Circuit board assembly and camera module
By designing the supporting parts of the golden line and the fence from the overflow of glue, the problem of golden line collapse and glue overflowing in the COB solution improves the performance and reliability of the camera module.
Patent Information
- Application Number
- CN202420803540.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-04-18
AI Technical Summary
In the COB solution, the weight of FOG glue is prone to collapse the gold wire, causing the gold wire to collapse and deform, affecting the performance of the camera module. At the same time, the glue has strong fluidity and is prone to spilling and contaminating other components.
A lineboard component is designed, including the sensitivity component, protective component and packaging rubber layer. Protective components support the golden line through supporting parts to avoid collapse, and to prevent the glue overflow of the packaging layer through the column parts.
Effectively avoid the problem of the collapse of the golden line and the overflow of glue, improve the performance and reliability of the camera module, while reducing production costs.
Smart Images
Figure CN222395752U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of camera modules, in particular to a circuit board component and a camera module. Background Art
[0002] With the development of camera technology and the improvement of consumers' requirements for automobile quality and reliability, camera modules are gradually being used in automobiles. Although automobile cameras can provide many conveniences for consumers, the high price of automobile cameras will also affect consumers' car purchase choices.
[0003] Imaging chips are the core components of camera modules currently used in automobiles. Currently, mainstream camera modules mostly adopt the high-priced BGA (Ball Grid Array) solution, which has caused the price of camera modules to remain high for a long time. More and more camera manufacturers and customers have turned to the lower-priced COB (Chip-On-Board) solution for in-depth research and exploration.
[0004] The COB solution mainly uses gold wire to connect the imaging chip and the circuit board. This solution has a core problem. When using FOG glue to encapsulate the gold wire, the weight of the FOG glue can easily crush the gold wire, causing the gold wire to collapse, resulting in serious deformation of the gold wire and affecting the performance of the camera module. In addition, in order to allow the FOG glue to fill the entire gap between the front and the circuit board, the FOG glue has strong fluidity and is easy to overflow and contaminate other components. Utility Model Content
[0005] Based on this, it is necessary to provide a circuit board assembly and a camera module to address the problems of gold wire collapse and glue overflow in the existing COB solution.
[0006] A circuit board assembly, comprising:
[0007] A photosensitive component, the photosensitive component comprising a circuit board, a chip mounted on the circuit board, and a plurality of gold wires, the gold wires connecting the chip and the circuit board;
[0008] A protection component, the protection component comprising a support member fixed to the circuit board, the support member being arranged below the gold wire; and
[0009] A packaging glue layer is arranged on the circuit board to fill the gap between the gold wire and the circuit board.
[0010] In one embodiment, the photosensitive component further includes components installed on the circuit board, and the protective component further includes a fence member fixed to the circuit board, the fence member is surrounded by the chip and the gold wire to separate the chip and the components, and the packaging glue layer is filled in the fence member.
[0011] In one of the embodiments, the support member is a first filling glue layer, and the glue aspect ratio of the first filling glue layer is greater than the glue aspect ratio of the packaging glue layer.
[0012] In one embodiment, the first filling glue layer has a supporting surface, the supporting surface extends from the upper surface of the chip toward the circuit board, and the supporting surface is used to support the gold wire.
[0013] In one embodiment, the fence member is a second filling adhesive layer, and the height-to-width ratio of the adhesive of the second filling adhesive layer is greater than the height-to-width ratio of the adhesive of the packaging adhesive layer.
[0014] In one embodiment, the support member and the fence member are both molded structural members.
[0015] In one embodiment, the protection component further includes a plurality of connecting ribs, one end of each connecting rib is connected to the support member, and the other end of each connecting rib is connected to the fence member.
[0016] In one embodiment, the protective component is made of insulating material.
[0017] In one embodiment, the packaging adhesive layer is made of black material.
[0018] A camera module, comprising:
[0019] Camera body; and
[0020] A circuit board assembly as described in any of the above items, wherein the circuit board assembly is installed on the camera body.
[0021] The support member of the circuit board assembly is located below the gold wire, and the support member can support the gold wire so that the gold wire will only be slightly deformed under the weight of the glue of the packaging glue layer, thereby avoiding the problem of gold wire collapse. The fence member can form a dam around the gold wire to prevent the glue of the packaging glue layer from overflowing, thereby protecting other components on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 A three-dimensional schematic diagram of a circuit board assembly provided for one embodiment of the present application;
[0023] Figure 2A schematic top view of a circuit board assembly according to the above embodiment of the present application is shown;
[0024] Figure 3 A side view schematic diagram of a first filling glue layer of a circuit board assembly according to the above embodiment of the present application is shown;
[0025] Figure 4 A side view schematic diagram of a circuit board assembly before filling a packaging glue layer according to the above embodiment of the present application is shown;
[0026] Figure 5 A side view schematic diagram of the circuit board assembly after the packaging glue layer is filled according to the above embodiment of the present application is shown.
[0027] Figure numerals: 10, photosensitive component; 11, circuit board; 12, chip; 13, components; 14, gold wire; 20, protective component; 21, support member; 22, fence member; 23, connecting rib; 24, first filling glue layer; 241, supporting surface; 25, second filling glue layer; 30, packaging glue layer. DETAILED DESCRIPTION
[0028] In order to make the above-mentioned purposes, features and advantages of the utility model more obvious and easy to understand, the specific implementation methods of the utility model are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the utility model. However, the utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the utility model, so the utility model is not limited by the specific embodiments disclosed below.
[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0032] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0033] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.
[0034] For details, please refer to Figures 1 to 5The present application provides a circuit board assembly, which may include a photosensitive component 10, a protective component 20, a plurality of gold wires 14 and a packaging glue layer 30. The photosensitive component 10 may include a circuit board 11, a chip 12 mounted on the circuit board 11, and a plurality of gold wires 14, wherein the gold wires 14 connect the chip 12 and the circuit board 11. The protective component 20 includes a support member 21 fixed to the circuit board 11, wherein the support member 21 is arranged between the chip 12 and the fence member 22. The gold wire 14 connects the chip 12 and the circuit board 11, and the support member 21 is arranged below the gold wire 14. The packaging glue layer 30 is arranged on the circuit board 11 to fill the gap between the gold wire 14 and the circuit board 11. The packaging glue layer 30 can be formed by filling glue. The glue of the packaging glue layer 30 has strong fluidity and can wrap the gold wire 14 and fill the gap between the gold wire 14 and the circuit board 11. The glue of the packaging glue layer 30 can be FOG glue.
[0035] It can be understood that the support member 21 is located below the gold wire 14. When the glue of the packaging glue layer 30 is filled, the support member 21 can support the gold wire 14 so that the gold wire 14 will only be slightly deformed under the weight of the glue of the packaging glue layer 30, thereby avoiding the problem of collapse of the gold wire 14.
[0036] Alternatively, if Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, in one embodiment, the photosensitive component 10 further includes a component 13 mounted on the circuit board 11, and the protective component 20 further includes a fence 22 fixed to the circuit board 11, the fence 22 is arranged around the chip 12 and the gold wire 14 to separate the chip 12 and the component 13, and the packaging glue layer 30 is filled in the fence 22. In this way, the fence 22 can form a dam around the gold wire 14, which can prevent the glue of the packaging glue layer 30 from overflowing, and protect other components 13 on the circuit board 11.
[0037] Alternatively, if Figure 3 , Figure 4 and Figure 5As shown, in one embodiment, the support member 21 is a first filling glue layer 24, and the first filling glue layer 24 can be filled with glue around the chip 12 by dispensing, so as to be bonded to the circuit board 11. After the first filling glue layer 24 is cured, it can support the gold wire 14 to avoid the problem of collapse of the gold wire 14. The glue aspect ratio of the first filling glue layer 24 is greater than the glue aspect ratio of the packaging glue layer 30. The glue aspect ratio is the ratio of the height to the width of the glue after curing. The larger the glue aspect ratio, the less the glue collapses, the thicker the glue, and the lower the fluidity of the glue. The smaller the glue aspect ratio, the thinner the glue and the greater the fluidity of the glue. Since the first filling glue layer 24 needs to maintain a structure that can support the gold wire 14, it needs to have a small fluidity to avoid deformation of the glue of the first filling glue layer 24 before curing, which affects the effect of supporting the gold wire 14. Since the packaging glue layer 30 needs to cover and wrap the gold wire 14 , it needs to have good fluidity to prevent the packaging glue layer 30 formed by the filling glue from failing to completely wrap the gold wire 14 .
[0038] Preferably, if Figure 3 , Figure 4 and Figure 5 As shown, the first filling glue layer 24 has a supporting surface 241, which extends from the upper surface of the chip 12 to the circuit board 11, and the supporting surface 241 is used to support the gold wire 14. When the gold wire 14 is attached to the supporting surface 241 under the gravity pressure of the glue of the packaging glue layer 30, the supporting surface 241 can guide the gold wire 14 to the circuit board 11 to prevent the gold wire 14 from being deformed.
[0039] Optional, such as Figure 4 and Figure 5 As shown, in one embodiment, the fence member 22 is a second filling glue layer 25, and the second filling glue layer 25 can be filled with glue around the support member 21 by dispensing, so as to be bonded to the circuit board 11. After curing, the second filling glue layer 25 can form a barrier to prevent the glue of the encapsulation glue layer 30 from overflowing, so as to protect other components 13 on the circuit board 11. The height-to-width ratio of the glue of the second filling glue layer 25 is greater than the height-to-width ratio of the glue of the encapsulation glue layer 30, so as to avoid deformation of the glue of the second filling glue layer 25 before curing, reduce the height of the barrier, and affect the protective effect of the barrier.
[0040] Alternatively, if Figure 1 and Figure 2 As shown, in one embodiment, the support member 21 and the fence member 22 are both molded structural members, and the molded structural member has the shape of the support member 21 and the fence member 22, and can play a supporting and protective role. The molded structural member can be affixed to the circuit board 11 by SMT, bonding and other process methods.
[0041] Preferably, if Figure 1 and Figure 2 As shown, in one embodiment, the protection component 20 further includes a plurality of connecting ribs 23, one end of each connecting rib 23 is connected to the support member 21, and the other end of each connecting rib 23 is connected to the fence member 22. The connecting rib 23 can connect the support member 21 and the fence member 22, thereby reinforcing the structure of the protection component 20 and facilitating the integral molding of the protection component 20.
[0042] For example, Figure 1 and Figure 2 As shown, in one embodiment, the shape of the support member 21 and the shape of the fence member 22 are both rectangular. In this way, the shape of the support member 21 is more in line with the shape of the chip 12, and the shape of the fence member 22 is more suitable for the arrangement of the gold wire 14, making the structure of the circuit board assembly more compact and neater.
[0043] Alternatively, if Figure 1 and Figure 2 As shown, in one embodiment, one end of the connecting rib 23 is connected to the corner of the support member 21, and the other end of the connecting rib 23 is connected to the corner of the fence member 22. In this way, on the one hand, arranging the connecting rib 23 at the corner can make the structural strength of the protection component 20 higher, and on the other hand, the connecting rib 23 can avoid the gold wire 14 to avoid interference with the gold wire 14.
[0044] Optionally, in one embodiment, the protective component 20 is made of insulating material. In other words, the glue used to form the first filling glue layer 24 and the glue used to form the second filling glue layer 25 are both insulating glue, and the material forming the molded structure is an insulating material. This arrangement can avoid the problem of short circuit of the gold wire 14.
[0045] Since the circuit board 11 structure of the present application solves the problem of gold wire 14 collapse, after the circuit board assembly completes the gold wire 14 welding, it is only necessary to detect the integrity of the gold wire 14 and the pad. Usually, AOI optical inspection equipment is used for automatic inspection during the inspection. Therefore, in one embodiment, the encapsulation glue layer 30 is made of black material. The black sealant layer can prevent the gold wire 14 from generating stray light, so that the gold wire 14 can pass the integrity inspection.
[0046] Furthermore, the present application also provides a camera module, comprising: a camera body and a circuit board assembly as described in any one of the above items, wherein the circuit board assembly is mounted on the camera body. The camera module adopts a COB solution at a lower price, and can solve the problem of gold wire 14 collapse in the COB solution, which can not only ensure the safety and reliability of the camera module, but also reduce the cost of the camera module.
[0047] The technical features of the above embodiment can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above embodiment are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0048] The above embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A circuit board assembly, characterized in that: include: A photosensitive component, the photosensitive component comprising a circuit board, a chip mounted on the circuit board, and a plurality of gold wires, the gold wires connecting the chip and the circuit board; A protection component, the protection component comprising a support member fixed to the circuit board, the support member being arranged below the gold wire; and A packaging glue layer is arranged on the circuit board to fill the gap between the gold wire and the circuit board.
2. The circuit board assembly according to claim 1, characterized in that: The photosensitive component further includes components installed on the circuit board, and the protective component further includes a fence member fixed to the circuit board, the fence member is arranged around the periphery of the chip and the gold wire to separate the chip and the components, and the packaging glue layer is filled in the fence member.
3. The circuit board assembly according to claim 2, characterized in that: The support member is a first filling glue layer, and the glue aspect ratio of the first filling glue layer is greater than the glue aspect ratio of the packaging glue layer.
4. The circuit board assembly according to claim 3, characterized in that: The first filling glue layer has a supporting surface, the supporting surface extends from the upper surface of the chip toward the circuit board, and the supporting surface is used to support the gold wire.
5. The circuit board assembly according to claim 2, characterized in that: The fence piece is a second filling glue layer, and the height-to-width ratio of glue in the second filling glue layer is greater than the height-to-width ratio of glue in the packaging glue layer.
6. The circuit board assembly according to claim 2, characterized in that: The support member and the fence member are both molded structural members.
7. The circuit board assembly according to claim 6, characterized in that: The protection component further includes a plurality of connecting ribs, one end of each connecting rib is connected to the support member, and the other end of each connecting rib is connected to the fence member.
8. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The protective component is made of insulating material.
9. The circuit board assembly according to any one of claims 1 to 7, characterized in that: The packaging adhesive layer is made of black material.
10. A camera module, characterized in that: include: Camera body; and The circuit board assembly as described in any one of claims 1 to 9, wherein the circuit board assembly is mounted on the camera body.