Welding tin stacking prevention structure
By designing the first heat dissipation layer distributed at intervals on the circuit board, the problem of low heat dissipation efficiency and tin accumulation when welding and fixing the power transformer on the inverter circuit board is solved, and the effective flow of solder and efficient heat dissipation of the power transformer are achieved.
Patent Information
- Application Number
- CN202420949498.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-01-24
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing inverter circuit boards have low heat dissipation efficiency when soldering fixed power transformers and are prone to pile tin during the welding process.
A welded anti -pile tin structure is designed, including the first heat sink layer of several interval distribution on the circuit board. The first heat dissipation layer is composed of the heat dissipation department, the welding department and the diversion part. The ministry and the heat dissipation department are used to avoid welding accumulation and improve heat dissipation efficiency.
Effectively avoid the accumulation of welds on the foot, improve the heat dissipation efficiency of the power transformer, and heat dissipation by increasing the heat dissipation area and using the welding of the flowing part.
Smart Images
Figure CN222395867U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit boards, in particular to a welding anti-tin accumulation structure. Background Art
[0002] The functions of power transformers are power transmission, voltage conversion and insulation isolation. As a major soft magnetic electromagnetic component, it is widely used in power supply technology and power electronics technology. Power transformers are essential components in inverter circuits.
[0003] However, the existing structure of welding and fixing the power transformer on the inverter circuit board has the following shortcomings: the power transformer will heat up due to the large amount of heat generated after working for a long time, and the current inverter circuit board mainly installs fans and other heat dissipation equipment for auxiliary heat dissipation. This method is too inefficient and easily causes the power transformer to be overheated due to the inability to dissipate the heat in time; secondly, the power transformer is a pin device, which needs to be welded and fixed by wave soldering. Since the pin distance of the power transformer is short, tin accumulation is easy to occur during the welding process. Therefore, in order to solve the above-mentioned technical problems, the welding anti-tin accumulation structure of the present application is proposed. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a welding anti-tinning structure which can improve the heat dissipation and cooling of the power transformer and prevent the pins of the transformer from being tinned during wave soldering.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A welding anti-tin stacking structure, used for welding a fixed power transformer, comprising:
[0007] A circuit board, the circuit board comprising an insertion surface and a welding surface, the welding surface being provided with a plurality of first heat dissipation layers distributed at intervals, each of the first heat dissipation layers being provided with an insertion hole penetrating the circuit board, and in at least one of the first heat dissipation layers, the first heat dissipation layer comprising a heat dissipation portion, a welding portion and a plurality of shunt portions, the welding portion being arranged around the insertion hole, and the welding portion being connected to the inner wall of the insertion hole, one end of each of the shunt portions being connected to the welding portion, and the other end of each of the shunt portions being connected to the heat dissipation portion, so that a separation area is formed between any two adjacent shunt portions;
[0008] The pins of the power transformer are used to be inserted into the insertion holes one by one from the insertion surface to the welding surface, and when extending from one side of each first heat dissipation layer, the solder welds the pins to the welding parts respectively.
[0009] Optionally, a plurality of second heat dissipation layers distributed at intervals are arranged on the insertion surface, and each of the second heat dissipation layers is respectively connected to each of the first heat dissipation layers.
[0010] Optionally, a heat conduction hole is further provided on the circuit board, and the heat conduction hole is used to be connected to one of the first heat dissipation layers and one of the second heat dissipation layers respectively.
[0011] Optionally, a heat-conducting layer is disposed on the inner side wall of the heat-conducting hole, and the heat-conducting layer is connected to the first heat dissipation layer and the second heat dissipation layer respectively.
[0012] Optionally, the thermal conductive layer, the second heat dissipation layer and the first heat dissipation layer are all tin layer structures.
[0013] Optionally, the first heat dissipation layer has a thickness of 40 μm to 70 μm.
[0014] Optionally, a plurality of the heat conducting holes are provided, and intervals are provided between the heat conducting holes.
[0015] Optionally, the diameter of the heat conducting hole is 0.8 mm to 1 mm.
[0016] Optionally, the width of the diversion portion is 2 mm to 3 mm.
[0017] Optionally, the width of the diversion portion is 2.15 mm to 2.85 mm.
[0018] Compared with the prior art, the utility model has at least the following advantages:
[0019] 1. During wave soldering, when solder solders the pins to the welding part, the excess solder will flow to the heat dissipation part through the shunt parts, thereby effectively avoiding the accumulation of solder on the pins.
[0020] 2. When the power transformer generates heat, the heat can be quickly transferred to the heat dissipation part, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the power transformer. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 This is a schematic structural diagram of a welding anti-tin accumulation structure according to an embodiment of the utility model;
[0023] Figure 2 for Figure 1 A schematic diagram of the local structure of the welding anti-tin stacking structure from another angle
[0024] Figure 3 This is a schematic diagram of the partial structure of the first heat dissipation layer of one embodiment of the utility model;
[0025] Figure 4 It is a schematic diagram of a partial cross-sectional structure of a circuit board according to one embodiment of the utility model.
[0026] Description of reference numerals:
[0027] 10. Welding anti-tin stacking structure; 20. Power transformer; 21. Pin; 100. Circuit board; 110. Insertion surface; 120. Welding surface; 200. First heat dissipation layer; 130. Insertion hole; 210. Heat dissipation part; 220. Welding part; 230. Diverter part; 121. Partition area; 300. Second heat dissipation layer; 140. Thermal hole; 400. Thermal conductive layer. DETAILED DESCRIPTION
[0028] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings show preferred embodiments of the present invention.
[0029] like Figures 1 to 3 As shown, a welding anti-tin stacking structure 10 is used for welding a fixed power transformer 20, which includes a circuit board 100, the circuit board 100 includes an insertion surface 110 and a welding surface 120, a plurality of first heat dissipation layers 200 distributed at intervals are arranged on the welding surface 120, and each first heat dissipation layer 200 is provided with an insertion hole 130 penetrating the circuit board 100, in at least one first heat dissipation layer 200, the first heat dissipation layer 200 includes a heat dissipation portion 210, a welding portion 220 and a plurality of shunt portions 230, and the welding portion 220 is arranged around the insertion hole 130 The soldering part 220 is connected to the inner wall of the insertion hole 130, one end of each shunt part 230 is connected to the soldering part 220, and the other end of each shunt part 230 is connected to the heat dissipation part 210, so that a separation area 121 is formed between any two adjacent shunt parts 230, and each pin 21 of the power transformer 20 is used to be inserted into each insertion hole 130 one by one from the insertion surface 110 to the soldering surface 120, and when it extends from one side of each first heat dissipation layer 200, the solder solders the pin 21 to the soldering part 220 respectively.
[0030] It should be noted that the circuit board 100 has two side surfaces facing each other, one of which is a plug-in surface 110 for installing components such as a power transformer 20, and the other is a welding surface 120 for welding and fixing components such as the power transformer 20. A plurality of independently distributed first heat dissipation layers 200 are arranged in the welding surface 120, and each first heat dissipation layer 200 is attached to the welding surface 120. A plug-in hole 130 penetrating the circuit board 100 is provided in each first heat dissipation layer 200. The plug-in hole 130 is used to allow the pin 21 of the power transformer 20 to pass through. In this way, when the solder solders the pin 21 to the first heat dissipation layer 200, the first heat dissipation layer 200 is electrically connected to the pin 21. Furthermore, at least one first heat dissipation layer 200 is composed of a heat dissipation portion 210, a welding portion 220 and a plurality of shunt portions 230. For example, only one first heat dissipation layer 200 is composed of a heat dissipation portion 210, a welding portion 220, and a plurality of diverter portions 230. Another example is that two first heat dissipation layers 200 are composed of a heat dissipation portion 210, a welding portion 220, and a plurality of diverter portions 230. Another example is that all first heat dissipation layers 200 are composed of a heat dissipation portion 210, a welding portion 220, and a plurality of diverter portions 230. The specific number of first heat dissipation layers 200 composed of a heat dissipation portion 210, a welding portion 220, and a plurality of diverter portions 230 can be specifically set according to actual needs. Further, when the first heat dissipation layer 200 is composed of the heat dissipation part 210, the welding part 220 and a plurality of shunt parts 230, specifically, the welding part 220 is distributed around the outside of the insertion hole 130, the heat dissipation part 210 is located outside the welding part 220, and a gap is provided between the heat dissipation part 210 and the welding part 220, one end of each shunt part 230 is connected to the welding part 220, and the other end of each shunt part 230 is connected to the heat dissipation part 210. In this way, when the solder solders the pin 21 to the welding part 220 during wave soldering, the excess solder will flow to the heat dissipation part 210 through each shunt part 230, thereby effectively preventing the solder from accumulating on each pin 21. Furthermore, since the pin 21 is connected to the heat dissipation part 210, and the heat dissipation part 210 can be set to a structure of indefinite size as needed, when the power transformer 20 generates heat, the heat can be quickly transferred to the heat dissipation part 210, thereby increasing the heat dissipation area and improving the heat dissipation efficiency of the power transformer 20.
[0031] like Figure 1 and Figure 4 As shown, in one embodiment, a plurality of second heat dissipation layers 300 are disposed on the insertion surface 110 and are spaced apart from each other, and each second heat dissipation layer 300 is connected to each first heat dissipation layer 200 , respectively.
[0032] It should be noted that in order to further improve the heat dissipation efficiency of the power transformer 20, a plurality of second heat dissipation layers 300 are also provided on the insertion surface 110, so that each second heat dissipation layer 300 is respectively connected to each first heat dissipation layer 200, thereby further increasing the heat dissipation area and thus improving the heat dissipation efficiency.
[0033] like Figures 1 to 4 As shown, in one embodiment, a heat conducting hole 140 is further provided on the circuit board 100 , and the heat conducting hole 140 is used to be connected to one of the first heat dissipation layers 200 and one of the second heat dissipation layers 300 respectively.
[0034] It should be noted that in order to smoothly connect the first heat dissipation layer 200 and the second heat dissipation layer 300 , a through-hole heat conduction hole 140 is opened on the circuit board 100 , and the first heat dissipation layer 200 and the second heat dissipation layer 300 are connected by the heat conduction hole 140 .
[0035] like Figure 4 As shown, in one embodiment, a heat-conducting layer 400 is disposed on the inner wall of the heat-conducting hole 140 , and the heat-conducting layer 400 is connected to the first heat-dissipating layer 200 and the second heat-dissipating layer 300 , respectively.
[0036] In this way, the first heat dissipation layer 200 and the second heat dissipation layer 300 are connected through the heat conductive layer 400 , so that heat can be transferred to the first heat dissipation layer 200 and the second heat dissipation layer 300 through the heat conductive layer 400 for heat dissipation.
[0037] In one embodiment, the heat conducting layer 400, the second heat dissipation layer 300 and the first heat dissipation layer 200 are all tin layer structures. Further, the heat conducting layer 400, the second heat dissipation layer 300 and the first heat dissipation layer 200 are an integrally formed structure. In this way, good heat conduction can be achieved.
[0038] like Figure 4 As shown, in one embodiment, the thickness D of the first heat dissipation layer 200 is 40 μm to 70 μm. For example, the thickness of the first heat dissipation layer 200 can also be 45 μm, or 50 μm, or 55 μm, or 60 μm, or 65 μm. In this way, setting the first heat dissipation layer 200 to the above thickness range can ensure rapid and effective heat dissipation. Further, in one embodiment, the thickness of the second heat dissipation layer 300 and the heat conductive layer 400 are consistent with the first heat dissipation layer 200.
[0039] Furthermore, in one embodiment, a plurality of heat conducting holes 140 are provided, and intervals are provided between each heat conducting hole 140. Thus, by providing a plurality of heat conducting holes 140, the efficiency of heat transfer from the first heat dissipation layer 200 to the second heat dissipation layer 300 can be improved, thereby improving the heat dissipation efficiency of the power transformer 20.
[0040] In one embodiment, the diameter of the heat conducting hole 140 is 0.8 mm to 1 mm. For example, the diameter of the heat conducting hole 140 can also be 0.9 mm. In this way, the structural strength of the circuit board 100 itself and the heat transfer efficiency of the heat conducting hole 140 can be effectively taken into account.
[0041] like Figure 3 As shown, in one embodiment, the width E of the shunt portion 230 is 2 mm to 3 mm. Furthermore, the width of the shunt portion 230 is 2.15 mm to 2.85 mm. For example, the width of the shunt portion 230 can also be set to 2.2 mm, or 2.3 mm, or 2.4 mm, or 2.5 mm, or 2.6 mm, or 2.7 mm. In this way, setting the width of the shunt portion 230 to the above range can ensure that when the solder is soldering the pin 21 and the soldering portion 220, the excess tin can flow to the heat dissipation portion 210 through each shunt portion 230, and the heat generated by the power transformer 20 can be smoothly transferred to the first heat dissipation layer 200 and the second heat dissipation layer 300 through each shunt portion 230 for heat dissipation.
[0042] It should be noted that the area on the soldering surface 120 other than the first heat dissipation layer 200 is coated with a circuit board insulating green oil layer, so as to ensure that the area other than the first heat dissipation layer 200 is insulated. Similarly, the area on the plug-in surface 110 other than the second heat dissipation layer 300 is also coated with a circuit board insulating green oil layer.
[0043] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A welding anti-tin stacking structure, used for welding a fixed power transformer, characterized in that: include: A circuit board, the circuit board comprising an insertion surface and a welding surface, the welding surface being provided with a plurality of first heat dissipation layers distributed at intervals, each of the first heat dissipation layers being provided with an insertion hole penetrating the circuit board, and in at least one of the first heat dissipation layers, the first heat dissipation layer comprising a heat dissipation portion, a welding portion and a plurality of shunt portions, the welding portion being arranged around the insertion hole, and the welding portion being connected to the inner wall of the insertion hole, one end of each of the shunt portions being connected to the welding portion, and the other end of each of the shunt portions being connected to the heat dissipation portion, so that a separation area is formed between any two adjacent shunt portions; The pins of the power transformer are used to be inserted into the insertion holes one by one from the insertion surface to the welding surface, and when extending from one side of each first heat dissipation layer, the solder welds the pins to the welding parts respectively.
2. The welding anti-tin accumulation structure according to claim 1, characterized in that: A plurality of second heat dissipation layers are arranged on the insertion surface and are distributed at intervals, and each of the second heat dissipation layers is connected to each of the first heat dissipation layers respectively.
3. The welding anti-tin accumulation structure according to claim 2, characterized in that: The circuit board is also provided with heat-conducting holes, and the heat-conducting holes are used to be connected to one of the first heat-dissipating layers and one of the second heat-dissipating layers respectively.
4. The welding anti-tin accumulation structure according to claim 3, characterized in that: A heat-conducting layer is disposed on the inner side wall of the heat-conducting hole, and the heat-conducting layer is connected to the first heat-dissipating layer and the second heat-dissipating layer respectively.
5. The welding anti-tin accumulation structure according to claim 4, characterized in that: The heat-conducting layer, the second heat-dissipating layer and the first heat-dissipating layer are all tin layer structures.
6. The welding anti-tin accumulation structure according to claim 5, characterized in that: The thickness of the first heat dissipation layer is 40 μm to 70 μm.
7. The welding anti-tin accumulation structure according to claim 3, characterized in that: A plurality of heat conduction holes are provided, and intervals are arranged between the heat conduction holes.
8. The welding anti-tin accumulation structure according to claim 3, characterized in that: The diameter of the heat conducting hole is 0.8 mm to 1 mm.
9. The welding anti-tin accumulation structure according to claim 1, characterized in that: The width of the diversion portion is 2 mm to 3 mm.
10. The welding anti-tin accumulation structure according to claim 8, characterized in that: The width of the diversion portion is 2.15 mm to 2.85 mm.