Fixing device for die bonder

Abstract

The utility model discloses a fixing device for a die bonder, comprising: a plurality of fixing mechanisms, a rotating assembly and a base, the plurality of fixing mechanisms are arranged on the rotating assembly in an array, the plurality of fixing mechanisms are detachably connected with the rotating assembly, the rotating assembly is rotatably connected with the base, and the rotating assembly is detachably connected with the base. A driving assembly is arranged in the base, and the rotating assembly is connected with the driving assembly. The whole device is installed at the corresponding position of a die bonder, the fixing mechanisms with the corresponding number are installed on the rotating assembly according to the machining procedure of a workpiece to be machined, a corresponding control program is preset in the die bonder, the driving assembly in the base drives the rotating assembly, the rotating assembly drives the fixing mechanisms to rotate to the corresponding machining stations, and the workpiece to be machined is machined. Therefore, the problems that the fixing effect of a fixing device on an existing die bonder is poor, and production of multiple processing procedures of various types of products cannot be met are solved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor packaging equipment, and in particular to a fixing device for a die bonding machine. Background Art

[0002] The die bonder is a mechanical device used to fix crystals and semiconductor packages. It is one of the key devices in the packaging process of LED, chip semiconductors, camera mounting, etc. It has the characteristics of high speed, high precision, and full automation with a visual system.

[0003] The fixing device on the existing die-bonding machine has a poor fixing effect and cannot meet the production of multiple processing steps for various types of products. Utility Model Content

[0004] The main purpose of the present application is to provide a fixing device for a crystal bonding machine, aiming to solve the problem that the fixing device on the existing crystal bonding machine has a poor fixing effect and cannot meet the production of multiple processing steps for various types of products.

[0005] To achieve the above-mentioned purpose, the present application provides a fixing device for a crystal bonding machine, comprising: a fixing mechanism, a rotating assembly and a base, wherein there are a plurality of fixing mechanisms, and an array of the plurality of fixing mechanisms is arranged on the rotating assembly, and a plurality of the fixing mechanisms are detachably connected to the rotating assembly, and the rotating assembly is rotatably connected to the base, and a driving assembly is arranged in the base, and the rotating assembly is connected to the driving assembly.

[0006] Optionally, the fixing mechanism includes: a base and a first limiting component, the base is arranged on the rotating component, the first limiting component is slidably connected to the base, and the first limiting component is provided with a slot corresponding to the workpiece to be processed.

[0007] Optionally, a second limiting component and a third limiting component are further provided on the base, and the second limiting component and the third limiting component are respectively located on two sides of the card slot.

[0008] Optionally, the first limiting assembly includes a limiting head and a sliding member, the sliding member is slidably connected to the base, the limiting head is detachably connected to the sliding member, and the slot is arranged on the limiting head.

[0009] Optionally, a positioning component is provided on the base; wherein the positioning component is used for positioning a recognition mark of a crystal bonding machine.

[0010] Optionally, the number of the fixing mechanisms corresponds to the number of processing stations of the die bonding machine.

[0011] The embodiment of the present application proposes a fixing device for a crystal bonder, comprising: a fixing mechanism, a rotating assembly and a base, wherein there are a plurality of fixing mechanisms, and an array of the plurality of fixing mechanisms is arranged on the rotating assembly, and a plurality of the fixing mechanisms are detachably connected to the rotating assembly, and the rotating assembly is rotatably connected to the base, and a driving assembly is arranged in the base, and the rotating assembly is connected to the driving assembly. The entire device is installed at a corresponding position of the crystal bonder, and a corresponding number of fixing mechanisms are installed on the rotating assembly according to the processing steps of the workpiece to be processed, and a corresponding control program is preset in the crystal bonder, and the rotating assembly is driven by the driving assembly in the base, and the fixing mechanism is driven to rotate to the corresponding processing station by the rotating assembly to complete the corresponding processing step, thereby solving the problem that the fixing device on the existing crystal bonder has a poor fixing effect and cannot meet the production of multiple processing steps of various types of products. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0013] Figure 2 This is a schematic diagram of the main structure of an embodiment of the present application;

[0014] Figure 3 A schematic diagram of a top view of the structure of an embodiment of the present application;

[0015] Figure 4 This is a schematic diagram of the overall structure of the fixing mechanism in the embodiment of the present application;

[0016] Figure 5 It is a schematic diagram of the top view of the fixing mechanism in the embodiment of the present application;

[0017] Legend: 1-fixing mechanism, 2-rotating assembly, 201-base, 202-first limiting assembly, 203-second limiting assembly, 204-third limiting assembly, 205-positioning assembly, 3-base, 4-workpiece to be processed.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0023] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5A fixing device for a crystal bonder comprises: a fixing mechanism 1, a rotating assembly 2 and a base 3, wherein the fixing mechanisms 1 are provided in a plurality, wherein the fixing mechanisms 1 are arranged in an array on the rotating assembly 2, wherein the fixing mechanisms 1 are detachably connected to the rotating assembly 2, wherein the rotating assembly 2 is rotationally connected to the base 3, wherein a driving assembly is arranged in the base 3, wherein the rotating assembly 2 is connected to the driving assembly. In this embodiment, the driving assembly may be a motor, wherein the driving assembly may be connected to the control end of the crystal bonder, wherein the driving assembly is controlled by the control end of the crystal bonder according to a preset control program, wherein the entire device is installed at a corresponding position of the crystal bonder, wherein a corresponding number of fixing mechanisms 1 are installed on the rotating assembly 2 according to the processing procedures of the workpiece 4 to be processed, wherein the corresponding control program is preset in the crystal bonder, wherein the rotating assembly 2 is driven by the driving assembly in the base 3, wherein the fixing mechanism 1 is driven to rotate to the corresponding processing station by the rotating assembly 2, and wherein the corresponding processing procedures are completed, thereby solving the problem that the fixing effect of the fixing device on the existing crystal bonder is poor and the production of multiple processing procedures of various types of products cannot be satisfied.

[0024] In this embodiment, the fixing mechanism 1 includes: a base 201 and a first limiting component 202, wherein the base 201 is disposed on the rotating component 2, the first limiting component 202 is slidably connected to the base 201, and the first limiting component 202 is provided with a slot corresponding to the workpiece 4 to be processed. Figure 4 As shown, the workpiece 4 to be processed is limited and fixed by the slot on the first limiting component 202, and the spatial position of the workpiece 4 to be processed is adjusted by sliding the first limiting component 202 and the base 201 to meet actual processing requirements.

[0025] In this embodiment, the base 201 is further provided with a second limiting assembly 203 and a third limiting assembly 204, which are respectively located on both sides of the slot. The second limiting assembly 203 and the third limiting assembly 204 can further limit both sides of the workpiece 4 to enhance the limiting and fixing effect.

[0026] In this embodiment, the first limit assembly 202 includes a limit head and a sliding member, the sliding member is slidably connected to the base 201, the limit head is detachably connected to the sliding member, and the card slot is arranged on the limit head. The corresponding limit head can be replaced according to the model of the workpiece 4 to meet the requirements of limiting and fixing the workpiece 4 to be processed.

[0027] In this embodiment, a positioning assembly 205 is provided on the base 201, wherein the positioning assembly 205 is used for positioning the identification mark of the die bonder. The positioning assembly 205 cooperates with the laser sensor or the visual system on the die bonder to position the fixing mechanism 1, thereby improving the positioning accuracy.

[0028] In this embodiment, the number of the fixing mechanisms 1 corresponds to the number of processing stations of the die bonding machine. Each processing station corresponds to a fixing mechanism 1, which meets the requirements of continuous processing.

[0029] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A fixing device for a crystal bonding machine, characterized in that: include: A fixing mechanism (1), a rotating assembly (2) and a base (3), wherein the fixing mechanism (1) is in plurality, the plurality of fixing mechanisms (1) are arranged in an array on the rotating assembly (2), the plurality of fixing mechanisms (1) are detachably connected to the rotating assembly (2), the rotating assembly (2) is rotatably connected to the base (3), a driving assembly is arranged in the base (3), the rotating assembly (2) is connected to the driving assembly, and the fixing mechanism (1) comprises: a base (201) and a first A limit assembly (202), wherein the base (201) is arranged on the rotating assembly (2), the first limit assembly (202) is slidably connected to the base (201), the first limit assembly (202) is provided with a slot corresponding to the workpiece (4) to be processed, and the base (201) is also provided with a second limit assembly (203) and a third limit assembly (204), wherein the second limit assembly (203) and the third limit assembly (204) are respectively located on two sides of the slot.

2. The fixing device for a crystal bonding machine according to claim 1, characterized in that: The first limiting assembly (202) comprises a limiting head and a sliding member, the sliding member is slidably connected to the base (201), the limiting head is detachably connected to the sliding member, and the slot is arranged on the limiting head.

3. The fixing device for a die bonding machine according to claim 1, characterized in that: A positioning component (205) is arranged on the base (201); wherein the positioning component (205) is used for positioning a crystal bonding machine identification mark.

4. The fixing device for a die bonding machine according to claim 1, characterized in that: The number of the fixing mechanisms (1) corresponds to the number of processing stations of the crystal bonding machine.

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