc. through the first interface 261.

[0046] like Figure 3As shown, in one embodiment of the present application, the main board 26 also includes a multi-machine synchronization interface 262 to achieve synchronization between multiple depth cameras, so as to form a multi-machine synchronization system. Multiple depth cameras can be connected together through the multi-machine synchronization interface 262 and work synchronously.

[0047] like Figure 3 As shown, in one embodiment of the present application, the depth camera also includes a transfer circuit board 211, and the transfer circuit board 211 and the main board 26 are installed on the same side of the main board bracket 25. The transfer circuit board 211 includes a first connector 2112 and a second interface 2111, and the first connector 2112 is plugged into the first interface 261 to electrically connect the transfer circuit board 211 to the main board 26. In some embodiments, the second interface 2111 and the first interface 261 are specifically type-c interfaces, and the difference is that the openings of the second interface 2111 and the first interface 261 are different. For example, the first interface 261 is set at the side of the depth camera, and the opening of the first interface 261 faces one side of the depth camera; the second interface 2111 is set at the bottom of the depth camera, and the opening of the second interface 2111 faces the bottom of the depth camera; thus, it is suitable for different installation environments. The depth camera can output data to the host computer and receive data transmitted by the host computer through the second interface. The second interface 2111 can specifically have waterproof performance to prevent the second interface 2111 from being damaged by water. In some implementations, the second interface 2111 and the first interface 261 may be of different types to achieve interface expansion.

[0048] In some embodiments, the depth camera may also include a second pressing member 212, which presses against the electrical connection between the adapter circuit board 211 and the main board 26 to ensure the stability of the electrical connection between the adapter circuit board 211 and the main board 26, and fixes the adapter circuit board 211 on the main board bracket 25 to prevent it from displacement or shaking during operation.

[0049] like Figures 6 to 8 As shown, the depth camera includes a front shell 1 and a rear shell 3. The rear shell 3 and the front shell 1 enclose a mounting cavity. The photoelectric bracket 21 and the components on the photoelectric bracket 21, the mainboard bracket 25 and the components on the mainboard bracket 25 are accommodated in the mounting cavity. The mainboard bracket 25 is fixed on the front shell 1 or the rear shell 3.

[0050] The photoelectric bracket 21 can be in contact with the front shell 1. The photoelectric bracket 21 acts as a bridge for heat conduction and conducts heat to the front shell 1. At the same time, the mainboard bracket 25 also conducts heat to the rear shell 3 or the front shell 1. The front shell 1 and the rear shell 3, as the outer shell structure of the depth camera, not only have the function of protecting the internal components, but also can exchange heat with the outside air, thereby dissipating heat to the surrounding environment and ensuring the thermal stability of the depth camera. Among them, the front shell 1 and the rear shell 3 can be made of materials such as iron, aluminum, copper, and alloys, so that the front shell 1 and the rear shell 3 have good heat dissipation performance.

[0051] like Figure 7 As shown, in one embodiment of the present application, the depth camera includes a shell seal 4, which is arranged between the front shell 1 and the rear shell 3 to seal the gap between the front shell 1 and the rear shell 3 to prevent foreign substances from penetrating into the camera from the gap between the front shell 1 and the rear shell 3. Specifically, an annular groove is provided on the front shell 1 or the rear shell 3, and the shape and size of the groove match the shell seal 4. After the shell seal 4 is provided in the annular groove, the shell seal 4 is squeezed together by the front shell 1 and the rear shell 3, so that the shell seal 4 can be tightly fitted, so that the depth camera has a better sealing effect. Not only does it enhance the sealing of the depth camera, enabling it to better resist the influence of the external environment, especially the intrusion of water, but it also improves the overall stability and durability of the camera.

[0052] In one embodiment of the present application, the housing seal 4 is a sealing rubber ring, and the sealing rubber ring is a silicone sealing ring. This material not only has good elasticity and wear resistance, but also has excellent sealing performance.

[0053] In some embodiments, the mainboard bracket 25 includes a connecting boss 251, which is used to connect the depth camera to other devices (such as a bracket, a robot, or a car), and the front shell 1 or the rear shell 3 is provided with an escape opening 9 corresponding to the connecting boss 251. Figure 7 As shown, the sealing rubber ring includes a first sub-ring 41 and a second sub-ring 42 connected to the first sub-ring 41. The first sub-ring 41 is arranged between the front shell 1 and the rear shell 3, specifically in the annular groove, to seal the gap between the front shell 1 and the rear shell 3. The second sub-ring 42 is sleeved on the connecting boss 251 to seal the gap between the connecting boss 251 and the avoidance opening 9, so as to further enhance the waterproof performance of the depth camera.

[0054] In one embodiment of the present application, a first exposure hole is provided on the front shell 1 or the rear shell 3, and the first exposure hole is used to expose the second interface 2111, which is convenient for users to plug and unplug. In order to improve the waterproof ability at the second interface 2111, the depth camera includes an interface sealing ring 7, which is sleeved on the second interface 2111 to seal the gap between the first exposure hole and the second interface 2111, preventing external water and other liquids from entering the depth camera from the interface, thereby improving the waterproof performance of the depth camera.

[0055] In one embodiment of the present application, a second exposure hole is provided on the front shell 1 or the rear shell 3, and the second exposure hole is used to expose the multi-machine synchronization interface 262, which is convenient for users to plug and unplug. In order to prevent water from entering the multi-machine synchronization interface 262, the depth camera also includes a multi-machine synchronization interface plug 8, which is pluggable and connected to the second exposure hole. When the multi-machine synchronization interface plug 8 is plugged into the second exposure hole, the second exposure hole is sealed. A sealing ring may also be provided between the multi-machine synchronization interface 262 and the second exposure hole to seal the gap. At the same time, the multi-machine synchronization interface plug 8 makes the depth camera more beautiful in appearance.

[0056] like Figure 7 and Figure 8 As shown, in one embodiment of the present application, the depth camera further includes a buffer seal 6, which is connected between the photoelectric bracket 21 and the front shell 1, and can be specifically sleeved on the front side of the photoelectric bracket 21, and has through holes corresponding to the laser emission module 22, the first imaging module 23, the second imaging module 27 and the proximity sensor 28. When the depth camera is installed in the front shell 1, the buffer seal 6 can seal the gap between the front surface of the photoelectric bracket 21 and the front shell 1 to further prevent dust, water, etc. from entering each component. At the same time, the buffer seal 6 can also play a role in buffering and vibration reduction, so that the depth camera is not easily impacted.

[0057] like Figure 7 and Figure 8 As shown, in one embodiment of the present application, the front shell 1 is provided with through holes at positions corresponding to the laser emission module 22, the first imaging module 23, the second imaging module 27 and the proximity sensor 28. A glass lens 5 is provided on the front side of the front shell 1, and the glass lens 5 can be fixed on the front side of the front shell 1 by means of adhesive or the like. The glass lens 5 can protect the depth camera and prevent dust and water from entering the depth camera.

[0058] like Figure 7 As shown, in one embodiment of the present application, the rear side of the rear shell 3 is further provided with a plurality of heat dissipation teeth 31 distributed at intervals, and each heat dissipation tooth 31 is arranged at equal intervals along the length direction of the rear shell 3, which is conducive to the heat transfer of the rear shell 3 to the air. The heat dissipation teeth 31 extend in a vertical direction on the rear side of the rear shell 3. The heat dissipation teeth 31 can increase the contact area between the rear shell 3 and the air and improve the heat dissipation performance. In other embodiments, the heat dissipation teeth 31 can also extend obliquely or horizontally on the rear side of the rear shell 3.

[0059] In some embodiments, the specific steps of the assembly process of the depth camera of the present application are as follows:

[0060] First, assemble the laser emission module 22, the first imaging module 23, the second imaging module 27, and the proximity sensor 28 onto the photoelectric bracket 21, fix the heat sink 24 into the receiving groove of the photoelectric bracket 21, fix the head circuit board 29 to the rear end of the photoelectric bracket 21, and electrically connect the laser emission module 22, the first imaging module 23, the second imaging module 27, and the proximity sensor 28, and use spring screws and other screws to fix the photoelectric bracket 21 to the front end of the mainboard bracket 25, and fix the mainboard 26 and the adapter circuit board 211 to the Assemble to the rear end of the mainboard bracket 25, electrically connect the head circuit board 29 with the mainboard 26, assemble the buffer seal 6 on the front side of the photoelectric bracket 21, and then assemble the mainboard bracket 25 to the front shell 1, install the shell seal 4 in the groove on the front shell 1, assemble the rear shell 3 to the front shell 1 and lock the front shell 1 and the rear shell 3, assemble the glass lens 5 to the front side of the front shell 1, assemble the interface sealing ring 7 to the first interface 261, and assemble the multi-machine synchronization interface plug 8 into the second exposure hole on the rear shell 3 to complete the assembly of the depth camera.

[0061] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A depth camera, characterized in that: include: The photoelectric bracket is provided with a plurality of mounting holes, and a receiving groove is provided on the rear side of the photoelectric bracket; The laser emission module and the first imaging module are installed in different installation holes, and the rear end of the laser emission module extends into the accommodating groove; A heat sink is installed in the receiving groove and contacts the rear end of the laser emission module; A mainboard bracket, installed on the rear side of the photoelectric bracket; The mainboard is mounted on the mainboard bracket and is electrically connected to the laser emission module and the first imaging module.

2. The depth camera according to claim 1, wherein: The depth camera can be communicatively connected with a host computer. A processing chip is provided on the main board. The processing chip is electrically connected to the laser emission module and the first imaging module. The processing chip is used to: control the laser emission module and the first imaging module, and receive the structured light image captured by the first imaging module, calculate the depth image based on the structured light image and / or output the structured light image to the host computer.

3. The depth camera according to claim 1 or 2, characterized in that: The heat sink includes a heat conducting plate and a plurality of heat dissipation fins. The heat conducting plate is installed in the accommodating groove and contacts with the rear end of the laser emission module. Each of the heat dissipation fins is connected to the rear end of the heat conducting plate.

4. The depth camera according to claim 3, wherein: The heat conducting plate includes a first sub-plate body and a second sub-plate body extending laterally and connected, the first sub-plate body and / or the second sub-plate body are fixed to the photoelectric bracket, the multiple heat dissipation fins are connected to the rear end of the first sub-plate body and / or the second sub-plate body, the front end of the first sub-plate body is in contact with the rear end of the laser emission module, and the front end of the second sub-plate body is in contact with the photoelectric bracket.

5. The depth camera according to claim 1 or 2, characterized in that: The main board includes a first interface, and the depth camera also includes an adapter circuit board. The adapter circuit board and the main board are installed on the same side of the main board bracket. The adapter circuit board includes a first connector and a second interface. The first connector is plugged into the first interface to electrically connect the adapter circuit board and the main board.

6. The depth camera according to claim 1 or 2, characterized in that: It also includes a front shell and a rear shell, the front shell and the rear shell are enclosed to form an installation cavity, the photoelectric bracket and the mainboard bracket are installed in the installation cavity, and the mainboard bracket is fixed to the front shell or the rear shell.

7. The depth camera according to claim 6, wherein: The depth camera further includes a housing sealer disposed between the front housing and the rear housing to seal a gap between the front housing and the rear housing.

8. The depth camera according to claim 7, wherein: The housing seal is a sealing rubber ring, the mainboard bracket includes a connecting boss, the connecting boss is used to connect the depth camera to other devices, and the front shell or the rear shell is provided with an avoidance opening corresponding to the connecting boss; The sealing rubber ring includes a first sub-ring and a second sub-ring connected to the first sub-ring, the first sub-ring is arranged between the front shell and the rear shell to seal the gap between the front shell and the rear shell, and the second sub-ring is sleeved on the connecting boss to seal the gap between the connecting boss and the avoidance.

9. The depth camera according to claim 6, wherein: The depth camera further includes an interface sealing ring, a first exposure hole is provided on the front shell or the rear shell, the first exposure hole is used to expose a second interface of the depth camera, and the interface sealing ring is sleeved on the second interface to seal a gap between the first exposure hole and the second interface; and / or, The depth camera also includes a multi-machine synchronization interface plug. The main board is provided with a multi-machine synchronization interface. The front shell or the rear shell is provided with a second exposure hole. The second exposure hole is used to expose the multi-machine synchronization interface. The multi-machine synchronization interface plug is pluggable and connected to the second exposure hole. When the multi-machine synchronization interface plug is plugged into the second exposure hole, the second exposure hole is sealed.

10. The depth camera according to claim 6, wherein: The depth camera further includes a buffer seal, which is disposed between the photoelectric bracket and the front shell to seal the gap between the photoelectric bracket and the front shell; and / or, a plurality of heat dissipation teeth distributed at intervals are further disposed on the rear side of the rear shell.

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