Chip suction nozzle and mounting equipment
By integrated heating components and chip suction of the chip of the heating structure, the problems of chip shift and operation of existing technologies are solved, and the accurate paste and rapid heating and solidification of chips are realized, and the installation efficiency is improved.
Patent Information
- Application Number
- CN202420998557.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-05-09
AI Technical Summary
In the existing chip mount technology, separate heating components cause chip displacement, making it difficult to achieve accurate mounting, and are complex in operation and inefficient in efficiency.
Design a chip suction nozzle that integrates a heating component and a thermally conductive structural member. It absorbs the chip through the effective adsorption surface of the thermally conductive structural member and transfers the heat generated by the heating component to the adhesive layer to achieve precise heating and solidification of the chip.
The precise paste and rapid heating and solidification of the chip are achieved, the chip is shifted, the operation is simplified, and the installation efficiency is improved.
Smart Images
Figure CN222394793U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip packaging technology, and in particular to a chip suction nozzle and mounting equipment. Background Art
[0002] At present, in the semiconductor chip mounting, the chip to be packaged is often sucked up by a suction nozzle and transferred to the top of the packaging substrate, and then the chip is fixed on the packaging substrate through the adhesive layer to realize the reliable mounting of the chip. In this process, not only the chip suction nozzle is required to provide extremely strong negative pressure adsorption ability to prevent the chip from falling off the suction nozzle. It is also necessary to use a heating component to heat and cure the adhesive layer between the packaging substrate and the chip to be packaged. The prior art usually uses a separate heating component to heat and cure the adhesive layer on the packaging substrate. The suction nozzle needs to be separated from the chip, and the heating component heats the adhesive layer. This process can easily cause the chip to shift, which is not conducive to precise mounting. In addition, the operation is relatively complicated, which is not conducive to improving the mounting efficiency. Utility Model Content
[0003] The purpose of the present application is to provide a chip suction nozzle and mounting equipment, which can directly use the suction nozzle to achieve heating, which can not only achieve accurate chip mounting, but also effectively improve the mounting efficiency.
[0004] The embodiment of the present application is implemented as follows:
[0005] In the first aspect, an embodiment of the present application provides a chip suction nozzle, comprising a suction nozzle shell and a heating component; a heat-conducting structural component is provided on the suction nozzle shell, and the heat-conducting structural component has an effective adsorption surface that can be bonded to the surface of the chip to be packaged; the heating component is installed on the suction nozzle shell and connected to the heat-conducting structural component, and the heat-conducting structural component can transfer the heat generated by the heating component to the chip to be packaged, so as to heat the adhesive layer in contact with the chip to be packaged.
[0006] As an optional implementation manner, the surface of the chip to be packaged is covered with a UV adhesive layer, and the effective adsorption surface is bonded to the UV adhesive layer.
[0007] As an optional implementation, the nozzle housing has a mounting plate, and a UV light source is disposed on the mounting plate for projecting light toward the effective adsorption surface.
[0008] As an optional implementation, the heat-conducting structural member is a glass structural member, so that the light projected by the UV light source can pass through the effective adsorption surface to irradiate the UV adhesive layer.
[0009] As an optional implementation, the main optical axis of the UV light source is perpendicular to the effective adsorption surface.
[0010] As an optional implementation, a light shielding sleeve is provided in the nozzle housing, the light shielding sleeve is arranged around the main optical axis of the UV light source, and the projection of the light shielding sleeve along the main optical axis direction is located at the periphery of the effective adsorption surface.
[0011] As an optional embodiment, the suction nozzle shell and the heat-conducting structural part form an internal chamber, and the effective adsorption surface is provided with connecting air holes, and the connecting air holes connect the external environment and the internal chamber; it also includes a negative pressure module connected to the internal chamber, and the negative pressure module can generate a force to absorb the chip to be packaged through the connecting air holes, so that the effective adsorption surface is in contact with the surface of the chip to be packaged.
[0012] As an optional implementation, the heat-conducting structure is a cover structure, the effective adsorption surface is located on the bottom surface of the cover structure, and the heating component is attached to the side wall of the cover structure.
[0013] As an optional implementation, a plurality of spaced-apart communicating air holes are provided on the effective adsorption surface.
[0014] In the second aspect, an embodiment of the present application provides a mounting device, including the above-mentioned chip suction nozzle and a moving device; the moving device can drive the chip suction nozzle to move above the chip to be packaged, and after the chip suction nozzle sucks the chip, the moving device can drive the chip suction nozzle to move to the packaging substrate to place the chip.
[0015] Preferably, the chip suction nozzle provided in the embodiment of the present application includes a suction nozzle shell and a heating component; the suction nozzle shell is provided with a heat-conducting structure, and the heat-conducting structure has an effective adsorption surface that can be bonded to the surface of the chip to be packaged; the heating component is installed on the suction nozzle shell and connected to the heat-conducting structure, and the heat-conducting structure can transfer the heat generated by the heating component to the chip to be packaged, so as to heat the adhesive layer in contact with the chip to be packaged. The surface of the chip to be packaged is covered with a UV adhesive layer, and the effective adsorption surface is bonded to the UV adhesive layer. The suction nozzle shell has a mounting plate, and a UV light source is provided on the mounting plate to project light toward the effective adsorption surface.
[0016] The beneficial effects of the embodiments of the present application include:
[0017] In the first aspect, the embodiment of the present application provides a chip suction nozzle, including a suction nozzle shell and a heating component; the suction nozzle shell provided by the embodiment of the present application is provided with a heat-conducting structure, and the heat-conducting structure has an effective adsorption surface that can be attached to the surface of the chip to be packaged; the heating component of the embodiment of the present application is installed on the suction nozzle shell and connected to the heat-conducting structure, and the heat-conducting structure can transfer the heat generated by the heating component to the chip to be packaged, which is used to heat the adhesive layer in contact with the chip to be packaged. The embodiment of the present application can adsorb the chip to be packaged through the effective adsorption surface of the heat-conducting structure, and the chip suction nozzle provided by the embodiment of the present application can realize adsorption and heating of the chip to be packaged, adsorb the chip to be packaged through the effective adsorption surface, and transfer it to the packaging substrate, so that the surface of the chip to be packaged away from the heat-conducting structure is adhered to the adhesive layer on the packaging substrate, and the heating component can cure the adhesive layer by heating to achieve accurate fixation of the chip to be packaged. The embodiment of the present application can realize adsorption and heating through the chip suction nozzle, avoid the displacement of the chip to be packaged due to switching the heating component, so it is conducive to the accurate fixation of the chip to be packaged, and also conducive to rapid heating and curing.
[0018] On the second aspect, the embodiment of the present application provides a mounting device, including the above-mentioned chip suction nozzle and a moving device; the moving device of the embodiment of the present application can drive the chip suction nozzle to move above the chip to be packaged, and after the chip suction nozzle sucks the chip, the moving device can drive the chip suction nozzle to move to the packaging substrate to place the chip. The embodiment of the present application can adsorb the chip to be packaged through the effective adsorption surface on the chip suction nozzle. The embodiment of the present application can move the chip to be packaged to the packaging substrate through the moving device, and make the chip to be packaged and bonded to the adhesive layer. The mounting equipment provided by the embodiment of the present application can not only realize the precise mounting of the chip to be packaged, but also greatly improve the mounting production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0020] Figure 1 This is one of the structural schematic diagrams of the chip suction nozzle of the embodiment of the present application;
[0021] Figure 2 This is the second structural schematic diagram of the chip suction nozzle of the embodiment of the present application;
[0022] Figure 3 This is the third structural diagram of the chip nozzle of the embodiment of the present application;
[0023] Figure 4 This is the fourth structural schematic diagram of the chip suction nozzle according to the embodiment of the present application.
[0024] icon:
[0025] 100-chip suction nozzle; 101-suction nozzle shell; 102-heating component; 103-heat-conducting structural part; 104-effective adsorption surface; 105-chip to be packaged; 106-adhesive layer; 107-UV adhesive layer; 108-mounting board; 109-UV light source; 110-light shielding cover; 111-internal chamber; 112-connecting air hole; 113-cover structure. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0029] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0030] At present, in the semiconductor chip mounting, the chip to be packaged 105 is often sucked up by a suction nozzle and transferred to the top of the packaging substrate, and then the chip is fixed on the packaging substrate by the adhesive layer 106 to achieve reliable chip mounting. In this process, not only is the chip suction nozzle 100 required to provide extremely strong negative pressure adsorption capabilities to prevent the chip from falling off the suction nozzle. It is also necessary to use a heating component 102 to heat and cure the adhesive layer 106 between the packaging substrate and the chip to be packaged 105. The prior art usually uses a separate heating component 102 to heat and cure the adhesive layer 106 on the packaging substrate. The suction nozzle needs to be separated from the chip, and the heating component 102 heats the adhesive layer 106. This process can easily cause the chip to shift, which is not conducive to precise mounting. In addition, the operation is relatively complicated, which is not conducive to improving mounting efficiency.
[0031] In order to solve the above technical problems, the embodiment of the present application provides a chip suction nozzle 100 and a mounting device.
[0032] Reference Figure 1 , Figure 2 As shown, the embodiment of the present application provides a chip suction nozzle 100, including a suction nozzle shell 101 and a heating component 102; a heat-conducting structure 103 is provided on the suction nozzle shell 101, and the heat-conducting structure 103 has an effective adsorption surface 104 that can be bonded to the surface of the chip 105 to be packaged; the heating component 102 is installed on the suction nozzle shell 101 and connected to the heat-conducting structure 103, and the heat-conducting structure 103 can transfer the heat generated by the heating component 102 to the chip to be packaged 105, so as to heat the adhesive layer 106 in contact with the chip to be packaged 105.
[0033] It should be noted that the chip suction nozzle 100 provided in the embodiment of the present application forms a negative pressure to absorb the chip to be packaged 105 through the effective suction surface 104 on the heat conductive structure 103. The negative pressure suction force is generated by a negative pressure pump or other device, so that the chip to be packaged 105 can be attached to the effective suction surface 104.
[0034] The magnitude of the negative pressure generated by the effective adsorption surface 104 can be set by those skilled in the art as required, and is not particularly limited thereto.
[0035] It should be noted that the adhesive layer 106 is a thermosetting glue. The chip to be packaged 105 may be an ultra-thin chip that is not pressure-resistant and cannot be washed, such as a memory chip in a microphone. The chip to be packaged 105 may also be other types of chips, which can be selected by those skilled in the art according to their needs, and there is no special limitation on this.
[0036] It should be noted that the heating component 102 may be an electric heating wire or other heating components 102 .
[0037] Reference Figure 1 , Figure 2 As shown, the chip suction nozzle 100 provided in the embodiment of the present application includes a suction nozzle shell 101 and a heating component 102; the suction nozzle shell 101 provided in the embodiment of the present application is provided with a heat-conducting structure 103, and the heat-conducting structure 103 has an effective adsorption surface 104 that can be bonded to the surface of the chip 105 to be packaged; the heating component 102 of the embodiment of the present application is installed on the suction nozzle shell 101 and connected to the heat-conducting structure 103, and the heat-conducting structure 103 can transfer the heat generated by the heating component 102 to the chip 105 to be packaged, so as to heat the adhesive layer 106 in contact with the chip 105 to be packaged.
[0038] The embodiment of the present application can adsorb the chip 105 to be packaged through the effective adsorption surface 104 of the heat-conducting structure 103. The chip suction nozzle 100 provided in the embodiment of the present application can realize the adsorption and heating of the chip 105 to be packaged. The chip 105 to be packaged is adsorbed through the effective adsorption surface 104 and transferred to the packaging substrate, so that the surface of the chip 105 to be packaged facing away from the heat-conducting structure 103 is adhered to the adhesive layer 106 on the packaging substrate. The heating component 102 can cure the adhesive layer 106 by heating to achieve precise fixation of the chip 105 to be packaged.
[0039] The embodiment of the present application can achieve adsorption and heating through the chip suction nozzle 100, avoiding the displacement of the chip 105 to be packaged due to switching the heating component 102, thereby facilitating the precise fixation of the chip 105 to be packaged and also facilitating rapid heating and curing.
[0040] Reference Figure 2 As shown, as an optional implementation, the surface of the chip 105 to be packaged is covered with a UV adhesive layer 107 , and the effective adsorption surface 104 is bonded to the UV adhesive layer 107 .
[0041] Furthermore, in the embodiment of the present application, a UV adhesive layer 107 is covered on the surface of the chip 105 to be packaged.
[0042] It should be noted that the UV adhesive layer 107 covers the side in contact with the effective adsorption surface 104. The UV adhesive layer 107 of the embodiment of the present application is laid in the wafer processing stage, that is, the UV adhesive layer 107 is covered before the wafer is cut. The embodiment of the present application can protect the surface of the chip 105 to be packaged through the UV adhesive layer 107, effectively preventing the front of the chip from being contaminated or scratched by particles, thereby greatly improving the chip packaging yield.
[0043] Reference Figure 1 , Figure 2 As shown, as an optional implementation, the side of the UV adhesive layer 107 in the embodiment of the present application facing away from the chip is covered with a backing adhesive, so that the UV adhesive layer 107 can be reliably bonded to the effective adsorption surface 104, facilitating the separation of the UV adhesive layer 107 from the chip.
[0044] It should be noted that the embodiment of the present application can bond the chip to be packaged 105 to the effective adsorption surface 104 of the chip suction nozzle 100 through the UV adhesive layer 107. The adhesive force formed by the UV adhesive layer 107 can enhance the gripping force of the chip suction nozzle 100 on the chip to be packaged 105.
[0045] Reference Figure 2 , Figure 3 As shown, as an optional embodiment, the nozzle housing 101 has a mounting plate 108 , and a UV light source 109 is disposed on the mounting plate 108 for projecting light toward the effective adsorption surface 104 .
[0046] Furthermore, in the embodiment of the present application, a UV light source 109 is disposed on the mounting plate 108 .
[0047] It should be noted that, refer to Figure 1 As shown, in the embodiment of the present application, the UV light source 109 irradiates the UV adhesive layer 107 bonded to the chip to be packaged 105, and the UV adhesive layer 107 can be separated from the chip to be packaged 105 by irradiating for a preset time. After the UV debonding is completed, the effective adsorption surface 104 can release negative pressure to absorb the UV adhesive layer 107, and remove the UV adhesive layer 107 from above the chip to be packaged 105, and separate the UV adhesive layer 107 from the effective adsorption surface 104 by blowing or removing the negative pressure.
[0048] As an optional implementation, the heat-conducting structural member 103 is a glass structural member, so that the light projected by the UV light source 109 can pass through the effective adsorption surface 104 to irradiate the UV adhesive layer 107 .
[0049] Further, the heat-conducting structural member 103 of the embodiment of the present application is a glass structural member. It should be noted that the glass structural member is made of transparent material, and the light projected by the UV light source 109 can pass through the effective adsorption surface 104 to irradiate the UV adhesive layer 107. It should be noted that the glass structural member has a high light transmittance, so that the UV light source 109 can effectively irradiate the UV adhesive layer 107, shorten the illumination time, and improve efficiency.
[0050] Preferably, the main optical axis of the UV light source 109 is perpendicular to the effective adsorption surface 104 , so that the light generated by the UV light source 109 can effectively irradiate the UV adhesive layer 107 , which is beneficial to further improve the irradiation intensity.
[0051] Reference Figure 3 As shown, as an optional embodiment, a light shielding sleeve 110 is provided in the nozzle housing 101 , and the light shielding sleeve 110 is arranged around the main optical axis of the UV light source 109 , and the projection of the light shielding sleeve 110 along the main optical axis direction is located at the periphery of the effective adsorption surface 104 .
[0052] Furthermore, in the embodiment of the present application, a shading cover 110 is provided in the nozzle shell 101. The shading cover 110 can not only focus light to enhance the illumination intensity of the UV light source 109 on the UV adhesive layer 107, but also effectively prevent the light generated by the UV light source 109 from emitting from the side wall of the glass structure.
[0053] Reference Figure 2 , Figure 4 As shown, as an optional embodiment, the nozzle shell 101 and the heat-conducting structure 103 form an internal chamber 111, and a connecting air hole 112 is provided on the effective adsorption surface 104, and the connecting air hole 112 connects the external environment with the internal chamber 111; it also includes a negative pressure module connected to the internal chamber 111, and the negative pressure module can generate a force to absorb the chip to be packaged 105 through the connecting air hole 112, so that the effective adsorption surface 104 is in contact with the surface of the chip to be packaged 105.
[0054] In the embodiment of the present application, a negative pressure module is used to form a negative pressure force to achieve suction of the chip 105 to be packaged.
[0055] Reference Figure 4 As shown, as an optional embodiment, the heat-conducting structure 103 is a cover structure 113, the effective adsorption surface 104 is located on the bottom surface of the cover structure 113, and the heating component 102 is attached to the side wall of the cover structure 113. The effective adsorption surface 104 is provided with a plurality of spaced communicating air holes 112.
[0056] It should be noted that when the cover structure 113 is made of a transparent material, the communicating air holes 112 are arranged on the bottom surface of the cover structure 113. The size of the effective adsorption surface 104 can be set by those skilled in the art as required, and is not particularly limited thereto.
[0057] An embodiment of the present application provides a mounting device, including the above-mentioned chip suction nozzle 100 and a moving device; the moving device can drive the chip suction nozzle 100 to move above the chip to be packaged 105. After the chip suction nozzle 100 sucks the chip, the moving device can drive the chip suction nozzle 100 to move to the packaging substrate to place the chip.
[0058] The mounting equipment provided in the embodiment of the present application includes the above-mentioned chip suction nozzle 100 and a moving device; the moving device in the embodiment of the present application can drive the chip suction nozzle 100 to move above the chip to be packaged 105. After the chip suction nozzle 100 sucks the chip, the moving device can drive the chip suction nozzle 100 to move to the packaging substrate to place the chip. The embodiment of the present application can adsorb the chip to be packaged 105 through the effective adsorption surface 104 on the chip suction nozzle 100. The embodiment of the present application can move the chip to be packaged 105 to the packaging substrate through the moving device, and make the chip to be packaged 105 and the adhesive layer 106 bonded and adhered. The mounting equipment provided in the embodiment of the present application can not only realize the precise mounting of the chip to be packaged 105, but also greatly improve the mounting production efficiency.
[0059] Better, refer to Figure 1 , Figure 2 As shown, the chip suction nozzle 100 provided in the embodiment of the present application includes a suction nozzle shell 101 and a heating component 102; a heat-conducting structure 103 is provided on the suction nozzle shell 101, and the heat-conducting structure 103 has an effective adsorption surface 104 that can be bonded to the surface of the chip 105 to be packaged; the heating component 102 is installed on the suction nozzle shell 101 and connected to the heat-conducting structure 103, and the heat-conducting structure 103 can transfer the heat generated by the heating component 102 to the chip 105 to be packaged, so as to heat the adhesive layer 106 in contact with the chip 105 to be packaged. The surface of the chip 105 to be packaged is covered with a UV adhesive layer 107, and the effective adsorption surface 104 is bonded to the UV adhesive layer 107. The suction nozzle shell 101 has a mounting plate 108, and a UV light source 109 is provided on the mounting plate 108 to project light toward the effective adsorption surface 104.
[0060] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A chip suction nozzle, characterized in that: The invention comprises a nozzle shell (101) and a heating component (102); the nozzle shell (101) is provided with a heat-conducting structural component (103), and the heat-conducting structural component (103) has an effective adsorption surface (104) that can be bonded to the surface of a chip (105) to be packaged; the heating component (102) is installed on the nozzle shell (101) and connected to the heat-conducting structural component (103), and the heat-conducting structural component (103) can transfer the heat generated by the heating component (102) to the chip (105) to be packaged, so as to heat the adhesive layer (106) in contact with the chip (105) to be packaged.
2. The chip suction nozzle according to claim 1, characterized in that: The surface of the chip (105) to be packaged is covered with a UV adhesive layer (107), and the effective adsorption surface (104) is bonded to the UV adhesive layer (107).
3. The chip suction nozzle according to claim 2, characterized in that: The nozzle housing (101) has a mounting plate (108), and a UV light source (109) is arranged on the mounting plate (108) for projecting light toward the effective adsorption surface (104).
4. The chip suction nozzle according to claim 3, characterized in that: The heat-conducting structural component (103) is a glass structural component, so that the light projected by the UV light source (109) can pass through the effective adsorption surface (104) to irradiate the UV adhesive layer (107).
5. The chip suction nozzle according to claim 3, characterized in that: The main optical axis of the UV light source (109) is perpendicular to the effective adsorption surface (104).
6. The chip suction nozzle according to claim 3, characterized in that: A light shielding sleeve (110) is arranged in the nozzle housing (101), the light shielding sleeve (110) is arranged around the main optical axis of the UV light source (109), and the projection of the light shielding sleeve (110) along the main optical axis direction is located at the periphery of the effective adsorption surface (104).
7. The chip nozzle according to any one of claims 1 to 6, characterized in that: The nozzle shell (101) and the heat-conducting structural member (103) form an internal chamber (111); the effective adsorption surface (104) is provided with a communicating air hole (112), and the communicating air hole (112) connects the external environment with the internal chamber (111); and also includes a negative pressure module connected to the internal chamber (111), and the negative pressure module can generate a force to absorb the chip to be packaged (105) through the communicating air hole (112), so that the effective adsorption surface (104) and the surface of the chip to be packaged (105) are fitted.
8. The chip suction nozzle according to claim 7, characterized in that: The heat-conducting structural component (103) is a cover structure (113), the effective adsorption surface (104) is located on the bottom surface of the cover structure (113), and the heating component (102) is attached to the side wall of the cover structure (113).
9. The chip suction nozzle according to claim 8, characterized in that: The effective adsorption surface (104) is provided with a plurality of communicating air holes (112) arranged at intervals.
10. A mounting device, characterized in that: It comprises the chip suction nozzle (100) as described in any one of claims 1 to 9 and a moving device; the moving device can drive the chip suction nozzle (100) to move above the chip (105) to be packaged, and after the chip suction nozzle (100) sucks the chip, the moving device can drive the chip suction nozzle (100) to move to the packaging substrate to place the chip.