Cutting assembly of integrated circuit chip

Abstract

The utility model discloses a cutting assembly of an integrated circuit chip, and relates to the technical field of chip production. The dust collection device comprises a cutting head, a protective cover, a first dust collection assembly and a second dust collection assembly. The cutting head is mounted at the bottom of the moving seat, the moving seat is arranged at the bottom of a top plate of the C-shaped rack, a vacuum adsorption table is fixed at the top of a bottom plate of the C-shaped rack, and a chip body is adsorbed at the top of the vacuum adsorption table; the protective cover is used for covering the cutting head inside, the protective cover is driven by a first electric cylinder to ascend and descend, and the first electric cylinder is fixed to the top of the top plate of the C-shaped rack. Dust generated during cutting work of the cutting head can be absorbed through the first dust absorption assembly, dust attached to the surface of a chip body after the chip body is cut can be further absorbed through the second dust absorption assembly, and the cleaning effect is better; the problem that an air blowing mechanism of an existing cutting assembly is difficult to thoroughly clean dust attached to the surface of a chip is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip production, in particular to a cutting component of an integrated circuit chip. Background Art

[0002] An integrated circuit chip, also known as an IC, is a tiny, thin sheet of silicon-based material with integrated electronic components such as transistors, resistors, capacitors, etc. It is a basic component of electronic devices and a vital element in the field of modern science and technology. The process of manufacturing an integrated circuit chip involves multiple steps, including using photolithography technology to form circuit patterns on silicon wafers, and then forming electronic components through processes such as deposition, etching, and diffusion, and finally packaging them into a complete chip. Cutting components is a key part of the chip manufacturing process.

[0003] After searching, the announcement number CN219465567U and the announcement date 2023-08-04 disclose a cutting component for an integrated circuit chip, which belongs to the field of circuit chip processing. A cutting component for an integrated circuit chip comprises a working platform, a working frame is arranged on the top of the working platform, a cutting component storage rack is installed on the top of the working platform and on the inner side of the working frame, a plurality of installation bins are arranged on the top of the working platform and on one side of the cutting component storage rack, a cutting gun is arranged on the inner side of the cutting component storage rack, an air supply cylinder is installed on the top of the working frame, an inner bin is arranged on the inner side of the working frame and close to the top, a blower mechanism is arranged on the inner side of the inner bin, and the blower mechanism is used to change the position of the wind force of the air supply cylinder; it can remove the residual dirt on it through wind gas, avoid the damage to the chip caused by cleaning such as brushes or liquids, thereby being able to efficiently, safely and environmentally friendly remove the residue on the surface of the circuit chip, and improve the performance and life of the circuit chip.

[0004] The patent has the following shortcomings:

[0005] 1. The blower mechanism of the cutting component of the device removes the residual dirt on the chip through wind and gas, avoiding the phenomenon that brushes or liquids may damage the chip, so that the residue on the surface of the circuit chip can be removed efficiently, safely and environmentally friendly. However, the wind is far away from the chip, making it difficult to completely clean the dust attached to the chip surface;

[0006] 2. The cutting components of the device are not sufficiently protected, and the dust generated during cutting can easily escape, affecting the surrounding environment and the health of the operator.

[0007] To this end, we provide a cutting assembly for integrated circuit chips to solve the above problems. Utility Model Content

[0008] The purpose of the utility model is to provide a cutting component for integrated circuit chips, which can not only absorb the dust generated by the cutting head during cutting work through the first dust suction component, but also further absorb the dust attached to the surface of the chip body after the cutting is completed through the second dust suction component, so as to achieve better cleaning effect and solve the problem that the blower mechanism of the existing cutting component is difficult to completely clean the dust attached to the chip surface.

[0009] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0010] The utility model discloses a cutting assembly for integrated circuit chips, comprising a cutting head, a protective cover, a first dust suction assembly and a second dust suction assembly; the cutting head is mounted at the bottom of a movable seat, the movable seat is arranged at the bottom of a top plate of a C-shaped frame, a vacuum adsorption table is fixed on the top of the bottom plate of the C-shaped frame, and a chip body is adsorbed on the top of the vacuum adsorption table; the protective cover is used to cover the cutting head therein, the protective cover is driven to rise and fall by a first electric cylinder, and the first electric cylinder is fixed on the top of the top plate of the C-shaped frame; the first dust suction assembly and the second dust suction assembly are both integrated on the protective cover, the first dust suction assembly is used to absorb dust generated by the cutting head during cutting work, and the second dust suction assembly is used to absorb dust attached to the surface of the chip body after the chip body is cut.

[0011] The utility model is further configured as follows: the protective cover comprises a cover body, a frame body, a buffer assembly, a rubber pad and an elastic enclosure; four buffer assemblies are provided for connecting the cover body and the frame body, the frame body is located below the cover body, and the rubber pad is fixed to the bottom of the frame body; the elastic enclosure is fixed between the cover body and the frame body for closing the gap therebetween.

[0012] The utility model is further configured such that the buffer assembly includes a buffer rod and a buffer spring sleeved on the buffer rod; the bottom end of the buffer rod is fixedly connected to the frame, and the top end of the buffer rod is movably inserted into the insertion hole at the bottom of the cover; the two ends of the buffer spring are respectively fixedly connected to the cover and the frame.

[0013] The utility model is further configured such that a guide rod is fixed on the top of the cover body, the guide rod movably passes through the top plate of the C-shaped frame, a top elastic tape is also fixed on the top of the cover body, the cutting head passes through the top elastic tape, and is fixedly connected to the top elastic tape.

[0014] The utility model is further configured such that the first dust suction component includes an annular tube, a suction pipe, and a first exhaust pipe; the annular tube is fixedly sleeved outside the cover, a plurality of suction pipes equally spaced are provided on the annular tube, the suction pipes are inserted into the cover, the annular tube is connected to the first exhaust pipe, and the first exhaust pipe is used to connect to an external purification device.

[0015] The utility model is further configured such that the second dust suction component includes a dust suction plate and a second exhaust pipe; the dust suction plate is located inside the cover body, a plurality of suction holes evenly distributed in a lattice shape are arranged on the bottom surface thereof, the second exhaust pipe is arranged on the top surface thereof, and the second exhaust pipe is used to connect to an external purification device; a proximity sensor is also arranged on the bottom surface of the dust suction plate for accurately controlling the distance from the chip body.

[0016] The utility model is further configured such that the second dust suction assembly also includes a first support, a second support, a third support, a fourth support, a second electric cylinder, a rotating shaft and a fifth support; the first support is fixed to the side surface of the dust suction plate, the first support and the second support are hinged by a pin shaft, and the second support is fixed to the inner wall of the cover body; the third support is fixed to the top surface of the dust suction plate, the third support and the fourth support are hinged by a pin shaft, the fourth support is fixed to the movable end of the second electric cylinder, the rotating shaft is fixed on the cylinder body of the second electric cylinder, the rotating shaft is rotatably connected to the fifth support, and the fifth support is also fixed to the inner wall of the cover body.

[0017] The utility model is further configured that a side elastic tape is arranged on the side of the cover body, and the second electric cylinder penetrates through the side elastic tape and is fixedly connected to the side elastic tape.

[0018] The utility model is further configured such that the dust suction plate is in a vertical state and located at the inner wall of the cover body when the cutting head is cutting; and the dust suction plate is in a horizontal state after the cutting head completes cutting to absorb the dust attached to the surface of the chip body.

[0019] The utility model has the following beneficial effects:

[0020] 1. The utility model provides a first dust suction component and a second dust suction component, which can not only absorb the dust generated by the cutting head during cutting operation through the first dust suction component to prevent dust from escaping and affecting the surrounding environment and the health of operators, but also can clean the surface of the chip body for the first time, and can further absorb the dust attached to the surface of the chip body after the cutting is completed through the second dust suction component, so as to thoroughly clean the chip body and achieve a better cleaning effect.

[0021] 2. The utility model provides a protective cover and a first electric cylinder. Through the protective function of the protective cover, the dust suction effect of the first dust suction component is improved to avoid dust scattering and waste chips splashing to injure people. The protective cover can be raised and lowered to facilitate the removal and placement of the chip body. At the same time, the height of the second dust suction component can be adjusted to adapt to the use of chip bodies of different thicknesses, and the universality is better.

[0022] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 The present invention is a three-dimensional schematic diagram of the overall structural appearance of a cutting component of an integrated circuit chip.

[0025] Figure 2 It is a front cross-sectional schematic diagram of the overall structure of a cutting component of an integrated circuit chip.

[0026] Figure 3 A schematic diagram of a protective cover structure for a cutting assembly of an integrated circuit chip Figure 1 .

[0027] Figure 4 A schematic diagram of a protective cover structure for a cutting assembly of an integrated circuit chip Figure 2 .

[0028] Figure 5 A schematic diagram of the structure of the second dust collection component of a cutting component for an integrated circuit chip Figure 1 .

[0029] Figure 6 A schematic diagram of the structure of the second dust collection component of a cutting component for an integrated circuit chip Figure 2 .

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] 1-cutting head, 2-moving seat, 3-C-type frame, 301-vacuum adsorption table, 4-protective cover, 401-cover body, 401a-jack, 401b-guide rod, 401c-top elastic tape, 401d-side elastic tape, 402-frame, 403-buffer assembly, 403a-buffer rod, 403b-buffer spring, 404-rubber pad, 405-elastic enclosure, 5-first electric cylinder, 6- A dust suction component, 601-annular tube, 602-suction pipe, 603-first exhaust pipe, 7-second dust suction component, 701-dust suction plate, 702-suction hole, 703-proximity sensor, 704-second exhaust pipe, 705-first support, 706-second support, 707-third support, 708-fourth support, 709-second electric cylinder, 710-rotating shaft, 711-fifth support, 8-chip body. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] For specific embodiment 1, please refer to Figure 1-4 The utility model is a cutting assembly for integrated circuit chips, comprising a cutting head 1 and a protective cover 4; the cutting head 1 is mounted at the bottom of a moving seat 2, the moving seat 2 is arranged at the bottom of a top plate of a C-shaped frame 3, a vacuum adsorption table 301 is fixed on the top of the bottom plate of the C-shaped frame 3, and a chip body 8 is adsorbed on the top of the vacuum adsorption table 301; the protective cover 4 is used to cover the cutting head 1 inside thereof, and the protective cover 4 is driven to rise and fall by a first electric cylinder 5, and the first electric cylinder 5 is fixed on the top of the top plate of the C-shaped frame 3.

[0034] Specifically, the protective cover 4 includes a cover body 401, a frame body 402, a buffer assembly 403, a rubber pad 404 and an elastic enclosure 405; four buffer assemblies 403 are provided for connecting the cover body 401 and the frame body 402, the frame body 402 is located below the cover body 401, and a rubber pad 404 is fixed to the bottom of the frame body 402; the elastic enclosure 405 is fixed between the cover body 401 and the frame body 402 to close the gap therebetween.

[0035] Furthermore, the buffer assembly 403 includes a buffer rod 403a and a buffer spring 403b sleeved on the buffer rod 403a; the bottom end of the buffer rod 403a is fixedly connected to the frame 402, and the top end of the buffer rod 403a is movably inserted into the socket 401a at the bottom of the cover 401; the two ends of the buffer spring 403b are respectively fixedly connected to the cover 401 and the frame 402.

[0036] Furthermore, a guide rod 401b is fixed on the top of the cover body 401, and the guide rod 401b movably penetrates the top plate of the C-shaped frame 3. A top elastic tape 401c is also fixed on the top of the cover body 401, and the cutting head 1 penetrates the top elastic tape 401c and is fixedly connected to the top elastic tape 401c.

[0037] The operation process of this embodiment is as follows: the protective cover 4 is driven to descend by the first electric cylinder 5 until the rubber pad 404 abuts against the C-shaped frame 3, the moving seat 2 drives the cutting head 1 to move in the XY direction, and the chip body 8 is cut by the cutting head 1. The protective function of the protective cover 4 prevents dust from being scattered and waste chips from splashing and injuring people.

[0038] For specific embodiment 2, please refer to Figure 1-3 On the basis of the specific embodiment 1, it also includes a first dust suction component 6, which is integrated on the protective cover 4 and is used to absorb dust generated by the cutting head 1 during cutting work.

[0039] Specifically, the first dust suction component 6 includes an annular tube 601, a suction pipe 602, and a first exhaust pipe 603; the annular tube 601 is fixedly mounted outside the cover body 401, and a plurality of suction pipes 602 distributed at equal intervals are arranged on the annular tube 601, and the suction pipes 602 are inserted into the cover body 401, and the annular tube 601 is connected to the first exhaust pipe 603, and the first exhaust pipe 603 is used to connect to an external purification device.

[0040] The operating process of this embodiment is as follows: under the action of the suction force of the external purification equipment, the dust generated by the cutting head 1 during cutting enters the annular pipe 601 through the suction pipe 602, and then enters the first exhaust pipe 603 through the annular pipe 601, and is transported to the external purification equipment through the first exhaust pipe 603 for purification treatment, so as to prevent dust from escaping and affecting the surrounding environment and the health of the operator.

[0041] For specific embodiment 3, please refer to Figure 1-2 , 5-6, based on the specific embodiment 1 and the specific embodiment 2, it also includes a second dust suction component 7, the second dust suction component 7 is integrated on the protective cover 4, and is used to absorb the dust attached to the surface of the chip body 8 after the chip body 8 is cut.

[0042] Specifically, the second dust suction component 7 includes a dust suction plate 701 and a second exhaust pipe 704; the dust suction plate 701 is located inside the cover body 401, and a plurality of suction holes 702 evenly distributed in a dot matrix are arranged on its bottom surface, and a second exhaust pipe 704 is arranged on its top surface, and the second exhaust pipe 704 is used to connect to an external purification device; a proximity sensor 703 is also arranged on the bottom surface of the dust suction plate 701, which is used to accurately control the distance from the chip body 8.

[0043] Furthermore, the second dust suction component 7 also includes a first support 705, a second support 706, a third support 707, a fourth support 708, a second electric cylinder 709, a rotating shaft 710 and a fifth support 711; the first support 705 is fixed on the side of the dust suction plate 701, the first support 705 and the second support 706 are hinged by a pin shaft, and the second support 706 is fixed on the inner wall of the cover body 401; the third support 707 is fixed on the top surface of the dust suction plate 701, the third support 707 and the fourth support 708 are hinged by a pin shaft, the fourth support 708 is fixed to the movable end of the second electric cylinder 709, and a rotating shaft 710 is fixed on the cylinder body of the second electric cylinder 709, the rotating shaft 710 is rotatably connected with the fifth support 711, and the fifth support 711 is also fixed on the inner wall of the cover body 401.

[0044] Furthermore, a side elastic tape 401d is provided on the side of the cover body 401, and the second electric cylinder 709 penetrates the side elastic tape 401d and is fixedly connected to the side elastic tape 401d; when the cutting head 1 is cutting, the dust suction plate 701 is in a vertical state and is located on the inner wall of the cover body 401; after the cutting head 1 completes the cutting, the dust suction plate 701 is in a horizontal state to absorb the dust attached to the surface of the chip body 8.

[0045] The operation process of this embodiment is as follows: when the cutting head 1 completes cutting and the surface of the chip body 8 needs to be cleaned, the dust suction plate 701 is driven to rotate to a horizontal state by the second electric cylinder 709, and then the protective cover 4 is driven to descend by the first electric cylinder 5, and the protective cover 4 drives the second dust suction assembly 7 to descend, and the distance from the chip body 8 is precisely controlled by the proximity sensor 703, and then the dust attached to the surface of the chip body 8 is absorbed through the suction hole 702, so that the chip body 8 is thoroughly cleaned, and the cleaning effect is better.

[0046] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0047] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A cutting assembly for integrated circuit chips, comprising a cutting head (1), a protective cover (4), a first dust suction assembly (6) and a second dust suction assembly (7); characterized in that: The cutting head (1) is mounted on the bottom of a movable seat (2); the movable seat (2) is arranged at the bottom of a top plate of a C-shaped frame (3); a vacuum adsorption table (301) is fixed on the top of the bottom plate of the C-shaped frame (3); and a chip body (8) is adsorbed on the top of the vacuum adsorption table (301); The protective cover (4) is used to cover the cutting head (1) therein, and the protective cover (4) is driven to rise and fall by a first electric cylinder (5), and the first electric cylinder (5) is fixed to the top of the top plate of the C-shaped frame (3); The first dust suction component (6) and the second dust suction component (7) are both integrated on the protective cover (4); the first dust suction component (6) is used to absorb dust generated by the cutting head (1) during cutting operation; and the second dust suction component (7) is used to absorb dust attached to the surface of the chip body (8) after cutting is completed.

2. The integrated circuit chip cutting assembly according to claim 1, characterized in that: The protective cover (4) comprises a cover body (401), a frame body (402), a buffer component (403), a rubber pad (404) and an elastic enclosure (405); Four buffer components (403) are provided, and are used to connect the cover body (401) and the frame body (402); the frame body (402) is located below the cover body (401); and the rubber pad (404) is fixed to the bottom of the frame body (402); The elastic enclosure (405) is fixed between the cover body (401) and the frame body (402) to close the gap between the two.

3. The integrated circuit chip cutting assembly according to claim 2, characterized in that: The buffer assembly (403) comprises a buffer rod (403a) and a buffer spring (403b) sleeved on the buffer rod (403a); The bottom end of the buffer rod (403a) is fixedly connected to the frame (402), and the top end of the buffer rod (403a) is movably inserted into the insertion hole (401a) at the bottom of the cover body (401); Two ends of the buffer spring (403b) are fixedly connected to the cover body (401) and the frame body (402) respectively.

4. The integrated circuit chip cutting assembly according to claim 2, characterized in that: A guide rod (401b) is fixed on the top of the cover body (401), and the guide rod (401b) movably penetrates the top plate of the C-shaped frame (3); A top elastic tape (401c) is also fixed to the top of the cover body (401), and the cutting head (1) passes through the top elastic tape (401c) and is fixedly connected to the top elastic tape (401c).

5. The integrated circuit chip cutting assembly according to claim 2, characterized in that: The first dust collection component (6) comprises an annular tube (601), a suction tube (602), and a first exhaust pipe (603); The annular tube (601) is fixedly sleeved outside the cover body (401); a plurality of equally spaced suction pipes (602) are provided on the annular tube (601); the suction pipes (602) are inserted into the cover body (401); the annular tube (601) is connected to the first exhaust pipe (603); and the first exhaust pipe (603) is used to connect to an external purification device.

6. The integrated circuit chip cutting assembly according to claim 2, characterized in that: The second dust collection component (7) comprises a dust collection plate (701) and a second exhaust pipe (704); The dust suction plate (701) is located inside the cover body (401), and a plurality of suction holes (702) evenly distributed in a lattice are arranged on its bottom surface, and the second exhaust pipe (704) is arranged on its top surface, and the second exhaust pipe (704) is used to connect to an external purification device; A proximity sensor (703) is also provided on the bottom surface of the dust suction plate (701) for accurately controlling the distance from the chip body (8).

7. The integrated circuit chip cutting assembly according to claim 6, characterized in that: The second dust suction assembly (7) further comprises a first support (705), a second support (706), a third support (707), a fourth support (708), a second electric cylinder (709), a rotating shaft (710) and a fifth support (711); The first support (705) is fixed on the side surface of the dust collecting plate (701), the first support (705) and the second support (706) are hingedly connected via a pin, and the second support (706) is fixed on the inner wall of the cover body (401); The third support (707) is fixed on the top surface of the dust collecting plate (701), the third support (707) is hinged with the fourth support (708) via a pin shaft, the fourth support (708) is fixed to the movable end of the second electric cylinder (709), the rotating shaft (710) is fixed on the cylinder body of the second electric cylinder (709), the rotating shaft (710) is rotatably connected to the fifth support (711), and the fifth support (711) is also fixed on the inner wall of the cover body (401).

8. The integrated circuit chip cutting assembly according to claim 7, characterized in that: A side elastic tape (401d) is provided on the side of the cover body (401), and the second electric cylinder (709) penetrates the side elastic tape (401d) and is fixedly connected to the side elastic tape (401d).

9. The integrated circuit chip cutting assembly according to claim 6, characterized in that: When the cutting head (1) is in cutting operation, the dust collecting plate (701) is in a vertical state and is located on the inner wall of the cover body (401); After the cutting head (1) completes cutting, the dust suction plate (701) is in a horizontal state, and absorbs dust attached to the surface of the chip body (8).

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