Wafer scribing assembly

Abstract

The utility model relates to the field of semiconductor wafer processing, in particular to a wafer scribing assembly which comprises an assembly frame body, a fine adjustment mechanism, a bearing disc, a rotary clamping mechanism, a cutting mechanism and a smoke suction device. The fine adjustment mechanism is arranged on the upper end face of the assembly frame body, and the bearing disc is assembled on the fine adjustment mechanism. The rotary clamping mechanism is installed above the bearing disc through a supporting frame, and the cutting mechanism and the smoke suction device are arranged on the side portion of the bearing disc through a side frame. By the adoption of the device, the overall structure is optimized, lifting, clamping and rotating assemblies are integrated, the space occupied by the overall device is reduced, and the size of the device is reduced; a free fine adjustment mechanism is matched to ensure that various wafers can adapt to component equipment, so that the overall utilization rate is improved; and a smoking device is integrated, so that the damage and pollution of hot air and hot smoke generated in the laser scribing and cutting process to the wafer are reduced.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor wafer processing, in particular to a wafer dicing component. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches. In the process of semiconductor chip manufacturing, the wafer needs to be cut by a dicing device to obtain chips that meet the requirements. Wafer cutting is also commonly called dicing.

[0003] The most important thing in the wafer scribing process is the positioning of the laser scribing position. The accuracy of laser scribing and the stability of wafer clamping are the biggest problems limiting wafer laser scribing. The existing laser scribing devices are usually not very accurate in the positioning process due to defects in the device, resulting in a low yield rate of the final wafer chips. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide a wafer dicing assembly.

[0005] The utility model provides the following technical solutions:

[0006] A wafer dicing assembly, comprising an assembly frame, a fine-tuning mechanism, a carrier plate, a screw clamping mechanism, a cutting mechanism and a smoking device; the fine-tuning mechanism is arranged on the upper end surface of the assembly frame, and the carrier plate is assembled on the fine-tuning mechanism; the screw clamping mechanism is installed above the carrier plate through a support frame, and the cutting mechanism and the smoking device are arranged on the side of the carrier plate through a side frame;

[0007] Further, the fine-tuning mechanism includes a Y-axis track, a support frame plate and an X-axis track; the Y-axis track is fixed on the component frame, the support frame plate is slidably assembled on the Y-axis track, a set of X-axis tracks is assembled across the support frame plate, and the carrier plate is installed on the X-axis track;

[0008] Furthermore, the clamping mechanism comprises a bidirectional electric cylinder, an auxiliary rod, a rotating motor and a clamping block; the auxiliary rod is vertically arranged on the component frame, and the telescopic ends of both ends of the bidirectional electric cylinder are respectively provided with an upper frame plate and a lower frame plate; the end of the upper frame plate is rotatably mounted with the clamping block, and the end of the lower frame plate is upwardly mounted with the rotating motor;

[0009] Furthermore, the output end of the rotating motor is an anti-slip rubber block; the upper frame plate and the lower frame plate are both slidably sleeved on the auxiliary rod;

[0010] Furthermore, the cutting mechanism includes a propulsion cylinder, a cutting frame, a cutting connecting plate and a laser head; the propulsion cylinder is mounted on the side frame, and its telescopic end passes through the side frame and is connected to the cutting frame, and a group of laser heads are relatively mounted on the front end of the cutting frame through the cutting connecting plate;

[0011] Furthermore, the smoking device includes an exhaust device and a smoking pipe; the exhaust device is fixed on the component frame, and the bottom is connected to the external exhaust pipeline, and the smoking pipe is vertically arranged on the exhaust device and located next to the cutting mechanism;

[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0013] The utility model is adopted to optimize the overall structure, integrate the lifting, clamping and rotating components, reduce the space occupied by the overall equipment, and reduce the size of the equipment; with a free fine-tuning mechanism, it is ensured that various types of wafers can adapt to the component equipment and improve the overall utilization rate; and an exhaust device is integrated to reduce the damage and pollution to the wafers caused by the hot air and hot smoke generated during the laser scribing and cutting process. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the front view of the utility model;

[0016] Figure 3 It is a schematic diagram of the inclined elevation of the utility model. DETAILED DESCRIPTION

[0017] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0018] refer to Figure 1-3 As shown, a wafer dicing assembly comprises an assembly frame 1, a fine adjustment mechanism, a carrier plate 3, a screw clamp mechanism 4, a cutting mechanism 5 and a smoking device 6; the fine adjustment mechanism is arranged on the upper end surface of the assembly frame 1, and the carrier plate 3 is assembled on the fine adjustment mechanism; the screw clamp mechanism 4 is installed above the carrier plate 3 through a support frame 11, and the cutting mechanism 5 and the smoking device 6 are assumed to be on the side of the carrier plate 3 through a side frame 13;

[0019] Further, the fine-tuning mechanism includes a Y-axis track 21, a support frame plate 22 and an X-axis track 23; the Y-axis track 21 is fixed on the component frame 1, the support frame plate 22 is slidably assembled on the Y-axis track 21, a set of X-axis tracks 23 is assembled across the support frame plate 22, and the carrier plate 3 is installed on the X-axis track 23;

[0020] In this embodiment, the position of the carrier plate 3 can be adjusted as needed through the Y-axis track 21 and the X-axis track 23 to adapt to wafers of various sizes and ensure that the wafers can be cut and diced within the assembly.

[0021] In this embodiment, an anti-skid ring 31 is provided on the carrier plate 3, which can ensure that the wafer is placed on the carrier plate 3 without slight deviation; and the anti-skid ring 31 also provides a center position reference for external operators or other handling devices.

[0022] Further, the clamping mechanism 4 includes a bidirectional electric cylinder 41, an auxiliary rod 42, a rotating motor 46 and a clamping block 45; the auxiliary rod 42 is vertically arranged on the component frame 1, and the telescopic ends of the two bidirectional electric cylinder 41 are respectively provided with an upper frame plate 43 and a lower frame plate 44; the end of the upper frame plate 43 is rotatably installed with the clamping block 45, and the end of the lower frame plate 44 is upwardly equipped with a rotating motor 46; further, the output end of the rotating motor 46 is an anti-slip rubber block; the upper frame plate 43 and the lower frame plate 44 are both slidably sleeved on the auxiliary rod 42;

[0023] In this embodiment, the wafer is placed and mounted on the carrier plate 3, waiting for the rotary clamping mechanism 4 to clamp and rotate, and the bidirectional motor 41 is used for the main lifting and clamping power, the lower shelf plate 44 moves upward, and the upper shelf plate 43 moves downward; after moving to a certain extent, the wafer is lifted by the anti-slip rubber block at the output end of the rotating motor 46, and abuts against the clamping block 45 to clamp the wafer, and then the rotating motor 46 drives the wafer and the clamping block 45 to rotate together, waiting for the cutting mechanism 5 to perform dicing and cutting.

[0024] Furthermore, the cutting mechanism 5 includes a propulsion cylinder 51, a cutting frame 52, a cutting connecting plate 54 and a laser head 53; the propulsion cylinder 51 is mounted on the side frame 13, and its telescopic end passes through the side frame 13 and is connected to the cutting frame 52, and a group of the laser heads 53 are relatively mounted on the front end of the cutting frame 52 through the cutting connecting plate 54;

[0025] In this embodiment, when the wafer is clamped and lifted and then rotates, the propulsion cylinder 51 in the cutting mechanism 5 pushes forward to extend the laser head 53 as a whole, ensuring that a group of relative laser heads 53 hover on the upper and lower sides of the wafer, and then the laser head 53 performs laser slicing and cutting on the rotating wafer.

[0026] Furthermore, the smoking device 6 includes an exhaust device 61 and a smoking pipe 62; the exhaust device 61 is fixed on the component frame 1, and the bottom is connected to the external exhaust pipeline, and the smoking pipe 62 is vertically arranged on the exhaust device 61 and located next to the cutting mechanism 5;

[0027] In this embodiment, the smoking device 6 is sucked by the exhaust device 61 to promptly extract the hot smoke generated by laser cutting and slicing, which is then collected into the exhaust device through the smoking pipe 62 and then flows out of the equipment component, thereby reducing the pollution and impact of the hot smoke on the wafer.

[0028] The utility model is adopted to optimize the overall structure, integrate the lifting, clamping and rotating components, reduce the space occupied by the overall equipment, and reduce the size of the equipment; with a free fine-tuning mechanism, it is ensured that various types of wafers can adapt to the component equipment and improve the overall utilization rate; and an exhaust device is integrated to reduce the damage and pollution to the wafers caused by the hot air and hot smoke generated during the laser scribing and cutting process.

[0029] The specific embodiments described herein are merely examples of the spirit of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in similar ways, but they will not deviate from the scope defined by the spirit of the present invention.

Claims

1. A wafer dicing assembly, characterized in that: The invention comprises a component frame (1), a fine adjustment mechanism, a carrier plate (3), a screw clamp mechanism (4), a cutting mechanism (5) and a smoking device (6); the fine adjustment mechanism is arranged on the upper end surface of the component frame (1), and the carrier plate (3) is assembled on the fine adjustment mechanism; the screw clamp mechanism (4) is installed above the carrier plate (3) through a support frame (11), and the cutting mechanism (5) and the smoking device (6) are mounted on the side of the carrier plate (3) through a side frame (13); The fine adjustment mechanism comprises a Y-axis track (21), a support frame plate (22) and an X-axis track (23); the Y-axis track (21) is fixed on the component frame (1), the support frame plate (22) is slidably mounted on the Y-axis track (21), a set of X-axis tracks (23) is straddled and mounted on the support frame plate (22), and the carrier plate (3) is mounted on the X-axis track (23); The clamping mechanism (4) comprises a bidirectional electric cylinder (41), an auxiliary rod (42), a rotating motor (46) and a clamping block (45); the auxiliary rod (42) is vertically arranged on the component frame (1); the telescopic ends of both ends of the bidirectional electric cylinder (41) are respectively provided with an upper frame plate (43) and a lower frame plate (44); the end of the upper frame plate (43) is rotatably mounted with the clamping block (45), and the end of the lower frame plate (44) is upwardly mounted with the rotating motor.

2. A wafer dicing assembly according to claim 1, characterized in that: The output end of the rotating motor (46) is a non-slip rubber block; the upper frame plate (43) and the lower frame plate (44) are both slidably sleeved on the auxiliary rod (42).

3. A wafer dicing assembly according to claim 1, characterized in that: The cutting mechanism (5) comprises a propulsion cylinder (51), a cutting frame (52), a cutting connecting plate (54) and a laser head (53); the propulsion cylinder (51) is mounted on a side frame (13), and a telescopic end thereof passes through the side frame (13) and is connected to the cutting frame (52); a group of the laser heads (53) are mounted on the front end of the cutting frame (52) via the cutting connecting plate (54).

4. A wafer dicing assembly according to claim 3, characterized in that: The smoking device (6) comprises an exhaust device (61) and a smoking pipe (62); the exhaust device (61) is fixed on the component frame (1) and is connected to an external exhaust pipeline at the bottom; the smoking pipe (62) is vertically arranged on the exhaust device (61) and is located next to the cutting mechanism (5).

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