Correction wheel

Abstract

A correction wheel comprises two correction layers, a buffer compression pad and a fixing plate, the two correction layers are connected with the upper face and the lower face of the fixing plate through the buffer compression pad, the correction layers are in a circular ring shape, meshing teeth are arranged on the outer circumferences of the correction layers, four diamond plating layers are arranged on the correction layers, and the four diamond plating layers take the circle center of the correction layers as the axis point. The buffer compression pads are symmetrically and uniformly arranged on the correction layer, and center holes matched with the correction layer are formed in the centers of the fixing plate and the buffer compression pads. According to the grinding and polishing pad, through the double-layer annular body structure and the rubber buffer ring arranged at the joint of the fixing plate and the correction layer, the effect of the buffer layer can be automatically generated, pressure is evenly distributed, the grinding and polishing pad is corrected at a time, and the flatness is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of machinery, in particular to a correction wheel. Background Art

[0002] The main application areas of silicon carbide wafers are LED solid-state lighting and high-frequency devices. This material has excellent properties such as bandgap, drift velocity, breakdown voltage, thermal conductivity, high temperature resistance, etc. that are several times higher than traditional silicon. It has irreplaceable advantages in electronic applications such as high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, microwave, and extreme environment applications such as aerospace, military industry, and nuclear energy. With the development of semiconductor chips, higher requirements are placed on the quality and efficiency of silicon carbide wafers.

[0003] The double-sided grinding of existing silicon carbide wafers is often processed by CMP chemical polishing. The CMP chemical polishing technology mainly removes the surface line marks of the cutting disc and corrects the warpage, curvature and flatness of the wafer. Then, after the grinding and polishing process, the grinding and polishing pad on the existing grinding and polishing disc decreases in flatness due to pressure, rotation speed and other reasons, which affects the processing quality. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a correction wheel with a double-layer buffer structure which can correct the grinding and polishing pad to ensure better flatness requirements and improve the grinding and polishing quality of silicon carbide sheets.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a correction wheel, including two correction layers, a buffer compression pad and a fixed plate, the two correction layers are connected to the upper and lower surfaces of the fixed plate through the buffer compression pad, the correction layer is annular, and the outer circumference of the correction layer has teeth, four diamond coatings are arranged on the correction layer, the four diamond coatings are symmetrically arranged on the correction layer in the upper and lower directions with the center of the correction layer as the axis point, and the centers of the fixed plate and the buffer compression pad are provided with center holes adapted to the correction layers.

[0006] Furthermore, the diamond coating is arranged on a side of the correction layer facing away from the fixing plate.

[0007] Furthermore, a rubber buffer ring is provided at the connection between the fixing plate and the correction layer.

[0008] Furthermore, the four diamond coatings are all arc-shaped.

[0009] Furthermore, the thickness of the diamond coating is 0.03 mm.

[0010] Furthermore, the circular diameter of the correction layer is between 120 mm and 504 mm.

[0011] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model uses a double-layer annular structure and a rubber buffer ring is arranged at the connection between the fixed plate and the correction layer, which can automatically generate a buffer layer effect, evenly distribute the pressure, and make the grinding and polishing pad corrected at one time to ensure the flatness; by setting a double-layer correction layer, it can ensure better flatness requirements and improve the grinding and polishing quality of the silicon carbide wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of an embodiment of the utility model;

[0013] Figure 2 This is a schematic diagram of the structure of a buffer compression pad in one embodiment of the utility model;

[0014] Figure 3 This is a structural schematic diagram of a fixing plate in one embodiment of the utility model;

[0015] Figure 4 for Figure 1 Schematic diagram of the structure of the middle correction layer;

[0016] In the figure: 1. correction layer, 2. diamond coating, 3. buffer compression pad, 4. fixing plate, 5. rubber buffer ring. DETAILED DESCRIPTION

[0017] The present invention is further explained below in conjunction with specific implementation methods.

[0018] Refer to the attached Figure 1 -Attached Figure 4 This embodiment includes a fixing plate 4, a correction layer 1 with a circular diameter of 500 mm respectively arranged on the upper and lower surfaces of the fixing plate 4, and a buffer compression pad 3 for connecting the correction layer 1 and the fixing plate 4. At the same time, the centers of the fixing plate 4 and the buffer compression pad 3 are both provided with a center hole adapted to the correction layer 1, wherein the correction layer 1 is annular and the outer circumference of the correction layer 1 is all geared. On the side of the correction layer 1 facing away from the fixing plate 4, four arc-shaped diamond coating layers 2 with a thickness of 0.03 mm are arranged symmetrically and evenly distributed up and down and left and right with the circular shape of the correction layer 1 as the axis point. A rubber buffer ring 5 is provided at the connection between the fixing plate 4 and the correction layer 1.

[0019] Working principle: place a correction layer 1 on the polishing pad on the grinding and polishing disc, then connect the fixing plate 4 with the correction layer 1, then put the buffer compression pad 3 on the fixing plate 4, install the rubber buffer ring 5 on the fixing plate 4, and finally connect another correction layer 1 with the fixing plate 4 through the rubber buffer ring 5. When the upper and lower grinding and polishing discs are fitted to correct the grinding and polishing pad, when the pressure is ≥150KG, the rubber buffer rings 5 ​​of the upper and lower correction layers 1 will automatically produce a buffer layer effect, evenly distribute the pressure, so that the grinding and polishing pad can be corrected at one time, and the flatness can reach within 10um. In this embodiment, the material of the fixing plate 4 is PVC, and the rubber buffer ring 5 is made of a special material with buffer elastic shrinkage performance. When the two correction layers 1 are under pressure, they can automatically level the parallelism, thereby performing precision grinding and polishing correction on the disc surface grinding and polishing pad.

Claims

1. A correction wheel, characterized in that: The invention comprises two correction layers, a buffer compression pad and a fixed plate, wherein the two correction layers are connected to the upper and lower surfaces of the fixed plate through the buffer compression pad, the correction layer is in an annular shape, and the outer circumference of the correction layer has teeth, four diamond coatings are arranged on the correction layer, and the four diamond coatings are symmetrically and evenly arranged on the correction layer with the center of the correction layer as the axis point, and the centers of the fixed plate and the buffer compression pad are provided with center holes adapted to the correction layers.

2. The correction wheel according to claim 1, characterized in that: The diamond coating is arranged on a side of the correction layer facing away from the fixing plate.

3. The correction wheel according to claim 2, characterized in that: A rubber buffer ring is provided at the connection between the fixing plate and the correction layer.

4. The correction wheel according to claim 3, characterized in that: The four diamond coatings are all in arc shape.

5. The correction wheel according to claim 4, characterized in that: The thickness of the diamond coating is 0.03 mm.

6. The correction wheel according to claim 5, characterized in that: The circular diameter of the correction layer is between 120 mm and 504 mm.

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