Electric kettle with semiconductor

Abstract

The utility model discloses an electric kettle with a semiconductor. The electric kettle with the semiconductor comprises a kettle body, the bottom of the kettle body is provided with a base, and a containing cavity is formed in the base; the semiconductor module is arranged in the accommodating cavity and is connected with the bottom of the kettle body; the current reversing module is electrically connected to the semiconductor module and used for supplying power to the semiconductor module in the forward direction or the reverse direction so that the semiconductor module can conduct heat dissipation or heating on the kettle body. According to the electric kettle, the characteristics of a semiconductor are utilized to drive the current reversing module to supply power to the semiconductor module in the forward direction or the reverse direction, so that the semiconductor module is cooled or heated, the kettle body is cooled or heated, the cooling or heating efficiency of the kettle body is improved, and the service life of the kettle body is prolonged. Therefore, the kettle body has good heat dissipation and heating performance at the same time, and better use experience is provided for a user.

Description

Technical Field

[0001] The utility model relates to the field of kettles, in particular to an electric kettle with a semiconductor. Background Art

[0002] At present, electric kettles generally have a heating unit that can heat the liquid in the kettle. The most common method is to boil tap water. However, the boiled water cannot be drunk immediately due to its high temperature. Generally, it can only be allowed to dissipate heat naturally until the water temperature drops to a suitable range before it can be drunk. Especially in the hot summer, affected by the high temperature of the environment, the natural heat dissipation of the liquid in the kettle becomes particularly slow, which brings a poor user experience; some users choose to pour the high-temperature liquid into other containers and then store them in the refrigerator to cool the liquid quickly, but during the pouring process, the high-temperature liquid is easy to splash onto the user, causing the user to be scalded. Therefore, it is necessary to invent an electric kettle that can have both heat dissipation and heating functions. Utility Model Content

[0003] In order to overcome at least one of the defects of the prior art described above, the utility model provides an electric kettle with a semiconductor, which has good heat dissipation and heating performance.

[0004] An electric kettle with a semiconductor according to an embodiment of the utility model comprises: a kettle body, wherein a base is provided at the bottom of the kettle body, and a receiving cavity is provided in the base; a semiconductor module, wherein the semiconductor module is provided in the receiving cavity and connected to the bottom of the kettle body; and a current commutation module, wherein the current commutation module is electrically connected to the semiconductor module and is used for supplying forward or reverse power to the semiconductor module so that the semiconductor module dissipates heat or heats the kettle body.

[0005] In the electric kettle with semiconductors, the characteristics of semiconductors are utilized to drive the current switching module to supply forward or reverse power to the semiconductor module, so that the semiconductor module can cool or generate heat, thereby dissipating heat or heating the kettle body, thereby improving the heat dissipation or heating efficiency of the kettle body, so that the kettle body has good heat dissipation and heating performance at the same time, so as to provide users with a better user experience.

[0006] According to some embodiments of the present invention, the accommodating cavity further accommodates a heating module, and the heating module is connected to the bottom of the kettle body.

[0007] According to some embodiments of the present invention, the semiconductor module includes a semiconductor board and a power supply cable, the semiconductor board is connected to the bottom of the kettle body, and the current switching module is electrically connected to the semiconductor board through the power supply cable.

[0008] According to some embodiments of the present invention, the heating module includes a heating body, which surrounds the outer side of the semiconductor board and is connected to the bottom of the kettle body.

[0009] According to some embodiments of the present invention, a heat sink is further included, and the heat sink is connected to the bottom of the semiconductor board.

[0010] According to some embodiments of the present invention, at least one ventilation hole is formed at the bottom of the base, and the ventilation hole is arranged opposite to the heat sink.

[0011] According to some embodiments of the present invention, the bottom of the base protrudes outward to form a cushion block.

[0012] According to some embodiments of the present invention, the kettle body is made of heat-conducting material.

[0013] According to some embodiments of the present invention, a heat-insulating outer shell is further included, wherein the heat-insulating outer shell is sleeved on the outer side of the kettle body, and a heat-insulating cavity is formed between the heat-insulating outer shell and the kettle body.

[0014] According to some embodiments of the utility model, at least one heat dissipation port is provided on the heat-insulating shell, the heat-insulating cavity is connected to the heat-dissipating port, and the heat-dissipating port cover is provided with a heat-insulating cover plate.

[0015] In summary, the electric kettle with semiconductor provided by the utility model has the following technical effects:

[0016] By utilizing the characteristics of semiconductors, the current switching module is driven to supply forward or reverse power to the semiconductor module, so that the semiconductor module can cool or generate heat, thereby dissipating heat or heating the kettle body, thereby improving the heat dissipation or heating efficiency of the kettle body, so that the kettle body has good heat dissipation and heating performance at the same time, so as to provide users with a better user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of an electric kettle with a semiconductor according to an embodiment of the utility model;

[0018] Figure 2 It is another structural schematic diagram of the electric kettle with semiconductor according to an embodiment of the utility model;

[0019] Figure 3 It is another structural schematic diagram of the electric kettle with semiconductor according to an embodiment of the utility model;

[0020] Figure 4 This is a circuit diagram of a current commutation module according to an embodiment of the present utility model.

[0021] The meanings of the reference numerals are as follows:

[0022] 1. Kettle body; 11. Base; 12. Accommodating cavity; 2. Semiconductor module; 21. Semiconductor board; 22. Power supply cable; 3. Heating module; 31. Heating element; 4. Heat sink; 5. Thermal insulation shell; 6. Thermal insulation cavity. DETAILED DESCRIPTION

[0023] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0024] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0026] See also Figure 1 , Figure 2 and Figure 3 The utility model discloses an electric kettle with a semiconductor. The kettle comprises a kettle body 1, a semiconductor module 2 and a current commutation module. In some embodiments, a base 11 is provided at the bottom of the kettle body 1, and a receiving cavity 12 is provided in the base 11; the semiconductor module 2 is provided in the receiving cavity 12 and connected to the bottom of the kettle body 1; the current commutation module is electrically connected to the semiconductor module 2, and is used to supply power to the semiconductor module 2 in a forward or reverse direction, so that the semiconductor module 2 dissipates heat or heats the kettle body 1. Preferably, the characteristics of semiconductors are utilized to drive the current commutation module to supply power to the semiconductor module 2 in a forward or reverse direction, so that the semiconductor module 2 cools or generates heat, thereby dissipating heat or heating the kettle body 1, thereby improving the efficiency of heat dissipation or heating of the kettle body 1, so that the kettle body 1 has good heat dissipation and heating performance at the same time, so as to provide users with a better use experience.

[0027] Specifically, based on the Peltier Effect of semiconductor materials, when current passes through a pair of electric couples made of two different semiconductor materials, one end thereof absorbs heat and the other end releases heat, thereby achieving a cooling or heating effect. Therefore, the semiconductor module 2 can both cool and heat, thereby heating or dissipating the heat of the kettle body 1. Furthermore, semiconductor materials generally include N-type (higher electron concentration) and P-type (higher hole concentration) semiconductors. Under the action of direct current, electrons flow from the N-type region with higher conductivity to the P-type region with lower conductivity. In this process, the region where the current passes will generate heat due to resistance, thereby causing the temperature to rise, while the region where the current does not pass will have a lower temperature due to reduced resistance, thereby forming a temperature difference. In addition, semiconductors are characterized by having no moving parts, high reliability, and no reliance on refrigerants, and will not cause environmental pollution.

[0028] See also Figure 2 Optionally, the base 11 and the kettle body 1 can be two independent components, and the base 11 is connected to the bottom of the kettle body 1 by one or more of the connection methods such as threaded connection, welding, snap connection and bonding; Optionally, the kettle body 1 and the base 11 can be integrally formed to make the electric kettle have better overall strength, reduce the number of parts, and optimize the assembly process.

[0029] Optionally, the current switching module can be composed of integrated circuits such as chips. Specifically, the current switching module is electrically connected to the public power grid through a power adapter to provide sufficient current and voltage to the semiconductor module 2. At the same time, the current switching module receives command signals from the user through external components such as buttons and / or touch screens, thereby changing the direction of the current transmitted to the semiconductor module 2, so that the semiconductor module 2 generates heat or cools, thereby heating or dissipating heat from the kettle body 1. Optionally, the current switching module can also be powered by the electric kettle's own energy storage module, wherein the energy storage module is a lithium battery or dry cell that can be charged and discharged multiple times.

[0030] Optional, such as Figure 4As shown, the current reversing module includes a power adapter, a contact K1, a contact K2, a contact K3, a contact K4, a contact K5, a switch S1 and an electromagnet T1, the power adapter is electrically connected to the public power grid, the contact K4 is electrically connected to the positive pole of the input end of the semiconductor module 2, the contact K5 is electrically connected to the negative pole of the input end of the semiconductor module 2, and the contact K4 and the contact K5 are moving contacts, one end of the switch S1, the contact K1 and the contact K3 are all electrically connected to the positive pole of the output end of the power adapter, the contact K2 is electrically connected to the negative pole of the output end of the power adapter, and the contact K1, the contact K2 and the contact K3 are static contacts, the other end of the switch S1 is electrically connected to one end of the electromagnet T1, and the other end of the electromagnet is electrically connected to the negative pole of the output end of the power adapter; when the switch S1 is disconnected, the contact K1 and the contact K3 are electrically connected to the positive pole of the output end of the power adapter, and the contact K2 is electrically connected to the negative pole of the output end of the power adapter. The contact K4 is electrically connected, and the contact K2 is electrically connected to the contact K5, so that the positive pole of the output end of the power adapter is electrically connected to the positive pole of the input end of the semiconductor module 2, and the negative pole of the output end of the power adapter is electrically connected to the negative pole of the input end of the semiconductor module 2, so as to realize forward power supply to the semiconductor module 2, so that the semiconductor module 2 is cooled, thereby dissipating the heat of the kettle body 1; when the switch S1 is closed, the electromagnet T1 is energized to generate a magnetic field, driving the contact K2 and the contact K4 to be electrically connected, and the contact K3 is electrically connected to the contact K5, so that the negative pole of the output end of the power adapter is electrically connected to the positive pole of the input end of the semiconductor module 2, and the positive pole of the output end of the power adapter is electrically connected to the negative pole of the input end of the semiconductor module 2, so as to realize reverse power supply to the semiconductor module 2, so that the semiconductor module 2 is heated, thereby heating the kettle body 1.

[0031] See also Figure 1 and Figure 2 In some embodiments, the accommodating cavity 12 further accommodates a heating module 3, and the heating module 3 is connected to the bottom of the kettle body 1. Specifically, when the kettle body 1 is heated, the heating module 3 and the semiconductor module 2 heat the kettle body 1 together to improve the heating efficiency of the kettle body 1. Furthermore, according to actual heating needs, the heating module 3 and the semiconductor module 2 can be driven to heat the kettle body 1 individually or together, so as to provide different heating modes for users.

[0032] See also Figure 1 and Figure 2In some embodiments, the semiconductor module 2 includes a semiconductor board 21 and a power supply cable 22, the semiconductor board 21 is connected to the bottom of the kettle body 1, and the current reversing module is electrically connected to the semiconductor board 21 through the power supply cable 22. Preferably, the semiconductor board 21 is made of semiconductor material, and the current reversing module supplies power to the semiconductor board 21 through the power supply cable 22, so that the semiconductor board 21 performs heating or cooling; optionally, the number of the semiconductor boards 21 may be one or more, and when the number of the semiconductor boards 21 is more than one, the multiple semiconductor boards 21 are connected in parallel with each other, and are electrically connected to the current reversing module through the power supply cable 22, so that the multiple semiconductor boards 21 are all powered by the same current reversing module and can perform heating or cooling at rated voltage. Specifically, when the current commutation module supplies forward power to the semiconductor board 21, the end of the semiconductor board 21 close to the kettle body 1 absorbs heat, and the end of the semiconductor board 21 away from the kettle body 1 releases heat, so that the semiconductor board 21 absorbs the heat of the kettle body 1 to achieve heat dissipation of the kettle body 1. When the current commutation module supplies reverse power to the semiconductor board 21, the end of the semiconductor board 21 close to the kettle body 1 releases heat, and the end of the semiconductor board 21 away from the kettle body 1 absorbs heat, so that the semiconductor board 21 transfers heat to the kettle body 1 to achieve heating of the kettle body 1.

[0033] See also Figure 1 and Figure 2 In some embodiments, the heating module 3 includes a heating element 31, which surrounds the outer side of the semiconductor plate 21 and is connected to the bottom of the kettle body 1. Optionally, the heating element 31 can be an electric heating wire heating element 31, a silicon-molybdenum rod heating element 31, a silicon-carbon rod heating element 31, a lanthanum chromate heating element 31 or a PTC heating element 31, etc. Preferably, the heating element 31 surrounds the outer side of the semiconductor plate 21 so that the heating element 31 that can generate heat stably and the semiconductor plate 21 work in the same area, which can reliably heat the kettle body 1 and improve the heating efficiency of the kettle body 1. Furthermore, the heat generated by the heating element 31 and the semiconductor plate 21 can be transferred outward from the same area, reducing the heat loss during the transfer process and further improving the heating efficiency. Optionally, the base 11 may also be provided with a cable hole, and the power cord of the heating element 31 and the power supply cable 22 are both inserted into the cable hole, so that the power cord of the heating element 31 and the power supply cable 22 are in the same cable hole, thereby reducing the number of openings in the base 11 and being able to gather the cables in the same position, thereby optimizing the cable layout of the equipment.

[0034] See also Figure 1 and Figure 2In some embodiments, a heat sink 4 is further included, and the heat sink 4 is connected to the bottom of the semiconductor board 21. Optionally, the heat sink 4 can be made of aluminum and its alloys or copper and its alloys to improve the heat dissipation capacity of the heat sink 4; optionally, thermal conductive silicone grease can be provided between the heat sink 4 and the semiconductor board 21, so that the heat emitted by the semiconductor board 21 is more effectively transferred to the heat sink 4, and then dissipated to the surrounding air through the heat sink 4. Specifically, when the semiconductor board 21 cools the kettle body 1, the current reversing module supplies positive power to the semiconductor board 21, driving the semiconductor board 21 to absorb heat at one end close to the kettle body 1, thereby absorbing the heat of the kettle body 1 and achieving heat dissipation of the kettle body 1. At the same time, the semiconductor board 21 releases heat at one end away from the kettle body 1. At this time, the heat sink 4 dissipates the heat released by the semiconductor board 21 to the outside to improve the heat dissipation effect of the semiconductor board 21. Furthermore, other heat dissipation devices, such as a fan, may be provided at the bottom of the heat sink 4. The airflow organization formed by the fan during heat dissipation can improve the efficiency of the semiconductor board 21 in dissipating heat to the outside, thereby further optimizing the heat dissipation effect of the heat sink 4.

[0035] In some embodiments, at least one ventilation hole is provided at the bottom of the base 11, and the ventilation hole is arranged opposite to the heat sink 4. Optionally, when the heat sink 4 is dissipating heat, the heat sink 4 can effectively dissipate the heat of the semiconductor board 21 to the outside air through the ventilation hole, thereby improving the heat dissipation effect. Preferably, the bottom of the base 11 is provided with a ventilation hole whose cross-sectional area is larger than the cross-sectional area of ​​the heat sink 4, or the bottom of the base 11 is provided with a plurality of ventilation holes corresponding to the heat sink 4, so as to improve the circulation efficiency between the accommodating cavity 12 and the outside air, promote the heat exchange efficiency between the semiconductor board 21 and the heat sink 4 and the outside air, and thus improve the overall heat dissipation effect.

[0036] In some embodiments, the bottom of the base 11 protrudes outward to form a cushion block. Specifically, the cushion block is formed by the bottom of the base protruding outward, so that there is a gap between the bottom of the base 11 and the placement plane of the electric kettle, thereby ensuring that the air in the accommodating cavity 12 can circulate with the outside air. Further, the shape of the cushion block is not limited. Preferably, the number of the cushion blocks is greater than or equal to two, and they are evenly distributed at the bottom of the base 11, so that the cushion blocks can stably support the kettle body 1 to prevent the kettle body 1 from tilting.

[0037] In some embodiments, the kettle body 1 is made of a heat-conducting material. Optionally, the heat-conducting material can be one or more of stainless steel, glass, aluminum and its alloys, silicone, plastic, etc.; when the liquid contained in the kettle body 1 needs to dissipate heat, the kettle body 1 made of a heat-conducting material has a large contact area with the outside world, and can effectively dissipate the heat of the liquid to the outside air. At the same time, the current reversing module supplies positive power to the semiconductor board 21, and the semiconductor board 21 absorbs heat at one end close to the kettle body 1, and releases heat at one end away from the kettle body 1, so that the semiconductor board 21 absorbs the heat of the kettle body 1, and dissipates heat to the kettle body 1, and then dissipates heat to the liquid contained in the kettle body 1, and at the same time, the heat sink 4 dissipates the heat released by the semiconductor board 21 to the air in the accommodating cavity 12, and the accommodating cavity 12 is connected to the outside air through the ventilation hole, so as to dissipate the heat generated by the semiconductor board 21 to the outside air.

[0038] See also Figure 1 , Figure 2 and Figure 3 In some embodiments, it further includes a heat-insulating outer shell 5 , which is sleeved on the outer side of the kettle body 1 , and a heat-insulating cavity 6 is formed between the heat-insulating outer shell 5 and the kettle body 1 . When the liquid in the kettle body 1 needs to be heated, the heating element 31 is energized to drive the heating element 31 to generate heat, and at the same time, the current reversing module reversely supplies power to the semiconductor board 21, and the semiconductor board 21 releases heat at one end close to the kettle body 1, and absorbs heat at the other end away from the kettle body 1, so that the semiconductor board 21 transfers heat to the kettle body 1, so that the heating element 31 and the semiconductor board 21 can jointly heat the liquid through the kettle body 1 to improve the heating efficiency, and utilize the good thermal conductivity of the kettle body 1 itself to improve the heat transfer efficiency of the heating element 31 and the semiconductor board 21, reduce the heat loss during the transfer process, and the heat insulation cavity 6 is separated from the heat insulation shell 5 and the kettle body 1 to effectively isolate the kettle body 1 from the outside world, prevent the heat of the kettle body 1 from being dissipated into the outside air, and further optimize the heating effect. Furthermore, since the heat-insulating cavity 6 is provided between the heat-insulating outer shell 5 and the kettle body 1, the heat transfer from the kettle body 1 is effectively isolated, that is, the heat on the kettle body 1 cannot be transferred to the heat-insulating outer shell 5, effectively preventing the user from being burned by high temperature when touching the heat-insulating outer shell 5 with bare hands. Optionally, the base 11 can be integrally formed with the heat-insulating outer shell 5.

[0039] In some embodiments, at least one heat dissipation port is provided on the heat-insulating shell 5, the heat-insulating cavity 6 is connected to the heat-dissipation port, and the heat-dissipation port cover is provided with a heat-insulating cover plate. That is, the heat-dissipation port is opened or closed by moving the heat-insulating cover plate. Optionally, when the liquid contained in the kettle body 1 needs to be heated, the heat-insulating cover plate is driven to close the heat-dissipation port, so that the heat-insulating cavity 6 is in a closed state, thereby effectively isolating the kettle body 1 from the outside world, preventing the kettle body 1 from radiating heat to the outside air, and improving the heating effect. Optionally, when the liquid contained in the kettle body 1 needs to dissipate heat, the heat-insulating cover plate is removed from the heat-dissipation port, so that the heat-dissipation port is in an open state, that is, the outer surface of the kettle body 1 can contact the outside air through the heat-insulating cavity 6, thereby radiating the heat of the liquid to the outside air, and improving the heat dissipation effect.

[0040] See also Figure 1 , Figure 2 and Figure 3In some embodiments, a base 11 is provided at the bottom of the kettle body 1, and a receiving cavity 12 is provided in the base 11; the semiconductor board 21 is provided in the receiving cavity 12, and the semiconductor board 21 is connected to the bottom of the kettle body 1, wherein the semiconductor board 21 is powered by the current commutation module, wherein the current commutation module supplies power to the semiconductor board 21 in a forward or reverse direction, so that the semiconductor board 21 dissipates heat or heats the kettle body 1, and specifically, when the current commutation module supplies power to the semiconductor board 21 in a forward direction, the semiconductor board 21 is close to one side of the kettle body 1 The end absorbs heat, and the end of the semiconductor board 21 away from the kettle body 1 releases heat, so that the semiconductor board 21 absorbs the heat of the kettle body 1 to achieve heat dissipation of the kettle body 1. When the current reversing module reversely supplies power to the semiconductor board 21, the end of the semiconductor board 21 close to the kettle body 1 releases heat, and the end of the semiconductor board 21 away from the kettle body 1 absorbs heat, so that the semiconductor board 21 transfers heat to the kettle body 1 to achieve heating of the kettle body 1, so that the kettle body 1 has good heat dissipation and heating properties at the same time, so as to provide users with a better usage experience. Optionally, the outer side of the semiconductor board 21 is surrounded by the heating element 31, and the heating element 31 is connected to the bottom of the kettle body 1. Optionally, the bottom of the semiconductor board 21 is connected to the heat sink 4. Further, the bottom of the base 11 is provided with at least one ventilation hole, and the ventilation hole is arranged opposite to the heat sink 4. Further, the bottom of the base 11 protrudes outward to form a pad so that there is a gap between the bottom of the base 11 and the placement plane of the electric kettle. Optionally, the kettle body 1 is made of heat-conducting material. Further, the outer side of the kettle body 1 is provided with the heat-insulating outer shell 5, and a heat-insulating cavity 6 is formed between the heat-insulating outer shell 5 and the kettle body 1. Further, at least one heat dissipation port is provided on the heat-insulating outer shell 5, and the heat-insulating cavity 6 is connected to the heat dissipation port, and the heat dissipation port cover is provided with a heat-insulating cover plate.Specifically, when the liquid contained in the kettle body 1 needs to be heated, the heat-insulating cover is driven to close the heat dissipation port, so that the heat-insulating cavity 6 is in a closed state, thereby effectively isolating the kettle body 1 from the outside world and preventing the kettle body 1 from radiating heat to the outside air, and then the heating element 31 is energized to drive the heating element 31 to generate heat. At the same time, the current reversing module reversely supplies power to the semiconductor board 21, and the end of the semiconductor board 21 close to the kettle body 1 releases heat, and the end of the semiconductor board 21 away from the kettle body 1 absorbs heat, so that the semiconductor board 21 transfers heat to the kettle body 1, so that the heating element 31 and the semiconductor board 21 jointly heat the liquid through the kettle body 1, so as to improve the heating efficiency; when the liquid contained in the kettle body 1 needs to dissipate heat, the heat-insulating cover is removed from the heat dissipation port, so that the heat dissipation port is in a closed state. The open state, that is, the outer surface of the kettle body 1 can contact the outside air through the insulating cavity 6, so that the heat of the liquid is dissipated to the outside air, improving the heat dissipation effect, and at the same time, the power to the heating element 31 is cut off, and then the current reversing module supplies positive power to the semiconductor board 21, and the semiconductor board 21 absorbs heat at one end close to the kettle body 1, and releases heat at the other end away from the kettle body 1, so that the semiconductor board 21 absorbs the heat of the kettle body 1, and dissipates the heat of the kettle body 1, and then dissipates the heat of the liquid contained in the kettle body 1, and at the same time, the heat sink 4 dissipates the heat released by the semiconductor board 21 into the air in the accommodating cavity 12, and the accommodating cavity 12 is connected to the outside air through the ventilation hole, so as to dissipate the heat generated by the semiconductor board 21 to the outside air, further optimizing the heat dissipation effect.

[0041] The technical means disclosed in the solution of the utility model are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications are also regarded as the protection scope of the utility model.

Claims

1. An electric kettle with a semiconductor, characterized in that: include: A kettle body, wherein a base is provided at the bottom of the kettle body, and a receiving cavity is provided in the base; A semiconductor module, which is disposed in the accommodating cavity and connected to the bottom of the kettle body; A current switching module is electrically connected to the semiconductor module and is used to supply power to the semiconductor module in a forward or reverse direction so that the semiconductor module dissipates heat or heats the kettle body.

2. The electric kettle with semiconductor according to claim 1, characterized in that: The accommodating cavity also accommodates a heating module, and the heating module is connected to the bottom of the kettle body.

3. The electric kettle with semiconductor according to claim 2, characterized in that: The semiconductor module includes a semiconductor board and a power supply cable. The semiconductor board is connected to the bottom of the kettle body. The current switching module is electrically connected to the semiconductor board through the power supply cable.

4. The electric kettle with semiconductor according to claim 3, characterized in that: The heating module includes a heating element, which surrounds the outer side of the semiconductor board and is connected to the bottom of the kettle body.

5. The electric kettle with semiconductor according to claim 3, characterized in that: A heat sink is also included, and the heat sink is connected to the bottom of the semiconductor board.

6. The electric kettle with semiconductor according to claim 5, characterized in that: At least one ventilation hole is formed at the bottom of the base, and the ventilation hole is arranged opposite to the heat sink.

7. The electric kettle with semiconductor according to claim 6, characterized in that: The bottom of the base protrudes outwards to form a cushion block.

8. The electric kettle with semiconductor according to claim 1, characterized in that: The kettle body is made of heat-conducting material.

9. The electric kettle with semiconductor according to claim 1, characterized in that: It also includes a heat-insulating outer shell, which is sleeved on the outer side of the kettle body, and a heat-insulating cavity is formed between the heat-insulating outer shell and the kettle body.

10. The electric kettle with semiconductor according to claim 9, characterized in that: At least one heat dissipation opening is provided on the heat-insulating shell, the heat-insulating cavity is communicated with the heat-dissipating opening, and the heat-dissipating opening cover is provided with a heat-insulating cover plate.

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