Alignment device for pre-adjusting position of wafer

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to an alignment device for pre-adjusting the position of a wafer, which comprises a connecting plate, a placing plate I, a placing plate II, a motor, a screw rod, a moving block, a swing rod and a moving rod, the motor is detachably connected with the connecting plate and is positioned above the connecting plate, and the screw rod is detachably connected with the motor and is positioned and penetrates through the placing plate I; the rotating directions of threads at the two ends of the screw rod are opposite, the moving block is in threaded connection with the screw rod and wraps the screw rod, one end of the swing rod is rotationally connected with the moving block and located above the moving block, the moving rod is rotationally connected with the swing rod and located at the other end of the swing rod, the motor is started to drive the screw rod to rotate, and the screw rod drives the moving block to move; and one end of the swing rod drives the moving rod to move so as to drive the rotating shaft to rotate, the auxiliary rod drives the positioning roller to move, and the positioning roller aligns and positions the wafer on the rotating chuck, so that the problems that the alignment process is relatively complicated, the overall cost of the device is relatively high, and the actual application is relatively tedious are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to an alignment device for pre-adjusting a wafer position. Background Art

[0002] During the wafer processing process, it is necessary to spray acid, alkali, organic and other liquids onto the wafer, and quickly spread to the entire wafer under the action of centrifugal force. However, due to fluctuations in the hydraulic pressure, air pressure, oil temperature and other conditions in the drive source, the robot arm may be positioned inaccurately. If the robot arm is positioned incorrectly, the wafer will not be placed in the correct position, resulting in uneven wafer cleaning or the wafer may fall off the rotating chuck during high-speed rotation.

[0003] To solve the above problems, the prior art patent (CN218215245U) discloses an alignment device for pre-adjusting the wafer position. The horizontal distance between the center of the second sensing element and the center of the rotating chuck is smaller than the diameter of the wafer. When the machine places the wafer on the rotating chuck, the second sensing element also senses the lateral distance between the wafer and the second sensing element to prevent the robot arm from having a positioning deviation in the longitudinal position when placing the wafer on the rotating chuck.

[0004] However, in the above-mentioned prior art, the alignment process is relatively complicated, the overall cost of the device is relatively high and it is relatively cumbersome in practical application. Utility Model Content

[0005] The utility model aims to provide an alignment device for pre-adjusting the position of a wafer, which solves the technical problems in the prior art that the alignment process is relatively complicated, the overall cost of the device is relatively high, and it is relatively cumbersome in actual application.

[0006] To achieve the above-mentioned purpose, the utility model adopts an alignment device for pre-adjusting the wafer position, including a connecting plate, a placing plate 1, a placing plate 2 and a positioning assembly, the positioning assembly including a motor, a screw, a moving block, a rocker arm, a moving rod and a moving part, the placing plate 1 is fixedly connected to the connecting plate and is located above the connecting plate, the placing plate 2 is fixedly connected to the connecting plate and is located above the connecting plate, the motor is detachably connected to the connecting plate and is located above the connecting plate, the screw is detachably connected to the motor and passes through the placing plate 1, and the threads at both ends of the screw have opposite rotation directions, the moving block is threadedly connected to the screw and wraps the screw, one end of the rocker arm is rotatably connected to the moving block and is located above the moving block, and the moving rod is rotatably connected to the rocker arm and is located at the other end of the rocker arm.

[0007] Wherein, the positioning assembly also includes a rotating shaft, an auxiliary rod, a rotating block and a positioning roller, the rotating shaft is detachably connected to the moving rod and passes through the connecting plate, the auxiliary rod is detachably connected to the rotating shaft and is located below the rotating shaft, the rotating block is rotatably connected to the auxiliary rod and is located below the auxiliary rod, and the positioning roller is detachably connected to the rotating block and is located below the rotating block.

[0008] Among them, the movable part includes a fixed plate, a telescopic rod and a mounting plate, the telescopic rod is detachably connected to the connecting plate and is located above the connecting plate, the fixed plate is detachably connected to the telescopic rod and is located above the telescopic rod, and the mounting plate is fixedly connected to the fixed plate and is located on one side of the fixed plate.

[0009] Among them, the moving part also includes cylinder 1 and cylinder 2, cylinder 1 is detachably connected to the fixed plate and is located below the fixed plate, cylinder 2 is detachably connected to the fixed plate and is located below the fixed plate, and the output ends of cylinder 1 and cylinder 2 are both detachably connected to the connecting plate.

[0010] Among them, the alignment device for pre-adjusting the wafer position also includes positioning rod one, positioning rod two and positioning rod three, the positioning rod one is fixedly connected to the connecting plate and located below the connecting plate, the positioning rod two is fixedly connected to the connecting plate and located below the connecting plate, and the positioning rod three is fixedly connected to the connecting plate and located below the connecting plate.

[0011] The utility model discloses an alignment device for pre-adjusting the position of a wafer, wherein the first placement plate is fixedly connected to the connecting plate and is located above the connecting plate, the second placement plate is fixedly connected to the connecting plate and is located above the connecting plate, the motor is detachably connected to the connecting plate and is located above the connecting plate, the screw is detachably connected to the motor and passes through the first placement plate, and the threads at both ends of the screw have opposite rotation directions, the moving block is threadedly connected to the screw and wraps the screw, one end of the swing rod is rotatably connected to the moving block and is located above the moving block, the moving rod is rotatably connected to the swing rod and is located at the other end of the swing rod, the motor is started to drive the screw to rotate, and the screw drives the moving blocks at both ends to move, so that the swing rod drives one end of the moving rod to swing, and the other end of the moving rod drives the rotating shaft to rotate, and the rotating shaft drives the auxiliary rod to swing, thereby driving the positioning roller to position and align the wafer on the rotating chuck, and this method can effectively solve the problem that the alignment process is relatively complicated, the overall cost of the device is relatively high, and it is relatively cumbersome in practical applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a structural schematic diagram of the first embodiment of the utility model.

[0014] Figure 2 It is a front view of the first embodiment of the utility model.

[0015] Figure 3 It is a side view of the first embodiment of the utility model.

[0016] Figure 4 It is a structural schematic diagram of the second embodiment of the utility model.

[0017] 101-connecting plate, 102-placing plate one, 103-placing plate two, 104-motor, 105-screw, 106-moving block, 107-swing rod, 108-moving rod, 109-rotating shaft, 110-auxiliary rod, 111-rotating block, 112-positioning roller, 113-fixed plate, 114-telescopic rod, 115-mounting plate, 116-cylinder one, 117-cylinder two, 118-rotating chuck, 201-positioning rod one, 202-positioning rod two, 203-positioning rod three. DETAILED DESCRIPTION

[0018] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0019] The first embodiment of the present application is:

[0020] See also Figure 1 to Figure 3 ,in Figure 1 It is a structural schematic diagram of the first embodiment of the utility model. Figure 2 2 is a front view of the first embodiment of the utility model. Figure 3 It is a side view of the first embodiment of the utility model.

[0021] The utility model provides an alignment device for pre-adjusting the position of a wafer, comprising a connecting plate 101, a placement plate 102, a placement plate 2 103, a motor 104, a screw 105, a moving block 106, a rocker rod 107, a moving rod 108, a rotating shaft 109, an auxiliary rod 110, a rotating block 111, a positioning roller 112, a fixed plate 113, a telescopic rod 114, a mounting plate 115, a cylinder 116 and a cylinder 2 117. The above-mentioned scheme solves the problems in the prior art that the alignment process is relatively complicated, the overall cost of the device is relatively high, and it is relatively cumbersome in actual application.

[0022] According to this specific embodiment, the placement plate 102 is fixedly connected to the connecting plate 101 and is located above the connecting plate 101. The placement plate 103 is fixedly connected to the connecting plate 101 and is located above the connecting plate 101. The motor 104 is detachably connected to the connecting plate 101 and is located above the connecting plate 101. The screw 105 is detachably connected to the motor 104 and passes through the placement plate 102. The threads at both ends of the screw 105 are rotated in opposite directions. The block 106 is threadedly connected to the screw rod 105 and wraps the screw rod 105. One end of the rocker arm 107 is rotatably connected to the moving block 106 and is located above the moving block 106. The moving rod 108 is rotatably connected to the rocker arm 107 and is located at the other end of the rocker arm 107. The motor 104 is started to drive the screw rod 105 to rotate, and the moving block 106 is driven to move by the threads at both ends of the screw rod 105 rotating in opposite directions, so that the rocker arm 107 drives the moving rod 108 to swing.

[0023] Among them, the rotating shaft 109 is detachably connected to the moving rod 108 and passes through the connecting plate 101, the auxiliary rod 110 is detachably connected to the rotating shaft 109 and is located below the rotating shaft 109, the rotating block 111 is rotatably connected to the auxiliary rod 110 and is located below the auxiliary rod 110, and the positioning roller 112 is detachably connected to the rotating block 111 and is located below the rotating block 111. When the moving rod 108 swings, it will drive the rotating shaft 109 to rotate, so that the auxiliary rod 110 swings, and drives the positioning roller 112 to position and align the wafer.

[0024] Secondly, the telescopic rod 114 is detachably connected to the connecting plate 101 and is located above the connecting plate 101. The fixed plate 113 is detachably connected to the telescopic rod 114 and is located above the telescopic rod 114. The mounting plate 115 is fixedly connected to the fixed plate 113 and is located on one side of the fixed plate 113. The mounting plate 115 facilitates the fixing of the position of the fixed plate 113. The telescopic rod 114 assists in fixing the distance between the fixed plate 113 and the connecting plate 101.

[0025] At the same time, the cylinder 1 116 is detachably connected to the fixing plate 113 and is located below the fixing plate 113, the cylinder 2 117 is detachably connected to the fixing plate 113 and is located below the fixing plate 113, and the output ends of the cylinder 1 116 and the cylinder 2 117 are both detachably connected to the connecting plate 101. Starting the cylinder 1 116 and the cylinder 2 117 can move the connecting plate 101 up and down, thereby adjusting the position of the connecting plate 101.

[0026] An alignment device for pre-adjusting the position of a wafer using the present embodiment is provided by setting a connecting plate 101, a placing plate 102, a placing plate 2 103, a motor 104, a screw 105, a moving block 106, a swing rod 107, a moving rod 108, a rotating shaft 109, an auxiliary rod 110, a rotating block 111, a positioning roller 112, a fixed plate 113, a telescopic rod 114, a mounting plate 115, a cylinder 116 and a cylinder 2 117. The placing plate 102 is fixedly connected to the connecting plate 101 and is located above the connecting plate 101. The placing plate 2 103 is fixedly connected to the connecting plate 101 and is located above the connecting plate 101. The motor 104 is detachably connected to the connecting plate 101 and is located above the connecting plate 101. The screw 105 is detachably connected to the motor 104 and passes through the placing plate 102. The threads at both ends of 105 rotate in opposite directions, the moving block 106 is threadedly connected to the screw rod 105 and wraps the screw rod 105, one end of the swing rod 107 is rotatably connected to the moving block 106 and is located above the moving block 106, the moving rod 108 is rotatably connected to the swing rod 107 and is located at the other end of the swing rod 107, the motor 104 is started to drive the screw rod 105 to rotate, and the moving block 106 is driven to move by the threads at both ends of the screw rod 105 rotating in opposite directions, so that the swing rod 107 drives the moving rod 108 to swing, and when the moving rod 108 swings, it will drive the rotating shaft 109 to rotate, so that the auxiliary rod 110 swings, and drives the positioning roller 112 to position and align the wafer, thereby solving the technical problems that the alignment process is more complicated, the overall cost of the device is higher, and it is more cumbersome in actual application.

[0027] The second embodiment of the present application is:

[0028] Based on the first embodiment, please refer to Figure 4 , Figure 4 It is a structural schematic diagram of the second embodiment of the utility model.

[0029] The utility model provides an alignment device for pre-adjusting the wafer position, which also includes a positioning rod 1 201, a positioning rod 202 and a positioning rod 3 203. The above scheme solves the problem in the prior art that it is inconvenient to determine the installation position of the alignment device for pre-adjusting the wafer position when installing it.

[0030] Among them, the positioning rod 1 201 is fixedly connected to the connecting plate 101 and is located below the connecting plate 101, the positioning rod 202 is fixedly connected to the connecting plate 101 and is located below the connecting plate 101, and the positioning rod 3 203 is fixedly connected to the connecting plate 101 and is located below the connecting plate 101. When fixing the fixing plate 113, the position of the fixing plate 113 can be determined by the positioning rod 1 201, the positioning rod 202 and the positioning rod 3 203, thereby facilitating the fixation of the alignment device for pre-adjusting the wafer position.

[0031] An alignment device for pre-adjusting the wafer position is used in the present embodiment. By setting a positioning rod 1 201, a positioning rod 202 and a positioning rod 3 203, the fixing plate 113 can be positioned by the positioning rod 1 201, the positioning rod 202 and the positioning rod 3 203 when installing the alignment device for pre-adjusting the wafer position, thereby facilitating the installation process of the alignment device for pre-adjusting the wafer position, thereby solving the problem of being inconvenient to determine the installation position of the alignment device for pre-adjusting the wafer position when installing it.

[0032] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the utility model.

Claims

1. An alignment device for pre-adjusting the position of a wafer, comprising a connecting plate, a placing plate 1 and a placing plate 2, wherein the placing plate 1 is fixedly connected to the connecting plate and is located above the connecting plate, and the placing plate 2 is fixedly connected to the connecting plate and is located above the connecting plate, characterized in that: It also includes a positioning assembly, which includes a motor, a screw, a moving block, a rocker arm, a moving rod and a moving part. The motor is detachably connected to the connecting plate and is located above the connecting plate. The screw is detachably connected to the motor and passes through the placement plate 1, and the threads at both ends of the screw have opposite rotation directions. The moving block is threadedly connected to the screw and wraps the screw. One end of the rocker arm is rotatably connected to the moving block and is located above the moving block. The moving rod is rotatably connected to the rocker arm and is located at the other end of the rocker arm.

2. The alignment device for pre-adjusting the wafer position according to claim 1, characterized in that: The positioning assembly also includes a rotating shaft, an auxiliary rod, a rotating block and a positioning roller. The rotating shaft is detachably connected to the moving rod and passes through the connecting plate. The auxiliary rod is detachably connected to the rotating shaft and is located below the rotating shaft. The rotating block is rotatably connected to the auxiliary rod and is located below the auxiliary rod. The positioning roller is detachably connected to the rotating block and is located below the rotating block.

3. The alignment device for pre-adjusting the wafer position according to claim 1, characterized in that: The movable component includes a fixed plate, a telescopic rod and a mounting plate, the telescopic rod is detachably connected to the connecting plate and is located above the connecting plate, the fixed plate is detachably connected to the telescopic rod and is located above the telescopic rod, and the mounting plate is fixedly connected to the fixed plate and is located on one side of the fixed plate.

4. The alignment device for pre-adjusting the wafer position as claimed in claim 3, characterized in that: The moving part also includes cylinder one and cylinder two, wherein cylinder one is detachably connected to the fixed plate and is located below the fixed plate, and cylinder two is detachably connected to the fixed plate and is located below the fixed plate, and the output ends of cylinder one and cylinder two are both detachably connected to the connecting plate.

5. The alignment device for pre-adjusting the wafer position according to claim 1, characterized in that: The alignment device for pre-adjusting the wafer position also includes positioning rod one, positioning rod two and positioning rod three. Positioning rod one is fixedly connected to the connecting plate and located below the connecting plate. Positioning rod two is fixedly connected to the connecting plate and located below the connecting plate. Positioning rod three is fixedly connected to the connecting plate and located below the connecting plate.

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