Grounding elastic sheet for SMT (Surface Mount Technology)
By designing the grounded shifts used for SMT patch, using the combined structure of the background welding ground and the squeezing part, the system overlap of the float metal device is realized, and the high cost of the conductive foam grounding method is not as good as the conductive foam. The problem of good suppression of EMI and EMS issues significantly inhibit the EMC and EMS problems.
Patent Information
- Application Number
- CN202420851393.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-04-23
AI Technical Summary
In the prior art, when grounding the floating metal device using conductive foam increases labor cost, and the conductivity performance is poor, so the EMI and EMS problems of EMC cannot be effectively suppressed.
Design a grounding spring for SMT patches, including a PCB board and a chip. The ground spring is reflowed and welded to the PCB. After the floating metal is installed corresponding to the chip, the bottom of the floating metal resists and squeezes the squeezed part. Pressure, the squeezed part will deform, realizing the systematic overlap between PCB board and floating metal.
It achieves effective grounding of floating metal devices, reduces labor cost, improves conductive performance, and significantly suppresses EMI and EMS problems of EMC.
Smart Images
Figure CN222395859U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of surface assembly, in particular to a grounding spring for SMT patches. Background Art
[0002] With the development of current electronic technology, product integration is getting higher and higher, and the structural design of some places cannot be perfectly solved. At present, the most common method used in the industry is to stick conductive foam to connect the floating metal devices to the system ground. Sticking conductive foam will not only increase the number of manual positions, but also the conductive performance of conductive foam is not particularly good, so the EMI and EMS effects of EMC are not perfect. Therefore, we propose a grounding spring for SMT patches. Utility Model Content
[0003] The purpose of the utility model is to solve the shortcomings of the prior art. At present, the most common method used in the industry is to stick conductive foam to connect the floating metal device to the system ground. Sticking conductive foam not only increases the number of manual positions, but also the conductive performance of the conductive foam is not particularly good, so the EMI and EMS effects on EMC are not perfect.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A grounding spring for SMT patch, comprising a PCB board and a chip arranged at the upper end, a grounding spring is reflow-welded at the upper end of the PCB board near the chip, and a floating ground metal is installed on the PCB board;
[0006] The grounding spring consists of a grounding part and an extruded part. The grounding part is reflow-welded on the PCB. After the floating metal corresponds to the chip installation, the bottom of the floating metal contacts and extrudes the extruded part, and the extruded part is deformed so that the PCB and the floating metal are overlapped.
[0007] Furthermore, the grounding spring is made of copper or stainless steel.
[0008] Furthermore, the grounding portion and the extruded portion are integrally formed, the upper end of the extruded portion is in an arc structure and both ends are connected to the grounding portion.
[0009] Compared with the prior art, the beneficial effects of the utility model are:
[0010] The utility model can be used for grounding design with floating metal on PCB circuit board. For some design scenarios where grounding is not possible, when the structure cannot be changed, the floating metal material device can be completely overlapped with the system ground, which can effectively solve the EMC EMI and EMS series problems caused by the floating metal device. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 A schematic diagram of the overall installation structure of a grounding spring for SMT patches provided by the utility model;
[0012] Figure 2 A schematic diagram of the overall structure of a grounding spring for SMT patch provided by the utility model;
[0013] Figure 3 The utility model provides a schematic diagram of a grounding spring structure for SMT patches.
[0014] Legend: 1. PCB board; 2. Chip; 3. Grounding spring; 31. Grounding part; 32. Extruded part; 4. Floating metal. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0016] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0017] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.
[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.
[0019] Example 1
[0020] like Figure 1-3As shown, the utility model provides a technical solution: a grounding spring for SMT patch, comprising a PCB board 1 and a chip 2 arranged at the upper end, a grounding spring 3 is reflow-welded at the upper end of the PCB board 1 near the chip 2, and a floating ground metal 4 is installed on the PCB board 1. The grounding spring 3 can be overlapped with the system ground of the PCB board 1 in products with a small space and a relatively compact structure, thereby solving the EMC EMI radiation emission problem and the EMS radiation interference problem caused by the floating ground metal 4 in the electronic product; the grounding spring 3 is composed of a grounding part 31 and an extruded part 32, the grounding part 31 is reflow-welded on the PCB board 1, and after the floating ground metal 4 is installed corresponding to the chip 2, the bottom of the floating ground metal 4 is pressed against the extruded part 32, and the extruded part 32 is deformed so that the PCB board 1 and the floating ground metal 4 are overlapped.
[0021] Example 2
[0022] like Figure 1-3 As shown, the grounding spring piece 3 is made of copper or stainless steel. The material thickness and material of the grounding spring piece 3 are designed according to requirements. Any material that can be conductively welded can be used according to requirements. The grounding spring piece 3 can be designed to be various specifications such as 0.3, 0.5, 0.7, 0.9 in height to meet the overlapping requirements. The grounding portion 31 and the extruded portion 32 are integrally formed, and the upper end of the extruded portion 32 is an arc structure and both ends are connected to the grounding portion 31.
[0023] Working principle: The grounding spring 3 is attached to the designated position on the PCB board 1 and fixed to the PCB board 1 after reflow soldering. Then, the floating ground metal 4, such as the heat sink installed on the housing, is installed and pressed on the grounding spring 3. By pressing the housing, the grounding spring 3 is deformed to a certain extent, so as to achieve a perfect overlap between the system ground and the floating ground metal 4.
[0024] Compared with the commonly used methods of attaching conductive foam to overlap or attaching absorbing materials to shield, this grounding spring has the following advantages:
[0025] 1) The fit is tighter, thus achieving the best effect;
[0026] 2) Cost reduction (including material cost and labor cost);
[0027] 3) Reduce the required space on the PCB to ensure the grounding effect;
[0028] 4) Perfectly suppress EMC (EMI and EMS).
[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A grounding spring for SMT patch, comprising a PCB board (1) and a chip (2) arranged on the upper end, characterized in that: A grounding spring (3) is reflow-welded on the upper end of the PCB board (1) near the chip (2), and a floating ground metal (4) is installed on the PCB board (1); The grounding spring (3) is composed of a grounding portion (31) and an extruded portion (32). The grounding portion (31) is reflow-welded on the PCB (1). After the floating metal (4) is installed corresponding to the chip (2), the bottom of the floating metal (4) contacts and extrudes the extruded portion (32), causing the extruded portion (32) to deform and thereby completing the overlap between the PCB (1) and the floating metal (4).
2. A grounding spring for SMT patch according to claim 1, characterized in that: The grounding spring (3) is made of copper or stainless steel.
3. The grounding spring for SMT patch according to claim 1, characterized in that: The grounding portion (31) and the extruded portion (32) are integrally formed, and the upper end of the extruded portion (32) is in an arc structure and both ends are connected to the grounding portion (31).